CN105047642B - Port protection circuit integrated package - Google Patents

Port protection circuit integrated package Download PDF

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Publication number
CN105047642B
CN105047642B CN201510494334.3A CN201510494334A CN105047642B CN 105047642 B CN105047642 B CN 105047642B CN 201510494334 A CN201510494334 A CN 201510494334A CN 105047642 B CN105047642 B CN 105047642B
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China
Prior art keywords
circuit
integrated package
port
substrate
circuit integrated
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CN201510494334.3A
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Chinese (zh)
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CN105047642A (en
Inventor
苟引刚
王久
高桂丽
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Shenzhen Penang Electronics Co ltd
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Shenzhen Penang Electronics Co ltd
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Priority to CN201510494334.3A priority Critical patent/CN105047642B/en
Publication of CN105047642A publication Critical patent/CN105047642A/en
Priority to PCT/CN2016/094533 priority patent/WO2017025043A1/en
Application granted granted Critical
Publication of CN105047642B publication Critical patent/CN105047642B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

The application discloses port protection circuit integrated package, this embodiment adopts matrix structure and the conductive packaging matrix of longitudinal distribution to encapsulate a plurality of circuit modules, has reduced the subsides area of printed wiring board and the distribution interval of components and parts that occupy when component transverse distribution, and integrated structure is simple, practices thrift electronic equipment's accommodation space. In addition, the embodiment can reduce the welding procedure of an application end through the connection of the conductive packaging matrix, and has the advantages of less labor consumption and high production efficiency. In addition, the module comprises at least one circuit surge protection element, so that the miniaturization development of equipment in the port protection field is realized while the distribution volume of protection devices is reduced. And the staggered distribution of the longitudinal connecting pieces improves the protection performance and the product stability, is applied to the field of port circuit overvoltage protection, and can solve the contradiction between small distribution volume, small accommodating space and poor overvoltage performance.

Description

Port protection circuit integrated package
Technical Field
The application relates to the field of port circuit protection, in particular to a port protection circuit integrated package.
Background
At present, the scope of lightning disasters is spread over various industries, and advanced electronic devices such as computer networks, measurement, monitoring, protection and the like which take large-scale integrated circuits as core components are widely applied to industries such as electric power, aviation, national defense, security, communication, broadcast television, finance, traffic, petrifaction, medical treatment and the like, and are widely applied to various fields of other modern life, and the advanced electronic devices generally have the defect of weak tolerance to transient overvoltage and overcurrent. It is not difficult to see that, with the continuous intensive research of information industry technology and the development requirement of miniaturized electronic equipment, the lightning protection element is a key device for lightning protection, overvoltage protection and overcurrent protection, and is indispensable, and the development direction of miniaturization and integration of the electronic equipment must be satisfied.
In the field of port technology, bob smith circuits used as electrical isolation are widely used as an industry standard in interface circuits. At present, the overvoltage and overcurrent protection scheme for applying the Bob Smith circuit to the interface circuit is realized by pasting discrete components and single protection devices of the Bob Smith circuit on a circuit board through a plurality of pasting processes, or forming a module by welding the discrete components and the single protection devices, and then pasting the module on the circuit board to realize the interface protection circuit, so that the steps of module welding and the realization of the circuit board for a plurality of pasting are more, time and labor are consumed, the testing steps are complicated, and the production efficiency is reduced; and the interface protection circuit formed by the discrete component welding and the common welding module occupies a larger area of the PCB, and the service performance of the product is reduced. In addition, the common welding module mode has high technical requirements on welding, has poor circuit welding stability, cannot realize batch high-efficiency production, and cannot meet the development trend of miniaturization, integration, high-efficiency production and high performance of electronic equipment.
Disclosure of Invention
The embodiment of the application provides an integrated package of port protection circuit, which solves the problems of time consumption, multiple procedures, large occupied area of PCB, low production efficiency and poor product stability of the existing port circuit.
In a first aspect, embodiments of the present application provide a port protection circuit integrated package, including:
at least two matrixes which are distributed at intervals up and down, wherein each matrix comprises at least one conductive connecting piece for electric connection;
at least one circuit module distributed between adjacent substrates, wherein each circuit module comprises at least one element and/or at least one integrated packaging module, each integrated packaging module comprises at least two elements, and at least one element in all elements is a circuit protection element; at least one pin connection end of at least one element in all circuit modules distributed between adjacent matrixes is used as an external electrode terminal, and the at least one circuit module distributed between the adjacent matrixes is connected with at least one matrix in the adjacent matrixes through the electrical connection of the external electrode terminal and the conductive connecting piece of the at least one matrix; the components in all circuit modules which are in circuit interconnection relationship are interconnected through interconnection pin connection ends of the components; and/or the number of the groups of groups,
the components in all circuit modules which are in circuit interconnection relation are interconnected with the electrical connection of the same conductive connecting piece through the interconnection pin connecting end; and/or the number of the groups of groups,
The port protection circuit integrated package further comprises a first interconnection element, wherein part or all of the elements in all circuit modules are in circuit interconnection relation, are connected with the conductive connection elements in one-to-one correspondence through the interconnection pin connection ends, and are interconnected through the first interconnection element arranged between the conductive connection elements in the corresponding connection.
With reference to the first aspect, in a first possible implementation manner, each of the substrates is a conductive package substrate;
each of the substrates includes at least one conductive connector for electrical connection, comprising:
each conductive package substrate is a conductive connecting piece for electrical connection.
With reference to the first possible implementation manner of the first aspect, in a second possible implementation manner, the port protection circuit integrated package further includes a first interconnect, including:
the port protection circuit integrated package further comprises a first longitudinal interconnection, wherein part or all of the components in circuit module with circuit interconnection relationship are connected with the conductive package substrates in a one-to-one correspondence through the interconnection pin connection ends, and are interconnected through the first longitudinal interconnection arranged between the conductive package substrates which are correspondingly connected.
With reference to the second possible implementation manner of the first aspect, in a third possible implementation manner, the first longitudinal interconnection is that any one of the conductive package matrixes of the corresponding connection extends longitudinally to another one of the conductive package matrixes.
With reference to the third possible implementation manner of the first aspect, in a fourth possible implementation manner, the method further includes:
an encapsulation shell or encapsulation filler for encapsulating all conductive package matrices and all circuit modules in the port guard circuit integrated package;
the base body is used for externally connecting the port protection circuit integrated package to an external circuit, each base body is used for externally connecting the port protection circuit integrated package to the external circuit, and the external connection piece is formed by extending the base body to which the external connection piece belongs out of the encapsulation shell or the filling body.
With reference to the fourth possible implementation manner of the first aspect, in a fifth possible implementation manner,
and a grid, a groove or a boss is arranged at the connection part of the surface of at least one matrix and the external electrode terminal.
With reference to the fifth possible implementation manner of the first aspect, in a sixth possible implementation manner, a thickness of the substrate is greater than or equal to 0.05mm and less than or equal to 1.5mm.
With reference to the fourth possible implementation manner of the first aspect, in a seventh possible implementation manner, the external connection piece includes a first extension portion, the first extension portion extends longitudinally out of the encapsulation shell or the encapsulation filler for the matrix including the external connection piece, and the external connection pieces located on the same side of the port protection circuit integrated package are distributed in a staggered manner.
With reference to the seventh possible implementation manner of the first aspect, in an eighth possible implementation manner, the external connection piece further includes a second extension portion, where the second extension portion is formed by transversely extending an end of the first extension portion.
With reference to the fourth possible implementation manner of the first aspect, in a ninth possible implementation manner, the external connection piece includes a first extension portion and a second extension portion, the first extension portion is that the base body including the external connection piece longitudinally extends to the encapsulation shell or the filling body, and the second extension portion is that the tail end of the first extension portion is far away from the base body and transversely extends out of the encapsulation shell or the filling body, and the external connection pieces located on the same side of the port protection circuit integrated package are distributed in a staggered manner.
With reference to the first aspect or any one of the first to ninth possible implementations of the first aspect, in a tenth possible implementation,
the components in all circuit modules further comprise at least one port protection circuit basic component, wherein the port protection circuit basic component comprises any one of a resistor, a capacitor, an inductor, a fuse and a surge protection device;
the circuit protection element comprises a gas discharge tube or a transient voltage suppressor or a piezoresistor or a thermistor or a semiconductor discharge tube or a fuse.
