WO2017025043A1 - Port protection circuit integrated package - Google Patents

Port protection circuit integrated package Download PDF

Info

Publication number
WO2017025043A1
WO2017025043A1 PCT/CN2016/094533 CN2016094533W WO2017025043A1 WO 2017025043 A1 WO2017025043 A1 WO 2017025043A1 CN 2016094533 W CN2016094533 W CN 2016094533W WO 2017025043 A1 WO2017025043 A1 WO 2017025043A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
integrated package
protection circuit
port protection
substrate
Prior art date
Application number
PCT/CN2016/094533
Other languages
French (fr)
Chinese (zh)
Inventor
苟引刚
王久
高桂丽
Original Assignee
深圳市槟城电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市槟城电子有限公司 filed Critical 深圳市槟城电子有限公司
Publication of WO2017025043A1 publication Critical patent/WO2017025043A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/49Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Definitions

  • the present application relates to the field of port circuit protection, and in particular, to a port protection circuit integrated package.
  • the overvoltage and overcurrent protection schemes for applying Bob Smith circuit to the interface circuit are to place the discrete components of the Bob Smith circuit and the single protection device on the circuit board through multiple patching processes, or by soldering discrete components and A single protective device forms a module, and the module is placed in the form of a circuit board to implement an interface protection circuit.
  • the module welding and the multiple steps of the circuit board realize many steps, consumes labor, and the test steps are cumbersome, which reduces production. Efficiency; and the interface protection circuit formed by the discrete component soldering and the common soldering module occupies a large area of the PCB, which reduces the product performance.
  • the common welding module method has high technical requirements for welding, and the welding stability of the circuit is very poor. It is not possible to mass-produce high-efficiency production, and cannot meet the development trend of miniaturization, integration, high-efficiency production and high performance of electronic equipment.
  • the embodiment of the present application provides a port protection circuit integrated package, which solves the problems of the existing port circuit, such as consuming a large number of processes, occupying a large PCB area, low production efficiency, and poor product stability. Problem solution
  • an embodiment of the present application provides a port protection circuit integrated package, including:
  • each of the substrates comprising at least one electrically conductive connection for electrical connection;
  • each of the circuit modules includes at least one component and/or includes at least one integrated package module, and each of the integrated package modules includes at least two At least one of all the components of the circuit module is a circuit protection component; at least one of the terminal terminals of at least one of the circuit modules distributed between the adjacent substrates serves as an external electrode terminal, and is distributed adjacent to the substrate
  • the at least one circuit module is connected to at least one of the adjacent substrates by electrical connection of the external electrode terminal and the conductive connection of the at least one substrate; part or all of all circuit modules
  • the components having circuit interconnection relationships are interconnected by their interconnect pin connections; and/or,
  • the elements of all or all of the circuit modules having circuit interconnection relationships are interconnected by electrical connection of the interconnect pin terminals to the same conductive connection; and/or,
  • the port protection circuit integrated package further includes a first interconnect, and the components of all or all of the circuit modules having a circuit interconnection relationship are electrically connected to the conductive through the interconnecting end One-to-one correspondences are interconnected, and interconnected by the first interconnects disposed between the conductive connections of the corresponding connections.
  • the port protection circuit integrated package provided by the embodiment of the present application encapsulates a plurality of circuit modules by using a longitudinally distributed base structure and a conductive connection member of the base body, thereby reducing the lateral distribution of the components and occupying the surface area of the printed circuit board, and the components
  • the distribution pitch and the distribution distance between the PCB wirings are simple, and the space for accommodating electronic equipment is saved.
  • the connection of the conductive connecting members can reduce the welding process at the application end, can reduce the PCB patch manufacturing process, has less workmanship, and has high production efficiency.
  • the reduction of the distribution volume of the shielding device, the integration of at least one circuit protection component to enhance the port protection performance enables the miniaturization of devices in the field of port protection.
  • the regular distribution of the longitudinal connecting members improves the protection performance and product stability, and is applied to the field of overvoltage protection of the port circuit, which can solve the small distribution volume and small accommodation space. The contradiction between poor performance and overvoltage.
  • the embodiment reduces the application test standard of multiple components, and only adjusts and confirms the performance test standard and the product implementation standard of the integrated component, and can standardize the production and application of the Bob Smith port circuit overvoltage protection scheme. Port circuit.
  • the embodiment can reduce the operation of multiple discrete components, multiple independent performance tests, and the application of multiple component circuit combinations, and implements a port protection circuit using a Bob Smith overvoltage protection.
  • the standardized production of the integrated components can ensure the stability of the circuit application connection, and the reduction in the number of times the device is produced and the number of soldering of the circuit board can also improve the stability of the circuit application connection.
  • FIG. 1B is a front cross-sectional view of a port protection circuit integrated package according to an embodiment of the present disclosure
  • FIG. 1b is a schematic structural diagram of an RC integration module according to an embodiment of the present application
  • FIG. 1c is a circuit structural diagram of a port protection circuit integrated package provided by an embodiment of the present application
  • FIG. 1D is an application circuit diagram of a port protection circuit integrated package provided by an embodiment of the present application
  • FIG. 2 is a structural diagram of an RC integrated module according to an embodiment of the present application
  • FIG. 2b is another structural diagram of an RC integrated module according to an embodiment of the present application.
  • FIG. 3 is a circuit diagram of another port protection circuit integrated package according to an embodiment of the present disclosure
  • FIG. 3b is a front cross-sectional view of another port protection circuit integrated package according to an embodiment of the present disclosure
  • FIG. 4 is a circuit structural diagram of another port protection circuit integrated package provided by this embodiment.
  • FIG. 5 is a circuit structural diagram of another port protection circuit integrated package provided by this embodiment. BEST MODE FOR CARRYING OUT THE INVENTION
  • the embodiment provides a port protection circuit integrated package, including:
  • each of the substrates comprising at least one electrically conductive connection for electrical connection;
  • each circuit module distributed between adjacent substrates, each circuit module comprising at least one component and / or comprising at least one integrated package module, each integrated package module comprising at least two components, each component comprising At least one bow-pin connection, at least one of all components is a circuit protection component
  • At least one pin connection end of at least one of all circuit modules distributed between adjacent substrates serves as an external electrode terminal, and at least one circuit module distributed between adjacent substrates and at least one of adjacent substrates pass The external electrode terminal is electrically connected to the conductive connection of the at least one base; all or all of the circuit modules having circuit interconnection relationships are interconnected by their interconnecting pins; and/or
  • circuit module having circuit interconnections are interconnected by electrical connection of the interconnection pin terminals to the same conductive connection; and/or,
  • the port protection circuit integrated package further includes a first interconnect member, and some or all of the circuit modules having circuit interconnection relationships are connected to the conductive connectors in a one-to-one correspondence through the interconnecting pins, and through The first interconnects disposed between the correspondingly connected conductive connectors are interconnected.
  • each of the substrates is a conductive package substrate
  • Each of the substrates includes at least one electrically conductive connection for electrical connection, including:
  • Each of the conductive package substrates is a conductive connection for electrical connection. Therefore, distributed in adjacent groups
  • the at least one circuit module between the body and the at least one of the adjacent substrates are connected by an electrical connection of the external electrode terminal and the conductive connection of the at least one base body, including:
  • the at least one circuit module distributed between the adjacent substrates and the at least one of the adjacent substrates are connected by an electrical connection of the external electrode terminal and the at least one substrate.
  • the port protection circuit integrated package further includes a first interconnect, including
  • the port protection circuit integrated package further includes a first vertical interconnection member, and the first vertical interconnection member is an element having a circuit interconnection relationship in part or all of all the circuit modules, and the conductive package is connected through the interconnection pin
  • the substrates are connected one-to-one and interconnected by a first longitudinal interconnect disposed between the correspondingly connected conductive package substrates.
  • the interconnecting pin connection ends of the components having the circuit interconnection relationship are interconnected by the first longitudinal interconnects corresponding to the connected conductive package substrates, and the first vertical interconnects are corresponding The ends of any one of the connected conductive package substrates extend longitudinally to another conductive package substrate.
  • the conductive package substrate is a conductive connector, specifically a conductive frame
  • the conductive frame includes a conductive pin and a conductive pin extending from the conductive tray
  • the conductive tray is used for packaging components
  • the conductive pin For connection to external pins or pin connections of interconnecting components, some or all of the interconnected components are interconnected by a connection of the interconnecting pins to the same conductive tray, or/and some or all The interconnected components are interconnected by longitudinally extending conductive pins.
  • the conductive frame is a metal frame.
  • the metal frame is a copper lead frame.
  • the port protection circuit integrated package further includes:
  • an encapsulation case or an encapsulation body for encapsulating all of the conductive package substrates and all circuit modules in the port protection circuit integrated package;
  • At least one substrate for the external port protection circuit to integrate the package to the external circuit wherein the at least one substrate for the external port protection circuit integrated package to the external circuit further includes an external connection member, and the external connection member belongs thereto
  • the base body extends out of the encapsulating shell or the filler body.
  • a portion of the base body connected to the external electrode terminal is provided with a grid or a square Groove or u-shaped groove or boss.
  • the thickness of the substrate is greater than or equal to 0.05 mm and less than or equal to 1.5 mm.
  • the thickness of the substrate is greater than or equal to 0.08 mm and less than or equal to 1.4 mm.
  • the thickness of the substrate is greater than or equal to 0.09 mm and less than or equal to 1.3 mm.
  • the thickness of the substrate is greater than or equal to 0.1 mm and less than or equal to 1.2 mm.
  • the thickness of the substrate is 0.2 mm or 0.3 mm or 0.4 mm or 0.5 mm or 0.6 mm or 0.7 mm or 0.8 mm or 0.9 mm or 1.0 mm or 1.1 mm or 1.2
  • the external connecting member includes a first extending portion, and the first extending portion extends from the end of the base body including the external connecting member in an direction perpendicular to the base body to extend the enclosing shell or enclose the filling Body, the external connectors on the same side of the port protection circuit integrated package are misaligned.
  • the external connecting member includes a first extending portion, and the first extending portion extends from the end of the base body including the external connecting member in a direction perpendicular to the base body to the enclosing housing or encapsulating the filling
  • the outer surface of the body, the external connectors on the same side of the integrated circuit of the port protection circuit are distributed in a wrong manner.
  • the external connecting member includes a first extending portion and a second extending portion, and the first extending portion extends from the end of the base body including the external connecting member in a direction perpendicular to the base body
  • the body or the encapsulation body is formed, and the second extension portion is formed by extending a distal end of the first extension portion in a direction perpendicular to the first extension portion.
  • the external connecting member includes a first extending portion and a second extending portion, and the first extending portion extends from the end of the base body including the external connecting member in a direction perpendicular to the base body
  • the body or the encapsulation body is formed, and the second extension portion is formed by extending the end of the first extension portion horizontally away from the base body in a direction perpendicular to the first extension portion.
  • the external connecting member includes a first extending portion and a second extending portion, and the first extending portion extends from the end of the base body including the external connecting member in a direction perpendicular to the base body
  • the body or the encapsulating body, the second extension portion is formed by extending the end of the first extending portion laterally toward the base body in a direction perpendicular to the first extending portion.
  • the external connecting member includes a first extending portion and a second extending portion, and the first extending portion extends from the end of the base body including the external connecting member to the enclosing shell in a direction perpendicular to the base body
  • the outer surface of the body or the encapsulation body, the second extension portion is formed by extending the end of the first extension portion laterally away from the base body in a direction perpendicular to the first extension portion.
  • the external connector includes a first extension portion and a second extension portion, and the first extension portion extends from the end of the base body including the external connection member in a direction perpendicular to the base body to the encapsulation shell
  • the outer surface of the body or the encapsulation body, the second extension portion is formed by extending the end of the first extension portion laterally toward the base body in a direction perpendicular to the first extension portion.
  • the external connector includes a first extension portion and a second extension portion, the first extension portion extending from the base body including the external connection member in a direction perpendicular to the base body to the encapsulation housing or An inner edge of the filling body, the second extending portion is an end of the first extending portion extending away from the base body in an direction perpendicular to the first extending portion, or enclosing the filling body, on the same side of the port protection circuit integrated package
  • the external connectors are distributed in a wrong way.
  • At least one port protection circuit basic component is further included, and the port protection circuit basic component includes any one of a resistor, a capacitor, an inductor, a fuse, and a surge protection device.
  • circuit protection components include gas discharge tubes or transient voltage suppressors or varistors or thermistors or semiconductor discharge tubes or fuses.
  • the surge protection device comprises a gas discharge tube or a transient voltage suppressor or a varistor or a thermistor or a semiconductor discharge tube or fuse.
  • the port protection circuit integrated package includes at least one circuit module distributed between adjacent substrates, including:
  • the port protection circuit integrated package includes a circuit module including an RC integrated module distributed between adjacent substrates, and the RC integrated module includes a first resistor and a first capacitor having a series relationship, wherein the RC integrated mode
  • the group includes:
  • the first capacitor electrode layer, the first ceramic substrate, the second capacitor electrode layer, and the resistive printed layer are sequentially laminated.
  • the RC integrated module further includes:
  • the resistive printed layer includes: [0068] a first resistive printed layer for filling a via hole and printed on a surface of the second capacitor electrode layer in the via hole; [0069] a resistive electrode layer printed on a surface of the first resistive printed layer.
  • the port protection circuit integrated package includes at least one circuit module distributed between adjacent substrates, including:
  • the port protection circuit integrated package includes at least one circuit module including an RC integrated module distributed between adjacent substrates, wherein the RC integrated module includes a first resistor and a first capacitor having a series relationship, wherein
  • the RC integrated module includes:
  • the first capacitor electrode layer, the first dielectric layer, and the resistance layer are sequentially laminated.
  • the first dielectric layer includes a aligning laminate, and N dielectric layers are laminated, and each of the adjacent two dielectric layers is connected between the two dielectric layers. Electrode layer; N is an integer greater than zero.
  • the RC integration module further includes:
  • the resistance layer includes:
  • the first resistive paste printed layer and the resistive electrode layer are laminated from bottom to top.
  • the RC integrated module further includes:
  • the second dielectric layer is provided with a through hole
  • the resistance layer includes:
  • a first resistive paste printed layer for filling a via hole and printed on a surface of the second capacitor electrode layer in the via hole is laminated on the resistive electrode layer on the surface of the first resistive paste printed layer.
  • the first dielectric layer is a first ceramic dielectric substrate for fabricating a capacitor
  • the second dielectric layer is a second ceramic dielectric substrate for fabricating a capacitor
  • the first ceramic dielectric substrate is a cerium carbonate dielectric substrate, a calcium titanate dielectric substrate or a magnesium titanate dielectric substrate.
  • the first capacitor electrode layer, the second capacitor electrode layer, and the resistance electrode layer comprise an alloy of platinum, gold, silver, copper or nickel or at least two kinds of metals.
  • the first resistive paste printed layer is a lanthanide resistive paste.
  • At least one of all circuit modules is a circuit protection component, and 2N port protection circuit basic components, N is greater than or equal to 1, 2N port protection circuit basic components
  • the N components are resistors, and the other N components are capacitors.
  • the N resistors are electrically connected in series with the N capacitors.
  • the first pin connection of each resistor is connected to the capacitor connected to the resistor.
  • an N-1 circuit protection component wherein all circuit protection components are electrically interconnected with the N resistors one by one, and all the circuit protection components are electrically interconnected with the N capacitors one by one, wherein any One of the two pin terminals of the circuit protection component is connected to the second pin terminal of the resistor connected to the circuit protection component, and the two pin terminals of any circuit protection component Another bow I-pin connection is connected to the second bow-pin connection of the capacitor correspondingly connected to the circuit protection component, and
  • the embodiment provides a port protection circuit integrated package, including:
  • each of the substrates including at least one electrically conductive connection for electrical connection;
  • each circuit module distributed between adjacent substrates, each circuit module comprising at least one component and/or comprising at least one integrated package module, each integrated package module comprising at least two components, each component comprising At least one bow-pin connection, at least one of all components is a circuit protection component
  • At least one pin connection end of at least one of all circuit modules distributed between adjacent substrates serves as an external electrode terminal, and at least one circuit module distributed between adjacent substrates and at least one of adjacent substrates pass
  • the external electrode terminals are electrically connected to the conductive connection members of the at least one base; all or all of the circuit modules having circuit interconnection relationships are interconnected by the interconnecting pins; and/or
  • circuit module having circuit interconnections are interconnected by electrical connection of the interconnection pin terminals to the same conductive connection; and/or,
  • the port protection circuit integrated package component further includes a first interconnect member, and all or all of the circuit module having circuit interconnection relationship are connected to the conductive connector in a one-to-one correspondence through the interconnecting pin connection terminal And interconnecting through a first interconnect disposed between the correspondingly connected conductive connectors.
  • one of the components is a circuit protection component, and further includes two port protection circuit basic components, which are respectively a first resistor and a first capacitor having a series interconnection relationship.
  • the circuit structure in which the first resistor and the first capacitor are connected in series is taken as an example, and the port protection circuit integrated package corresponding to the circuit structure in this embodiment is specifically described in conjunction with FIG. 1 to FIG.
  • FIG. 1B is a front cross-sectional view of a port protection circuit integrated package according to an embodiment of the present disclosure
  • FIG. 1b is a schematic structural diagram of an RC integrated module according to an embodiment of the present application
  • the port protection circuit integrated package provided in this embodiment includes a first base Z1, a second base Z2, and a third base Z3, and includes a first circuit module M1 distributed between the adjacent first substrate Z1 and the second substrate Z2, and a second circuit module M2 distributed between the adjacent second substrate Z2 and the third substrate Z3;
