CN105181599A - Infrared SF6 gas detection apparatus based on photoelectric conversion technology - Google Patents
Infrared SF6 gas detection apparatus based on photoelectric conversion technology Download PDFInfo
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- CN105181599A CN105181599A CN201510550545.4A CN201510550545A CN105181599A CN 105181599 A CN105181599 A CN 105181599A CN 201510550545 A CN201510550545 A CN 201510550545A CN 105181599 A CN105181599 A CN 105181599A
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Abstract
The present invention discloses an infrared SF6 gas detection apparatus based on a photoelectric conversion technology. According to the infrared SF6 gas detection apparatus, infrared light emitted by an infrared light source sequentially passes through a first lens, a SF6 gas chamber, a grating, a second lens and a photoelectric conversion module along the transmission path, wherein a photoelectric detection module uses a thermoelectric stimulated current module, the photoelectric conversion module comprises an optical beam splitter, an optical coupling system, a self-test triggering light source drive circuit, a photoelectric conversion circuit, a synchronization circuit and a signal processing and output circuit, the failure model in the SF6 gas chamber is a metal projection, the metal projection is a composite structure, the internal metal electrode substrate is a nickel alloy, and aluminum, copper and graphene are sequentially wrapped on the surface from inside to outside. With the infrared SF6 gas detection apparatus of the present invention, the defects of the existing SF6 gas decomposition product detection are solved, the on-site SF6 gas decomposition product detection effect is effectively improved, the detection difficulty is reduced, the detection period is shortened, and the continuous online monitoring and analysis judgment function of the SF6 gas state can be achieved.
Description
Technical field
The present invention relates to the detection technique field of SF6 gas, particularly based on the infrared SF6 gas-detecting device of photoelectric conversion technique.
Background technology
In technical field of electric power, gas-insulating and fully-enclosed formula combined electrical apparatus (Gas-insulatedMetal-enclosedSwitchgear, GIS) compact conformation, stable insulation, cutout ability is strong, rate of restriking is low, reliable, is widely used in high pressure and extra-high voltage Force system; GIS adopts SF6 as insulation and arc-extinguishing medium, and its excellent specific property is also mainly derived from the high electric strength of SF6 and strong arc extinction performance characteristic; When there is electric discharge or overheating fault in GIS, SF6 gas can be caused to decompose to a certain extent, not only cause GIS insulating property to reduce, also may cause serious fault.
At present, the preparation of piezo-electricity composite material electrode is general adopts Magnetron Sputtering Thin Film deposition technique, but this technology has the following disadvantages: (1) to equipment and site requirements high; (2) utilization factor of electrode raw material and production efficiency lower; (3) electrode obtained and the adhesion of piezo-electricity composite material poor; Not only containing lead zirconate titanate (PZT) pottery but also containing organic polymer in compound substance; For polymeric material, adopt Conventional wet chemical deposition technique, its preprocessing process needs through the roughening treatment of 60-75 DEG C in a few to tens of minute
Along with automatically controlling and the development of microelectric technique, increasing equipment needs work under the rugged surroundings such as strong acid, highly basic, aggressive atmosphere, high temperature; No matter be large-scale transmission line of electricity, regular industrial instrument, or microelectronic component all be unable to do without with circuit the socket, plug and the electrode (being referred to as electrode below) that are connected each element and circuit; Owing to needing to switch at any time, frequently, usually the materials such as the electrode in equipment strictly cannot be sealed, but if when electrode is exposed or sealing is not good, its material surface is very easily by the dielectric corrosion in environment.
Summary of the invention
Technical matters to be solved by this invention is, overcomes the shortcoming of prior art, provides a kind of infrared SF6 gas-detecting device based on photoelectric conversion technique.