With reference to the first aspect or any one of the first to ninth possible implementation manners of the first aspect, in an eleventh possible implementation manner, the port protection circuit integrated package includes at least one circuit module distributed between adjacent substrates, including:
the port protection circuit integrated package comprises at least one circuit module including RC integrated modules distributed between adjacent substrates, wherein the RC integrated modules comprise a first resistor and a first capacitor which are in serial connection, and the RC integrated modules comprise:
The first capacitor electrode layer, the first dielectric layer and the resistive layer are laminated in this order.
With reference to the eleventh possible implementation manner of the first aspect, in a twelfth possible implementation manner, the first dielectric layer includes N dielectric layers that are stacked in an aligned manner and pressed together, and an inner electrode layer is connected between every two adjacent dielectric layers in all N dielectric layers; and N is an integer greater than 0.
With reference to the twelfth possible implementation manner of the first aspect, in a thirteenth possible implementation manner, the RC integrated module further includes:
and a second capacitance electrode layer laminated between the first dielectric layer and the resistive layer.
With reference to the thirteenth possible implementation manner of the first aspect, in a fourteenth possible implementation manner, the resistive layer includes:
the first resistor paste printing layer and the resistor electrode layer are laminated from bottom to top.
With reference to the fourteenth possible implementation manner of the first aspect, in a fifteenth possible implementation manner, the RC integrated module further includes:
a second dielectric layer laminated on the surface of the second capacitance electrode layer;
the second dielectric layer is provided with a through hole;
the resistive layer includes:
The first resistance paste printing layer is used for filling the through hole and is printed on the surface of the second capacitance electrode layer in the through hole;
and the resistor electrode layer is laminated on the surface of the first resistor paste printing layer.
With reference to the fifteenth possible implementation manner of the first aspect, in a sixteenth possible implementation manner, the first dielectric layer is a first ceramic dielectric matrix used to fabricate a capacitor, and the second dielectric layer is a second ceramic dielectric matrix used to fabricate a capacitor.
With reference to the sixteenth possible implementation manner of the first aspect, in a seventeenth possible implementation manner, the first ceramic dielectric substrate is a barium carbonate dielectric substrate, a calcium titanate dielectric substrate, or a magnesium titanate dielectric substrate.
With reference to the seventeenth possible implementation manner of the first aspect, in an eighteenth possible implementation manner, the first capacitive electrode layer, the second capacitive electrode layer, and the resistive electrode layer include palladium, platinum, gold, silver, copper, nickel, or an alloy formed by at least two metals thereof.
With reference to the eighteenth possible implementation manner of the first aspect, in a nineteenth possible implementation manner, the first resistive paste printing layer is a ruthenium-based resistive paste.
With reference to the eleventh possible implementation manner of the first aspect, in a twentieth possible implementation manner, elements in all circuit modules further include at least one port protection circuit basic element, including:
the elements in all the circuit modules further comprise N resistors and N capacitors, wherein N is greater than or equal to 1, the N resistors are electrically connected in series with the N capacitors in a one-to-one correspondence manner, and a first pin connection end of any resistor is connected to a first pin connection end of the capacitor correspondingly connected with the resistor;
and the elements in all the circuit modules further comprise N circuit protection elements, all the N circuit protection elements are electrically connected with the N resistors in a one-to-one correspondence manner, the N circuit protection elements are electrically connected with the N capacitors in a one-to-one correspondence manner, wherein the second pin connection end of each resistor and the second pin connection end of each capacitor are connected with the two pin connection ends of the corresponding circuit protection elements in a one-to-one correspondence manner, and the second pin connection ends of all the capacitors are connected with each other.
With reference to the eleventh possible implementation manner of the first aspect, in a twenty-first possible implementation manner, the port protection circuit integrated package includes at least two matrixes distributed at intervals, including:
The port protection circuit integrated package comprises a first substrate, a second substrate and a third substrate which are distributed at intervals up and down;
a first circuit module is distributed between the adjacent first substrate and the second substrate, the first circuit module comprises the RC integrated module, a pin connecting end of the first resistor and a pin connecting end of the first capacitor except for pin connecting ends of the first resistor and the first capacitor which are connected in series are used as two external electrode terminals of the first circuit module, and the first circuit module is electrically connected with the first substrate and the second substrate through the two external electrode terminals of the first circuit module and the first substrate and the second substrate in one-to-one correspondence;
a second circuit module is distributed between the second substrate and the third substrate which are adjacent, the second circuit module comprises one circuit protection element, and two pin connection ends of the circuit protection element are used as two external electrode terminals of the second circuit module; the second circuit module is connected with the second substrate and the third substrate through corresponding electric connection between the two external electrode terminals of the second circuit module and the second substrate and the third substrate.
With reference to the twenty-first possible implementation manner of the first aspect, in a twenty-second possible implementation manner, the circuit protection element and the first capacitor/the first resistor are elements for externally connecting the port protection circuit integrated package to an external circuit, the first substrate, the second substrate, and the third substrate are three conductive package substrates for externally connecting the port protection circuit integrated package to the external circuit, and the first substrate, the second substrate, and the third substrate respectively include one external connection.
With reference to the twenty-second possible implementation manner of the first aspect, in a twenty-third possible implementation manner, the external connection piece of the first substrate and the external connection piece of the third substrate are located on the same side of the port protection circuit integrated package.
With reference to the twenty-first possible implementation manner of the first aspect, in a twenty-fourth possible implementation manner, the circuit protection element is an element for externally connecting the port protection circuit integrated package to an external circuit, the second substrate and the third substrate are respectively used as conductive package substrates for externally connecting the port protection circuit integrated package to the external circuit, and the second substrate and the third substrate respectively include one external connection piece;
A pin connection end of the first resistor/the first capacitor except for the first resistor and the first capacitor which are connected in series is correspondingly connected with two pin connection ends of the circuit protection element one by one to be connected with each other, and the pin connection end of the first resistor/the first capacitor except for the first resistor and the first capacitor which are connected in series is electrically connected with the pin connection end of the circuit protection element and the second substrate to be connected with each other; the method comprises the steps of,
the port guard circuit integrated package further includes a first interconnect comprising:
the port guard circuit integrated package further includes the first longitudinal interconnect connected between the first and third matrices and for interconnecting the first resistor/first capacitor with the circuit guard element.
With reference to the twenty-fourth possible implementation manner of the first aspect, in a twenty-fifth possible implementation manner,
the first longitudinal interconnect is an end of the first substrate extending toward the third substrate to the third substrate.
With reference to the twenty-first possible implementation manner of the first aspect, in a twenty-sixth possible implementation manner, a thickness of all substrates is greater than or equal to 0.1mm and less than or equal to 0.3mm; the port protection circuit integrated package is square or cuboid, the thickness of the port protection circuit integrated package is less than or equal to 2.5mm and greater than or equal to 1.0mm, the length of the port protection circuit integrated package is less than or equal to 6mm and greater than or equal to 1.5mm, and the width of the port protection circuit integrated package is less than or equal to 6mm and greater than or equal to 1.5mm.
With reference to the twenty-first possible implementation manner of the first aspect, in a twenty-seventh possible implementation manner, a thickness of all substrates is greater than or equal to 0.2mm and less than or equal to 0.3mm; the port protection circuit integrated package is square or cuboid, the thickness of the port protection circuit integrated package is less than or equal to 2.5mm and greater than or equal to 1.5mm, the length of the port protection circuit integrated package is less than or equal to 5.5mm and greater than or equal to 5mm, and the width of the port protection circuit integrated package is less than or equal to 3.6mm and greater than or equal to 3mm.
With reference to the first aspect, in a twenty-eighth possible implementation manner, each of the substrates is an insulating package substrate;
each of the substrates includes at least one conductive connector for electrical connection, comprising:
at least one conductive connecting piece for electric connection is attached to the outer surface of each base body.
With reference to the twenty-eighth possible implementation manner of the first aspect, in a twenty-ninth possible implementation manner,
at least one conductive connecting piece for electrical connection is attached to the outer surface of each substrate, and the conductive connecting piece comprises:
At least one conductive connecting piece for electric connection is attached to the upper surface and/or the lower surface of each carrier.