  • the first circuit module M1 includes an RC integrated module.
  • the RC integrated module includes a first resistor R and a first capacitor having a series interconnection relationship (:, wherein the first resistor R and the first capacitor C Longitudinal
  • the structure is distributed, that is, the upper and lower opposite ends of the RC integrated module are the pin terminals of the external circuit.
  • the second circuit module M2 includes a circuit protection component, and the first substrate Z1 includes an external connector 110, and the second substrate Z2 includes an external connector 120, and the third substrate Z3 includes an external connector 130.
  • the first substrate Z1, the second substrate Z2, and the third substrate Z3 are spaced apart from each other, and both are conductive package substrates.
  • the first pin I of the first resistor R and the first pin of the first capacitor C are connected as two external electrode terminals of the first circuit module M1, the first resistor The second pin connection end of the R and the second pin connection end of the first capacitor C are connected in series, and the first circuit module M1 and the first base body Z1 and the second base body Z2 pass through the two external electrode terminals of the first circuit module M1. Connected to the corresponding electrical connection of the first substrate Z1 and the second substrate Z2.
  • the two pin terminals of the circuit protection component serve as two external electrode terminals of the second circuit module M2; the second circuit module M2 and the second base body Z2 and the third base body Z3 pass through two external terminals of the second circuit module M2
  • the electrode terminals are connected to the second base body Z2 and the third base body Z3 by electrical connection.
  • the first resistor R and the circuit protection component also have an interconnection relationship.
  • First electricity The interconnection of the resistor R and the first capacitor C is realized by the RC integrated module, and the first resistor R and the circuit protection component are interconnected by the following structure:
  • the first resistor R and the circuit protection component are interconnected by a first pin connection end of the first resistor R and a pin connection end of the circuit protection component and a common electrical connection of the same substrate, that is, the second substrate Z2 .
  • the first resistor R and the first capacitor C may be distributed between different substrates, and the first resistor R and the first capacitor C are connected to the same substrate to implement the first resistor R and the first capacitor C. Interconnection.
  • the circuit structure of the port protection circuit integrated package provided by the embodiment is described according to FIG. 1c, and the first resistor R and the circuit protection component in this embodiment are shown in FIG.
  • the first resistor R is connected to a pin connection end of the circuit protection component through the first bow pin connection end thereof.
  • the second pin connection end of the first resistor R and the second pin connection end of the first capacitor C have a series relationship.
  • the upper end of the upper and lower opposite ends of the RC integrated module is set as the first pin connection end of the first capacitor C
  • the lower end of the upper and lower opposite ends of the RC integrated module is the first A first pin connection of a resistor R.
  • the component for the external port protection circuit integrated package to the external circuit is the first capacitor C and the circuit protection component, and the first pin connection end of the first capacitor C and the two pins of the circuit protection component
  • the connector is used for an external port protection circuit to integrate the package to an external circuit.
  • the first pin connection end of the first capacitor C is connected to the external circuit through the first base body Z1 electrically connected thereto, and the two pin connection ends of the circuit protection component pass through the second base body Z2 respectively connected thereto
  • the third substrate Z3 is connected to an external circuit.
  • the port protection circuit integrated package provided in this embodiment is applied, and the first capacitor C is interconnected with the circuit protection component. Therefore, the port protection circuit integrates the external connector of the first substrate Z1 in the package.
  • the external connector 130 of the 110 and the third substrate Z3 is located on the same side of the port protection circuit integrated package.
  • the interconnection pin connection end of the first capacitor C and the circuit protection component is connected through the external connector 110 and the external connection. The connection of the device 130 to the same pad on the printed circuit board enables the interconnection of the application.
  • the port protection circuit integrated package provided by the embodiment further includes an encapsulation case for encapsulating all the conductive package bases and all circuit modules in the port protection circuit integrated package. (or enclose the filler) P.
  • the component corresponding connection for the external port protection circuit integrated package to the external circuit The conductive package base further includes an external connector formed by the conductive package base extending out of the encapsulation case or the filler body.
  • the external connection member 110, the external connection member 120 and the external connection member 130 are respectively The substrate to which it belongs extends out of the encapsulating housing or the filling body.
  • the external connecting member 110, the external connecting member 120 and the external connecting member 130 respectively comprise a first extending portion and a second extending portion
  • the first extending portion is a base body including an external connecting member extending in a direction perpendicular to the base body to the encapsulation
  • the housing or enclosing the inner edge of the filling body, the second extending portion is an end of the first extending portion extending away from the base body in an direction perpendicular to the first extending portion to extend the encapsulating shell P (or enclosing the filling body)
  • the port protection circuit integrates the external connectors on the same side of the package with a misaligned distribution.
  • FIG. 2a is a structural diagram of an RC integrated module according to an embodiment of the present application
  • FIG. 2b is an RC integration provided by an embodiment of the present application.
  • Another structure of the module, as shown in Figure 2a, the RC integrated module includes:
  • the first capacitor electrode layer 200, the first ceramic substrate 210, the second capacitor electrode layer 220, and the resistive printed layer 230 are sequentially laminated.
  • the implementation of the Bob Smith circuit can adopt the RC integrated module structure as shown in FIG. 2b.
  • the RC integrated module includes:
  • the first capacitor electrode layer 200, the first ceramic substrate 210, and the second capacitor electrode layer 220 are sequentially laminated;
  • the resistive printed layer 230 is laminated on the surface of the second capacitor electrode layer 220, the resistive printed layer 230 includes a second ceramic substrate 231, and the second ceramic substrate 231 is provided with a through hole 232;
  • a first resistive printed layer 233 for filling the via 232 and printed on the surface of the second capacitor electrode layer 220 in the via 232;
  • the circuit connection relationship in the present embodiment is that the first capacitor C has an interconnection relationship with the circuit protection component, and the interconnection relationship between the first resistor R and the first capacitor C, specifically, the interconnection in the embodiment.
  • the relationship is that the first capacitor C is connected to a pin connection end of the circuit protection component through the first pin connection end thereof, and the second pin connection end of the first resistor R and the second pin connection end of the first capacitor C Has a series relationship.
  • This embodiment is set for external port protection.
  • the components of the circuit integrated package to the external circuit are the first resistor R and the circuit protection component, and the first pin connection end of the first resistor R and the two pin terminals of the circuit protection component are used for the external port protection circuit integrated package.
  • Pieces to an external circuit Specifically, the first pin connection end of the first resistor R is connected to the external circuit through the first base body Z1 electrically connected thereto, and the two pin connection ends of the circuit protection component pass through the second base body Z2 respectively connected thereto And the third substrate Z3 is connected to an external circuit.
  • the port protection circuit integrated package provided in this embodiment is applied, the first resistor R is interconnected with the circuit protection component, and therefore, the port protection circuit integrates the external connector 110 and the third substrate Z3 of the first substrate Z1 in the package.
  • the external connector 130 is located on the same side of the port protection circuit integrated package.
  • the first resistor R and the circuit protection component are connected to each other through the external connector 110 and the external connector 130 and the printed circuit board.
  • the connection of the same pad on the top implements the interconnection of the application.
  • the interconnection of the first resistor R and the first capacitor C is realized by the RC integrated module, and the first capacitor and the circuit protection component are interconnected by the following structure:
  • the first capacitor C and the circuit protection component are interconnected by a first pin connection end of the first capacitor C and a pin connection end of the circuit protection component and a common electrical connection of the same substrate, that is, the second substrate Z2 .
  • the circuit protection component is a gas discharge tube or a transient voltage suppressor or a varistor or a thermistor or a semiconductor discharge tube or fuse.
  • a portion where the base body is connected to the external electrode terminal is provided with a mesh or a square groove or a u-shaped groove or a boss.
  • a portion where the first base body Z1 is connected to the external electrode terminal is provided with a boss, and a portion where the second base body Z2 is connected to the external electrode terminal is provided with a groove.
  • a portion of the third base body Z3 connected to the external electrode terminal is provided with a boss.
  • the thickness of the substrate is greater than or equal to 0.05 mm and less than or equal to 1.5 mm.
  • the thickness of the substrate is greater than or equal to 0.08 mm and less than or equal to 1.2 mm.
  • the thickness of the base body is greater than or equal to 1 mm, and is less than or equal to 1.
  • all of the substrates have a thickness greater than or equal to 0.1 mm and less than or equal to 0.3 mm;
  • the port protection circuit integrated package is a square or a rectangular parallelepiped, and the port protection circuit integrates the package.
  • the thickness of the port protection circuit integrated package is less than or equal to 6 mm and greater than or equal to 1.5 mm, and the width of the port protection circuit integrated package is less than or equal to 6 mm, which is greater than or equal to 2.5 mm. Or equal to 1.5mm.
  • the thickness of all the substrates is greater than or equal to 0.2 mm, less than or equal to 0.3 mm; the port protection circuit integrated package is a square or rectangular parallelepiped, and the thickness of the port protection circuit integrated package is less than or equal to 2.5 mm.
  • the length of the port protection circuit integrated package is less than or equal to 5.5 mm and greater than or equal to 5 mm, and the width of the port protection circuit integrated package is less than or equal to 3.6 mm and greater than or equal to 3 mm.
  • FIG. 3a is a circuit structure of another port protection circuit integrated package according to an embodiment of the present disclosure
  • FIG. 3b is another port protection circuit integrated package according to an embodiment of the present application.
  • the first pin I of the first capacitor C in this embodiment is connected to the other pin terminal of the circuit protection component to pass
  • the port protection circuit integrated package provided in this embodiment directly realizes the interconnection relationship between the first capacitor C and the circuit protection component.
  • FIG. 1c the first pin I of the first capacitor C in this embodiment
  • the port protection circuit integrated package further includes a first longitudinal interconnection 300, the first vertical interconnection being a first capacitor C having a circuit interconnection relationship and the circuit protection component passing through the respective
  • the pin connection end to be interconnected is connected to the first substrate Z1 and the third substrate Z3, and is disposed in a first longitudinal direction between the correspondingly connected conductive package substrates (the first substrate Z1 and the third substrate Z3)
  • the interconnects 300 are interconnected and the first longitudinal interconnects 300 are located inside or outside the enclosure or filler.
  • the first pin connection end of the first capacitor C extends to the third base body corresponding to the end of the connected first base body Z1, and specifically extends to the first The planar area where the three bases are connected to the external electrode terminals.
  • the difference between the embodiment and the port protection circuit integrated package shown in FIG. 1 is that the structure of the external connection component is different.
  • the component for the external port protection circuit integrated package to the external circuit is set.
  • the circuit protection component that is, the two pin terminals of the circuit protection component are used for the external port protection circuit to integrate the package to the external circuit. Specifically, the two pin terminals of the circuit protection component are respectively connected to each other.
  • the second substrate Z2 and the third substrate Z3 are connected to an external circuit, that is, the second substrate Z2 includes an external connector 310, a third base
  • the body Z3 includes an external connecting member 320
  • the external connecting member 310 is formed by extending the end of the second base body Z2 in a direction perpendicular to the second base body to the lower surface of the enclosing housing P (or enclosing the filling body), and an external connection.
  • the member 320 is formed such that the end of the third substrate Z3 extends longitudinally in a direction perpendicular to the third substrate Z3 to the lower surface of the encapsulating case P (or encapsulating the filling body).
  • the embodiment further provides a port protection circuit integrated package, including:
  • each of the substrates including at least one electrically conductive connection for electrical connection;
  • each circuit module includes at least one component and/or includes at least one integrated package module, each integrated package module includes at least two components, each component including At least one bow-pin connection, at least one of all components is a circuit protection component
  • At least one pin connection end of at least one of all circuit modules distributed between adjacent substrates serves as an external electrode terminal, and at least one circuit module distributed between adjacent substrates and at least one of adjacent substrates pass
  • the external electrode terminals are electrically connected to the conductive connection members of the at least one base; all or all of the circuit modules having circuit interconnection relationships are interconnected by the interconnecting pins; and/or
  • circuit module having circuit interconnection relationships are interconnected by electrical connection of the interconnection pin terminals to the same conductive connection; and/or,
  • the port protection circuit integrated package component further includes a first interconnect member, and some or all of the circuit modules having circuit interconnection relationships are connected to the conductive connectors in a one-to-one correspondence through the interconnecting pins, and through The first interconnects disposed between the correspondingly connected conductive connectors are interconnected.
  • the circuit protection component comprises a gas discharge tube or a transient voltage suppressor or a varistor or a thermistor or a semiconductor discharge tube or fuse.
  • all circuit modules further include at least one port protection circuit basic component, and the port protection circuit basic component includes at least one of a resistor, a capacitor, an inductor, a fuse, and a surge protection device.
  • the port protection circuit basic component includes at least one of a resistor, a capacitor, an inductor, a fuse, and a surge protection device. Basic components of the circuit.
  • the components of all circuit modules further include at least one port protection circuit basic component, including: [0132]
  • the components in all circuit modules further include N resistors and N capacitors, N is greater than or equal to 1, and N resistors are electrically connected in series with the N capacitors, wherein the first pin of any resistor The connection end is connected to the first pin connection end of the capacitor correspondingly connected to the resistor;
  • the components in all the circuit modules further include N-1 circuit protection components, and all the N circuit protection components are electrically interconnected with the N resistors one by one, and the N circuit protection components and the N capacitors are one by one.
  • the electrical interconnection wherein the second pin connection end of each resistor and the second pin connection end of each capacitor are connected in one-to-one correspondence with the two pin connection ends of the correspondingly connected circuit protection components, and The second pin connections of all capacitors are interconnected.
  • FIG. 4 is a circuit structural diagram of another port protection circuit integrated package according to the embodiment. As shown in FIG. 4, the circuit protection circuit implemented in this embodiment has two circuit protection components.
  • the circuit protection component further includes a second circuit protection component G2
  • the basic component of the port protection circuit further includes a second resistor R2 and a second capacitor C2
  • the second circuit protection A pin connection end of the component G2 and a pin connection end of the second resistor R2 respectively serve as a common terminal for realizing the serial connection of the second circuit protection component G2 and the second resistor R2, and the other pin of the second circuit protection component G2
  • a pin terminal of the connection terminal and the second capacitor C2 respectively serves as a common terminal for realizing the serial connection of the second circuit protection component G2 and the second capacitor C2, and another pin connection terminal of the second resistor R2 and the second capacitor C2
  • the other pin connection ends respectively serve as a common terminal for interconnecting the second resistor R2 and the second capacitor C2;
  • a bow terminal of the first capacitor C is connected to a bow terminal of the second capacitor C2.
  • FIG. 5 is a circuit structural diagram of another port protection circuit integrated package according to the embodiment.
  • the circuit protection component further includes a third circuit protection component G3 and a fourth circuit protection component G4, and the port protection circuit basic component further includes a third resistor R3, a fourth resistor R4, a third capacitor C3, and a fourth a capacitor C4, wherein a pin connection end of the third circuit protection component G3 and a pin connection end of the third resistor R3 respectively serve as a common terminal for realizing the serial connection of the third circuit protection component G3 and the third resistor R3, and the third circuit
  • the other pin connection end of the protection component G3 and the one pin connection end of the third capacitor C3 respectively serve as a common terminal for realizing the serial connection of the third circuit protection component G3 and the third capacitance C3, and another lead of the third resistor R3.
  • the pin connection end and the other pin connection end of the third capacitor C3 respectively serve as a common terminal for interconnecting the third resistor R3 and the third capacitor C3; a pin connection end of the fourth circuit protection component G4 and a fourth resistor R4 One pin Pick-up A common end of the fourth circuit protection component G4 and the fourth resistor R4 are connected in series, and the other pin connection end of the fourth circuit protection component G4 and the one pin connection end of the fourth capacitor C4 respectively serve as the fourth circuit protection component
  • the common terminal of the series connection of G 4 and the fourth capacitor C4, and the other pin connection end of the fourth resistor R4 and the other pin connection end of the fourth capacitor C 4 respectively serve as the fourth resistor R4 and the fourth capacitor C4.
  • a common terminal of the interconnect [0136] A pin terminal of the first capacitor C is connected to a pin terminal of the third capacitor C3 and a pin terminal of the fourth capacitor C4.
  • the port protection circuit integrated package corresponding to the circuit shown in FIG. 4 and FIG. 5 can be further processed by lamination processing based on the structure shown in FIG. 1a, and modules for implementing multiple circuit protection components and multiple Bob Smith Vertical integration of modules of the circuit.
  • the thickness of all the substrates is greater than or equal to 0.1 mm, less than or equal to 0.4 mm;
  • the port protection circuit integrated package is a square or a rectangular parallelepiped, and the thickness of the port protection circuit integrated package is less than or equal to 1.8mm, greater than or equal to 0.5mm, the length of the port protection circuit integrated package is less than or equal to 1.8mm, greater than or equal to 1.5mm, and the width of the port protection circuit integrated package is less than or equal to 1.8mm, greater than or equal to 1.5mm.
  • the thickness of all the substrates is greater than or equal to 0.2 mm and less than or equal to 0.3 mm;
  • the port protection circuit integrated package is a square or a rectangular parallelepiped, and the thickness of the port protection circuit integrated package is less than or equal to 1.5mm, greater than or equal to 0.7mm, the length of the port protection circuit integrated package is less than or equal to 1.5mm, greater than or equal to 0.7mm, and the width of the port protection circuit integrated package is less than or equal to 1.5mm, greater than or equal to 0.7mm.
  • the thickness of all the substrates is greater than or equal to 0.1 mm, less than or equal to 0.3 mm; the port protection circuit integrated package is a square or a rectangular parallelepiped, and the thickness of the port protection circuit integrated package is less than or equal to 2.5 mm.
  • the length of the port protection circuit integrated package is less than or equal to 6 mm and greater than or equal to 1.5 mm, and the width of the port protection circuit integrated package is less than or equal to 6 mm and greater than or equal to 1.5 mm.
  • the thickness of all the substrates is greater than or equal to 0.2 mm, less than or equal to 0.3 mm; the port protection circuit integrated package is a square or a rectangular parallelepiped, and the thickness of the port protection circuit integrated package is less than or equal to 2.5 mm. , greater than or equal to 1.5 mm, the length of the port protection circuit integrated package is less than or equal to 5.5 mm, greater than or equal to 5 mm, the port protection circuit integrated package The width is less than or equal to 3.6 mm and greater than or equal to 3 mm.

