CN105025662B - A kind of preparation technology of the heavy nickel gold of wiring board - Google Patents
A kind of preparation technology of the heavy nickel gold of wiring board Download PDFInfo
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- CN105025662B CN105025662B CN201510424488.5A CN201510424488A CN105025662B CN 105025662 B CN105025662 B CN 105025662B CN 201510424488 A CN201510424488 A CN 201510424488A CN 105025662 B CN105025662 B CN 105025662B
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0766—Rinsing, e.g. after cleaning or polishing a conductive pattern
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention belongs to wiring board manufacture field, relates in particular to a kind of golden preparation technology of the heavy nickel of wiring board.The heavy nickel gold process step includes upper plate, oil removing successively；Wash for the first time；Pickling；Second of washing；Preimpregnation, activation；Third time is washed；Heavy nickel；4th washing；Turmeric；5th washing；Lower plate.The technique, by controlling production line procedures pre-treatment, microetch amount and nickel cylinder, achieves excellent technique effect, has saved cost on the basis of existing equipment；By optimizing existing process, the corrosion of nickel in heavy nickel metal working sequence is reduced, reduces black PAD generation, improves the solderability of product；With good market prospects and economic value.
Description
Technical field
The invention belongs to wiring board manufacture field, relates in particular to a kind of golden preparation technology of the heavy nickel of wiring board.
Background technology
PCB surface pad is the end points that PCB circuits are connected with external component, and PCB surface pad is all copper conductor, must be entered
Row surface coating processing ensures component soldering reliability to protect terminal pad copper face not contaminated and aoxidize.PCB pads at present
Surface treatment is mostly golden (ENIG) using chemical nickel plating leaching, and chemical nickel plating leaching gold is because its coating flatness is high, cladding wearability is good
And the superior functions such as contact resistance is low, it is widely used in surface treatment and the microelectronics of the printed circuit board (PCB) of fine electronic product
In the encapsulation technology of chip and circuit board.It is well known that black disk (i.e. nickel oxide) occurs in ENIG coatings in welding process
Defect, connection reliability problem occurs；In addition, if chemical nickel and gold is surface-treated for beating gold thread product, thicker plating is needed
Layer gold can just meet to require, this necessarily increases surface treatment cost.Relevant the black of chemical nickel plating leaching gold cross-examinees topic, and explanation is copper
Enter gold leachate after the terminal pad chemical nickel plating of substrate, it is displacement reaction to soak golden process, and nickel dam has topical solutions to be corroded for golden liquid,
Intermetallic compound occurs in nickel and golden interface, and remains in interface, ionic soil of nickel cylinder solution itself also results in nickel in addition
Layer oxidation blackening.
Currently in order to solves the black disk phenomenon occurred in welding process, more using chemical NiPdAu technological process processing PCB
Surface, i.e., very thin chemical palladium layers are added between electroless nickel layer and leaching layer gold, stop the diffusion and migration of nickel, prevent black disk
Occur；In welding, after very thin layer gold fuses into solder rapidly, because the fusing point of palladium is high, the fusing speed ratio of palladium in welding
Gold it is slow a lot, the palladium of melting can form one layer of barrier layer in nickel surface can prevent the generation of cupro-nickel metal oxide, improve weldering
Connect performance.
But there is following defect in this way：ENEPIG compares ENIG, in flow scheme design only between nickel cylinder and Buddha's warrior attendant
Add a palladium cylinder, ENEPIG shortcomings：1) can not do over again, cost is higher, and cost relies on noble metal price fluctuation；2) anticorrosion
Poor-performing, the corrosive chemicals that ENIG is used can have attack to solder mask and character；3) vertical line produces, and consumption is big, no
Beneficial to Environmental Chemistry NiPdAu technique relative to chemical nickel and gold technique, essentially identical is required to nickel cylinder and golden cylinder, nickel cylinder is still adopted
With stainless steel material and add anodic protection, golden cylinder uses PPN materials, and more special is palladium cylinder, and the requirement of palladium cylinder is (poly- using PVDF
Vinylidene material) or PTFE (polytetrafluoroethylmaterial material).