With reference to the twenty-ninth possible implementation manner of the first aspect, in a thirty-first possible implementation manner,
the port guard circuit integrated package further includes a first interconnect comprising:
the port guard circuit integrated package further includes a first longitudinal interconnect;
the elements are distributed among different adjacent matrixes and are in circuit interconnection relation, are connected with the conductive connecting pieces in one-to-one correspondence through the interconnection pin connecting ends, and are interconnected through the first longitudinal interconnecting pieces arranged among the conductive connecting pieces which are correspondingly connected;
the projection of the corresponding connected conductive connecting piece perpendicular to the plane of the matrix is provided with a first intersection area;
the port guard circuit integrated package further includes:
the corresponding connected conductive connecting pieces and the areas between the conductive connecting pieces are provided with first through holes penetrating through the corresponding positions of the first intersection areas; the first longitudinal interconnect is connected between the conductive connections of the corresponding connection through the first via.
With reference to the thirty-first possible implementation manner of the first aspect, in a thirty-first possible implementation manner, all the matrixes are distributed in parallel and spaced up and down, and all the first longitudinal interconnects are perpendicular to the matrixes and located on the same side of the matrixes.
The port protection circuit integrated package provided by the embodiment of the application adopts the longitudinally distributed matrix structure and the conductive connecting pieces of the matrix to package a plurality of circuit modules, reduces the surface area of the printed circuit board occupied when elements are transversely distributed, and has the advantages of simple integrated structure and capability of saving the accommodating space of electronic equipment, along with the distribution interval between the elements and the distribution interval between the PCB wirings. In addition, the welding process of the application end can be reduced through the connection of the conductive connecting piece, the manufacturing process of the PCB patch can be reduced, the working hour is less, and the production efficiency is high. In addition, the distribution volume of the protection devices is reduced, and at least one circuit protection element is integrated to improve the port protection performance, so that the miniaturization development of equipment in the field of port protection can be realized. And the regular distribution of the longitudinal connecting pieces improves the protection performance and the product stability, is applied to the field of port circuit overvoltage protection, and can solve the contradiction between small distribution volume, small accommodating space and poor overvoltage performance.
In addition, the embodiment reduces the application test standards of a plurality of elements, and can realize batch standardized production of port circuits applying the Bob Smith port circuit overvoltage protection scheme only by adjusting and confirming the performance test standards and the product realization standards of the integrated component.
In addition, the embodiment can reduce the actions of multiple independent performance tests during the production of multiple discrete components and the combined performance test of multiple component circuits during the application of the whole machine, realizes the production of one port protection circuit by applying one Bob Smith overvoltage protection product and one chip welding, and one component by one product test and one performance test, so that the working procedures of equipment using the port protection circuit in the implementation are greatly reduced, the equipment production time is saved, and the production efficiency is improved.
In addition, the standardized production of the integrated piece can ensure the stability of circuit application connection, and the reduction of the welding times of the circuit board during the production of equipment can also improve the stability of circuit application connection.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1a is a front cross-sectional view of a port protection circuit integrated package provided in an embodiment of the present application;
fig. 1b is a schematic structural diagram of an RC integrated module according to an embodiment of the present disclosure;
fig. 1c is a circuit structure diagram of a port protection circuit integrated package according to an embodiment of the present application;
fig. 1d is an application circuit diagram of a port protection circuit integrated package according to an embodiment of the present application;
FIG. 2a is a block diagram of an RC integrated module according to an embodiment of the present disclosure;
FIG. 2b is another block diagram of an RC integrated module according to an embodiment of the present disclosure;
FIG. 3a is a circuit configuration of another port protection circuit integrated package according to an embodiment of the present disclosure;
FIG. 3b is a front cross-sectional view of another port guard circuit integrated package provided in an embodiment of the present application;
fig. 4 is a circuit configuration diagram of another port protection circuit integrated package according to the present embodiment;
fig. 5 is a circuit structure diagram of another port protection circuit integrated package according to the present embodiment.
Detailed Description
The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. The following will each explain in detail by means of specific examples.
Because of the miniaturization of the equipment, the area and the volume of the equipment are greatly reduced compared with the prior equipment, however, the interference resistance is weaker and weaker, and the lightning protection requirement on the equipment is more and more severe. Accordingly, the present embodiment provides a port guard circuit integrated package, comprising:
at least two matrixes which are distributed at intervals up and down, wherein each matrix comprises at least one conductive connecting piece for electric connection;
at least one circuit module distributed between adjacent matrixes, wherein each circuit module comprises at least one element and/or at least one integrated packaging module, each integrated packaging module comprises at least two elements, each element comprises at least one pin connecting end, and at least one element in all elements is a circuit protection element; at least one pin connection end of at least one element in all the circuit modules distributed between the adjacent matrixes is used as an external electrode terminal, and the at least one circuit module distributed between the adjacent matrixes is connected with at least one matrix in the adjacent matrixes through the electrical connection between the external electrode terminal and the conductive connecting piece of the at least one matrix; all or part of the elements with circuit interconnection relationship in all the circuit modules are interconnected through the interconnection pin connection ends; and/or the number of the groups of groups,
The components with circuit interconnection relations in all circuit modules are interconnected with the electrical connection of the same conductive connecting piece through the interconnection pin connecting ends; and/or the number of the groups of groups,
the port protection circuit integrated package further includes a first interconnect, and some or all of the components of the circuit modules having a circuit interconnect relationship are connected in one-to-one correspondence with the conductive connectors through interconnect pin connection terminals, and are interconnected by the first interconnect disposed between the correspondingly connected conductive connectors.
As an alternative embodiment, each substrate is a conductive encapsulation substrate;
each substrate includes at least one conductive connector for electrical connection, comprising:
each conductive package substrate is a conductive connection piece for electrical connection. Therefore, at least one circuit module distributed between adjacent substrates is connected with at least one substrate of the adjacent substrates through the electrical connection of the external electrode terminal and the conductive connection piece of at least one substrate, comprising:
at least one circuit module distributed between adjacent substrates is connected with at least one substrate in the adjacent substrates through the electrical connection of the external electrode terminal and the at least one substrate.
As an alternative embodiment, the port guard circuit integrated package further includes a first interconnect comprising:
the port protection circuit integrated package further comprises first longitudinal interconnects, wherein the first longitudinal interconnects are formed by connecting parts, which are in part or all of the circuit modules, with the conductive package substrates in a one-to-one correspondence through the interconnection pin connection ends, and interconnecting through the first longitudinal interconnects arranged between the conductive package substrates which are correspondingly connected.
As an alternative embodiment, the conductive package bases correspondingly connected to the interconnection pin connection ends of the elements having the circuit interconnection relationship are interconnected by a first longitudinal interconnection, which is a longitudinal extension of the end of any one of the correspondingly connected conductive package bases to the other conductive package base.
As an alternative embodiment, the conductive packaging substrate is a conductive connecting piece, specifically a conductive frame, where the conductive frame includes a conductive tray and conductive pins formed by extending the conductive tray, the conductive tray is used for packaging components, the conductive pins are used for connecting with pin connection ends of an external circuit or an interconnection component, and part or all of components with interconnection relationship are interconnected with connection of the same conductive tray through the interconnection pin connection ends, or/and part or all of components with interconnection relationship are interconnected through longitudinally extending conductive pins.
As an alternative embodiment, the conductive frame is a metal frame.
As an alternative embodiment, the metal frame is a copper lead frame.
As an alternative embodiment, the port guard circuit integrated package further comprises:
an encapsulation shell or encapsulation filler for encapsulating all conductive package matrices and all circuit modules in the port guard circuit integrated package;
the method comprises the following steps:
the external connection connector comprises an external connection shell and at least one matrix used for integrating the packaging piece of the external port protection circuit to the external circuit, wherein the at least one matrix used for integrating the packaging piece of the external port protection circuit to the external circuit further comprises the external connection piece, and the external connection piece is formed by extending the matrix to which the external connection piece belongs out of the packaging shell or the filling body.
As an alternative embodiment, the portion of the base body connected to the external electrode terminal is provided with a grid or square groove or u-shaped groove or boss.
As an alternative embodiment, the thickness of the substrate is greater than or equal to 0.05mm and less than or equal to 1.5mm.
Preferably, the thickness of the substrate is greater than or equal to 0.08mm and less than or equal to 1.4mm.
Preferably, the thickness of the substrate is greater than or equal to 0.09mm and less than or equal to 1.3mm.
Preferably, the thickness of the substrate is greater than or equal to 0.1mm and less than or equal to 1.2mm.
Preferably, the thickness of the substrate is 0.2mm or 0.3mm or 0.4mm or 0.5mm or 0.6mm or 0.7mm or 0.8mm or 0.9mm or 1.0mm or 1.1mm or 1.2mm or 1.35mm or 1.45mm or 0.45mm or 0.55mm or 0.65mm or 0.75mm or 0.48mm or 0.49mm or 0.43mm, and the specific implementation is not limited by a single embodiment.