Abstract

A port protection circuit integrated package; using longitudinally distributed package substrates (Z1, Z2, Z3) to package a plurality of circuit modules (340, 350), reducing the distribution spacing of components and the package area of a printed circuit board occupied when elements are laterally distributed; the integrated structure is simple and saves accommodating space of the electronic device.

Description

说明书 发明名称:一禾 Φ編方申户申,隨 I 圭機件 技术领域  Instruction manual Name of the invention: Yihe Φ 编方申户申, with I 圭机件 Technical field
[0001] 本申请涉及端口电路防护领域, 具体涉及一种端口防护电路集成封装件。  [0001] The present application relates to the field of port circuit protection, and in particular, to a port protection circuit integrated package.
背景技术  Background technique
[0002] 目前雷电灾害所涉及的范围遍布各行各业, 以大规模集成电路为核心组件的计 算机网络、 测量、 监控、 保护等先进电子设备被广泛应用于电力、 航空、 国防 、 安防、 通信、 广电、 金融、 交通、 石化、 医疗等行业, 以及广泛应用于其它 现代生活的各个领域, 这些先进电子设备普遍存在着对暂态过电压、 过电流耐 受能力较弱的缺点。 不难见得, 随着信息产业技术的不断深入研究和对小型化 电子设备的发展要求, 防雷元件是抗雷防护、 过压防护和过流防护的关键器件 , 必不可少, 而且必须要满足电子设备小型化和集成化的发展方向。  [0002] At present, lightning disasters cover a wide range of industries. Advanced electronic devices such as computer networks, measurement, monitoring, and protection with large-scale integrated circuits as the core components are widely used in electric power, aviation, defense, security, communications, and In the fields of broadcasting, finance, transportation, petrochemical, medical, and other fields of modern life, these advanced electronic devices generally have shortcomings of weak transient over-voltage and over-current. It is not difficult to see that with the continuous research of information industry technology and the development requirements of miniaturized electronic equipment, lightning protection components are essential components for lightning protection, overvoltage protection and overcurrent protection, which are essential and must be met. The development direction of miniaturization and integration of electronic devices.
[0003] 在端口技术领域中, 用作电性隔离的鲍勃史密斯电路作为一种工业标准被广泛 应用于接口电路中。 目前, 实现应用鲍勃史密斯电路至接口电路的过压、 过流 防护方案都是将鲍勃史密斯电路的分立元件和单个防护器件通过多次贴片工艺 贴放置电路板, 或者通过焊接分立元件和单个防护器件形成模组, 再将模组贴 放置电路板的形式实现接口防护电路, 模组焊接及电路板多次贴片实现的工序 步骤多、 耗吋耗力, 测试步骤繁琐, 降低了生产效率; 且分立元件焊接和普通 焊接模组形成的接口防护电路占用 PCB的面积较大, 降低了产品使用性能。 另外 , 普通焊接模组方式对焊接的技术要求高, 电路焊接稳定性很差, 不能批量化 高效率生产, 不能满足电子设备小型化、 集成化、 高效率生产和高性能的发展 趋势。  [0003] In the field of port technology, Bob Smith circuits used as electrical isolation are widely used as interface standards in an interface circuit. At present, the overvoltage and overcurrent protection schemes for applying Bob Smith circuit to the interface circuit are to place the discrete components of the Bob Smith circuit and the single protection device on the circuit board through multiple patching processes, or by soldering discrete components and A single protective device forms a module, and the module is placed in the form of a circuit board to implement an interface protection circuit. The module welding and the multiple steps of the circuit board realize many steps, consumes labor, and the test steps are cumbersome, which reduces production. Efficiency; and the interface protection circuit formed by the discrete component soldering and the common soldering module occupies a large area of the PCB, which reduces the product performance. In addition, the common welding module method has high technical requirements for welding, and the welding stability of the circuit is very poor. It is not possible to mass-produce high-efficiency production, and cannot meet the development trend of miniaturization, integration, high-efficiency production and high performance of electronic equipment.
技术问题  technical problem
[0004] 本申请实施例提供了一种端口防护电路集成封装件, 解决了现有的端口电路实 现耗吋, 工序多, 占用 PCB的面积较大, 生产效率低、 产品稳定性差的问题。 问题的解决方案  [0004] The embodiment of the present application provides a port protection circuit integrated package, which solves the problems of the existing port circuit, such as consuming a large number of processes, occupying a large PCB area, low production efficiency, and poor product stability. Problem solution
技术解决方案 [0005] 第一方面, 本申请实施例提供一种端口防护电路集成封装件, 包括: Technical solution [0005] In a first aspect, an embodiment of the present application provides a port protection circuit integrated package, including:
[0006] 上下间隔分布的至少两个基体, 每一个所述基体包括至少一个用于电性连接的 导电连接件; [0006] at least two substrates spaced apart from each other, each of the substrates comprising at least one electrically conductive connection for electrical connection;
[0007] 相邻所述基体之间分布的至少一个电路模块, 每个所述电路模块包括至少一个 元件及 /或者包括至少一个集成封装模组, 每一个所述集成封装模组包括至少两 个元件, 所有元件中的至少一个元件为电路防护元件; 相邻所述基体之间分布 的所有电路模块中的至少一个元件的至少一个引脚连接端作为外接电极端子, 分布于相邻所述基体之间的所述至少一个电路模块与相邻所述基体中的至少一 个基体通过所述外接电极端子和所述至少一个基体的导电连接件的电性连接而 连接; 所有电路模块中部分或者全部具有电路互连关系的所述元件通过其互连 引脚连接端进行互连; 以及 /或者,  [0007] at least one circuit module disposed adjacent to the substrate, each of the circuit modules includes at least one component and/or includes at least one integrated package module, and each of the integrated package modules includes at least two At least one of all the components of the circuit module is a circuit protection component; at least one of the terminal terminals of at least one of the circuit modules distributed between the adjacent substrates serves as an external electrode terminal, and is distributed adjacent to the substrate The at least one circuit module is connected to at least one of the adjacent substrates by electrical connection of the external electrode terminal and the conductive connection of the at least one substrate; part or all of all circuit modules The components having circuit interconnection relationships are interconnected by their interconnect pin connections; and/or,
[0008] 所有电路模块中部分或者全部具有电路互连关系的所述元件通过所述互连引脚 连接端与同一所述导电连接件的电性连接进行互连; 以及 /或者,  [0008] the elements of all or all of the circuit modules having circuit interconnection relationships are interconnected by electrical connection of the interconnect pin terminals to the same conductive connection; and/or,
[0009] 所述端口防护电路集成封装件还包括第一互连件, 所有电路模块中部分或者全 部具有电路互连关系的所述元件通过所述互连弓 I脚连接端与所述导电连接件一 一对应连接, 以及通过设置在所述对应连接的所述导电连接件之间的所述第一 互连件进行互连。  [0009] The port protection circuit integrated package further includes a first interconnect, and the components of all or all of the circuit modules having a circuit interconnection relationship are electrically connected to the conductive through the interconnecting end One-to-one correspondences are interconnected, and interconnected by the first interconnects disposed between the conductive connections of the corresponding connections.
[0010]  [0010]
发明的有益效果  Advantageous effects of the invention
有益效果  Beneficial effect
[0011] 本申请实施例提供的端口防护电路集成封装件, 采用纵向分布的基体结构及基 体的导电连接件封装多个电路模块, 减少元件横向分布吋占用的印刷线路板的 表面积, 元器件间的分布间距和 PCB布线间的分布间距, 集成结构简单, 节约电 子设备的容置空间。 另外, 通过导电连接件的连接可以减少应用端焊接工序, 可以减少 PCB贴片制作工序, 所用工吋少, 生产效率高。 另外, 减小防护器件的 分布体积的同吋, 集成至少一个电路防护元件提升端口防护性能, 得以实现端 口防护领域的设备小型化发展。 以及纵向连接件的规则分布提高了防护性能和 产品稳定性, 应用于端口电路过压防护领域, 可解决分布体积小、 容置空间小 和过压性能差之间的矛盾。 [0011] The port protection circuit integrated package provided by the embodiment of the present application encapsulates a plurality of circuit modules by using a longitudinally distributed base structure and a conductive connection member of the base body, thereby reducing the lateral distribution of the components and occupying the surface area of the printed circuit board, and the components The distribution pitch and the distribution distance between the PCB wirings are simple, and the space for accommodating electronic equipment is saved. In addition, the connection of the conductive connecting members can reduce the welding process at the application end, can reduce the PCB patch manufacturing process, has less workmanship, and has high production efficiency. In addition, the reduction of the distribution volume of the shielding device, the integration of at least one circuit protection component to enhance the port protection performance, enables the miniaturization of devices in the field of port protection. And the regular distribution of the longitudinal connecting members improves the protection performance and product stability, and is applied to the field of overvoltage protection of the port circuit, which can solve the small distribution volume and small accommodation space. The contradiction between poor performance and overvoltage.
[0012] 另外, 本实施例减少了多个元件的应用测试标准, 仅对该集成件的性能测试标 准及产品实现标准进行调整确认, 就可以批量标准化生产应用鲍勃史密斯端口 电路过压防护方案的端口电路。 [0012] In addition, the embodiment reduces the application test standard of multiple components, and only adjusts and confirms the performance test standard and the product implementation standard of the integrated component, and can standardize the production and application of the Bob Smith port circuit overvoltage protection scheme. Port circuit.
[0013] 另外, 本实施例能够减少多个分立元件生产吋多次独立性能测试和整机应用吋 多个元件电路组合性能测试的动作, 实现了一个端口防护电路应用一个鲍勃史 密斯过压防护产品, 一次贴片焊接的生产, 一个元件一次产品测试, 一次应用 性能测试, 使得应用该端口防护电路的设备实现吋的工序大大减少, 节约了设 备生产吋间, 提高了生产效率。 [0013] In addition, the embodiment can reduce the operation of multiple discrete components, multiple independent performance tests, and the application of multiple component circuit combinations, and implements a port protection circuit using a Bob Smith overvoltage protection. The product, the production of one-chip soldering, one component one-time product test, and one application performance test, greatly reduce the number of processes for implementing the port protection circuit, saving equipment production time and improving production efficiency.
[0014] 另外, 集成件标准化的生产能够保证电路应用连接的稳定性, 以及设备生产吋 电路板焊接次数的减少也能够提升电路应用连接的稳定性。 [0014] In addition, the standardized production of the integrated components can ensure the stability of the circuit application connection, and the reduction in the number of times the device is produced and the number of soldering of the circuit board can also improve the stability of the circuit application connection.
对附图的简要说明  Brief description of the drawing
附图说明  DRAWINGS
[0015] 为了更清楚地说明本申请实施例或现有技术中的技术方案, 下面将对实施例或 现有技术描述中所需要使用的附图作简单地介绍, 显而易见地, 下面描述中的 附图仅是本申请的一些实施例, 对于本领域普通技术人员来讲, 在不付出创造 性劳动的前提下, 还可以根据这些附图获得其他的附图。  [0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings to be used in the embodiments or the prior art description will be briefly described below, and obviously, in the following description The drawings are only some of the embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without any creative work.
[0016] 图 la为本申请实施例提供的一种端口防护电路集成封装件的正面剖视图; [0017] 图 lb为本申请实施例提供的一种 RC集成模组的结构示意图; [0016] FIG. 1B is a front cross-sectional view of a port protection circuit integrated package according to an embodiment of the present disclosure; [0017] FIG. 1b is a schematic structural diagram of an RC integration module according to an embodiment of the present application;
[0018] 图 lc为本申请实施例提供的一种端口防护电路集成封装件的电路结构图; [0019] 图 Id为本申请实施例提供的一种端口防护电路集成封装件的应用电路图; [0020] 图 2a为本申请实施例提供的 RC集成模组的一种结构图; [0018] FIG. 1c is a circuit structural diagram of a port protection circuit integrated package provided by an embodiment of the present application; [0019] FIG. 1D is an application circuit diagram of a port protection circuit integrated package provided by an embodiment of the present application; FIG. 2 is a structural diagram of an RC integrated module according to an embodiment of the present application;
[0021] 图 2b为本申请实施例提供的 RC集成模组的另一种结构图; [0021] FIG. 2b is another structural diagram of an RC integrated module according to an embodiment of the present application;
[0022] 图 3a为本申请实施例提供的另一种端口防护电路集成封装件的电路结构; [0023] 图 3b为本申请实施例提供的另一种端口防护电路集成封装件的正面剖视结构图 [0022] FIG. 3 is a circuit diagram of another port protection circuit integrated package according to an embodiment of the present disclosure; [0023] FIG. 3b is a front cross-sectional view of another port protection circuit integrated package according to an embodiment of the present disclosure; Structure diagram
[0024] 图 4为本实施例提供的另一种端口防护电路集成封装件的电路结构图; [0024] FIG. 4 is a circuit structural diagram of another port protection circuit integrated package provided by this embodiment;
[0025] 图 5为本实施例提供的另一种端口防护电路集成封装件的电路结构图。 实施该发明的最佳实施例 [0025] FIG. 5 is a circuit structural diagram of another port protection circuit integrated package provided by this embodiment. BEST MODE FOR CARRYING OUT THE INVENTION
本发明的最佳实施方式  BEST MODE FOR CARRYING OUT THE INVENTION
[0026] 下面将结合本申请实施例中的附图, 对本申请实施例中的技术方案进行清楚、 完整地描述, 显然, 所描述的实施例仅是本申请一部分实施例, 而不是全部的 实施例。 下面通过具体实施例, 分别进行详细的说明。  The technical solutions in the embodiments of the present application are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present application. It is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. example. The detailed description will be respectively made below through specific embodiments.
[0027] 由于设备的小型化, 其面积和体积都较以往有比较大的减少, 然而其所能抵抗 干扰的能力却越来越弱, 这也对设备的防雷要求越来越苛刻。 因此, 本实施例 提供一种端口防护电路集成封装件, 包括: [0027] Due to the miniaturization of the device, its area and volume are relatively reduced compared with the past, but its ability to resist interference is getting weaker and weaker, which also makes the lightning protection requirements of the device more and more demanding. Therefore, the embodiment provides a port protection circuit integrated package, including:
[0028] 上下间隔分布的至少两个基体, 每一个基体包括至少一个用于电性连接的导电 连接件; [0028] at least two substrates spaced apart from each other, each of the substrates comprising at least one electrically conductive connection for electrical connection;
[0029] 相邻基体之间分布的至少一个电路模块, 每个电路模块包括至少一个元件及 / 或者包括至少一个集成封装模组, 每一个集成封装模组包括至少两个元件, 每 个元件包括至少一个弓 I脚连接端, 所有元件中的至少一个元件为电路防护元件 [0029] at least one circuit module distributed between adjacent substrates, each circuit module comprising at least one component and / or comprising at least one integrated package module, each integrated package module comprising at least two components, each component comprising At least one bow-pin connection, at least one of all components is a circuit protection component
; 相邻基体之间分布的所有电路模块中的至少一个元件的至少一个引脚连接端 作为外接电极端子, 分布于相邻基体之间的至少一个电路模块与相邻基体中的 至少一个基体通过外接电极端子和至少一个基体的导电连接件的电性连接而连 接; 所有电路模块中部分或者全部具有电路互连关系的元件通过其互连弓 I脚连 接端进行互连; 以及 /或者, At least one pin connection end of at least one of all circuit modules distributed between adjacent substrates serves as an external electrode terminal, and at least one circuit module distributed between adjacent substrates and at least one of adjacent substrates pass The external electrode terminal is electrically connected to the conductive connection of the at least one base; all or all of the circuit modules having circuit interconnection relationships are interconnected by their interconnecting pins; and/or
[0030] 所有电路模块中部分或者全部具有电路互连关系的元件通过互连引脚连接端与 同一导电连接件的电性连接进行互连; 以及 /或者,  [0030] some or all of the components of the circuit module having circuit interconnections are interconnected by electrical connection of the interconnection pin terminals to the same conductive connection; and/or,