The content of the invention
Therefore, the technical problems to be solved by the invention are to overcome chemical nickel plating leaching gold nickel corrosion, welding process occur
It is middle black disc defect occur, the technical bottlenecks such as product link robust sex chromosome mosaicism are influenceed, so as to propose that a kind of cost is low, reduces corrosion
Spend, reduce the preparation technology for the heavy nickel gold of wiring board that black pad is produced, consumption rate is low.
In order to solve the above technical problems, a kind of wiring board of disclosure of the invention sinks the preparation technology of nickel gold online, wherein,
The technique includes pre-treatment step and heavy nickel gold step；
Preferably, the heavy nickel gold process step includes upper plate, oil removing successively；Wash for the first time；Pickling；Second
Washing；Preimpregnation, activation；Third time is washed；Heavy nickel；4th washing；Turmeric；5th washing；Lower plate.
Be more highly preferred to, a kind of described wiring board online sink nickel gold preparation technology, wherein, nickel during the heavy nickel
Groove drips the time≤10 seconds.
Preferably, a kind of described wiring board online sink nickel gold preparation technology, wherein, during the heavy nickel after nickel cylinder
Twice washing time≤1 point 30 seconds.
Be more highly preferred to, a kind of described wiring board online sink nickel gold preparation technology, wherein, nickel during the heavy nickel
Water-cleaning overflow amount is 10-12L/min after cylinder.
Preferably, a kind of described wiring board online sink nickel gold preparation technology, wherein, turmeric line during the turmeric
Microetch cylinder microetch amount is 0.508-1.016 μm.
Further, a kind of described wiring board online sink nickel gold preparation technology, wherein, in the pre-treatment step before
It is 8-12mm to handle polish-brush polishing scratch.
More further, a kind of described wiring board sinks the preparation technology of nickel gold online, wherein, described first time water
Wash, wash for second, wash for the third time, in the 4th washing, the 5th water-washing step, washing every time by one-stage water wash and two
Level washing two parts composition.
Preferably, a kind of described wiring board online sink nickel gold preparation technology, wherein, the pre-treatment step includes：
Enter plate, microetch, overflow washing, nog plate, sandblasting, dirt removal water, overflow washing, ultrasonic wave embathes, water column type rinses, waves water under high pressure
Wash, DI is washed, ejecting plate.
Preferably, described preparation technology, wherein, in the nog plate step in described pre-treatment step, use
Soft brush is 1000 mesh.
It is more highly preferred to, described preparation technology, wherein, in the nog plate step in described pre-treatment step, institute
Overflow washing times are stated as twice.
The above-mentioned technical proposal of the present invention has advantages below compared with prior art, on the basis of existing equipment, passes through
To production line procedures pre-treatment, microetch amount and the control of nickel cylinder, excellent technique effect is achieved, has saved cost；By excellent
Change existing process, reduce the corrosion of nickel in heavy nickel metal working sequence, reduce black PAD generation, improve the solderability of product.
Embodiment
Embodiment 1 present embodiment discloses a kind of wiring board online sink nickel gold preparation technology, comprise the following steps that：
S1 carries out heavy nickel gold pre-treatment, specifically：Use NaS2O8、H2SO4Carry out into plate microetch；Then overflow is washed 2 times；
Then nog plate processing is carried out with the soft brush of 1000 mesh, and the control of polish-brush polishing scratch is in 8-12mm；Then Buddha's warrior attendant sand blasting is used；Then rush
Sewage overflow is washed, and is then carried out ultrasonic wave and is embathed；Then carry out water column type flushing and wave high-pressure washing, last DI washings
Afterwards, you can ejecting plate.