As an alternative embodiment, the external connection piece comprises a first extension part, wherein the first extension part is that the tail end of the basal body comprising the external connection piece extends out of the encapsulation shell or the encapsulation filling body along the direction vertical to the basal body, and the external connection pieces positioned on the same side of the port protection circuit integrated encapsulation piece are distributed in a staggered way.
As an alternative embodiment, the external connection piece comprises a first extension part, wherein the first extension part is that the tail end of the basal body comprising the external connection piece extends to the outer surface of the encapsulation shell or the encapsulation filling body along the direction vertical to the basal body, and the external connection pieces positioned on the same side of the port protection circuit integrated encapsulation piece are distributed in a staggered way.
As an alternative embodiment, the external connection piece includes a first extension portion and a second extension portion, the first extension portion is formed by extending the end of the base body including the external connection piece out of the encapsulation shell or the encapsulation filling body along the direction perpendicular to the base body, and the second extension portion is formed by horizontally extending the end of the first extension portion along the direction perpendicular to the first extension portion.
As an alternative embodiment, the external connection piece comprises a first extension part and a second extension part, the first extension part is formed by extending the tail end of the base body of the external connection piece out of the encapsulation shell or the encapsulation filling body along the direction vertical to the base body, and the second extension part is formed by horizontally extending the tail end of the first extension part back to the base body along the direction vertical to the first extension part.
As an alternative embodiment, the external connection piece comprises a first extension part and a second extension part, the first extension part is formed by extending the tail end of the base body comprising the external connection piece out of the encapsulation shell or the encapsulation filling body along the direction perpendicular to the base body, and the second extension part is formed by extending the tail end of the first extension part transversely towards the base body along the direction perpendicular to the first extension part.
As an alternative embodiment, the external connection piece comprises a first extension part and a second extension part, the first extension part is formed by extending the tail end of the base body comprising the external connection piece to the outer surface of the encapsulation shell or the encapsulation filling body along the direction perpendicular to the base body, and the second extension part is formed by extending the tail end of the first extension part transversely back to the base body along the direction perpendicular to the first extension part.
As an alternative embodiment, the external connection member includes a first extension portion and a second extension portion, the first extension portion is formed by extending the end of the base body including the external connection member to the outer surface of the encapsulation housing or the encapsulation filler along the direction perpendicular to the base body, and the second extension portion is formed by extending the end of the first extension portion transversely toward the base body along the direction perpendicular to the first extension portion.
As an alternative embodiment, the external connection piece includes a first extension portion and a second extension portion, the first extension portion is that the substrate including the external connection piece extends to the inner edge of the encapsulation shell or the filling body along the direction perpendicular to the substrate, the second extension portion is that the tail end of the first extension portion extends out of the encapsulation shell or the encapsulation filling body along the direction perpendicular to the first extension portion away from the substrate, and the external connection pieces located on the same side of the port protection circuit integrated package are distributed in a staggered mode.
As an alternative embodiment, at least one port protection circuit basic element is further included, the port protection circuit basic element includes any one of a resistor, a capacitor, an inductor, a fuse, and a surge protection device, and the circuit protection element includes a gas discharge tube or a transient voltage suppressor or a varistor or a thermistor or a semiconductor discharge tube or a fuse.
As an alternative embodiment, the surge protection device comprises a gas discharge tube or a transient voltage suppressor or a varistor or a thermistor or a semiconductor discharge tube or a fuse.
As an alternative embodiment, a port guard circuit integrated package includes at least one circuit module distributed between adjacent substrates, comprising:
The port protection circuit integrated package comprises a circuit module including RC integrated modules distributed between adjacent substrates, wherein the RC integrated modules comprise a first resistor and a first capacitor having a series connection relationship, and the RC integrated modules comprise:
the first capacitor electrode layer, the first ceramic substrate, the second capacitor electrode layer and the resistor printing layer are sequentially laminated.
As an alternative embodiment, the RC integrated module further includes:
the second ceramic matrix is laminated on the surface of the second capacitor electrode layer and is provided with a through hole;
the resistor printing layer comprises:
the first resistor printing layer is used for filling the through hole and is printed on the surface of the second capacitor electrode layer in the through hole;
and a resistive electrode layer printed on the surface of the first resistive printing layer.
As an alternative embodiment, a port guard circuit integrated package includes at least one circuit module distributed between adjacent substrates, comprising:
the port protection circuit integrated package of (1) includes at least one circuit module including an RC integrated module distributed between adjacent substrates, the RC integrated module including a first resistor and a first capacitor in series relationship, wherein the RC integrated module includes:
the first capacitor electrode layer, the first dielectric layer and the resistive layer are laminated in this order.
As an alternative implementation mode, the first dielectric layer comprises N dielectric layers which are stacked in an alignment mode and pressed, and an inner electrode layer is connected between every two adjacent dielectric layers in all N dielectric layers; n is an integer greater than 0.
As an alternative embodiment, the RC integrated module further includes:
and a second capacitance electrode layer laminated between the first dielectric layer and the resistive layer.
As an alternative embodiment, the resistive layer includes:
the first resistor paste printing layer and the resistor electrode layer are laminated from bottom to top.
As an alternative embodiment, the RC integrated module further includes:
a second dielectric layer laminated on the surface of the second capacitance electrode layer;
the second dielectric layer is provided with a through hole;
the resistive layer includes:
the first resistor paste printing layer is used for filling the through hole and is printed on the surface of the second capacitor electrode layer in the through hole;
and a resistive electrode layer laminated on the surface of the first resistive paste printing layer.
As an alternative embodiment, the first dielectric layer is a first ceramic dielectric matrix for fabricating a capacitor and the second dielectric layer is a second ceramic dielectric matrix for fabricating a capacitor.
As an alternative embodiment, the first ceramic dielectric matrix is a barium carbonate dielectric matrix, a calcium titanate dielectric matrix, or a magnesium titanate dielectric matrix.
As an alternative embodiment, the first capacitive electrode layer, the second capacitive electrode layer, the resistive electrode layer comprise palladium, platinum, gold, silver, copper, nickel or an alloy of at least two metals thereof.
As an alternative embodiment, the first resistive paste print layer is a ruthenium-based resistive paste.
As an alternative implementation manner, at least one element in all circuit modules is a circuit protection element, 2N port protection circuit basic elements are also provided, N is greater than or equal to 1,2N, N elements in the port protection circuit basic elements are resistors, the other N elements are capacitors, the N resistors are electrically connected in series with the N capacitors in a one-to-one correspondence manner, wherein a first pin connection end of each resistor is connected to a first pin connection end of a capacitor correspondingly connected with the resistor;
and the circuit protection device further comprises N circuit protection elements, all the circuit protection elements are electrically connected with N resistors in a one-to-one correspondence manner, all the circuit protection elements are electrically connected with N capacitors in a one-to-one correspondence manner, wherein one of two pin connection ends of any one circuit protection element is connected to a second pin connection end of a resistor correspondingly connected with the circuit protection element, the other pin connection end of the two pin connection ends of any circuit protection element is connected to a second pin connection end of a capacitor correspondingly connected with the circuit protection element, and the second pin connection ends of all the capacitors are connected with each other.
Another embodiment
The present embodiment provides a port protection circuit integrated package, including:
at least two matrixes which are distributed at intervals up and down, wherein each matrix comprises at least one conductive connecting piece for electric connection;
at least one circuit module distributed between adjacent matrixes, wherein each circuit module comprises at least one element and/or at least one integrated packaging module, each integrated packaging module comprises at least two elements, each element comprises at least one pin connecting end, and at least one element in all elements is a circuit protection element; at least one pin connection end of at least one element in all the circuit modules distributed between the adjacent matrixes is used as an external electrode terminal, and the at least one circuit module distributed between the adjacent matrixes is connected with at least one matrix in the adjacent matrixes through the electrical connection between the external electrode terminal and the conductive connecting piece of the at least one matrix; all or part of the elements with circuit interconnection relationship in all the circuit modules are interconnected through interconnection pin connection ends; and/or the number of the groups of groups,
the components with circuit interconnection relations in all circuit modules are interconnected with the electrical connection of the same conductive connecting piece through the interconnection pin connecting ends; and/or the number of the groups of groups,
The port protection circuit integrated package component further comprises first interconnection elements, wherein part or all of the components with circuit interconnection relations in all circuit modules are connected with the conductive connection elements in a one-to-one correspondence through interconnection pin connection ends, and are interconnected through the first interconnection elements arranged between the conductive connection elements in the corresponding connection.