[0031] 端口防护电路集成封装件还包括第一互连件, 所有电路模块中部分或者全部具 有电路互连关系的元件通过互连弓 I脚连接端与导电连接件一一对应连接, 以及 通过设置在对应连接的导电连接件之间的第一互连件进行互连。  [0031] The port protection circuit integrated package further includes a first interconnect member, and some or all of the circuit modules having circuit interconnection relationships are connected to the conductive connectors in a one-to-one correspondence through the interconnecting pins, and through The first interconnects disposed between the correspondingly connected conductive connectors are interconnected.
本发明的实施方式 Embodiments of the invention
[0032] 作为一种可选的实施方式, 每一个基体为导电封装基体;  [0032] As an optional embodiment, each of the substrates is a conductive package substrate;
[0033] 每一个基体包括至少一个用于电性连接的导电连接件, 包括:  [0033] Each of the substrates includes at least one electrically conductive connection for electrical connection, including:
[0034] 每一个导电封装基体为一个用于电性连接的导电连接件。 因此, 分布于相邻基 体之间的至少一个电路模块与相邻基体中的至少一个基体通过外接电极端子和 至少一个基体的导电连接件的电性连接而连接, 包括: [0034] Each of the conductive package substrates is a conductive connection for electrical connection. Therefore, distributed in adjacent groups The at least one circuit module between the body and the at least one of the adjacent substrates are connected by an electrical connection of the external electrode terminal and the conductive connection of the at least one base body, including:
[0035] 分布于相邻基体之间的至少一个电路模块与相邻基体中的至少一个基体通过外 接电极端子和至少一个基体的电性连接而连接。  [0035] The at least one circuit module distributed between the adjacent substrates and the at least one of the adjacent substrates are connected by an electrical connection of the external electrode terminal and the at least one substrate.
[0036] 作为一种可选的实施方式, 端口防护电路集成封装件还包括第一互连件, 包括 [0036] As an optional implementation manner, the port protection circuit integrated package further includes a first interconnect, including
[0037] 端口防护电路集成封装件还包括第一纵向互连件, 第一纵向互连件为所有电路 模块中部分或者全部具有电路互连关系的元件通过互连弓 I脚连接端与导电封装 基体一一对应连接, 以及通过设置在对应连接的导电封装基体之间的第一纵向 互连件进行互连。 [0037] The port protection circuit integrated package further includes a first vertical interconnection member, and the first vertical interconnection member is an element having a circuit interconnection relationship in part or all of all the circuit modules, and the conductive package is connected through the interconnection pin The substrates are connected one-to-one and interconnected by a first longitudinal interconnect disposed between the correspondingly connected conductive package substrates.
[0038] 作为一种可选的实施方式, 具有电路互连关系的元件的互连引脚连接端对应连 接的导电封装基体通过第一纵向互连件互连, 第一纵向互连件为对应连接的导 电封装基体中的任一导电封装基体的末端纵向延伸至另一导电封装基体。  [0038] As an optional implementation manner, the interconnecting pin connection ends of the components having the circuit interconnection relationship are interconnected by the first longitudinal interconnects corresponding to the connected conductive package substrates, and the first vertical interconnects are corresponding The ends of any one of the connected conductive package substrates extend longitudinally to another conductive package substrate.
[0039] 作为一种可选的实施方式, 导电封装基体为导电连接件, 具体为导电框架, 导 电框架包括导电托盘和导电托盘延伸形成的导电引脚, 导电托盘用于封装元件 , 导电引脚用于与外接电路或者互连元件的引脚连接端进行连接, 部分或者全 部具有互联关系的元件通过互连弓 I脚连接端与同一导电托盘的连接进行互连, 或 /以及部分或者全部具有互联关系的元件通过纵向延伸的导电引脚进行互连。  [0039] As an optional implementation, the conductive package substrate is a conductive connector, specifically a conductive frame, the conductive frame includes a conductive pin and a conductive pin extending from the conductive tray, and the conductive tray is used for packaging components, and the conductive pin For connection to external pins or pin connections of interconnecting components, some or all of the interconnected components are interconnected by a connection of the interconnecting pins to the same conductive tray, or/and some or all The interconnected components are interconnected by longitudinally extending conductive pins.
[0040] 作为一种可选的实施方式, 导电框架为金属框架。  [0040] As an alternative embodiment, the conductive frame is a metal frame.
[0041] 作为一种可选的实施方式, 金属框架为铜引线框架。  [0041] As an alternative embodiment, the metal frame is a copper lead frame.
[0042] 作为一种可选的实施方式, 端口防护电路集成封装件还包括:  [0042] As an optional implementation manner, the port protection circuit integrated package further includes:
[0043] 用于包封端口防护电路集成封装件中的所有导电封装基体和所有电路模块的包 封壳体或者包封填充体;  [0043] an encapsulation case or an encapsulation body for encapsulating all of the conductive package substrates and all circuit modules in the port protection circuit integrated package;
[0044] 以及包括: [0044] and including:
[0045] 用于外接端口防护电路集成封装件至外部电路的至少一个基体, 其中, 用于外 接端口防护电路集成封装件至外部电路的至少一个基体还包括外接连接件, 外 接连接件为其所属的基体延伸出包封壳体或者填充体形成。  [0045] at least one substrate for the external port protection circuit to integrate the package to the external circuit, wherein the at least one substrate for the external port protection circuit integrated package to the external circuit further includes an external connection member, and the external connection member belongs thereto The base body extends out of the encapsulating shell or the filler body.
[0046] 作为一种可选的实施方式, 基体连接至外接电极端子的部位设有网格或者方形 凹槽或者 u型凹槽或者凸台。 [0046] As an optional implementation manner, a portion of the base body connected to the external electrode terminal is provided with a grid or a square Groove or u-shaped groove or boss.
[0047] 作为一种可选的实施方式, 基体的厚度大于或者等于 0.05mm, 且小于或者等 于 1.5mm。 [0047] As an alternative embodiment, the thickness of the substrate is greater than or equal to 0.05 mm and less than or equal to 1.5 mm.
[0048] 优选的, 所述基体的厚度大于或者等于 0.08mm, 且小于或者等于 1.4mm。  [0048] Preferably, the thickness of the substrate is greater than or equal to 0.08 mm and less than or equal to 1.4 mm.
[0049] 优选的, 所述基体的厚度大于或者等于 0.09mm, 且小于或者等于 1.3mm。 [0049] Preferably, the thickness of the substrate is greater than or equal to 0.09 mm and less than or equal to 1.3 mm.
[0050] 优选的, 所述基体的厚度大于或者等于 0.1mm, 且小于或者等于 1.2mm。 [0050] Preferably, the thickness of the substrate is greater than or equal to 0.1 mm and less than or equal to 1.2 mm.
[0051] 优选的, 所述基体的厚度为 0.2mm或者 0.3 mm或者 0.4mm或者 0.5 mm或者 0.6 mm或者 0.7mm或者 0.8 mm或者 0.9mm或者 1.0 mm或者 1.1 mm或者 1.2 [0051] Preferably, the thickness of the substrate is 0.2 mm or 0.3 mm or 0.4 mm or 0.5 mm or 0.6 mm or 0.7 mm or 0.8 mm or 0.9 mm or 1.0 mm or 1.1 mm or 1.2
mm或者 1.35 mm或者 1.45 mm或者 0.45mm或者 0.55 mm或者 0.65 mm mm或者 0.75 mm或者 0.48 mm或者 0.49 mm或者 0.43 mm, 具体实现不受单个实施例的限制。  Mm or 1.35 mm or 1.45 mm or 0.45 mm or 0.55 mm or 0.65 mm mm or 0.75 mm or 0.48 mm or 0.49 mm or 0.43 mm, the specific implementation is not limited by a single embodiment.
[0052] 作为一种可选的实施方式, 外接连接件包括第一延伸部, 第一延伸部为包括外 接连接件的基体的末端沿垂直于基体的方向延伸出包封壳体或者包封填充体, 位于端口防护电路集成封装件的同一侧的外接连接件错幵分布。 [0052] As an optional embodiment, the external connecting member includes a first extending portion, and the first extending portion extends from the end of the base body including the external connecting member in an direction perpendicular to the base body to extend the enclosing shell or enclose the filling Body, the external connectors on the same side of the port protection circuit integrated package are misaligned.
[0053] 作为一种可选的实施方式, 外接连接件包括第一延伸部, 第一延伸部为包括外 接连接件的基体的末端沿垂直于基体的方向延伸至包封壳体或者包封填充体的 外表面, 位于端口防护电路集成封装件的同一侧的外接连接件错幵分布。  [0053] As an optional embodiment, the external connecting member includes a first extending portion, and the first extending portion extends from the end of the base body including the external connecting member in a direction perpendicular to the base body to the enclosing housing or encapsulating the filling The outer surface of the body, the external connectors on the same side of the integrated circuit of the port protection circuit are distributed in a wrong manner.
[0054] 作为一种可选的实施方式, 外接连接件包括第一延伸部和第二延伸部, 第一延 伸部为包括外接连接件的基体的末端沿垂直于基体的方向延伸出包封壳体或者 包封填充体, 第二延伸部为第一延伸部的末端沿垂直于第一延伸部的方向水平 延伸形成。  [0054] As an optional embodiment, the external connecting member includes a first extending portion and a second extending portion, and the first extending portion extends from the end of the base body including the external connecting member in a direction perpendicular to the base body The body or the encapsulation body is formed, and the second extension portion is formed by extending a distal end of the first extension portion in a direction perpendicular to the first extension portion.
[0055] 作为一种可选的实施方式, 外接连接件包括第一延伸部和第二延伸部, 第一延 伸部为包括外接连接件的基体的末端沿垂直于基体的方向延伸出包封壳体或者 包封填充体, 第二延伸部为第一延伸部的末端沿垂直于第一延伸部的方向水平 背向基体延伸形成。  [0055] In an optional embodiment, the external connecting member includes a first extending portion and a second extending portion, and the first extending portion extends from the end of the base body including the external connecting member in a direction perpendicular to the base body The body or the encapsulation body is formed, and the second extension portion is formed by extending the end of the first extension portion horizontally away from the base body in a direction perpendicular to the first extension portion.
[0056] 作为一种可选的实施方式, 外接连接件包括第一延伸部和第二延伸部, 第一延 伸部为包括外接连接件的基体的末端沿垂直于基体的方向延伸出包封壳体或者 包封填充体, 第二延伸部为第一延伸部的末端沿垂直于第一延伸部的方向横向 朝向基体延伸形成。 [0057] 作为一种可选的实施方式, 外接连接件包括第一延伸部和第二延伸部, 第一延 伸部为包括外接连接件的基体的末端沿垂直于基体的方向延伸至包封壳体或者 包封填充体的外表面, 第二延伸部为第一延伸部的末端沿垂直于第一延伸部的 方向横向背向基体延伸形成。 [0056] In an optional embodiment, the external connecting member includes a first extending portion and a second extending portion, and the first extending portion extends from the end of the base body including the external connecting member in a direction perpendicular to the base body The body or the encapsulating body, the second extension portion is formed by extending the end of the first extending portion laterally toward the base body in a direction perpendicular to the first extending portion. [0057] As an optional embodiment, the external connecting member includes a first extending portion and a second extending portion, and the first extending portion extends from the end of the base body including the external connecting member to the enclosing shell in a direction perpendicular to the base body The outer surface of the body or the encapsulation body, the second extension portion is formed by extending the end of the first extension portion laterally away from the base body in a direction perpendicular to the first extension portion.
[0058] 作为一种可选的实施方式, 外接连接件包括第一延伸部和第二延伸部, 第一延 伸部为包括外接连接件的基体的末端沿垂直于基体的方向延伸至包封壳体或者 包封填充体的外表面, 第二延伸部为第一延伸部的末端沿垂直于第一延伸部的 方向横向朝向基体延伸形成。 [0058] As an optional embodiment, the external connector includes a first extension portion and a second extension portion, and the first extension portion extends from the end of the base body including the external connection member in a direction perpendicular to the base body to the encapsulation shell The outer surface of the body or the encapsulation body, the second extension portion is formed by extending the end of the first extension portion laterally toward the base body in a direction perpendicular to the first extension portion.
[0059] 作为一种可选的实施方式, 外接连接件包括第一延伸部和第二延伸部, 第一延 伸部为包括外接连接件的基体沿垂直于基体的方向延伸至包封壳体或者填充体 的内边缘, 第二延伸部为第一延伸部的末端沿垂直于第一延伸部的方向远离基 体延伸出包封壳体或者包封填充体, 位于端口防护电路集成封装件的同一侧的 外接连接件错幵分布。 [0059] As an optional embodiment, the external connector includes a first extension portion and a second extension portion, the first extension portion extending from the base body including the external connection member in a direction perpendicular to the base body to the encapsulation housing or An inner edge of the filling body, the second extending portion is an end of the first extending portion extending away from the base body in an direction perpendicular to the first extending portion, or enclosing the filling body, on the same side of the port protection circuit integrated package The external connectors are distributed in a wrong way.
[0060] 作为一种可选的实施方式, 还包括至少一个端口防护电路基本元件, 端口防护 电路基本元件包括电阻、 电容、 电感、 保险丝和浪涌防护器件中的任一种端口 防护电路基本元件, 以及电路防护元件包括气体放电管或瞬态电压抑制器或压 敏电阻或热敏电阻或半导体放电管或保险丝。  [0060] As an optional implementation, at least one port protection circuit basic component is further included, and the port protection circuit basic component includes any one of a resistor, a capacitor, an inductor, a fuse, and a surge protection device. And circuit protection components include gas discharge tubes or transient voltage suppressors or varistors or thermistors or semiconductor discharge tubes or fuses.
[0061] 作为一种可选的实施方式, 浪涌防护器件包括气体放电管或瞬态电压抑制器或 压敏电阻或热敏电阻或半导体放电管或保险丝。 [0061] As an alternative embodiment, the surge protection device comprises a gas discharge tube or a transient voltage suppressor or a varistor or a thermistor or a semiconductor discharge tube or fuse.
[0062] 作为一种可选的实施方式, 端口防护电路集成封装件包括相邻基体之间分布的 至少一个电路模块, 包括: [0062] As an optional implementation manner, the port protection circuit integrated package includes at least one circuit module distributed between adjacent substrates, including:
[0063] 端口防护电路集成封装件包括相邻基体之间分布的一包含 RC集成模组的电路 模块, RC集成模组中包括具有串连关系的第一电阻和第一电容, 其中 RC集成模 组包括: [0063] The port protection circuit integrated package includes a circuit module including an RC integrated module distributed between adjacent substrates, and the RC integrated module includes a first resistor and a first capacitor having a series relationship, wherein the RC integrated mode The group includes:
[0064] 依次叠层的第一电容电极层、 第一陶瓷基体、 第二电容电极层、 电阻印刷层。  [0064] The first capacitor electrode layer, the first ceramic substrate, the second capacitor electrode layer, and the resistive printed layer are sequentially laminated.
[0065] 作为一种可选的实施方式, RC集成模组还包括: [0065] As an optional implementation manner, the RC integrated module further includes:
[0066] 叠层于第二电容电极层表面的第二陶瓷基体, 第二陶瓷基体幵设有通孔; [0067] 电阻印刷层包括: [0068] 用于填充通孔, 且印刷于通孔内的第二电容电极层表面的第一电阻印刷层; [0069] 印刷于第一电阻印刷层表面的电阻电极层。 [0066] a second ceramic substrate laminated on the surface of the second capacitor electrode layer, the second ceramic substrate is provided with a through hole; [0067] The resistive printed layer includes: [0068] a first resistive printed layer for filling a via hole and printed on a surface of the second capacitor electrode layer in the via hole; [0069] a resistive electrode layer printed on a surface of the first resistive printed layer.
[0070] 作为一种可选的实施方式, 的端口防护电路集成封装件包括相邻基体之间分布 的至少一个电路模块, 包括:  [0070] As an optional implementation, the port protection circuit integrated package includes at least one circuit module distributed between adjacent substrates, including:
[0071] 的端口防护电路集成封装件包括相邻基体之间分布的至少一个包含 RC集成模 组的电路模块, RC集成模组中包括具有串连关系的第一电阻和第一电容, 其中[0071] The port protection circuit integrated package includes at least one circuit module including an RC integrated module distributed between adjacent substrates, wherein the RC integrated module includes a first resistor and a first capacitor having a series relationship, wherein
RC集成模组包括: The RC integrated module includes:
[0072] 依次叠层的第一电容电极层、 第一电介质层和电阻层。 [0072] The first capacitor electrode layer, the first dielectric layer, and the resistance layer are sequentially laminated.
[0073] 作为一种可选的实施方式, 第一电介质层包括对位叠层、 压合的 N个电介质层 , 所有 N个电介质层中的每相邻的两个电介质层之间连接有内电极层; N为大于 0 的整数。  [0073] As an optional implementation manner, the first dielectric layer includes a aligning laminate, and N dielectric layers are laminated, and each of the adjacent two dielectric layers is connected between the two dielectric layers. Electrode layer; N is an integer greater than zero.
[0074] 作为一种可选的实施方式, RC集成模组还包括:  [0074] As an optional implementation manner, the RC integration module further includes:
[0075] 叠层于第一电介质层和电阻层之间的第二电容电极层。 [0075] a second capacitor electrode layer laminated between the first dielectric layer and the resistance layer.
[0076] 作为一种可选的实施方式, 电阻层包括: [0076] As an optional implementation manner, the resistance layer includes:
[0077] 由下至上叠层的第一电阻浆料印刷层和电阻电极层。 [0077] The first resistive paste printed layer and the resistive electrode layer are laminated from bottom to top.
[0078] 作为一种可选的实施方式, RC集成模组还包括: [0078] As an optional implementation manner, the RC integrated module further includes:
[0079] 叠层于第二电容电极层表面的第二电介质层; [0079] a second dielectric layer laminated on the surface of the second capacitor electrode layer;
[0080] 第二电介质层幵设有通孔; [0080] the second dielectric layer is provided with a through hole;
[0081] 电阻层包括: [0081] The resistance layer includes:
[0082] 用于填充通孔, 且印刷于通孔内的第二电容电极层表面的第一电阻浆料印刷层 [0083] 叠层于第一电阻浆料印刷层表面的电阻电极层。  [0082] A first resistive paste printed layer for filling a via hole and printed on a surface of the second capacitor electrode layer in the via hole is laminated on the resistive electrode layer on the surface of the first resistive paste printed layer.
[0084] 作为一种可选的实施方式, 第一电介质层为用于制作电容器的第一陶瓷电介质 基体, 第二电介质层为用于制作电容器的第二陶瓷电介质基体。  [0084] As an alternative embodiment, the first dielectric layer is a first ceramic dielectric substrate for fabricating a capacitor, and the second dielectric layer is a second ceramic dielectric substrate for fabricating a capacitor.
[0085] 作为一种可选的实施方式, 第一陶瓷电介质基体为碳酸钡电介质基体、 钛酸钙 电介质基体或者钛酸镁电介质基体。  [0085] As an alternative embodiment, the first ceramic dielectric substrate is a cerium carbonate dielectric substrate, a calcium titanate dielectric substrate or a magnesium titanate dielectric substrate.
[0086] 作为一种可选的实施方式, 第一电容电极层、 第二电容电极层、 电阻电极层包 含把、 铂、 金、 银、 铜或镍或上述至少两种金属所成的合金。 [0087] 作为一种可选的实施方式, 第一电阻浆料印刷层为钌系电阻浆料。 [0086] In an optional embodiment, the first capacitor electrode layer, the second capacitor electrode layer, and the resistance electrode layer comprise an alloy of platinum, gold, silver, copper or nickel or at least two kinds of metals. [0087] As an alternative embodiment, the first resistive paste printed layer is a lanthanide resistive paste.
[0088] 作为一种可选的实施方式, 所有电路模块中的至少一个元件为电路防护元件外 , 还有 2N个端口防护电路基本元件, N大于或等于 1, 2N个端口防护电路基本元 件中的 N个元件为电阻, 另 N个元件为电容, N个电阻与 N个电容一一对应电性串 连, 其中, 每一电阻的第一引脚连接端连接至与电阻对应连接的电容的第一引 脚连接端; [0088] As an optional implementation manner, at least one of all circuit modules is a circuit protection component, and 2N port protection circuit basic components, N is greater than or equal to 1, 2N port protection circuit basic components The N components are resistors, and the other N components are capacitors. The N resistors are electrically connected in series with the N capacitors. The first pin connection of each resistor is connected to the capacitor connected to the resistor. First pin connection end;
[0089] 以及, 还包括 N-1电路防护元件, 所有电路防护元件与 N个电阻一一对应电性 互连, 所有电路防护元件与 N个电容一一对应电性互连, 其中, 任一电路防护元 件的两个引脚连接端中的其中一个引脚连接端连接至与电路防护元件对应连接 的电阻的第二引脚连接端, 以及任一电路防护元件的两个引脚连接端中的另一 个弓 I脚连接端连接至与电路防护元件对应连接的电容的第二弓 I脚连接端, 以及 [0089] and, further, an N-1 circuit protection component, wherein all circuit protection components are electrically interconnected with the N resistors one by one, and all the circuit protection components are electrically interconnected with the N capacitors one by one, wherein any One of the two pin terminals of the circuit protection component is connected to the second pin terminal of the resistor connected to the circuit protection component, and the two pin terminals of any circuit protection component Another bow I-pin connection is connected to the second bow-pin connection of the capacitor correspondingly connected to the circuit protection component, and
, 所有电容的第二引脚连接端互连。 , the second pin connection of all capacitors is interconnected.
[0090] 另一实施例  [0090] Another embodiment
[0091] 本实施例提供一种端口防护电路集成封装件, 包括:  [0091] The embodiment provides a port protection circuit integrated package, including:
[0092] 上下间隔分布的至少两个基体, 每一个基体包括至少一个用于电性连接的导电 连接件;  [0092] at least two substrates spaced apart from each other, each of the substrates including at least one electrically conductive connection for electrical connection;
[0093] 相邻基体之间分布的至少一个电路模块, 每个电路模块包括至少一个元件及 / 或者包括至少一个集成封装模组, 每一个集成封装模组包括至少两个元件, 每 个元件包括至少一个弓 I脚连接端, 所有元件中的至少一个元件为电路防护元件 [0093] at least one circuit module distributed between adjacent substrates, each circuit module comprising at least one component and/or comprising at least one integrated package module, each integrated package module comprising at least two components, each component comprising At least one bow-pin connection, at least one of all components is a circuit protection component
; 相邻基体之间分布的所有电路模块中的至少一个元件的至少一个引脚连接端 作为外接电极端子, 分布于相邻基体之间的至少一个电路模块与相邻基体中的 至少一个基体通过外接电极端子和至少一个基体的导电连接件的电性连接而连 接; 所有电路模块中部分或者全部具有电路互连关系的元件通过互连弓 I脚连接 端进行互连; 以及 /或者, At least one pin connection end of at least one of all circuit modules distributed between adjacent substrates serves as an external electrode terminal, and at least one circuit module distributed between adjacent substrates and at least one of adjacent substrates pass The external electrode terminals are electrically connected to the conductive connection members of the at least one base; all or all of the circuit modules having circuit interconnection relationships are interconnected by the interconnecting pins; and/or
[0094] 所有电路模块中部分或者全部具有电路互连关系的元件通过互连引脚连接端与 同一导电连接件的电性连接进行互连; 以及 /或者,  [0094] some or all of the components of the circuit module having circuit interconnections are interconnected by electrical connection of the interconnection pin terminals to the same conductive connection; and/or,
[0095] 端口防护电路集成封装元件还包括第一互连件, 所有电路模块中部分或者全部 具有电路互连关系的元件通过互连弓 I脚连接端与导电连接件一一对应连接, 以 及通过设置在对应连接的导电连接件之间的第一互连件进行互连。 [0095] The port protection circuit integrated package component further includes a first interconnect member, and all or all of the circuit module having circuit interconnection relationship are connected to the conductive connector in a one-to-one correspondence through the interconnecting pin connection terminal And interconnecting through a first interconnect disposed between the correspondingly connected conductive connectors.
[0096] 在本实施例中, 所有元件中的一个元件为电路防护元件, 还包括二个端口防护 电路基本元件, 分别是具有串连互连关系的第一电阻和第一电容。 下面将以第 一电阻和第一电容进行串连的电路结构为例, 并结合图 la至图 5对本实施例实现 该电路结构对应的端口防护电路集成封装件进行具体说明。 请参见图 la至图 2b, 图 la为本申请实施例提供的一种端口防护电路集成封装件的正面剖视图; 图 lb为 本申请实施例提供的一种 RC集成模组的结构示意图; 图 lc为本申请实施例提供 的一种端口防护电路集成封装件的电路结构图; 图1(1为本申请实施例提供的一 种端口防护电路集成封装件的应用电路图。 下面以三个基体和相邻基体之间各 分布的一个电路模块为例进行说明, 如图 la所示, 本实施例提供的端口防护电路 集成封装件包括第一基体 Zl、 第二基体 Z2和第三基体 Z3, 以及包括分布于相邻 的第一基体 Z1和第二基体 Z2之间的第一电路模块 Ml, 以及包括分布于相邻的第 二基体 Z2和第三基体 Z3之间的第二电路模块 M2; 以及, 第一电路模块 Ml包括 R C集成模组, 如图 lb所示, RC集成模组包括具有串连互连关系的第一电阻 R和第 一电容 (:, 其中第一电阻 R和第一电容 C呈纵向结构分布, 即 RC集成模组的上下 相对的两端为其外接电路的引脚连接端。 第二电路模块 M2包括一个电路防护元 件, 以及第一基体 Z1包括外接连接件 110, 第二基体 Z2包括外接连接件 120, 第 三基体 Z3包括外接连接件 130。 其中, 第一基体 Zl、 第二基体 Z2和第三基体 Z3上 下间隔分布, 都为导电封装基体。 [0096] In this embodiment, one of the components is a circuit protection component, and further includes two port protection circuit basic components, which are respectively a first resistor and a first capacitor having a series interconnection relationship. The circuit structure in which the first resistor and the first capacitor are connected in series is taken as an example, and the port protection circuit integrated package corresponding to the circuit structure in this embodiment is specifically described in conjunction with FIG. 1 to FIG. FIG. 1B is a front cross-sectional view of a port protection circuit integrated package according to an embodiment of the present disclosure; FIG. 1b is a schematic structural diagram of an RC integrated module according to an embodiment of the present application; A circuit structure diagram of a port protection circuit integrated package provided by an embodiment of the present application; FIG. 1 is a circuit diagram of an application of a port protection circuit integrated package provided by an embodiment of the present application. A circuit module of each of the adjacent bases is taken as an example. As shown in FIG. 1a, the port protection circuit integrated package provided in this embodiment includes a first base Z1, a second base Z2, and a third base Z3, and includes a first circuit module M1 distributed between the adjacent first substrate Z1 and the second substrate Z2, and a second circuit module M2 distributed between the adjacent second substrate Z2 and the third substrate Z3; The first circuit module M1 includes an RC integrated module. As shown in FIG. 1B, the RC integrated module includes a first resistor R and a first capacitor having a series interconnection relationship (:, wherein the first resistor R and the first capacitor C Longitudinal The structure is distributed, that is, the upper and lower opposite ends of the RC integrated module are the pin terminals of the external circuit. The second circuit module M2 includes a circuit protection component, and the first substrate Z1 includes an external connector 110, and the second substrate Z2 includes an external connector 120, and the third substrate Z3 includes an external connector 130. The first substrate Z1, the second substrate Z2, and the third substrate Z3 are spaced apart from each other, and both are conductive package substrates.
[0097] 在本实施例中, 第一电阻 R的第一弓 I脚连接端和第一电容 C的第一弓 I脚连接端 作为第一电路模块 Ml的两个外接电极端子, 第一电阻 R的第二引脚连接端和第 一电容 C的第二引脚连接端串连, 第一电路模块 Ml与第一基体 Z1和第二基体 Z2 通过第一电路模块 Ml的两个外接电极端子与第一基体 Z1和第二基体 Z2的对应电 性连接而连接。 以及, 电路防护元件的两个引脚连接端作为第二电路模块 M2的 两个外接电极端子; 第二电路模块 M2与第二基体 Z2和第三基体 Z3通过第二电路 模块 M2的两个外接电极端子和第二基体 Z2及第三基体 Z3的对应电性连接而连接 。 如图 lc所示, 本实施例提供的端口防护电路集成封装件中除第一电阻 R与第一 电容 C互连外, 第一电阻 R与电路防护元件也存在互连关系, 本实施例中第一电 阻 R与第一电容 C的互连通过 RC集成模组实现, 而第一电阻 R与电路防护元件通 过如下结构实现互连: [0097] In this embodiment, the first pin I of the first resistor R and the first pin of the first capacitor C are connected as two external electrode terminals of the first circuit module M1, the first resistor The second pin connection end of the R and the second pin connection end of the first capacitor C are connected in series, and the first circuit module M1 and the first base body Z1 and the second base body Z2 pass through the two external electrode terminals of the first circuit module M1. Connected to the corresponding electrical connection of the first substrate Z1 and the second substrate Z2. And the two pin terminals of the circuit protection component serve as two external electrode terminals of the second circuit module M2; the second circuit module M2 and the second base body Z2 and the third base body Z3 pass through two external terminals of the second circuit module M2 The electrode terminals are connected to the second base body Z2 and the third base body Z3 by electrical connection. As shown in FIG. 1c, in the port protection circuit integrated package provided by this embodiment, in addition to the first resistor R being interconnected with the first capacitor C, the first resistor R and the circuit protection component also have an interconnection relationship. In this embodiment, First electricity The interconnection of the resistor R and the first capacitor C is realized by the RC integrated module, and the first resistor R and the circuit protection component are interconnected by the following structure:
[0098] 第一电阻 R与电路防护元件通过第一电阻 R的第一引脚连接端和电路防护元件 的一引脚连接端与同一基体, 即第二基体 Z2的共同电性连接进行互连。  [0098] The first resistor R and the circuit protection component are interconnected by a first pin connection end of the first resistor R and a pin connection end of the circuit protection component and a common electrical connection of the same substrate, that is, the second substrate Z2 .
[0099] 在其他实施方式中, 可以在不同基体之间分布第一电阻 R和第一电容 C, 第一 电阻 R与第一电容 C与同一基体进行连接实现第一电阻 R与第一电容 C的互连。  [0099] In other embodiments, the first resistor R and the first capacitor C may be distributed between different substrates, and the first resistor R and the first capacitor C are connected to the same substrate to implement the first resistor R and the first capacitor C. Interconnection.
[0100] 具体地, 在本实施例中, 根据图 lc说明本实施例提供的端口防护电路集成封装 件的电路结构, 如图 lc所示, 本实施例中的第一电阻 R与电路防护元件存在互连 关系, 以及第一电阻 R和第一电容 C之间存在互连关系, 具体地, 第一电阻 R通 过其第一弓 I脚连接端连接至电路防护元件的一引脚连接端, 以及第一电阻 R的第 二引脚连接端和第一电容 C的第二引脚连接端具有串连关系。 在本实施例中, 设 定 RC集成模组的上下相对的两端中的上端为第一电容 C的第一引脚连接端, 以 及 RC集成模组的上下相对的两端中的下端为第一电阻 R的第一引脚连接端。 本 实施例设定用于外接端口防护电路集成封装件至外部电路的元件为第一电容 C和 电路防护元件, 则第一电容 C的第一引脚连接端以及电路防护元件的两个引脚连 接端用于外接端口防护电路集成封装件至外部电路。 具体地, 第一电容 C的第一 引脚连接端通过与其对应电性连接的第一基体 Z1连接至外部电路, 电路防护元 件的两个引脚连接端通过与其分别对应连接的第二基体 Z2和第三基体 Z3连接至 外部电路。 如图 Id所示, 本实施例提供的端口防护电路集成封装件在应用吋, 第一电容 C与电路防护元件互连, 因此, 端口防护电路集成封装件中的第一基体 Z1的外接连接件 110和第三基体 Z3的外接连接件 130位于端口防护电路集成封装 件的同一侧, 在应用贴片吋, 第一电容 C与电路防护元件的互联引脚连接端通过 外接连接件 110和外接连接件 130与印刷线路板上的同一焊盘的连接实现应用吋 的互连。  [0100] Specifically, in the embodiment, the circuit structure of the port protection circuit integrated package provided by the embodiment is described according to FIG. 1c, and the first resistor R and the circuit protection component in this embodiment are shown in FIG. There is an interconnection relationship, and there is an interconnection relationship between the first resistor R and the first capacitor C. Specifically, the first resistor R is connected to a pin connection end of the circuit protection component through the first bow pin connection end thereof. And the second pin connection end of the first resistor R and the second pin connection end of the first capacitor C have a series relationship. In this embodiment, the upper end of the upper and lower opposite ends of the RC integrated module is set as the first pin connection end of the first capacitor C, and the lower end of the upper and lower opposite ends of the RC integrated module is the first A first pin connection of a resistor R. In this embodiment, the component for the external port protection circuit integrated package to the external circuit is the first capacitor C and the circuit protection component, and the first pin connection end of the first capacitor C and the two pins of the circuit protection component The connector is used for an external port protection circuit to integrate the package to an external circuit. Specifically, the first pin connection end of the first capacitor C is connected to the external circuit through the first base body Z1 electrically connected thereto, and the two pin connection ends of the circuit protection component pass through the second base body Z2 respectively connected thereto And the third substrate Z3 is connected to an external circuit. As shown in FIG. 1D, the port protection circuit integrated package provided in this embodiment is applied, and the first capacitor C is interconnected with the circuit protection component. Therefore, the port protection circuit integrates the external connector of the first substrate Z1 in the package. The external connector 130 of the 110 and the third substrate Z3 is located on the same side of the port protection circuit integrated package. In the application patch, the interconnection pin connection end of the first capacitor C and the circuit protection component is connected through the external connector 110 and the external connection. The connection of the device 130 to the same pad on the printed circuit board enables the interconnection of the application.