In order to solve above technical matters, the invention provides a kind of infrared SF6 gas-detecting device based on photoelectric conversion technique, device comprises light source, the infrared light launched of light source along its transmission path the first lens, SF6 air chamber, grating, the second lens, the photoelectric conversion module of process successively, wherein, photoelectric detection module adopts pyroelectricity module;
Photoelectric conversion module comprises optical beam-splitter, optical coupling system, self-inspection triggering light source driving circuit, photoelectric switching circuit, synchronizing circuit and signal transacting and output circuit, optical beam-splitter is provided with self-inspection and triggers light source and photo-detector, self-inspection is triggered light source and is connected with synchronizing circuit by self-inspection triggering light source driving circuit, photo-detector is connected with photoelectric switching circuit, photoelectric switching circuit is connected with output circuit with signal transacting respectively at synchronizing circuit, and optical beam-splitter is arranged between photoelectric conversion module and the second lens;
Photoelectric conversion module also by Fiber connection to data processing module, infrared light supply selects mid-infrared light wave band, and infrared light supply selects Elema or metallic filament lamp, and utilizes snoot, the radiation of infrared light supply is converged on a direction; Fault model in SF6 air chamber is metallic projections;
Metallic projections is composite structure, and interior metal electrode matrix is nickel alloy, and surface is coated with aluminium, copper and Graphene with this from inside to outside, and its preparation technology is specially:
A: metal electrode base carry out milling face, welds together alclad sheet and metal electrode base, completes aluminium cladding process by hot rolling technology to metal electrode base;
B: oil removal treatment is carried out to the metal electrode base of coated mistake, consisting of of degreasing fluid: natrium carbonicum calcinatum (Na2CO3) 40-60g/L, sodium phosphate (Na3PO412H2O) 40-60g/L, NaOH (NaOH) 10-50g/L, sodium silicate (Na2SiO39H2O) 5-20g/L, OP-10 emulsifying agent 1-3ml/L, 30-40 DEG C, the oil removing time is 5-10 minute;
C: hydrophilic treatment is carried out to metal electrode base, consisting of of hydrophilic processing liquid: acetonitrile (C2H3N) 10-20%, methylene chloride (CH2Cl2) 5-10%, DMF (C3H7NO) 70-85%, 30-40 DEG C, the hydrophilic time is 3-5 minute;
D: roughening treatment is carried out to metal electrode base, consisting of of coarsening solution: hydrofluorite (HF40%) 100-250ml/L, ammonium bifluoride (NH4HF2) 10-20g/L, room temperature, coarsening time 3-5 minute;
E: colloid palladium activation is carried out to metal electrode base, consisting of of colloid palladium solution: dichloro diamino palladium (Pd (NH3) 2Cl2) 0.05-1.0g/L, stannous chloride (SnCl22H2O) 8-16g/L, hydrochloric acid 10-60ml/L, sodium stannate (Na2SnO33H2O) 0.4-0.8g/L, sodium chloride (NaCl) 100-150g/L, 30-35 DEG C, soak time is 3-5 minute;
F: carry out electroless plating process to after metal electrode base dispergation, copper deposition solution consists of: copper sulphate (CuSO45H2O) 10-15g/L, disodium ethylene diamine tetraacetate (EDTA2Na) 29-44g/L, glyoxalic acid (C2H2O3) 7-12g/L, potassium ferrocyanide 10-20mg/L, a, a '-dipyridine 10-30mg/L, pH13-14,30-40 DEG C, sedimentation time is 10-60 minute;
G: metal electrode base is placed in hydrogen and argon gas mixed gas, after temperature is raised to 900-1200 DEG C, Schilling metal is annealed a period of time, after pass into acetylene carbon source, carbon source generation cracking also at metal surface growing graphene under the catalytic action of metallic copper, namely completes the preparation of metallic projections.
Technique effect: select nickel alloy as electrode matrix in the present invention, due to the specific properties of nickel alloy, be convenient to processing and manufacturing, nickel alloy electrode occurs that in discharge process the number of times of heavy-current discharge is more, causes CF
4generation speed high, especially nickel alloy electric discharge initial stage SO
2f
2with SOF
2gas production rate maximum, and have sluggish trend with the growth of discharge time;
And aluminum is due to themopositive reaction can occur, in course of reaction, there is thermal effect, make SOF
2with SO
2f
2gas production rate all can have rising tendency; SO under cooperation copper electrode simultaneously
2f
2with SOF
2the equal tool of gas production rate linearly rising tendency, and SO
2f
2gas production rate greatly improve;
Meanwhile, the resistivity under Graphene room temperature is about ~ 10-8 Ω m, and can bear the current density up to 108A/cm2, therefore Graphene-copper compound structure has good conductive capability; The C atom of Graphene sp2 hydridization all forms saturated bond, therefore has higher chemical stability, is not easily corroded;
Graphene preparation technology is simple, and mainly process raw material cheap, therefore the cost of Graphene-copper compound structure is far below noble metal electrode simultaneously;
Graphene has higher physical strength, and breaking strength can reach 40N/m, and friction factor is less, and therefore the electrode wear resistance of Graphene-copper compound structure is excellent;
The present invention organically combines SOF
2with SO
2f
2gas happening law, taken into full account SF6 gas shelf depreciation elementary-mid-term-key character of later stage different phase, metal electrode performance improves greatly.