In this embodiment, one of all the components is a circuit protection component, and further includes two port protection circuit basic components, namely a first resistor and a first capacitor having a serial interconnection relationship. The following will take a circuit structure in which a first resistor and a first capacitor are connected in series as an example, and specifically describe a port protection circuit integrated package according to this embodiment, which is implemented by using fig. 1a to 5. Referring to fig. 1a to fig. 2b, fig. 1a is a front cross-sectional view of a port protection circuit integrated package according to an embodiment of the present application; fig. 1b is a schematic structural diagram of an RC integrated module according to an embodiment of the present disclosure; fig. 1c is a circuit structure diagram of a port protection circuit integrated package according to an embodiment of the present application; fig. 1d is an application circuit diagram of a port protection circuit integrated package according to an embodiment of the present application. Taking three substrates and one circuit module distributed between adjacent substrates as an example, as shown in fig. 1a, the port protection circuit integrated package provided in this embodiment includes a first substrate Z1, a second substrate Z2, and a third substrate Z3, and includes a first circuit module M1 distributed between the adjacent first substrate Z1 and the second substrate Z2, and includes a second circuit module M2 distributed between the adjacent second substrate Z2 and the third substrate Z3; and the first circuit module M1 includes an RC integrated module, as shown in fig. 1b, where the RC integrated module includes a first resistor R and a first capacitor C having a serial interconnection relationship, and the first resistor R and the first capacitor C are distributed in a longitudinal structure, i.e., two opposite ends of the RC integrated module are pin connection ends of an external circuit thereof. The second circuit module M2 includes a circuit protection device, the first substrate Z1 includes an external connection 110, the second substrate Z2 includes an external connection 120, and the third substrate Z3 includes an external connection 130. The first substrate Z1, the second substrate Z2, and the third substrate Z3 are all conductive package substrates.
In this embodiment, the first pin connection end of the first resistor R and the first pin connection end of the first capacitor C are used as two external electrode terminals of the first circuit module M1, the second pin connection end of the first resistor R and the second pin connection end of the first capacitor C are connected in series, and the first circuit module M1 is connected with the first substrate Z1 and the second substrate Z2 through the two external electrode terminals of the first circuit module M1 and the corresponding electrical connection of the first substrate Z1 and the second substrate Z2. The two pin connecting ends of the circuit protection element are used as two external electrode terminals of the second circuit module M2; the second circuit module M2 is electrically connected to the second substrate Z2 and the third substrate Z3 through the corresponding electrical connection between the two external electrode terminals of the second circuit module M2 and the second substrate Z2 and the third substrate Z3. As shown in fig. 1C, in the port protection circuit integrated package provided in this embodiment, besides interconnection between the first resistor R and the first capacitor C, there is also an interconnection relationship between the first resistor R and the circuit protection element, in this embodiment, interconnection between the first resistor R and the first capacitor C is implemented by an RC integrated module, and interconnection between the first resistor R and the circuit protection element is implemented by the following structure:
the first resistor R and the circuit protection element are interconnected with the same substrate, i.e. the common electrical connection of the second substrate Z2, through the first pin connection end of the first resistor R and a pin connection end of the circuit protection element.
In other embodiments, the first resistor R and the first capacitor C may be distributed between different substrates, where the first resistor R and the first capacitor C are connected to the same substrate to implement interconnection between the first resistor R and the first capacitor C.
Specifically, in this embodiment, according to the circuit structure of the port protection circuit integrated package provided in this embodiment, as shown in fig. 1C, there is an interconnection relationship between the first resistor R and the circuit protection element, and there is an interconnection relationship between the first resistor R and the first capacitor C, specifically, the first resistor R is connected to a pin connection end of the circuit protection element through a first pin connection end thereof, and a second pin connection end of the first resistor R and a second pin connection end of the first capacitor C have a serial relationship. In this embodiment, the upper end of the two opposite ends of the RC integrated module is set as the first pin connection end of the first capacitor C, and the lower end of the two opposite ends of the RC integrated module is set as the first pin connection end of the first resistor R. In this embodiment, the components for connecting the external port protection circuit integrated package to the external circuit are the first capacitor C and the circuit protection component, and then the first pin connection end of the first capacitor C and the two pin connection ends of the circuit protection component are used for connecting the external port protection circuit integrated package to the external circuit. Specifically, the first pin connection end of the first capacitor C is connected to an external circuit through a first substrate Z1 correspondingly and electrically connected thereto, and the two pin connection ends of the circuit protection element are connected to the external circuit through a second substrate Z2 and a third substrate Z3 correspondingly and respectively connected thereto. As shown in fig. 1d, when the port protection circuit integrated package provided in this embodiment is applied, the first capacitor C is interconnected with the circuit protection element, so that the external connection 110 of the first substrate Z1 and the external connection 130 of the third substrate Z3 in the port protection circuit integrated package are located on the same side of the port protection circuit integrated package, and when the patch is applied, the interconnection pin connection end of the first capacitor C and the circuit protection element is connected with the same pad on the printed circuit board through the external connection 110 and the external connection 130, so as to implement interconnection during application.
Preferably, as shown in fig. 1a, the port protection circuit integrated package provided in this embodiment further includes an encapsulation case (or encapsulation filler) P for encapsulating all conductive package substrates and all circuit modules in the port protection circuit integrated package.
In this embodiment, the conductive package substrate for correspondingly connecting the external port protection circuit integrated package to the external circuit further includes an external connection member formed by extending the conductive package substrate out of the package housing or the filling body, and preferably, in this embodiment, the external connection member 110, the external connection member 120 and the external connection member 130 are formed by extending the substrate to which they belong out of the package housing or the filling body, respectively. Specifically, the external connection member 110, the external connection member 120 and the external connection member 130 respectively include a first extension portion and a second extension portion, the first extension portion is that a substrate including the external connection member extends to an inner edge of the encapsulation shell or the encapsulation filler along a direction perpendicular to the substrate, the second extension portion is that a tail end of the first extension portion extends out of the encapsulation shell P (or the encapsulation filler) away from the substrate along a direction perpendicular to the first extension portion, and the external connection members located on the same side of the port protection circuit integrated package are distributed in a staggered manner.
As an alternative implementation manner, please refer to fig. 2a and fig. 2b, fig. 2a is a structural diagram of an RC integrated module provided by an embodiment of the present application, and fig. 2b is another structural diagram of an RC integrated module provided by an embodiment of the present application, as shown in fig. 2a, the RC integrated module includes:
the first capacitor electrode layer 200, the first ceramic substrate 210, the second capacitor electrode layer 220, and the resistor print layer 230 are sequentially stacked.
Preferably, the bob smith circuit may be implemented by using an RC integrated module structure as shown in fig. 2b, and specifically, the RC integrated module includes:
a first capacitive electrode layer 200, a first ceramic substrate 210, and a second capacitive electrode layer 220 laminated in this order;
the resistor printing layer 230 is laminated on the surface of the second capacitor electrode layer 220, the resistor printing layer 230 comprises a second ceramic substrate 231, and the second ceramic substrate 231 is provided with a through hole 232;
a first resistor printing layer 233 for filling the via hole 232 and printing on the surface of the second capacitor electrode layer 220 in the via hole 232;
and a resistive electrode layer 234 printed on the surface of the first resistive printed layer 233.