[0101] 优选的, 如图 la所示, 本实施例提供的端口防护电路集成封装件还包括用于包 封端口防护电路集成封装件中的所有导电封装基体和所有电路模块的包封壳体 (或者包封填充体) P。  [0101] Preferably, as shown in FIG. 1a, the port protection circuit integrated package provided by the embodiment further includes an encapsulation case for encapsulating all the conductive package bases and all circuit modules in the port protection circuit integrated package. (or enclose the filler) P.
[0102] 在本实施例中, 用于外接端口防护电路集成封装件至外部电路的元件对应连接 的导电封装基体还包括导电封装基体延伸出包封壳体或者填充体而形成的外接 连接件, 优选的, 在本实施例中, 外接连接件 110, 外接连接件 120和外接连接 件 130分别为其所属的基体延伸出包封壳体或者填充体形成。 具体地, 外接连接 件 110, 外接连接件 120和外接连接件 130分别包括第一延伸部和第二延伸部, 第 一延伸部为包括外接连接件的基体沿垂直于基体的方向延伸至包封壳体或者包 封填充体的内边缘, 第二延伸部为第一延伸部的末端沿垂直于第一延伸部的方 向远离基体延伸出包封壳体 P (或者包封填充体) , 以及位于端口防护电路集成 封装件的同一侧的外接连接件错幵分布。 [0102] In this embodiment, the component corresponding connection for the external port protection circuit integrated package to the external circuit The conductive package base further includes an external connector formed by the conductive package base extending out of the encapsulation case or the filler body. Preferably, in the embodiment, the external connection member 110, the external connection member 120 and the external connection member 130 are respectively The substrate to which it belongs extends out of the encapsulating housing or the filling body. Specifically, the external connecting member 110, the external connecting member 120 and the external connecting member 130 respectively comprise a first extending portion and a second extending portion, and the first extending portion is a base body including an external connecting member extending in a direction perpendicular to the base body to the encapsulation The housing or enclosing the inner edge of the filling body, the second extending portion is an end of the first extending portion extending away from the base body in an direction perpendicular to the first extending portion to extend the encapsulating shell P (or enclosing the filling body), and The port protection circuit integrates the external connectors on the same side of the package with a misaligned distribution.
[0103] 作为一种可选的实施方式, 请参见图 2a和图 2b, 图 2a为本申请实施例提供的 RC 集成模组的一种结构图, 图 2b为本申请实施例提供的 RC集成模组的另一种结构 图, 如图 2a所示, RC集成模组包括: [0103] As an alternative embodiment, please refer to FIG. 2a and FIG. 2b, FIG. 2a is a structural diagram of an RC integrated module according to an embodiment of the present application, and FIG. 2b is an RC integration provided by an embodiment of the present application. Another structure of the module, as shown in Figure 2a, the RC integrated module includes:
[0104] 依次叠层的第一电容电极层 200、 第一陶瓷基体 210、 第二电容电极层 220、 电 阻印刷层 230。 [0104] The first capacitor electrode layer 200, the first ceramic substrate 210, the second capacitor electrode layer 220, and the resistive printed layer 230 are sequentially laminated.
[0105] 优选的, 鲍勃史密斯电路的实现可采用如图 2b所示的 RC集成模组结构, 具体 地, RC集成模组包括:  [0105] Preferably, the implementation of the Bob Smith circuit can adopt the RC integrated module structure as shown in FIG. 2b. Specifically, the RC integrated module includes:
[0106] 依次叠层的第一电容电极层 200、 第一陶瓷基体 210、 第二电容电极层 220; [0106] The first capacitor electrode layer 200, the first ceramic substrate 210, and the second capacitor electrode layer 220 are sequentially laminated;
[0107] 叠层于第二电容电极层 220表面的电阻印刷层 230, 电阻印刷层 230包括第二陶 瓷基体 231, 第二陶瓷基体 231幵设有通孔 232; [0107] The resistive printed layer 230 is laminated on the surface of the second capacitor electrode layer 220, the resistive printed layer 230 includes a second ceramic substrate 231, and the second ceramic substrate 231 is provided with a through hole 232;
[0108] 用于填充通孔 232, 且印刷于通孔 232内的第二电容电极层 220表面的第一电阻 印刷层 233; [0108] a first resistive printed layer 233 for filling the via 232 and printed on the surface of the second capacitor electrode layer 220 in the via 232;
[0109] 印刷于第一电阻印刷层 233表面的电阻电极层 234。  [0109] A resistive electrode layer 234 printed on the surface of the first resistive printed layer 233.
[0110] 在其他实施例中, 作为一种可选的实施方式, 设定 RC集成模组的上下相对的 两端中的上端为第一电阻 R的第一引脚连接端, 以及 RC集成模组的上下相对的 两端中的下端为第一电容 C的第一引脚连接端。 而本实施方式中的电路连接关系 为第一电容 C与电路防护元件存在互连关系, 以及第一电阻 R和第一电容 C之间 存在互连关系, 具体地, 本实施方式中的互连关系为第一电容 C通过其第一引脚 连接端连接至电路防护元件的一引脚连接端, 以及第一电阻 R的第二引脚连接端 和第一电容 C的第二引脚连接端具有串连关系。 本实施例设定用于外接端口防护 电路集成封装件至外部电路的元件为第一电阻 R和电路防护元件, 则第一电阻 R 的第一引脚连接端以及电路防护元件的两个引脚连接端用于外接端口防护电路 集成封装件至外部电路。 具体地, 第一电阻 R的第一引脚连接端通过与其对应电 性连接的第一基体 Z1连接至外部电路, 电路防护元件的两个引脚连接端通过与 其分别对应连接的第二基体 Z2和第三基体 Z3连接至外部电路。 本实施例提供的 端口防护电路集成封装件在应用吋, 第一电阻 R与电路防护元件互连, 因此, 端 口防护电路集成封装件中的第一基体 Z1的外接连接件 110和第三基体 Z3的外接连 接件 130位于端口防护电路集成封装件的同一侧, 在应用贴片吋, 第一电阻 R与 电路防护元件的互联引脚连接端通过外接连接件 110和外接连接件 130与印刷线 路板上的同一焊盘的连接实现应用吋的互连。 本实施方式中第一电阻 R与第一电 容 C的互连通过 RC集成模组实现, 而第一电容与电路防护元件通过如下结构实 现互连: [0110] In other embodiments, as an optional implementation manner, setting an upper end of the upper and lower opposite ends of the RC integrated module as a first pin connection end of the first resistor R, and an RC integrated mode The lower end of the upper and lower opposite ends of the group is the first pin connection end of the first capacitor C. The circuit connection relationship in the present embodiment is that the first capacitor C has an interconnection relationship with the circuit protection component, and the interconnection relationship between the first resistor R and the first capacitor C, specifically, the interconnection in the embodiment. The relationship is that the first capacitor C is connected to a pin connection end of the circuit protection component through the first pin connection end thereof, and the second pin connection end of the first resistor R and the second pin connection end of the first capacitor C Has a series relationship. This embodiment is set for external port protection. The components of the circuit integrated package to the external circuit are the first resistor R and the circuit protection component, and the first pin connection end of the first resistor R and the two pin terminals of the circuit protection component are used for the external port protection circuit integrated package. Pieces to an external circuit. Specifically, the first pin connection end of the first resistor R is connected to the external circuit through the first base body Z1 electrically connected thereto, and the two pin connection ends of the circuit protection component pass through the second base body Z2 respectively connected thereto And the third substrate Z3 is connected to an external circuit. The port protection circuit integrated package provided in this embodiment is applied, the first resistor R is interconnected with the circuit protection component, and therefore, the port protection circuit integrates the external connector 110 and the third substrate Z3 of the first substrate Z1 in the package. The external connector 130 is located on the same side of the port protection circuit integrated package. In the application patch, the first resistor R and the circuit protection component are connected to each other through the external connector 110 and the external connector 130 and the printed circuit board. The connection of the same pad on the top implements the interconnection of the application. In this embodiment, the interconnection of the first resistor R and the first capacitor C is realized by the RC integrated module, and the first capacitor and the circuit protection component are interconnected by the following structure:
[0111] 第一电容 C与电路防护元件通过第一电容 C的第一引脚连接端和电路防护元件 的一引脚连接端与同一基体, 即第二基体 Z2的共同电性连接进行互连。  [0111] The first capacitor C and the circuit protection component are interconnected by a first pin connection end of the first capacitor C and a pin connection end of the circuit protection component and a common electrical connection of the same substrate, that is, the second substrate Z2 .
[0112] 作为一种可选的实施方式, 电路防护元件为气体放电管或瞬态电压抑制器或压 敏电阻或热敏电阻或半导体放电管或保险丝。  [0112] As an alternative embodiment, the circuit protection component is a gas discharge tube or a transient voltage suppressor or a varistor or a thermistor or a semiconductor discharge tube or fuse.
[0113] 优选的, 基体连接至外接电极端子的部位设有网格或者方形凹槽或者 u型凹槽 或者凸台。 具体地, 本实施例中第一基体 Z1连接至外接电极端子的部位设有凸 台, 以及第二基体 Z2连接至外接电极端子的部位设有凹槽。 以及第三基体 Z3的 连接至外接电极端子的部位设有凸台。  [0113] Preferably, a portion where the base body is connected to the external electrode terminal is provided with a mesh or a square groove or a u-shaped groove or a boss. Specifically, in the embodiment, a portion where the first base body Z1 is connected to the external electrode terminal is provided with a boss, and a portion where the second base body Z2 is connected to the external electrode terminal is provided with a groove. And a portion of the third base body Z3 connected to the external electrode terminal is provided with a boss.
[0114] 作为一种可选的实施方式, 基体的厚度大于或者等于 0.05mm, 且小于或者等 于 1.5mm。  [0114] As an alternative embodiment, the thickness of the substrate is greater than or equal to 0.05 mm and less than or equal to 1.5 mm.
[0115] 作为一种可选的实施方式, 基体的厚度大于或者等于 0.08mm, 且小于或者等 于 1.2mm。  [0115] As an alternative embodiment, the thickness of the substrate is greater than or equal to 0.08 mm and less than or equal to 1.2 mm.
[0116] 作为一种可选的实施方式, 基体的厚度大于或者等于 lmm, 且小于或者等于 1.  [0116] As an optional implementation manner, the thickness of the base body is greater than or equal to 1 mm, and is less than or equal to 1.
3mm。  3mm.
[0117] 优选的, 所有基体的厚度大于或者等于 0.1mm, 小于或者等于 0.3mm; 所述端 口防护电路集成封装件为正方体或者长方体, 所述端口防护电路集成封装件的 厚度小于或者等于 2.5mm, 大于或者等于 1.0mm, 所述端口防护电路集成封装件 的长度小于或者等于 6mm, 大于或者等于 1.5mm, 所述端口防护电路集成封装件 的宽度小于或者等于 6mm, 大于或者等于 1.5mm。 [0117] Preferably, all of the substrates have a thickness greater than or equal to 0.1 mm and less than or equal to 0.3 mm; the port protection circuit integrated package is a square or a rectangular parallelepiped, and the port protection circuit integrates the package. The thickness of the port protection circuit integrated package is less than or equal to 6 mm and greater than or equal to 1.5 mm, and the width of the port protection circuit integrated package is less than or equal to 6 mm, which is greater than or equal to 2.5 mm. Or equal to 1.5mm.
[0118] 优选的, 所有基体的厚度大于或者等于 0.2mm, 小于或者等于 0.3mm; 所述端 口防护电路集成封装件为正方体或者长方体, 所述端口防护电路集成封装件的 厚度小于或者等于 2.5mm, 大于或者等于 1.5mm, 所述端口防护电路集成封装件 的长度小于或者等于 5.5mm, 大于或者等于 5mm, 所述端口防护电路集成封装件 的宽度小于或者等于 3.6mm, 大于或者等于 3mm。  [0118] Preferably, the thickness of all the substrates is greater than or equal to 0.2 mm, less than or equal to 0.3 mm; the port protection circuit integrated package is a square or rectangular parallelepiped, and the thickness of the port protection circuit integrated package is less than or equal to 2.5 mm. The length of the port protection circuit integrated package is less than or equal to 5.5 mm and greater than or equal to 5 mm, and the width of the port protection circuit integrated package is less than or equal to 3.6 mm and greater than or equal to 3 mm.
[0119] 另一实施例  [0119] Another embodiment
[0120] 请参见图 3a至图 3b, 图 3a为本申请实施例提供的另一种端口防护电路集成封装 件的电路结构, 图 3b为本申请实施例提供的另一种端口防护电路集成封装件的 正面剖视结构图。 如图 3a至图 3b所示, 基于图 lc所示的电路结构, 本实施例中的 第一电容 C的第一弓 I脚连接端与电路防护元件的另一引脚连接端连接, 以通过本 实施例提供的端口防护电路集成封装件直接实现第一电容 C与电路防护元件的互 连关系。 本实施例中, 如图 3b所示, 端口防护电路集成封装件还包括第一纵向 互连件 300, 第一纵向互连件为具有电路互连关系的第一电容 C和电路防护元件 通过各自需要互连的引脚连接端与第一基体 Z1和第三基体 Z3—一对应连接, 以 及通过设置在对应连接的导电封装基体 (第一基体 Z1和第三基体 Z3) 之间的第 一纵向互连件 300进行互连, 第一纵向互连件 300位于包封壳体或者填充体的内 部或者外部。  Referring to FIG. 3a to FIG. 3b, FIG. 3a is a circuit structure of another port protection circuit integrated package according to an embodiment of the present disclosure, and FIG. 3b is another port protection circuit integrated package according to an embodiment of the present application. A front cross-sectional structural view of the piece. As shown in FIG. 3a to FIG. 3b, based on the circuit structure shown in FIG. 1c, the first pin I of the first capacitor C in this embodiment is connected to the other pin terminal of the circuit protection component to pass The port protection circuit integrated package provided in this embodiment directly realizes the interconnection relationship between the first capacitor C and the circuit protection component. In this embodiment, as shown in FIG. 3b, the port protection circuit integrated package further includes a first longitudinal interconnection 300, the first vertical interconnection being a first capacitor C having a circuit interconnection relationship and the circuit protection component passing through the respective The pin connection end to be interconnected is connected to the first substrate Z1 and the third substrate Z3, and is disposed in a first longitudinal direction between the correspondingly connected conductive package substrates (the first substrate Z1 and the third substrate Z3) The interconnects 300 are interconnected and the first longitudinal interconnects 300 are located inside or outside the enclosure or filler.