S2 carries out upper plate, oil removal treatment；
S3 carries out hot water wash step, and washing speed is 4-6L/min；
S4 carries out first time water-washing step：Specifically, after first carrying out one-stage water wash (washing speed is 8-10L/min), so
Carry out two level washing afterwards (washing speed is 8-10L/min)；After washing terminates, microetching step is carried out；
S5 carries out second of water-washing step：Specifically, one-stage water wash (washing speed is 8-10L/min) is first carried out, then
Carry out two level water-washing step (washing speed is 8-10L/min)；After washing terminates, acid pickling step is carried out；
S6 carries out third time water-washing step：Specifically, first carry out one-stage water wash (washing speed is 6-8L/min), Ran Houjin
Row two level water-washing step (washing speed is 6-8L/min)；After washing terminates, carry out presoaking-activation act；
S7 carries out the 4th water-washing step (washing speed is 6-8L/min)；
S8 chemical sinking nickels uniformly deposit certain thickness nickel dam by self-catalyzed reaction in plate face.(1)H2PO2 -+
H2O→HPO3 2-+H++2H；(2)Ni2++2H→Ni↓+2H+；(3)2H2PO2 -+H→HPO3 2-+H2O+P+H2↑
Wherein, the reason for nickel plating：Welding is provided：Gold is first fused to tin, and then tin generates alloy-layer with nickel again；Prevent copper and gold
Diffusion, prevents copper from aoxidizing；
S9 carries out the 5th water-washing step：Specifically, first carry out one-stage water wash (washing speed is 8-10L/min)；Then
Carry out two level washing (washing speed is 8-10L/min)；After washing terminates, chemical turmeric is carried out；Finally recovery washing；
S10 carries out the 6th water-washing step：Specifically, first carry out one-stage water wash (washing speed is 6-8L/min)；Two level
Wash (washing speed is 6-8L/min)；After washing terminates, lower plate step is carried out.
Obviously, above-described embodiment is only intended to clearly illustrate example, and is not the restriction to embodiment.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of change or
Change.There is no necessity and possibility to exhaust all the enbodiments.And the obvious change thus extended out or
Among changing still in the protection domain of the invention.
Claims (1)
1. a kind of wiring board online sink nickel gold preparation technology, it is characterised in that the processing step is as follows：
S1 carries out heavy nickel gold pre-treatment, specifically：Use NaS2O8、H2SO4Carry out into plate microetch；Then overflow is washed 2 times；Then use
The soft brush of 1000 mesh carries out nog plate processing, and the control of polish-brush polishing scratch is in 8-12 ㎜；Then Buddha's warrior attendant sand blasting is used；Then dirt removal water overflows
Flowing water is washed, and is then carried out ultrasonic wave and is embathed；Then carry out water column type flushing and wave high-pressure washing, after last DI washings, you can
Ejecting plate；
S2 carries out upper plate, oil removal treatment；
S3 carries out hot water wash step, and washing speed is 4-6L/min；
S4 carries out first time water-washing step：Specifically, after first carrying out one-stage water wash, two level washing is then carried out；After washing terminates,
Carry out microetching step；Wherein one-stage water wash speed is 8-10L/min；Two level washing washing speed is 8-10L/min；
S5 carries out second of water-washing step：Specifically, first carrying out one-stage water wash, two level water-washing step is then carried out；Washing terminates
Afterwards, acid pickling step is carried out；Wherein one-stage water wash speed is 8-10L/min；Two level washing washing speed is 8-10L/min；
S6 carries out third time water-washing step：Specifically, first carrying out one-stage water wash, two level water-washing step is then carried out；Washing terminates
Afterwards, carry out presoaking-activation act；Wherein one-stage water wash speed is that washing speed is 6-8L/min；Speed is washed in two level washing
6-8L/min；
S7 carries out the 4th water-washing step, wherein the 4th washing speed is 6-8L/min；
S8 chemical sinking nickels uniformly deposit certain thickness nickel dam by self-catalyzed reaction in plate face；
The reaction equation of wherein described self-catalyzed reaction is：1)H2PO2 -+H2O→HPO3 2-+H++2H；2)Ni2++2H→Ni+2H+；3)