In other embodiments, as an alternative implementation manner, the upper end of the upper and lower opposite ends of the RC integrated module is set to be the first pin connection end of the first resistor R, and the lower end of the upper and lower opposite ends of the RC integrated module is set to be the first pin connection end of the first capacitor C. In the present embodiment, the interconnection relationship between the first capacitor C and the circuit protection element, and the interconnection relationship between the first resistor R and the first capacitor C exist, and in particular, the interconnection relationship in the present embodiment is that the first capacitor C is connected to a pin connection end of the circuit protection element through a first pin connection end thereof, and a second pin connection end of the first resistor R and a second pin connection end of the first capacitor C have a serial connection relationship. In this embodiment, the components for connecting the external port protection circuit integrated package to the external circuit are the first resistor R and the circuit protection component, and then the first pin connection end of the first resistor R and the two pin connection ends of the circuit protection component are used for connecting the external port protection circuit integrated package to the external circuit. Specifically, the first pin connection end of the first resistor R is connected to an external circuit through a first substrate Z1 correspondingly and electrically connected thereto, and the two pin connection ends of the circuit protection element are connected to the external circuit through a second substrate Z2 and a third substrate Z3 correspondingly and respectively connected thereto. When the port protection circuit integrated package provided in this embodiment is applied, the first resistor R is interconnected with the circuit protection element, so that the external connection element 110 of the first substrate Z1 and the external connection element 130 of the third substrate Z3 in the port protection circuit integrated package are located on the same side of the port protection circuit integrated package, and when the patch is applied, the interconnection pin connection end of the first resistor R and the circuit protection element is connected with the same pad on the printed circuit board through the external connection element 110 and the external connection element 130 to realize the interconnection during application. In this embodiment, the interconnection between the first resistor R and the first capacitor C is implemented by an RC integrated module, and the interconnection between the first capacitor and the circuit protection element is implemented by the following structure:
The first capacitor C and the circuit protection element are interconnected with the same substrate, i.e. the common electrical connection of the second substrate Z2, through the first pin connection end of the first capacitor C and a pin connection end of the circuit protection element.
As an alternative embodiment, the circuit protection element is a gas discharge tube or a transient voltage suppressor or a varistor or a thermistor or a semiconductor discharge tube or a fuse.
Preferably, the part of the base body connected to the external electrode terminal is provided with a grid or square groove or a u-shaped groove or a boss. Specifically, in this embodiment, a boss is provided at a portion of the first substrate Z1 connected to the external electrode terminal, and a recess is provided at a portion of the second substrate Z2 connected to the external electrode terminal. And a boss is provided at a portion of the third base Z3 connected to the external electrode terminal.
As an alternative embodiment, the thickness of the substrate is greater than or equal to 0.05mm and less than or equal to 1.5mm.
As an alternative embodiment, the thickness of the substrate is greater than or equal to 0.08mm and less than or equal to 1.2mm.
As an alternative embodiment, the thickness of the substrate is greater than or equal to 1mm and less than or equal to 1.3mm.
Preferably, the thickness of all the substrates is greater than or equal to 0.1mm and less than or equal to 0.3mm; the port protection circuit integrated package is square or cuboid, the thickness of the port protection circuit integrated package is less than or equal to 2.5mm and greater than or equal to 1.0mm, the length of the port protection circuit integrated package is less than or equal to 6mm and greater than or equal to 1.5mm, and the width of the port protection circuit integrated package is less than or equal to 6mm and greater than or equal to 1.5mm.
Preferably, the thickness of all the substrates is greater than or equal to 0.2mm and less than or equal to 0.3mm; the port protection circuit integrated package is square or cuboid, the thickness of the port protection circuit integrated package is less than or equal to 2.5mm and greater than or equal to 1.5mm, the length of the port protection circuit integrated package is less than or equal to 5.5mm and greater than or equal to 5mm, and the width of the port protection circuit integrated package is less than or equal to 3.6mm and greater than or equal to 3mm.
Another embodiment
Referring to fig. 3a to fig. 3b, fig. 3a is a circuit structure of another integrated package for port protection circuit provided in an embodiment of the present application, and fig. 3b is a front cross-sectional structure diagram of another integrated package for port protection circuit provided in an embodiment of the present application. As shown in fig. 3a to 3b, based on the circuit structure shown in fig. 1C, the first pin connection end of the first capacitor C in the embodiment is connected to the other pin connection end of the circuit protection element, so that the interconnection relationship between the first capacitor C and the circuit protection element is directly realized through the port protection circuit integrated package provided in the embodiment. In this embodiment, as shown in fig. 3b, the port protection circuit integrated package further includes a first vertical interconnect 300, where the first vertical interconnect 300 is formed by connecting the first capacitor C and the circuit protection element, which have a circuit interconnection relationship, to the first substrate Z1 and the third substrate Z3 in a one-to-one correspondence through the pin connection ends, which are required to be interconnected, respectively, and by interconnecting the first vertical interconnect 300 disposed between the conductive package substrates (the first substrate Z1 and the third substrate Z3) which are connected correspondingly, and the first vertical interconnect 300 is located inside or outside the encapsulation case or the filling body.
Specifically, referring to the port protection circuit integrated package provided in fig. 3b, the end of the first substrate Z1, which is correspondingly connected to the first pin connection end of the first capacitor C, extends to the third substrate, specifically, extends to the plane area where the portion of the third substrate connected to the external electrode terminal is located. In addition, the difference between the present embodiment and the port protection circuit integrated package shown in fig. 1a is that the external connection member has a different structure, in this embodiment, the component configured to connect the port protection circuit integrated package to the external circuit is a circuit protection component, that is, two pin connection ends of the circuit protection component are configured to connect the port protection circuit integrated package to the external circuit, specifically, two pin connection ends of the circuit protection component are connected to the external circuit through a second substrate Z2 and a third substrate Z3 correspondingly connected thereto, that is, the second substrate Z2 includes an external connection member 310, the third substrate Z3 includes an external connection member 320, the external connection member 310 is formed by a terminal end of the second substrate Z2 extending longitudinally to a lower surface of the package housing P (or the package filler) in a direction perpendicular to the second substrate, and the external connection member 320 is formed by a terminal end of the third substrate Z3 extending longitudinally to a lower surface of the package housing P (or the package filler) in a direction perpendicular to the third substrate Z3.
Another embodiment
The embodiment also provides a port protection circuit integrated package, including:
at least two matrixes which are distributed at intervals up and down, wherein each matrix comprises at least one conductive connecting piece for electric connection;
at least one circuit module distributed between adjacent matrixes, wherein each circuit module comprises at least one element and/or at least one integrated packaging module, each integrated packaging module comprises at least two elements, each element comprises at least one pin connecting end, and at least one element in all elements is a circuit protection element; at least one pin connection end of at least one element in all the circuit modules distributed between the adjacent matrixes is used as an external electrode terminal, and the at least one circuit module distributed between the adjacent matrixes is connected with at least one matrix in the adjacent matrixes through the electrical connection between the external electrode terminal and the conductive connecting piece of the at least one matrix; all or part of the elements with circuit interconnection relationship in all the circuit modules are interconnected through interconnection pin connection ends; and/or the number of the groups of groups,
the components with circuit interconnection relations in all circuit modules are interconnected with the electrical connection of the same conductive connecting piece through the interconnection pin connecting ends; and/or the number of the groups of groups,
The port protection circuit integrated package component further comprises first interconnection elements, wherein part or all of the components with circuit interconnection relations in all circuit modules are connected with the conductive connection elements in a one-to-one correspondence through interconnection pin connection ends, and are interconnected through the first interconnection elements arranged between the conductive connection elements in the corresponding connection.
As an alternative embodiment, the circuit protection element comprises a gas discharge tube or a transient voltage suppressor or a varistor or a thermistor or a semiconductor discharge tube or a fuse.
As an alternative embodiment, all circuit modules further comprise at least one port protection circuit basic element comprising at least one of a resistor, a capacitor, an inductor, a fuse and a surge protection device.
As an alternative to this embodiment of the present invention,
the components in all circuit modules further include at least one port protection circuit base component comprising:
the elements in all the circuit modules further comprise N resistors and N capacitors, wherein N is greater than or equal to 1, the N resistors are electrically connected with the N capacitors in series in a one-to-one correspondence manner, and the first pin connecting end of any resistor is connected to the first pin connecting end of the capacitor correspondingly connected with the resistor;
And the elements in all the circuit modules further comprise N circuit protection elements, all the N circuit protection elements are electrically connected with the N resistors in a one-to-one correspondence manner, the N circuit protection elements are electrically connected with the N capacitors in a one-to-one correspondence manner, wherein the second pin connection end of each resistor and the second pin connection end of each capacitor are connected with the two pin connection ends of the corresponding connected circuit protection elements in a one-to-one correspondence manner, and the second pin connection ends of all the capacitors are connected with each other. Referring to fig. 4 specifically, fig. 4 is a circuit diagram of another integrated package of a port protection circuit provided in this embodiment, and as shown in fig. 4, in the port protection circuit implemented in this embodiment, 2 circuit protection elements are taken as an example, in the port protection circuit provided in this embodiment, the circuit protection element further includes a second circuit protection element G2, the port protection circuit basic element further includes a second resistor R2 and a second capacitor C2, where a pin connection end of the second circuit protection element G2 and a pin connection end of the second resistor R2 are respectively used as a common end for implementing the series connection of the second circuit protection element G2 and the second resistor R2, and another pin connection end of the second circuit protection element G2 and a pin connection end of the second capacitor C2 are respectively used as a common end for implementing the series connection of the second circuit protection element G2 and the second capacitor C2, and another pin connection end of the second resistor R2 and another pin connection end of the second capacitor C2 are respectively used as a common end for implementing the interconnection of the second resistor R2 and the second capacitor C2;
One pin connection end of the first capacitor C is connected to one pin connection end of the second capacitor C2.