[0121] 具体地, 请参照图 3b提供的端口防护电路集成封装件, 第一电容 C的第一引脚 连接端对应连接的第一基体 Z1的末端延伸至第三基体, 具体地延伸至第三基体 与外接电极端子连接的部位所在的平面区域。 另外, 本实施例与图 la所示的端口 防护电路集成封装件的不同之处在于外接连接件的结构不同, 本实施例中, 设 定用于外接端口防护电路集成封装件至外部电路的元件为电路防护元件, 即设 定电路防护元件的两个引脚连接端用于外接端口防护电路集成封装件至外部电 路, 具体地, 电路防护元件的两个引脚连接端通过与其分别对应连接的第二基 体 Z2和第三基体 Z3连接至外部电路, 即第二基体 Z2包括外接连接件 310, 第三基 体 Z3包括外接连接件 320, 外接连接件 310为第二基体 Z2的末端以垂直于第二基 体的方向纵向延伸至包封壳体 P (或者包封填充体) 的下表面形成, 以及外接连 接件 320为第三基体 Z3的末端以垂直于第三基体 Z3的方向纵向延伸至包封壳体 P (或者包封填充体) 的下表面形成。 [0121] Specifically, referring to the port protection circuit integrated package provided in FIG. 3b, the first pin connection end of the first capacitor C extends to the third base body corresponding to the end of the connected first base body Z1, and specifically extends to the first The planar area where the three bases are connected to the external electrode terminals. In addition, the difference between the embodiment and the port protection circuit integrated package shown in FIG. 1 is that the structure of the external connection component is different. In this embodiment, the component for the external port protection circuit integrated package to the external circuit is set. The circuit protection component, that is, the two pin terminals of the circuit protection component are used for the external port protection circuit to integrate the package to the external circuit. Specifically, the two pin terminals of the circuit protection component are respectively connected to each other. The second substrate Z2 and the third substrate Z3 are connected to an external circuit, that is, the second substrate Z2 includes an external connector 310, a third base The body Z3 includes an external connecting member 320, and the external connecting member 310 is formed by extending the end of the second base body Z2 in a direction perpendicular to the second base body to the lower surface of the enclosing housing P (or enclosing the filling body), and an external connection. The member 320 is formed such that the end of the third substrate Z3 extends longitudinally in a direction perpendicular to the third substrate Z3 to the lower surface of the encapsulating case P (or encapsulating the filling body).
[0122] 另一实施例 [0122] Another embodiment
[0123] 本实施例还提供一种端口防护电路集成封装件, 包括:  [0123] The embodiment further provides a port protection circuit integrated package, including:
[0124] 上下间隔分布的至少两个基体, 每一个基体包括至少一个用于电性连接的导电 连接件;  [0124] at least two substrates spaced apart from each other, each of the substrates including at least one electrically conductive connection for electrical connection;
[0125] 相邻基体之间分布的至少一个电路模块, 每个电路模块包括至少一个元件及 / 或者包括至少一个集成封装模组, 每一个集成封装模组包括至少两个元件, 每 个元件包括至少一个弓 I脚连接端, 所有元件中的至少一个元件为电路防护元件 [0125] at least one circuit module distributed between adjacent substrates, each circuit module includes at least one component and/or includes at least one integrated package module, each integrated package module includes at least two components, each component including At least one bow-pin connection, at least one of all components is a circuit protection component
; 相邻基体之间分布的所有电路模块中的至少一个元件的至少一个引脚连接端 作为外接电极端子, 分布于相邻基体之间的至少一个电路模块与相邻基体中的 至少一个基体通过外接电极端子和至少一个基体的导电连接件的电性连接而连 接; 所有电路模块中部分或者全部具有电路互连关系的元件通过互连弓 I脚连接 端进行互连; 以及 /或者, At least one pin connection end of at least one of all circuit modules distributed between adjacent substrates serves as an external electrode terminal, and at least one circuit module distributed between adjacent substrates and at least one of adjacent substrates pass The external electrode terminals are electrically connected to the conductive connection members of the at least one base; all or all of the circuit modules having circuit interconnection relationships are interconnected by the interconnecting pins; and/or
[0126] 所有电路模块中部分或者全部具有电路互连关系的元件通过互连引脚连接端与 同一导电连接件的电性连接进行互连; 以及 /或者,  [0126] Some or all of the components of the circuit module having circuit interconnection relationships are interconnected by electrical connection of the interconnection pin terminals to the same conductive connection; and/or,
[0127] 端口防护电路集成封装元件还包括第一互连件, 所有电路模块中部分或者全部 具有电路互连关系的元件通过互连弓 I脚连接端与导电连接件一一对应连接, 以 及通过设置在对应连接的导电连接件之间的第一互连件进行互连。 [0127] The port protection circuit integrated package component further includes a first interconnect member, and some or all of the circuit modules having circuit interconnection relationships are connected to the conductive connectors in a one-to-one correspondence through the interconnecting pins, and through The first interconnects disposed between the correspondingly connected conductive connectors are interconnected.
[0128] 作为一种可选的实施方式, 电路防护元件包括气体放电管或瞬态电压抑制器或 压敏电阻或热敏电阻或半导体放电管或保险丝。  [0128] As an alternative embodiment, the circuit protection component comprises a gas discharge tube or a transient voltage suppressor or a varistor or a thermistor or a semiconductor discharge tube or fuse.
[0129] 作为一种可选的实施方式, 所有电路模块还包括至少一个端口防护电路基本元 件, 端口防护电路基本元件包括电阻、 电容、 电感、 保险丝和浪涌防护器件中 的至少一种端口防护电路基本元件。 [0129] As an optional implementation manner, all circuit modules further include at least one port protection circuit basic component, and the port protection circuit basic component includes at least one of a resistor, a capacitor, an inductor, a fuse, and a surge protection device. Basic components of the circuit.
[0130] 作为一种可选的实施方式, [0130] As an alternative embodiment,
[0131] 所有电路模块中的元件还包括至少一个端口防护电路基本元件, 包括: [0132] 所有电路模块中的元件还包括 N个电阻和 N个电容, N大于或等于 1, N个电阻 与 N个电容一一对应电性串连, 其中, 任一电阻的第一引脚连接端连接至与电阻 对应连接的电容的第一引脚连接端; [0131] The components of all circuit modules further include at least one port protection circuit basic component, including: [0132] The components in all circuit modules further include N resistors and N capacitors, N is greater than or equal to 1, and N resistors are electrically connected in series with the N capacitors, wherein the first pin of any resistor The connection end is connected to the first pin connection end of the capacitor correspondingly connected to the resistor;
[0133] 以及, 所有电路模块中的元件还包括 N-1个电路防护元件, 所有 N个电路防护 元件与 N个电阻一一对应电性互连, N个电路防护元件与 N个电容一一对应电性 互连, 其中, 每一电阻的第二引脚连接端和每一电容的第二引脚连接端与对应 连接的电路防护元件的两个引脚连接端一一对应连接, 以及, 所有电容的第二 引脚连接端互连。 具体的请参见图 4, 图 4为本实施例提供的另一种端口防护电 路集成封装件的电路结构图, 如图 4所示, 本实施例实现的端口防护电路中以 2 个电路防护元件为例进行说明, 在本实施例提供的端口防护电路中, 电路防护 元件还包括第二电路防护元件 G2, 端口防护电路基本元件还包括第二电阻 R2和 第二电容 C2, 其中第二电路防护元件 G2的一引脚连接端和第二电阻 R2的一引脚 连接端分别作为实现第二电路防护元件 G2和第二电阻 R2串连的公共端, 第二电 路防护元件 G2的另一引脚连接端与第二电容 C2的一引脚连接端分别作为实现第 二电路防护元件 G2和第二电容 C2串连的公共端, 以及第二电阻 R2的另一引脚连 接端和第二电容 C2的另一引脚连接端分别作为实现第二电阻 R2和第二电容 C2互 连的公共端;  [0133] And, the components in all the circuit modules further include N-1 circuit protection components, and all the N circuit protection components are electrically interconnected with the N resistors one by one, and the N circuit protection components and the N capacitors are one by one. Corresponding to the electrical interconnection, wherein the second pin connection end of each resistor and the second pin connection end of each capacitor are connected in one-to-one correspondence with the two pin connection ends of the correspondingly connected circuit protection components, and The second pin connections of all capacitors are interconnected. For details, please refer to FIG. 4. FIG. 4 is a circuit structural diagram of another port protection circuit integrated package according to the embodiment. As shown in FIG. 4, the circuit protection circuit implemented in this embodiment has two circuit protection components. For example, in the port protection circuit provided in this embodiment, the circuit protection component further includes a second circuit protection component G2, and the basic component of the port protection circuit further includes a second resistor R2 and a second capacitor C2, wherein the second circuit protection A pin connection end of the component G2 and a pin connection end of the second resistor R2 respectively serve as a common terminal for realizing the serial connection of the second circuit protection component G2 and the second resistor R2, and the other pin of the second circuit protection component G2 A pin terminal of the connection terminal and the second capacitor C2 respectively serves as a common terminal for realizing the serial connection of the second circuit protection component G2 and the second capacitor C2, and another pin connection terminal of the second resistor R2 and the second capacitor C2 The other pin connection ends respectively serve as a common terminal for interconnecting the second resistor R2 and the second capacitor C2;
[0134] 第一电容 C的一弓 I脚连接端连接至第二电容 C2的一弓 I脚连接端。  [0134] A bow terminal of the first capacitor C is connected to a bow terminal of the second capacitor C2.
[0135] 请参见图 5, 图 5为本实施例提供的另一种端口防护电路集成封装件的电路结构 图, 如图 5所示, 基于图 5所示的端口防护电路, 在本实施例提供的端口防护电 路中, 电路防护元件还包括第三电路防护元件 G3和第四电路防护元件 G4, 端口 防护电路基本元件还包括第三电阻 R3、 第四电阻 R4、 第三电容 C3和第四电容 C4 , 其中第三电路防护元件 G3的一引脚连接端和第三电阻 R3的一引脚连接端分别 作为实现第三电路防护元件 G3和第三电阻 R3串连的公共端, 第三电路防护元件 G3的另一引脚连接端与第三电容 C3的一引脚连接端分别作为实现第三电路防护 元件 G3和第三电容 C3串连的公共端, 以及第三电阻 R3的另一引脚连接端和第三 电容 C3的另一引脚连接端分别作为实现第三电阻 R3和第三电容 C3互连的公共端 ; 第四电路防护元件 G4的一引脚连接端和第四电阻 R4的一引脚连接端分别作为 实现第四电路防护元件 G4和第四电阻 R4串连的公共端, 第四电路防护元件 G4的 另一引脚连接端与第四电容 C4的一引脚连接端分别作为实现第四电路防护元件 G 4和第四电容 C4串连的公共端, 以及第四电阻 R4的另一引脚连接端和第四电容 C 4的另一引脚连接端分别作为实现第四电阻 R4和第四电容 C4互连的公共端; [0136] 第一电容 C的一引脚连接端连接至第三电容 C3的一引脚连接端和第四电容 C4的 一引脚连接端。 [0135] Please refer to FIG. 5. FIG. 5 is a circuit structural diagram of another port protection circuit integrated package according to the embodiment. As shown in FIG. 5, based on the port protection circuit shown in FIG. In the provided port protection circuit, the circuit protection component further includes a third circuit protection component G3 and a fourth circuit protection component G4, and the port protection circuit basic component further includes a third resistor R3, a fourth resistor R4, a third capacitor C3, and a fourth a capacitor C4, wherein a pin connection end of the third circuit protection component G3 and a pin connection end of the third resistor R3 respectively serve as a common terminal for realizing the serial connection of the third circuit protection component G3 and the third resistor R3, and the third circuit The other pin connection end of the protection component G3 and the one pin connection end of the third capacitor C3 respectively serve as a common terminal for realizing the serial connection of the third circuit protection component G3 and the third capacitance C3, and another lead of the third resistor R3. The pin connection end and the other pin connection end of the third capacitor C3 respectively serve as a common terminal for interconnecting the third resistor R3 and the third capacitor C3; a pin connection end of the fourth circuit protection component G4 and a fourth resistor R4 One pin Pick-up A common end of the fourth circuit protection component G4 and the fourth resistor R4 are connected in series, and the other pin connection end of the fourth circuit protection component G4 and the one pin connection end of the fourth capacitor C4 respectively serve as the fourth circuit protection component The common terminal of the series connection of G 4 and the fourth capacitor C4, and the other pin connection end of the fourth resistor R4 and the other pin connection end of the fourth capacitor C 4 respectively serve as the fourth resistor R4 and the fourth capacitor C4. a common terminal of the interconnect; [0136] A pin terminal of the first capacitor C is connected to a pin terminal of the third capacitor C3 and a pin terminal of the fourth capacitor C4.
[0137] 图 4和图 5所示的电路对应的端口防护电路集成封装件可以以图 la所示的结构为 基础, 进一步进行层叠加工, 实现多个电路防护元件的模块与多个鲍勃史密斯 电路的模块的纵向集成。  [0137] The port protection circuit integrated package corresponding to the circuit shown in FIG. 4 and FIG. 5 can be further processed by lamination processing based on the structure shown in FIG. 1a, and modules for implementing multiple circuit protection components and multiple Bob Smith Vertical integration of modules of the circuit.
[0138] 作为一种可选的实施方式, 所有基体的厚度大于或者等于 0.1mm, 小于或者等 于 0.4mm; 端口防护电路集成封装件为正方体或者长方体, 端口防护电路集成封 装件的厚度小于或者等于 1.8mm, 大于或者等于 0.5mm, 端口防护电路集成封装 件的长度小于或者等于 1.8mm, 大于或者等于 1.5mm, 端口防护电路集成封装件 的宽度小于或者等于 1.8mm, 大于或者等于 1.5mm。  [0138] As an optional implementation manner, the thickness of all the substrates is greater than or equal to 0.1 mm, less than or equal to 0.4 mm; the port protection circuit integrated package is a square or a rectangular parallelepiped, and the thickness of the port protection circuit integrated package is less than or equal to 1.8mm, greater than or equal to 0.5mm, the length of the port protection circuit integrated package is less than or equal to 1.8mm, greater than or equal to 1.5mm, and the width of the port protection circuit integrated package is less than or equal to 1.8mm, greater than or equal to 1.5mm.
[0139] 作为一种可选的实施方式, 所有基体的厚度大于或者等于 0.2mm, 小于或者等 于 0.3mm; 端口防护电路集成封装件为正方体或者长方体, 端口防护电路集成封 装件的厚度小于或者等于 1.5mm, 大于或者等于 0.7mm, 端口防护电路集成封装 件的长度小于或者等于 1.5mm, 大于或者等于 0.7mm, 端口防护电路集成封装件 的宽度小于或者等于 1.5mm, 大于或者等于 0.7mm。  [0139] As an optional implementation manner, the thickness of all the substrates is greater than or equal to 0.2 mm and less than or equal to 0.3 mm; the port protection circuit integrated package is a square or a rectangular parallelepiped, and the thickness of the port protection circuit integrated package is less than or equal to 1.5mm, greater than or equal to 0.7mm, the length of the port protection circuit integrated package is less than or equal to 1.5mm, greater than or equal to 0.7mm, and the width of the port protection circuit integrated package is less than or equal to 1.5mm, greater than or equal to 0.7mm.
[0140] 优选的, 所有基体的厚度大于或者等于 0.1mm, 小于或者等于 0.3mm; 所述端 口防护电路集成封装件为正方体或者长方体, 所述端口防护电路集成封装件的 厚度小于或者等于 2.5mm, 大于或者等于 1.0mm, 所述端口防护电路集成封装件 的长度小于或者等于 6mm, 大于或者等于 1.5mm, 所述端口防护电路集成封装件 的宽度小于或者等于 6mm, 大于或者等于 1.5mm。  [0140] Preferably, the thickness of all the substrates is greater than or equal to 0.1 mm, less than or equal to 0.3 mm; the port protection circuit integrated package is a square or a rectangular parallelepiped, and the thickness of the port protection circuit integrated package is less than or equal to 2.5 mm. The length of the port protection circuit integrated package is less than or equal to 6 mm and greater than or equal to 1.5 mm, and the width of the port protection circuit integrated package is less than or equal to 6 mm and greater than or equal to 1.5 mm.
[0141] 优选的, 所有基体的厚度大于或者等于 0.2mm, 小于或者等于 0.3mm; 所述端 口防护电路集成封装件为正方体或者长方体, 所述端口防护电路集成封装件的 厚度小于或者等于 2.5mm, 大于或者等于 1.5mm, 所述端口防护电路集成封装件 的长度小于或者等于 5.5mm, 大于或者等于 5mm, 所述端口防护电路集成封装件 的宽度小于或者等于 3.6mm, 大于或者等于 3mm。 [0141] Preferably, the thickness of all the substrates is greater than or equal to 0.2 mm, less than or equal to 0.3 mm; the port protection circuit integrated package is a square or a rectangular parallelepiped, and the thickness of the port protection circuit integrated package is less than or equal to 2.5 mm. , greater than or equal to 1.5 mm, the length of the port protection circuit integrated package is less than or equal to 5.5 mm, greater than or equal to 5 mm, the port protection circuit integrated package The width is less than or equal to 3.6 mm and greater than or equal to 3 mm.
在本申请所提供的几个实施例中, 应该理解到, 以上描述, 仅为本申请的具体 实施方式, 但本申请的保护范围并不局限于此, 任何熟悉本技术领域的技术人 员在本申请揭露的技术范围内, 可轻易想到各种等效的修改或替换, 这些修改 或替换都应涵盖在本申请的保护范围之内。  In the several embodiments provided in the present application, it should be understood that the above description is only the specific embodiment of the present application, but the scope of protection of the present application is not limited thereto, and anyone skilled in the art is present in this application. Various equivalent modifications or substitutions are readily conceivable within the scope of the present invention.