The technical scheme that the present invention limits further is:
Further, the aforesaid infrared SF6 gas-detecting device based on photoelectric conversion technique, mid-infrared light band selection 6-14 micrometer range.
The aforesaid infrared SF6 gas-detecting device based on photoelectric conversion technique, device to the detection of analyte in air chamber for be tetrafluoride sulfonyl SOF4 in SF6 gas in air chamber, the content fluoridizing thionyl SOF2, fluoridize sulfonyl SO2F2 and sulphuric dioxide SO2 tetra-kinds of gas analytes.
Embodiment
embodiment 1
A kind of infrared SF6 gas-detecting device based on photoelectric conversion technique that the present embodiment provides, device comprises light source, the infrared light launched of light source along its transmission path the first lens, SF6 air chamber, grating, the second lens, the photoelectric conversion module of process successively, wherein, photoelectric detection module adopts pyroelectricity module;
Photoelectric conversion module comprises optical beam-splitter, optical coupling system, self-inspection triggering light source driving circuit, photoelectric switching circuit, synchronizing circuit and signal transacting and output circuit, optical beam-splitter is provided with self-inspection and triggers light source and photo-detector, self-inspection is triggered light source and is connected with synchronizing circuit by self-inspection triggering light source driving circuit, photo-detector is connected with photoelectric switching circuit, photoelectric switching circuit is connected with output circuit with signal transacting respectively at synchronizing circuit, and optical beam-splitter is arranged between photoelectric conversion module and the second lens;
Photoelectric conversion module also by Fiber connection to data processing module, infrared light supply selects mid-infrared light wave band, and infrared light supply selects Elema or metallic filament lamp, and utilizes snoot, the radiation of infrared light supply is converged on a direction; Fault model in SF6 air chamber is metallic projections;
Metallic projections is composite structure, and interior metal electrode matrix is nickel alloy, and surface is coated with aluminium, copper and Graphene with this from inside to outside, and its preparation technology is specially:
A: metal electrode base carry out milling face, welds together alclad sheet and metal electrode base, completes aluminium cladding process by hot rolling technology to metal electrode base;
B: oil removal treatment is carried out to the metal electrode base of coated mistake, consisting of of degreasing fluid: natrium carbonicum calcinatum (Na2CO3) 45g/L, sodium phosphate (Na3PO412H2O) 45g/L, NaOH (NaOH) 25g/L, sodium silicate (Na2SiO39H2O) 18g/L, OP-10 emulsifying agent 2ml/L, 30-40 DEG C, the oil removing time is 7 minutes;
C: hydrophilic treatment is carried out to metal electrode base, consisting of of hydrophilic processing liquid: acetonitrile (C2H3N) 10-20%, methylene chloride (CH2Cl2) 7%, DMF (C3H7NO) 81%, 35 DEG C, the hydrophilic time is 4 minutes;
D: roughening treatment is carried out to metal electrode base, consisting of of coarsening solution: hydrofluorite (HF40%) 185ml/L, ammonium bifluoride (NH4HF2) 15g/L, room temperature, coarsening time 4 minutes;
E: colloid palladium activation is carried out to metal electrode base, consisting of of colloid palladium solution: dichloro diamino palladium (Pd (NH3) 2Cl2) 0.55g/L, stannous chloride (SnCl22H2O) 12g/L, hydrochloric acid 35ml/L, sodium stannate (Na2SnO33H2O) 0.6g/L, sodium chloride (NaCl) 125g/L, 32 DEG C, soak time is 3 minutes;
F: carry out electroless plating process to after metal electrode base dispergation, copper deposition solution consists of: copper sulphate (CuSO45H2O) 12g/L, disodium ethylene diamine tetraacetate (EDTA2Na) 36g/L, glyoxalic acid (C2H2O3) 11g/L, potassium ferrocyanide 16mg/L, a, a '-dipyridine 26mg/L, pH14,33 DEG C, sedimentation time is 35 minutes;
G: metal electrode base is placed in hydrogen and argon gas mixed gas, after temperature is raised to 1050 DEG C, Schilling metal is annealed a period of time, after pass into acetylene carbon source, carbon source generation cracking also at metal surface growing graphene under the catalytic action of metallic copper, namely completes the preparation of metallic projections.