Referring to fig. 5, fig. 5 is a circuit diagram of another integrated package of a port protection circuit provided in this embodiment, as shown in fig. 5, based on the port protection circuit shown in fig. 5, in the port protection circuit provided in this embodiment, the circuit protection element further includes a third circuit protection element G3 and a fourth circuit protection element G4, the port protection circuit basic element further includes a third resistor R3, a fourth resistor R4, a third capacitor C3 and a fourth capacitor C4, wherein a pin connection end of the third circuit protection element G3 and a pin connection end of the third resistor R3 are respectively used as a common end for implementing the series connection of the third circuit protection element G3 and the third resistor R3, another pin connection end of the third circuit protection element G3 and a pin connection end of the third capacitor C3 are respectively used as a common end for implementing the series connection of the third circuit protection element G3 and the third capacitor C3, and another pin connection end of the third resistor R3 and another pin connection end of the third capacitor C3 are respectively used as a common end for implementing the interconnection of the third resistor R3 and the third capacitor C3; a pin connection end of the fourth circuit protection element G4 and a pin connection end of the fourth resistor R4 are respectively used as a common end for realizing the serial connection of the fourth circuit protection element G4 and the fourth resistor R4, another pin connection end of the fourth circuit protection element G4 and a pin connection end of the fourth capacitor C4 are respectively used as a common end for realizing the serial connection of the fourth circuit protection element G4 and the fourth capacitor C4, and another pin connection end of the fourth resistor R4 and another pin connection end of the fourth capacitor C4 are respectively used as a common end for realizing the interconnection of the fourth resistor R4 and the fourth capacitor C4;
A pin connection terminal of the first capacitor C is connected to a pin connection terminal of the third capacitor C3 and a pin connection terminal of the fourth capacitor C4.
The port protection circuit integrated package corresponding to the circuits shown in fig. 4 and 5 may be further subjected to lamination processing based on the structure shown in fig. 1a, so as to implement longitudinal integration of the modules of the plurality of circuit protection elements and the modules of the plurality of bob smith circuits.
As an alternative embodiment, the thickness of all the substrates is greater than or equal to 0.1mm and less than or equal to 0.4mm; the port protection circuit integrated package is square or cuboid, the thickness of the port protection circuit integrated package is less than or equal to 1.8mm and greater than or equal to 0.5mm, the length of the port protection circuit integrated package is less than or equal to 1.8mm and greater than or equal to 1.5mm, and the width of the port protection circuit integrated package is less than or equal to 1.8mm and greater than or equal to 1.5mm.
As an alternative embodiment, the thickness of all the substrates is greater than or equal to 0.2mm and less than or equal to 0.3mm; the port protection circuit integrated package is square or cuboid, the thickness of the port protection circuit integrated package is less than or equal to 1.5mm and greater than or equal to 0.7mm, the length of the port protection circuit integrated package is less than or equal to 1.5mm and greater than or equal to 0.7mm, and the width of the port protection circuit integrated package is less than or equal to 1.5mm and greater than or equal to 0.7mm.
Preferably, the thickness of all the substrates is greater than or equal to 0.1mm and less than or equal to 0.3mm; the port protection circuit integrated package is square or cuboid, the thickness of the port protection circuit integrated package is less than or equal to 2.5mm and greater than or equal to 1.0mm, the length of the port protection circuit integrated package is less than or equal to 6mm and greater than or equal to 1.5mm, and the width of the port protection circuit integrated package is less than or equal to 6mm and greater than or equal to 1.5mm.
Preferably, the thickness of all the substrates is greater than or equal to 0.2mm and less than or equal to 0.3mm; the port protection circuit integrated package is square or cuboid, the thickness of the port protection circuit integrated package is less than or equal to 2.5mm and greater than or equal to 1.5mm, the length of the port protection circuit integrated package is less than or equal to 5.5mm and greater than or equal to 5mm, and the width of the port protection circuit integrated package is less than or equal to 3.6mm and greater than or equal to 3mm.
In the several embodiments provided in the present application, it should be understood that the foregoing description is only a specific embodiment of the present application, but the scope of the present application is not limited thereto, and any equivalent modifications or substitutions can be easily made by those skilled in the art within the technical scope of the present application, and these modifications or substitutions are intended to be included in the scope of the present application.

Claims (29)

1. A port protection circuit integrated package, comprising:
at least two matrixes which are distributed at intervals up and down, wherein each matrix comprises at least one conductive connecting piece for electric connection;
at least one circuit module distributed between adjacent substrates, wherein each circuit module comprises at least one element and/or at least one integrated packaging module, each integrated packaging module comprises at least two elements, and at least one element in all elements is a circuit protection element; at least one pin connection end of at least one element in all circuit modules distributed between adjacent matrixes is used as an external electrode terminal, and the at least one circuit module distributed between the adjacent matrixes is connected with at least one matrix in the adjacent matrixes through the electrical connection of the external electrode terminal and the conductive connecting piece of the at least one matrix; the components in all circuit modules which are in circuit interconnection relationship are interconnected through interconnection pin connection ends of the components; and/or the number of the groups of groups,
the components in all circuit modules which are in circuit interconnection relation are interconnected with the electrical connection of the same conductive connecting piece through the interconnection pin connecting end; and/or the number of the groups of groups,
The port protection circuit integrated package further comprises a first interconnection element, wherein part or all of the elements with circuit interconnection relations in all circuit modules are connected with the conductive connection elements in a one-to-one correspondence through the interconnection pin connection ends, and are interconnected through the first interconnection element arranged between the conductive connection elements in the corresponding connection;
the port protection circuit integrated package includes at least one circuit module distributed between adjacent substrates, comprising:
the port protection circuit integrated package comprises at least one circuit module including RC integrated modules distributed between adjacent substrates, wherein the RC integrated modules comprise a first resistor and a first capacitor which are in serial connection, and the RC integrated modules comprise:
a first capacitor electrode layer, a first dielectric layer and a resistive layer laminated in this order;
the components in all circuit modules further include at least one port protection circuit base component comprising:
the elements in all the circuit modules further comprise N resistors and N capacitors, wherein N is greater than or equal to 1, the N resistors are electrically connected in series with the N capacitors in a one-to-one correspondence manner, and a first pin connection end of any resistor is connected to a first pin connection end of the capacitor correspondingly connected with the resistor;
The elements in all the circuit modules further comprise N circuit protection elements, all the N circuit protection elements are electrically connected with the N resistors in a one-to-one correspondence manner, the N circuit protection elements are electrically connected with the N capacitors in a one-to-one correspondence manner, wherein the second pin connection end of each resistor and the second pin connection end of each capacitor are connected with the two pin connection ends of the corresponding circuit protection elements in a one-to-one correspondence manner, and the second pin connection ends of all the capacitors are connected with each other;
the port protection circuit integrated package comprises at least two matrixes which are distributed at intervals up and down, and the port protection circuit integrated package comprises:
the port protection circuit integrated package comprises a first substrate, a second substrate and a third substrate which are distributed at intervals up and down;
a first circuit module is distributed between the adjacent first substrate and the second substrate, the first circuit module comprises the RC integrated module, a pin connecting end of the first resistor and a pin connecting end of the first capacitor except for pin connecting ends of the first resistor and the first capacitor which are connected in series are used as two external electrode terminals of the first circuit module, and the first circuit module is electrically connected with the first substrate and the second substrate through the two external electrode terminals of the first circuit module and the first substrate and the second substrate in one-to-one correspondence;
A second circuit module is distributed between the second substrate and the third substrate which are adjacent, the second circuit module comprises one circuit protection element, and two pin connection ends of the circuit protection element are used as two external electrode terminals of the second circuit module; the second circuit module is connected with the second substrate and the third substrate through corresponding electric connection between the two external electrode terminals of the second circuit module and the second substrate and the third substrate.