2H2PO2 -+H→HPO3 2-+H2O+P+H2；
Wherein, the reason for nickel plating：Welding is provided：Gold is first fused to tin, and then tin generates alloy-layer with nickel again；Prevent copper and gold from expanding
Dissipate, prevent copper from aoxidizing；
S9 carries out the 5th water-washing step：Specifically, first carry out one-stage water wash；Then two level washing is carried out；After washing terminates, enter
The chemical turmeric of row；Finally recovery washing；Wherein one-stage water wash speed is 8-10L/min；Two level washing washing speed is 8-10L/
min；
S10 carries out the 6th water-washing step：Specifically, first carry out one-stage water wash；Two level is washed；After washing terminates, lower plate is carried out
Step；Wherein one-stage water wash speed is that washing speed is 6-8L/min；Two level washing washing speed is 6-8L/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510424488.5A CN105025662B (en) | 2015-07-17 | 2015-07-17 | A kind of preparation technology of the heavy nickel gold of wiring board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510424488.5A CN105025662B (en) | 2015-07-17 | 2015-07-17 | A kind of preparation technology of the heavy nickel gold of wiring board |
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| Publication Number | Publication Date |
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| CN105025662A CN105025662A (en) | 2015-11-04 |
| CN105025662B true CN105025662B (en) | 2018-03-02 |
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| CN201510424488.5A Expired - Fee Related CN105025662B (en) | 2015-07-17 | 2015-07-17 | A kind of preparation technology of the heavy nickel gold of wiring board |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108337825A (en) * | 2018-02-08 | 2018-07-27 | 江西景旺精密电路有限公司 | PCB internal layer circuits making apparatus and production method |
| CN108650801B (en) * | 2018-04-02 | 2020-07-10 | 皆利士多层线路版(中山)有限公司 | Gold immersion method of thick copper circuit board |
| CN108990301A (en) * | 2018-05-10 | 2018-12-11 | 昆山市正大电路板有限公司 | A kind of PCB printed circuit board production and processing method |
| CN110318042B (en) * | 2019-06-18 | 2020-10-27 | 深圳市松柏实业发展有限公司 | Horizontal nickel-gold production line and nickel-gold melting method |
| CN110290647A (en) * | 2019-06-24 | 2019-09-27 | 大连崇达电路有限公司 | A kind of repair method of immersion Ni/Au plating leakage plate |
| CN110267455A (en) * | 2019-06-26 | 2019-09-20 | 深圳市新宇腾跃电子有限公司 | A kind of PCB surface treatment process |
| CN112739046A (en) * | 2020-11-07 | 2021-04-30 | 奥士康科技股份有限公司 | PCB manufacturing method for solving corner rolling deformation of outer layer circuit of Server-like PCB |
| CN112941496B (en) * | 2021-01-26 | 2021-09-24 | 广州皓悦新材料科技有限公司 | Chemical nickel-gold process with ultralow nickel corrosion |
| CN114206024B (en) * | 2021-11-04 | 2024-02-02 | 江苏普诺威电子股份有限公司 | Manufacturing method of MEMS (micro-electromechanical systems) packaging carrier plate |
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|---|---|---|---|---|
| CN101525744A (en) * | 2009-04-27 | 2009-09-09 | 深圳市成功化工有限公司 | Superficial treatment method of printed wiring board |
| CN102159028A (en) * | 2011-03-15 | 2011-08-17 | 珠海元盛电子科技股份有限公司 | Manufacturing method of flexible printed circuit board for manufacturing bank card patterns |
| CN104047041A (en) * | 2013-03-15 | 2014-09-17 | 深圳市九和咏精密电路有限公司 | Preparation method for printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013059980A1 (en) * | 2011-10-25 | 2013-05-02 | 建业（惠州）电路版有限公司 | Process for chemical plating of nickel and gold on circuit board |
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2015
- 2015-07-17 CN CN201510424488.5A patent/CN105025662B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101525744A (en) * | 2009-04-27 | 2009-09-09 | 深圳市成功化工有限公司 | Superficial treatment method of printed wiring board |
| CN102159028A (en) * | 2011-03-15 | 2011-08-17 | 珠海元盛电子科技股份有限公司 | Manufacturing method of flexible printed circuit board for manufacturing bank card patterns |
| CN104047041A (en) * | 2013-03-15 | 2014-09-17 | 深圳市九和咏精密电路有限公司 | Preparation method for printed circuit board |
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Granted publication date: 20180302 Termination date: 20200717 |