Claims

权利要求书 Claim
[权利要求 1] 一种端口防护电路集成封装件, 其特征在于, 包括:  [Claim 1] A port protection circuit integrated package, comprising:
上下间隔分布的至少两个基体, 每一个所述基体包括至少一个用于电 性连接的导电连接件;  At least two substrates spaced apart from each other, each of the substrates comprising at least one electrically conductive connection for electrical connection;
相邻所述基体之间分布的至少一个电路模块, 每个所述电路模块包括 至少一个元件及 /或者包括至少一个集成封装模组, 每一个所述集成 封装模组包括至少两个元件, 所有元件中的至少一个元件为电路防护 元件; 相邻所述基体之间分布的所有电路模块中的至少一个元件的至 少一个弓 I脚连接端作为外接电极端子, 分布于相邻所述基体之间的所 述至少一个电路模块与相邻所述基体中的至少一个基体通过所述外接 电极端子和所述至少一个基体的导电连接件的电性连接而连接; 所有 电路模块中部分或者全部具有电路互连关系的所述元件通过其互连引 脚连接端进行互连; 以及 /或者,  At least one circuit module disposed adjacent to the substrate, each of the circuit modules includes at least one component and/or includes at least one integrated package module, each of the integrated package modules including at least two components, all At least one of the components is a circuit protection component; at least one of the connector terminals of at least one of the circuit modules distributed between the adjacent substrates serves as an external electrode terminal, and is distributed between adjacent ones of the substrates The at least one circuit module is connected to at least one of the adjacent ones of the substrates through electrical connections of the external electrode terminals and the conductive connectors of the at least one substrate; some or all of the circuit modules have circuits The elements of the interconnect relationship are interconnected by their interconnect pin connections; and/or,
所有电路模块中部分或者全部具有电路互连关系的所述元件通过所述 互连引脚连接端与同一所述导电连接件的电性连接进行互连; 以及 / 或者,  The elements of all or all of the circuit modules having circuit interconnection relationships are interconnected by electrical connection of the interconnect pin terminals to the same conductive connection; and/or
所述端口防护电路集成封装件还包括第一互连件, 所有电路模块中部 分或者全部具有电路互连关系的所述元件通过所述互连弓 I脚连接端与 所述导电连接件一一对应连接, 以及通过设置在所述对应连接的所述 导电连接件之间的所述第一互连件进行互连。  The port protection circuit integrated package further includes a first interconnect member, and the components of all or all of the circuit modules having a circuit interconnection relationship are connected to the conductive connector through the interconnecting pin connection end Corresponding connections, and interconnections by the first interconnects disposed between the conductive connections of the corresponding connections.
[权利要求 2] 如权利要求 1所述的端口防护电路集成封装件, 其特征在于, 每一个 所述基体为导电封装基体; [Claim 2] The port protection circuit integrated package of claim 1, wherein each of the substrates is a conductive package substrate;
每一个所述基体包括至少一个用于电性连接的导电连接件, 包括: 每一个所述导电封装基体为一个用于电性连接的导电连接件。  Each of the substrates includes at least one electrically conductive connection for electrical connection, including: each of the electrically conductive package substrates is a conductive connection for electrical connection.
[权利要求 3] 如权利要求 2所述的端口防护电路集成封装件, 其特征在于, 所述端 口防护电路集成封装件还包括第一互连件, 包括: 所述端口防护电路集成封装件还包括第一纵向互连件, 所有电路模块 中部分或者全部具有电路互连关系的所述元件通过所述互连弓 I脚连接 端与所述导电封装基体一一对应连接, 以及通过设置在对应连接的所 述导电封装基体之间的所述第一纵向互连件进行互连。 [Claim 3] The port protection circuit integrated package of claim 2, wherein the port protection circuit integrated package further comprises a first interconnect, comprising: the port protection circuit integrated package further Including the first longitudinal interconnect, all circuit modules The components having part or all of the circuit interconnection relationship are connected to the conductive package substrate in a one-to-one correspondence through the interconnecting pins, and through the conductive package bases correspondingly connected The first longitudinal interconnects are interconnected.
[权利要求 4] 如权利要求 3所述的端口防护电路集成封装件, 其特征在于, 所述第 一纵向互连件为所述对应连接的所述导电封装基体中的任一所述导电 封装基体纵向延伸至另一所述导电封装基体。  [Claim 4] The port protection circuit integrated package of claim 3, wherein the first vertical interconnection is any one of the conductive package bases of the corresponding connection The substrate extends longitudinally to another of the electrically conductive package substrates.
[权利要求 5] 如权利要求 4所述的端口防护电路集成封装件, 其特征在于, 还包括 用于包封所述端口防护电路集成封装件中的所有导电封装基体和所有 电路模块的包封壳体或者包封填充体;  [Claim 5] The port protection circuit integrated package of claim 4, further comprising an encapsulation for encapsulating all of the conductive package substrates and all circuit modules in the port protection circuit integrated package The housing or encapsulating the filling body;
用于外接所述端口防护电路集成封装件至外部电路的至少一个所述基 体, 每一个用于外接所述端口防护电路集成封装件至外部电路的所述 基体还包括外接连接件, 所述外接连接件为其所属的所述基体延伸出 所述包封壳体或者所述填充体形成。  At least one of the substrates for externally connecting the port protection circuit integrated package to an external circuit, each of the substrates for externally connecting the port protection circuit integrated package to an external circuit further includes an external connection, the external connection The connecting piece is formed by the associated base body extending out of the enveloping housing or the filling body.
[权利要求 6] 如权利要求 5所述的端口防护电路集成封装件, 其特征在于, [Claim 6] The port protection circuit integrated package of claim 5, wherein
至少一个所述基体的表面与所述外接电极端子的连接的部位设有网格 或者凹槽或者凸台。  A portion of the surface of the at least one of the bases to which the external electrode terminals are connected is provided with a mesh or a groove or a boss.
[权利要求 7] 如权利要求 5所述的端口防护电路集成封装件, 其特征在于, 所述外 接连接件包括第一延伸部, 所述第一延伸部为包括所述外接连接件的 所述基体纵向延伸出所述包封壳体或者所述包封填充体, 位于所述端 口防护电路集成封装件的同一侧的所述外接连接件错幵分布。  [Claim 7] The port protection circuit integrated package according to claim 5, wherein the external connection member includes a first extension portion, and the first extension portion is the one including the external connection member The base body extends longitudinally out of the encapsulating housing or the encapsulating filler body, and the external connecting members located on the same side of the port protection circuit integrated package are misaligned.
[权利要求 8] 如权利要 7所述的端口防护电路集成封装件, 其特征在于, 所述外接 连接件还包括第二延伸部, 所述第二延伸部为所述第一延伸部的末端 横向延伸形成。  [Claim 8] The port protection circuit integrated package according to claim 7, wherein the external connection member further includes a second extension portion, and the second extension portion is an end of the first extension portion The lateral extension is formed.
[权利要求 9] 如权利要求 5所述的端口防护电路集成封装件, 其特征在于, 所述外 接连接件包括第一延伸部和第二延伸部, 所述第一延伸部为包括所述 外接连接件的所述基体纵向延伸至所述包封壳体或者所述填充体, 所 述第二延伸部为所述第一延伸部的末端远离所述基体横向延伸出所述 包封壳体或者所述填充体, 位于所述端口防护电路集成封装件的同一 侧的所述外接连接件错幵分布。 [Claim 9] The port protection circuit integrated package according to claim 5, wherein the external connection member includes a first extension portion and a second extension portion, and the first extension portion includes the external connection The base body of the connecting piece extends longitudinally to the enclosing housing or the filling body, The second extension portion is such that the end of the first extension portion extends laterally away from the base body to the encapsulation case or the filler body, and the external connection is located on the same side of the port protection circuit integrated package. The wrong distribution.
[权利要求 10] 如权利要求 1至 9中任一所述的端口防护电路集成封装件, 其特征在于 所有电路模块中的元件还包括至少一个端口防护电路基本元件, 所述 端口防护电路基本元件包括电阻、 电容、 电感、 保险丝和浪涌防护器 件中的任一种端口防护电路基本元件;  [Claim 10] The port protection circuit integrated package according to any one of claims 1 to 9, characterized in that the elements of all the circuit modules further comprise at least one port protection circuit basic element, the port protection circuit basic element Includes the basic components of any of the resistors, capacitors, inductors, fuses, and surge protection devices;
所述电路防护元件包括气体放电管或瞬态电压抑制器或压敏电阻或热 敏电阻或半导体放电管或保险丝。  The circuit protection component comprises a gas discharge tube or a transient voltage suppressor or a varistor or a thermistor or a semiconductor discharge tube or fuse.
[权利要求 11] 如权利要求 1至 9中任一所述的端口防护电路集成封装件, 其特征在于 , 所述的端口防护电路集成封装件包括相邻所述基体之间分布的至少 一个电路模块, 包括: [Claim 11] The port protection circuit integrated package according to any one of claims 1 to 9, wherein the port protection circuit integrated package comprises at least one circuit distributed between adjacent substrates Module, including:
所述的端口防护电路集成封装件包括相邻所述基体之间分布的至少一 个包含 RC集成模组的电路模块, 所述 RC集成模组中包括具有串连关 系的第一电阻和第一电容, 其中所述 RC集成模组包括:  The port protection circuit integrated package includes at least one circuit module including an RC integrated module distributed between adjacent substrates, wherein the RC integrated module includes a first resistor and a first capacitor having a series relationship The RC integrated module includes:
依次叠层的第一电容电极层、 第一电介质层和电阻层。  The first capacitor electrode layer, the first dielectric layer, and the resistance layer are sequentially laminated.
[权利要求 12] 如权利要求 11所述的端口防护电路集成封装件, 其特征在于, 所述端 口防护电路集成封装件包括上下间隔分布的至少两个基体, 包括: 所述端口防护电路集成封装件包括上下间隔分布的第一基体、 第二基 体和第三基体; The port protection circuit integrated package of claim 11 , wherein the port protection circuit integrated package comprises at least two bases spaced apart from each other, comprising: the port protection circuit integrated package The device includes a first substrate, a second substrate, and a third substrate spaced apart from each other;
相邻的所述第一基体和所述第二基体之间分布第一电路模块, 所述第 一电路模块包括所述 RC集成模组, 除所述第一电阻和所述第一电容 串连的引脚连接端之外的所述第一电阻的一引脚连接端和所述第一电 容的一引脚连接端作为所述第一电路模块的两个外接电极端子, 所述 第一电路模块与所述第一基体和所述第二基体通过所述第一电路模块 的所述两个外接电极端子与所述第一基体和所述第二基体的一一对应 电性连接而连接; 相邻的所述第二基体和所述第三基体之间分布第二电路模块, 所述第 二电路模块包括一个所述电路防护元件, 所述电路防护元件的两个引 脚连接端作为所述第二电路模块的两个外接电极端子; 所述第二电路 模块与所述第二基体和所述第三基体通过所述第二电路模块的两个外 接电极端子和所述第二基体及所述第三基体的对应电性连接而连接。 a first circuit module is disposed between the adjacent first substrate and the second substrate, the first circuit module includes the RC integrated module, and the first resistor and the first capacitor are connected in series a pin connection end of the first resistor and a pin connection end of the first capacitor outside the pin connection end as two external electrode terminals of the first circuit module, the first circuit The module and the first base body and the second base body are connected by a one-to-one electrical connection between the two external electrode terminals of the first circuit module and the first base body and the second base body; Disposing a second circuit module between the adjacent second substrate and the third substrate, the second circuit module includes one of the circuit protection components, and the two pin terminals of the circuit protection component serve as Two external electrode terminals of the second circuit module; the second circuit module and the second substrate and the third substrate pass through two external electrode terminals of the second circuit module and the second substrate and The third substrates are connected by corresponding electrical connections.
[权利要求 13] 如权利要求 12所述的端口防护电路集成封装件, 其特征在于, 所述电 路防护元件以及所述第一电容 /所述第一电阻为用于外接所述端口防 护电路集成封装件至外部电路的元件, 所述第一基体、 所述第二基体 和所述第三基体作为外接所述端口防护电路集成封装件至外部电路的 三个导电封装基体, 所述第一基体、 所述第二基体和所述第三基体分 别包括一所述外接连接件。 [Claim 13] The port protection circuit integrated package of claim 12, wherein the circuit protection component and the first capacitor/the first resistor are used for externally connecting the port protection circuit The first substrate, the second substrate, and the third substrate serve as three conductive package substrates circumscribing the port protection circuit integrated package to an external circuit, the first substrate The second base body and the third base body respectively comprise one of the external connecting members.
[权利要求 14] 如权利要求 13所述的端口防护电路集成封装件, 其特征在于, 所述第 一基体的外接连接件和所述第三基体的外接连接件位于所述端口防护 电路集成封装件的同一侧。 [Claim 14] The port protection circuit integrated package according to claim 13, wherein the external connection member of the first substrate and the external connection member of the third substrate are located in the port protection circuit integrated package The same side of the piece.
[权利要求 15] 如权利要求 12所述的端口防护电路集成封装件, 其特征在于, 所述电 路防护元件为用于外接所述端口防护电路集成封装件至外部电路的元 件, 所述第二基体、 所述第三基体分别作为外接所述端口防护电路集 成封装件至外部电路的导电封装基体, 所述第二基体和所述第三基体 分别包括一所述外接连接件; [Claim 15] The port protection circuit integrated package of claim 12, wherein the circuit protection component is an element for externally connecting the port protection circuit integrated package to an external circuit, the second The base body and the third base body respectively serve as a conductive package base circumscribing the port protection circuit integrated package to an external circuit, and the second base body and the third base body respectively comprise an external connection piece;
除所述第一电阻和所述第一电容串连之外的所述第一电容的一引脚连 接端及所述第一电阻的一引脚连接端与所述电路防护元件的两个引脚 连接端一一对应进行互连, 除所述第一电阻和所述第一电容串连之外 的所述第一电阻 /所述第一电容的一引脚连接端与所述电路防护元件 的一引脚连接端与所述第二基体电性连接实现互连; 以及, 所述端口防护电路集成封装件还包括第一互连件, 包括:  a pin connection end of the first capacitor and a pin connection end of the first resistor and the two lead wires of the circuit protection component except the first resistor and the first capacitor series The pin terminals are interconnected in a one-to-one correspondence, and the first resistor/the first capacitor of the first resistor and the first capacitor are connected to the circuit protection component except the first resistor and the first capacitor The one-pin connection is electrically connected to the second substrate to achieve interconnection; and the port protection circuit integrated package further includes a first interconnect, including:
所述端口防护电路集成封装件还包括连接于所述第一基体和所述第三 基体的之间的, 且用于实现所述第一电阻 /所述第一电容与所述电路 防护元件进行互连的所述第一纵向互连件。 如权利要求 15所述的端口防护电路集成封装件, 其特征在于, 所述第一纵向互连件为所述第一基体的末端朝向所述第三基体延伸至 所述第三基体。 The port protection circuit integrated package further includes a connection between the first substrate and the third substrate, and is configured to implement the first resistor/the first capacitor and the circuit protection component The first longitudinal interconnects interconnected. The port protection circuit integrated package of claim 15 wherein said first longitudinal interconnect extends from an end of said first substrate toward said third substrate to said third substrate.
如权利要求 1所述的端口防护电路集成封装件, 其特征在于, 每一个 所述基体为绝缘封装基体; The port protection circuit integrated package of claim 1 , wherein each of the substrates is an insulating package substrate;
每一个所述基体包括至少一个用于电性连接的导电连接件, 包括: 每一个所述基体的外表面附着至少一个用于电性连接的导电连接件。 如权利要求 17所述的端口防护电路集成封装件, 其特征在于, 每一个所述基体的外表面附着至少一个用于电性连接的导电连接件, 包括: Each of the substrates includes at least one electrically conductive connection for electrical connection, comprising: at least one electrically conductive connection for electrical connection to an outer surface of each of the substrates. The port protection circuit integrated package of claim 17, wherein the outer surface of each of the substrates is attached with at least one electrically conductive connection for electrical connection, comprising:
每一个所述载体的上表面和 /或下表面附着至少一个用于电性连接的 导电连接件。 At least one electrically conductive connection for electrical connection is attached to the upper and/or lower surface of each of said carriers.
如权利要求 18所述的端口防护电路集成封装件, 其特征在于, 所述端口防护电路集成封装件还包括第一互连件, 包括: The port protection circuit integrated package of claim 18, wherein the port protection circuit integrated package further comprises a first interconnect, comprising:
所述端口防护电路集成封装件还包括第一纵向互连件; The port protection circuit integrated package further includes a first longitudinal interconnect;
分布于不同相邻基体间, 且具有电路互连关系的所述元件通过所述互 连弓 I脚连接端与所述导电连接件一一对应连接, 以及通过设置在对应 连接的所述导电连接件之间的所述第一纵向互连件进行互连; 所述对应连接的所述导电连接件在垂直于所述基体所在平面的投影具 有第一交集区域; The elements distributed between different adjacent substrates and having a circuit interconnection relationship are connected to the conductive connectors in a one-to-one correspondence through the interconnecting pins, and through the conductive connections disposed in the corresponding connections The first longitudinal interconnects between the pieces are interconnected; the conductive connection of the corresponding connection has a first intersection area in a projection perpendicular to a plane of the substrate;
所述端口防护电路集成封装件还包括: The port protection circuit integrated package further includes:
对应连接的所述导电连接件及其之间的区域在所述第一交集区域对应 的位置处设置贯穿的第一通孔; 所述第一纵向互连件穿过所述第一通 孔连接至所述对应连接的所述导电连接件之间。 Correspondingly connecting the conductive connecting members and a region therebetween and a first through hole penetrating at a position corresponding to the first intersection region; the first longitudinal interconnect member is connected through the first through hole Between the electrically conductive connectors of the corresponding connection.
如权利要求 19所述的端口防护电路集成封装件, 其特征在于, 所有 基体上下平行间隔分布, 所有第一纵向互连件垂直于所述基体, 且位 The port protection circuit integrated package of claim 19, wherein all of the substrates are vertically spaced apart, all of the first longitudinal interconnects are perpendicular to the substrate, and
PCT/CN2016/094533 2015-08-12 2016-08-11 Port protection circuit integrated package WO2017025043A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510494334.3A CN105047642B (en) 2015-08-12 2015-08-12 Port protection circuit integrated package
CN201510494334.3 2015-08-12

Publications (1)

Publication Number Publication Date
WO2017025043A1 true WO2017025043A1 (en) 2017-02-16

Family

ID=54454062

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/094533 WO2017025043A1 (en) 2015-08-12 2016-08-11 Port protection circuit integrated package

Country Status (2)

Country Link
CN (1) CN105047642B (en)
WO (1) WO2017025043A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105047642B (en) * 2015-08-12 2024-01-19 深圳市槟城电子股份有限公司 Port protection circuit integrated package

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101562140A (en) * 2008-04-16 2009-10-21 中国科学院微电子研究所 Packaging method of improving antistatic capability of integrated circuit chip
CN202084537U (en) * 2011-01-12 2011-12-21 曾传滨 Integrated circuit with static discharge protection function
CN105047640A (en) * 2015-08-12 2015-11-11 深圳市槟城电子有限公司 Port-protecting circuit integrating and packaging element and manufacturing method thereof
CN105047642A (en) * 2015-08-12 2015-11-11 深圳市槟城电子有限公司 Port protection circuit integrated encapsulation component
CN204946890U (en) * 2015-08-12 2016-01-06 深圳市槟城电子有限公司 A kind of port-guard circuit integration packaging part
CN204991699U (en) * 2015-08-12 2016-01-20 深圳市槟城电子有限公司 Port protection integrated circuit packaging part

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000007242A1 (en) * 1998-07-28 2000-02-10 Infineon Technologies Ag Conductor frame, printed circuit board with a conductor frame and a method for producing a conductor frame
US7382627B2 (en) * 2004-10-18 2008-06-03 E.I. Du Pont De Nemours And Company Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof
US7436678B2 (en) * 2004-10-18 2008-10-14 E.I. Du Pont De Nemours And Company Capacitive/resistive devices and printed wiring boards incorporating such devices and methods of making thereof
US7430128B2 (en) * 2004-10-18 2008-09-30 E.I. Du Pont De Nemours And Company Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof
US20080192452A1 (en) * 2007-02-12 2008-08-14 Randall Michael S Passive electronic device
TWI398933B (en) * 2008-03-05 2013-06-11 Advanced Optoelectronic Tech Package structure of integrated circuit device and manufacturing method thereof
US8460968B2 (en) * 2010-09-17 2013-06-11 Stats Chippac Ltd. Integrated circuit packaging system with post and method of manufacture thereof
CN104465670B (en) * 2014-12-12 2018-01-23 京东方科技集团股份有限公司 A kind of array base palte and preparation method thereof, display device
CN204464985U (en) * 2015-04-03 2015-07-08 深圳市槟城电子有限公司 A kind of POE system protection circuit and POE guard system

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101562140A (en) * 2008-04-16 2009-10-21 中国科学院微电子研究所 Packaging method of improving antistatic capability of integrated circuit chip
CN202084537U (en) * 2011-01-12 2011-12-21 曾传滨 Integrated circuit with static discharge protection function
CN105047640A (en) * 2015-08-12 2015-11-11 深圳市槟城电子有限公司 Port-protecting circuit integrating and packaging element and manufacturing method thereof
CN105047642A (en) * 2015-08-12 2015-11-11 深圳市槟城电子有限公司 Port protection circuit integrated encapsulation component
CN204946890U (en) * 2015-08-12 2016-01-06 深圳市槟城电子有限公司 A kind of port-guard circuit integration packaging part
CN204991699U (en) * 2015-08-12 2016-01-20 深圳市槟城电子有限公司 Port protection integrated circuit packaging part

Also Published As

Publication number Publication date
CN105047642B (en) 2024-01-19
CN105047642A (en) 2015-11-11

Similar Documents

Publication Publication Date Title
US10102971B2 (en) Multilayer capacitor with an overcurrent protection device
US8634180B2 (en) Multi-layered ceramic capacitor having dual layer-electrode structure
CN106206017B (en) Electronic component
JP2001339016A (en) Surface mounting electronic circuit unit
JP2009099913A (en) Multi terminal type solid-state electrolytic capacitor
WO2017024981A1 (en) Port-protected circuit-integration package
EP1570496B1 (en) Conductive polymer device and method of manufacturing same
US20150325375A1 (en) Embedded package substrate capacitor with configurable/controllable equivalent series resistance
KR20180057105A (en) Capacitor and method of fabricating the same
US7889479B2 (en) Integrated multilayer chip capacitor module and integrated circuit apparatus having the same
CN204991699U (en) Port protection integrated circuit packaging part
CN204946890U (en) A kind of port-guard circuit integration packaging part
CN102379016A (en) Solid electrolytic capacitor
US10395834B2 (en) Multilayer capacitor and board having the same
WO2005062318A1 (en) Electronic component
WO2017025043A1 (en) Port protection circuit integrated package
CN201247691Y (en) Lamination ceramic capacitor structure
CN214754244U (en) Interposer and electronic apparatus
CN212907709U (en) Diode device structure
CN207068837U (en) Common electrode semiconductor package
US20160343512A1 (en) Matrix arrangement stacked-type solid electrolytic capacitor package structure and method of manufacturing the same
US20140307365A1 (en) Solid electrolytic capacitor package structure for decreasing equivalent series resistance and method of manufacturing the same
JP5741416B2 (en) Electronic component mounting structure
KR20210002379A (en) Package method for attached single small size and array type of chip semiconductor component
CN218732289U (en) Power device module and electronic equipment

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16834667

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16834667

Country of ref document: EP

Kind code of ref document: A1