2. The port guard circuit integrated package of claim 1, wherein each of the substrates is a conductive package substrate;
each of the substrates includes at least one conductive connector for electrical connection, comprising:
each conductive package substrate is a conductive connecting piece for electrical connection.
3. The port guard circuit integrated package of claim 2, further comprising a first interconnect comprising:
the port protection circuit integrated package further comprises a first longitudinal interconnection, wherein part or all of the components in circuit module with circuit interconnection relationship are connected with the conductive package substrates in a one-to-one correspondence through the interconnection pin connection ends, and are interconnected through the first longitudinal interconnection arranged between the conductive package substrates which are correspondingly connected.
4. The port guard circuit integrated package of claim 3, wherein the first longitudinal interconnect extends longitudinally from one of the conductive package bases of the corresponding connection to the other conductive package base.
5. The port guard circuit integrated package of claim 4, further comprising:
an encapsulation shell or encapsulation filler for encapsulating all conductive package matrices and all circuit modules in the port guard circuit integrated package;
the base body is used for externally connecting the port protection circuit integrated package to an external circuit, each base body is used for externally connecting the port protection circuit integrated package to the external circuit, and the external connection piece is formed by extending the base body to which the external connection piece belongs out of the encapsulation shell or the filling body.
6. The port guard circuit integrated package of claim 5,
and a grid, a groove or a boss is arranged at the connection part of the surface of at least one matrix and the external electrode terminal.
7. The port guard circuit integrated package of claim 6, wherein the thickness of the base is greater than or equal to 0.05mm and less than or equal to 1.5mm.
8. The port guard circuit integrated package of claim 5, wherein the external connection comprises a first extension, the first extension extending longitudinally out of the encapsulation housing or the encapsulation filler from the base including the external connection, the external connections on the same side of the port guard circuit integrated package being staggered.
9. The port guard circuit integrated package of claim 8, wherein the external connection further comprises a second extension formed by extending a distal end of the first extension laterally.
10. The port guard circuit integrated package of claim 5, wherein the external connection comprises a first extension and a second extension, the first extension is that the base body comprising the external connection extends longitudinally to the encapsulation housing or the filler, the second extension is that the end of the first extension extends transversely away from the base body to the encapsulation housing or the filler, and the external connection on the same side of the port guard circuit integrated package is staggered.
11. The port guard circuit integrated package of any one of claims 1 to 10,
the components in all circuit modules further comprise at least one port protection circuit basic component, wherein the port protection circuit basic component comprises any one of a resistor, a capacitor, an inductor, a fuse and a surge protection device;
the circuit protection element comprises a gas discharge tube or a transient voltage suppressor or a piezoresistor or a thermistor or a semiconductor discharge tube or a fuse.
12. The port guard circuit integrated package of claim 1, wherein the first dielectric layer comprises N dielectric layers stacked and bonded in alignment, an inner electrode layer being connected between each adjacent two of the N dielectric layers; and N is an integer greater than 0.
13. The port guard circuit integrated package of claim 12, wherein the RC integrated module further comprises:
and a second capacitance electrode layer laminated between the first dielectric layer and the resistive layer.
14. The port guard circuit integrated package of claim 13, wherein the resistive layer comprises:
The first resistor paste printing layer and the resistor electrode layer are laminated from bottom to top.
15. The port guard circuit integrated package of claim 14, wherein the RC integrated module further comprises:
a second dielectric layer laminated on the surface of the second capacitance electrode layer;
the second dielectric layer is provided with a through hole;
the resistive layer includes:
the first resistance paste printing layer is used for filling the through hole and is printed on the surface of the second capacitance electrode layer in the through hole;
and the resistor electrode layer is laminated on the surface of the first resistor paste printing layer.
16. The port guard circuit integrated package of claim 15, wherein the first dielectric layer is a first ceramic dielectric matrix for fabricating a capacitor and the second dielectric layer is a second ceramic dielectric matrix for fabricating a capacitor.
17. The port guard circuit integrated package of claim 16, wherein the first ceramic dielectric matrix is a barium carbonate dielectric matrix, a calcium titanate dielectric matrix, or a magnesium titanate dielectric matrix.
18. The port guard circuit integrated package of claim 17, wherein the first capacitive electrode layer, the second capacitive electrode layer, the resistive electrode layer comprise palladium, platinum, gold, silver, copper, nickel, or an alloy of at least two metals thereof.
19. The port guard circuit integrated package of claim 18, wherein the first resistive paste print layer is a ruthenium-based resistive paste.
20. The port guard circuit integrated package of claim 5, wherein the circuit guard element and the first capacitor/the first resistor are elements for externally connecting the port guard circuit integrated package to an external circuit, the first substrate, the second substrate, and the third substrate being three conductive package substrates for externally connecting the port guard circuit integrated package to an external circuit, the first substrate, the second substrate, and the third substrate each comprising one of the external connectors.
21. The port guard circuit integrated package of claim 20, wherein the external connection of the first base and the external connection of the third base are on the same side of the port guard circuit integrated package.
22. The port guard circuit integrated package of claim 5, wherein the circuit guard element is an element for externally connecting the port guard circuit integrated package to an external circuit, the second and third substrates are conductive package substrates respectively for externally connecting the port guard circuit integrated package to an external circuit, and the second and third substrates respectively comprise one of the external connection pieces;
A pin connection end of the first resistor/the first capacitor except for the first resistor and the first capacitor which are connected in series is correspondingly connected with two pin connection ends of the circuit protection element one by one to be connected with each other, and the pin connection end of the first resistor/the first capacitor except for the first resistor and the first capacitor which are connected in series is electrically connected with the pin connection end of the circuit protection element and the second substrate to be connected with each other; the method comprises the steps of,
the port guard circuit integrated package further includes a first interconnect comprising:
the port guard circuit integrated package further includes the first longitudinal interconnect connected between the first and third matrices and for interconnecting the first resistor/first capacitor with the circuit guard element.
23. The port guard circuit integrated package of claim 22,
the first longitudinal interconnect is an end of the first substrate extending toward the third substrate to the third substrate.
24. The port guard circuit integrated package of claim 1, wherein the thickness of all substrates is greater than or equal to 0.1mm and less than or equal to 0.3mm; the port protection circuit integrated package is square or cuboid, the thickness of the port protection circuit integrated package is less than or equal to 2.5mm and greater than or equal to 1.0mm, the length of the port protection circuit integrated package is less than or equal to 6mm and greater than or equal to 1.5mm, and the width of the port protection circuit integrated package is less than or equal to 6mm and greater than or equal to 1.5mm.
25. The port guard circuit integrated package of claim 1, wherein the thickness of all substrates is greater than or equal to 0.2mm and less than or equal to 0.3mm; the port protection circuit integrated package is square or cuboid, the thickness of the port protection circuit integrated package is less than or equal to 2.5mm and greater than or equal to 1.5mm, the length of the port protection circuit integrated package is less than or equal to 5.5mm and greater than or equal to 5mm, and the width of the port protection circuit integrated package is less than or equal to 3.6mm and greater than or equal to 3mm.
26. The port guard circuit integrated package of claim 1, wherein each of the substrates is an insulating package substrate;
at least one conductive connecting piece for electric connection is attached to the outer surface of each base body.
27. The port guard circuit integrated package of claim 26, wherein,
at least one conductive connecting piece for electrical connection is attached to the outer surface of each substrate, and the conductive connecting piece comprises:
at least one conductive connecting piece for electric connection is attached to the upper surface and/or the lower surface of each substrate.
28. The port guard circuit integrated package of claim 27, wherein the port guard circuit integrated package,
the port guard circuit integrated package further includes a first longitudinal interconnect;
the elements are distributed among different adjacent matrixes and are in circuit interconnection relation, are connected with the conductive connecting pieces in one-to-one correspondence through the interconnection pin connecting ends, and are interconnected through the first longitudinal interconnecting pieces arranged among the conductive connecting pieces which are correspondingly connected;
the projection of the corresponding connected conductive connecting piece perpendicular to the plane of the matrix is provided with a first intersection area;
the port guard circuit integrated package further includes:
the corresponding connected conductive connecting pieces and the areas between the conductive connecting pieces are provided with first through holes penetrating through the corresponding positions of the first intersection areas; the first longitudinal interconnect is connected between the conductive connections of the corresponding connection through the first via.
29. The port guard circuit integrated package of claim 28, wherein all of the base bodies are spaced apart in parallel up and down, and all of the first longitudinal interconnects are perpendicular to the base bodies and on the same side of the base bodies.
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