embodiment 2
A kind of infrared SF6 gas-detecting device based on photoelectric conversion technique that the present embodiment provides, device comprises light source, the infrared light launched of light source along its transmission path the first lens, SF6 air chamber, grating, the second lens, the photoelectric conversion module of process successively, wherein, photoelectric detection module adopts pyroelectricity module;
Photoelectric conversion module comprises optical beam-splitter, optical coupling system, self-inspection triggering light source driving circuit, photoelectric switching circuit, synchronizing circuit and signal transacting and output circuit, optical beam-splitter is provided with self-inspection and triggers light source and photo-detector, self-inspection is triggered light source and is connected with synchronizing circuit by self-inspection triggering light source driving circuit, photo-detector is connected with photoelectric switching circuit, photoelectric switching circuit is connected with output circuit with signal transacting respectively at synchronizing circuit, and optical beam-splitter is arranged between photoelectric conversion module and the second lens;
Photoelectric conversion module also by Fiber connection to data processing module, infrared light supply selects mid-infrared light wave band, mid-infrared light band selection 6-14 micrometer range, and infrared light supply selects Elema or metallic filament lamp, and utilize snoot, the radiation of infrared light supply is converged on a direction; Fault model in SF6 air chamber is metallic projections, device to the detection of analyte in air chamber for be tetrafluoride sulfonyl SOF4 in SF6 gas in air chamber, the content fluoridizing thionyl SOF2, fluoridize sulfonyl SO2F2 and sulphuric dioxide SO2 tetra-kinds of gas analytes.
Metallic projections is composite structure, and interior metal electrode matrix is nickel alloy, and surface is coated with aluminium, copper and Graphene with this from inside to outside, and its preparation technology is specially:
A: metal electrode base carry out milling face, welds together alclad sheet and metal electrode base, completes aluminium cladding process by hot rolling technology to metal electrode base;
B: oil removal treatment is carried out to the metal electrode base of coated mistake, consisting of of degreasing fluid: natrium carbonicum calcinatum (Na2CO3) 55g/L, sodium phosphate (Na3PO412H2O) 56g/L, NaOH (NaOH) 36g/L, sodium silicate (Na2SiO39H2O) 15g/L, OP-10 emulsifying agent 2ml/L, 35 DEG C, the oil removing time is 7 minutes;
C: hydrophilic treatment is carried out to metal electrode base, consisting of of hydrophilic processing liquid: acetonitrile (C2H3N) 15%, methylene chloride (CH2Cl2) 7%, DMF (C3H7NO) 82%, 31 DEG C, the hydrophilic time is 5 minutes;
D: roughening treatment is carried out to metal electrode base, consisting of of coarsening solution: hydrofluorite (HF40%) 165ml/L, ammonium bifluoride (NH4HF2) 17g/L, room temperature, coarsening time 5 minutes;
E: colloid palladium activation is carried out to metal electrode base, consisting of of colloid palladium solution: dichloro diamino palladium (Pd (NH3) 2Cl2) 0.65g/L, stannous chloride (SnCl22H2O) 11g/L, hydrochloric acid 65ml/L, sodium stannate (Na2SnO33H2O) 0.5g/L, sodium chloride (NaCl) 131g/L, 31 DEG C, soak time is 5 minutes;
F: carry out electroless plating process to after metal electrode base dispergation, copper deposition solution consists of: copper sulphate (CuSO45H2O) 11g/L, disodium ethylene diamine tetraacetate (EDTA2Na) 31g/L, glyoxalic acid (C2H2O3) 11g/L, potassium ferrocyanide 13mg/L, a, a '-dipyridine 35mg/L, pH13.5,31 DEG C, sedimentation time is 56 minutes;
G: metal electrode base is placed in hydrogen and argon gas mixed gas, after temperature is raised to 1150 DEG C, Schilling metal is annealed a period of time, after pass into acetylene carbon source, carbon source generation cracking also at metal surface growing graphene under the catalytic action of metallic copper, namely completes the preparation of metallic projections.
Above embodiment is only and technological thought of the present invention is described, can not limit protection scope of the present invention with this, and every technological thought proposed according to the present invention, any change that technical scheme basis is done, all falls within scope.
Claims (3)
1. the infrared SF6 gas-detecting device based on photoelectric conversion technique, it is characterized in that, described device comprises light source, the infrared light launched of described light source along its transmission path the first lens, SF6 air chamber, grating, the second lens, the photoelectric conversion module of process successively, wherein, described photoelectric detection module adopts pyroelectricity module;
Described photoelectric conversion module comprises optical beam-splitter, optical coupling system, self-inspection triggers light source driving circuit, photoelectric switching circuit, synchronizing circuit and signal transacting and output circuit, described optical beam-splitter is provided with self-inspection and triggers light source and photo-detector, described self-inspection is triggered light source and is connected with synchronizing circuit by self-inspection triggering light source driving circuit, described photo-detector is connected with photoelectric switching circuit, described photoelectric switching circuit is connected with output circuit with signal transacting respectively at synchronizing circuit, described optical beam-splitter is arranged between photoelectric conversion module and the second lens,
Described photoelectric conversion module also by Fiber connection to data processing module, described infrared light supply selects mid-infrared light wave band, and described infrared light supply selects Elema or metallic filament lamp, and utilizes snoot, the radiation of infrared light supply is converged on a direction; Fault model in described SF6 air chamber is metallic projections;
Described metallic projections is composite structure, and interior metal electrode matrix is nickel alloy, and surface is coated with aluminium, copper and Graphene with this from inside to outside, and its preparation technology is specially:
A: metal electrode base carry out milling face, welds together alclad sheet and metal electrode base, completes aluminium cladding process by hot rolling technology to metal electrode base;
B: oil removal treatment is carried out to the metal electrode base of coated mistake, consisting of of degreasing fluid: natrium carbonicum calcinatum (Na2CO3) 40-60g/L, sodium phosphate (Na3PO412H2O) 40-60g/L, sodium silicate (Na2SiO39H2O) 5-20g/L, OP-10 emulsifying agent 1-3ml/L, 30-40 DEG C, the oil removing time is 5-10 minute;
C: hydrophilic treatment is carried out to metal electrode base, consisting of of hydrophilic processing liquid: acetonitrile (C2H3N) 10-20%, methylene chloride (CH2Cl2) 5-10%, DMF (C3H7NO) 70-85%, 30-40 DEG C, the hydrophilic time is 3-5 minute;
D: roughening treatment is carried out to metal electrode base, consisting of of coarsening solution: hydrofluorite (HF40%) 100-250ml/L, ammonium bifluoride (NH4HF2) 10-20g/L, room temperature, coarsening time 3-5 minute;
E: colloid palladium activation is carried out to metal electrode base, consisting of of colloid palladium solution: dichloro diamino palladium (Pd (NH3) 2Cl2) 0.05-1.0g/L, hydrochloric acid 10-60ml/L, sodium stannate (Na2SnO33H2O) 0.4-0.8g/L, sodium chloride (NaCl) 100-150g/L, 30-35 DEG C, soak time is 3-5 minute;
F: carry out electroless plating process to after metal electrode base dispergation, copper deposition solution consists of: copper sulphate (CuSO45H2O) 10-15g/L, disodium ethylene diamine tetraacetate (EDTA2Na) 29-44g/L, glyoxalic acid (C2H2O3) 7-12g/L, potassium ferrocyanide 10-20mg/L, a, a '-dipyridine 10-30mg/L, pH13-14,30-40 DEG C, sedimentation time is 10-60 minute;
G: metal electrode base is placed in hydrogen and argon gas mixed gas, after temperature is raised to 900-1200 DEG C, Schilling metal is annealed a period of time, after pass into acetylene carbon source, carbon source generation cracking also at metal surface growing graphene under the catalytic action of metallic copper, namely completes the preparation of metallic projections.
2. the infrared SF6 gas-detecting device based on photoelectric conversion technique according to claim 1, is characterized in that, described mid-infrared light band selection 6-14 micrometer range.
3. the infrared SF6 gas-detecting device based on photoelectric conversion technique according to claim 1, it is characterized in that, described device to the detection of analyte in air chamber for be tetrafluoride sulfonyl SOF4 in SF6 gas in air chamber, the content fluoridizing thionyl SOF2, fluoridize sulfonyl SO2F2 and sulphuric dioxide SO2 tetra-kinds of gas analytes.
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| CN109894611A (en) * | 2019-03-29 | 2019-06-18 | 南京邮电大学 | A kind of Electroless Cu Plating iron cobalt-based composite anticorrosive absorbing material and its preparation method and application |
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| CN105181599B (en) | 2018-06-26 |
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