CN110290647A - A kind of repair method of immersion Ni/Au plating leakage plate - Google Patents
A kind of repair method of immersion Ni/Au plating leakage plate Download PDFInfo
- Publication number
- CN110290647A CN110290647A CN201910553035.0A CN201910553035A CN110290647A CN 110290647 A CN110290647 A CN 110290647A CN 201910553035 A CN201910553035 A CN 201910553035A CN 110290647 A CN110290647 A CN 110290647A
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- China
- Prior art keywords
- plating leakage
- immersion
- plating
- leakage plate
- liquid medicine
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to printed circuit board technology field, specially a kind of repair method of immersion Ni/Au plating leakage plate.The present invention on plating leakage plate by taping; then expose plating leakage position with the adhesive tape at blade excision plating leakage position; the protective layer of immersion Ni/Au is formed by adhesive tape; then immersion Ni/Au processing is carried out; film coating process is substituted using the mode of taping; the size of plating leakage plate is unrestricted, and is applicable to molded plating leakage plate.Since the adhesive tape at plating leakage position is cut off by blade, the adhesive tape on plating leakage plate at any plating leakage position can be cut off, therefore there are the plating leakage plates of plating leakage for reworkable any position.In addition, directly taping to form protective layer on plating leakage plate, it can shorten compared to film coating process and reprocess the period, efficiency is reprocessed in raising.The method of the present invention applicability is wide, and Rework cycle is shorter, and reworkable there are the plating leakage plates of different plating leakage situations, reduces plating leakage and scraps, reduces production cost.
Description
Technical field
The present invention relates to printed circuit board technology field more particularly to a kind of repair methods of immersion Ni/Au plating leakage plate.
Background technique
Immersion Ni/Au is also referred to as electroless nickel gold or heavy nickel soaks golden (Electroless Nickel Immersion Gold),
Refer to a kind of technique in PCB naked copper surface coating solderability coating, first carries out chemical nickel plating in naked copper face, then chemistry leaching
Gold.Chemical nickel gold coating integrate solderable, accessible conducting, can routing, the functions such as can radiate.Heavy nickel gold process can expire
The increasingly complicated PCB assembly of foot, welding requirement, and it is more at low cost than nickel-gold electroplating process, at the same can also side to conducting wire into
Row is effectively protected, and prevents from generating bad phenomenon in use.The typical process flow of immersion Ni/Au are as follows: oil removing → micro-
Erosion → activation → heavy nickel → turmeric.In the production process of immersion Ni/Au, because liquid medicine activity is insufficient, micro-corrosion liquid residual in consent
The problems such as, pad forms potential difference and the phenomenon of the not upper nickel gold of pad is caused to be known as plating leakage.At present for there are plating leakage defects
Plating leakage plate, Rework Technics are as follows: outer layer pad pasting → production do over again exposed plate → exposure → development → immersion Ni/Au → move back film →
Process afterwards.For current Rework Technics not there is only long flow path is reprocessed, the period is long, pad pasting problem at high cost, also to plating leakage plate
Size and plating leakage situation are restricted, and the size of plating leakage plate is exposed the limitation of developing apparatus, and can only reprocess in fixed spot welding
The plating leakage plate in plating leakage is taken inventory, the plating leakage of on-fixed point pad can not be reprocessed, molded plating leakage plate can not be also reprocessed, for this
The plating leakage plate that can not be reprocessed a bit can only carry out scrapping processing,.
Summary of the invention
The present invention has that reprocess the period long, at high cost and to plating leakage for the Rework Technics of existing immersion Ni/Au plating leakage plate
The conditional problem of size and plating leakage position of plate, provides that a kind of applied widely, period is shorter and lower-cost chemistry is heavy
The repair method of nickel gold plating leakage plate.
To achieve the above object, the present invention uses following technical scheme.
A kind of repair method of immersion Ni/Au plating leakage plate, the position that plating nickel gold is leaked on the plating leakage plate is plating leakage position, packet
Include following steps:
S1, one layer tape is pasted respectively in the upper and lower surfaces of plating leakage plate；
S2, adhesive tape corresponding with plating leakage position is cut off with blade, exposes plating leakage position；
S3, immersion Ni/Au processing is carried out to plating leakage plate, is sequentially depositing nickel layer and layer gold on plating leakage position；
S4, adhesive tape on plating leakage plate is removed.
In step S3, the immersion Ni/Au processing includes S31 deoiling step, the S32 microetching step, S33 successively carried out
The heavy nickel step of activation step, S34 and S35 turmeric step.
Preferably, in the S32 microetching step, in microetch liquid medicine, Na2S2O8Concentration be 60-80g/L, H2SO4Concentration
For 10-30mL/L, Cu2+Concentration be 5-15g/L, the temperature of microetch liquid medicine is 24-28 DEG C, and the microetch time is 60-90S.
Preferably, it in the S33 activation step, activates in liquid medicine, Pd2+Concentration be 10-16ppm, activate the temperature of liquid medicine
Degree is 25-29 DEG C, activation time 2-3min.
It preferably, further include acid pickling step, H in pickling liquid medicine before S33 activation step after the S32 microetching step2SO4
Concentration be 20-40mL/L, the temperature of pickling liquid medicine is 25-35 DEG C, pickling time 60-90S.
Preferably, in the heavy nickel step of the S34, in heavy nickel liquid medicine, NaH2PO4Concentration be 26-30g/L, Ni2+With
NaH2PO4Molar ratio be 0.40-0.45, pH 4.1-4.7.
Preferably, in the S35 turmeric step, in turmeric liquid medicine, KAu (CN)2Concentration be 0.8-1.2g/L, pH is
4.8-5.2。
Compared with prior art, the beneficial effects of the present invention are:
Then the present invention exposes plating leakage position with the adhesive tape at blade excision plating leakage position by taping on plating leakage plate,
The protective layer of immersion Ni/Au is formed by adhesive tape, then carries out immersion Ni/Au processing, pad pasting work is substituted using the mode of taping
The size of skill, plating leakage plate is unrestricted, and is applicable to molded plating leakage plate.Since the adhesive tape at plating leakage position passes through blade
Excision, can cut off the adhesive tape on plating leakage plate at any plating leakage position, therefore there are the plating leakage plates of plating leakage for reworkable any position.This
Outside, it directly tapes to form protective layer on plating leakage plate, can shorten compared to film coating process and reprocess the period, efficiency is reprocessed in raising.This
Inventive method applicability is wide, and Rework cycle is shorter, and reworkable there are the plating leakage plates of different plating leakage situations, reduces plating leakage and scraps, drops
Low production cost.
Specific embodiment
In order to more fully understand technology contents of the invention, combined with specific embodiments below to technical solution of the present invention
It is described further and illustrates.
Embodiment
The present embodiment provides a kind of repair method of immersion Ni/Au plating leakage plate, the position of plating nickel gold is leaked on the plating leakage plate
For plating leakage position, comprising the following steps:
(1) one layer tape is pasted respectively in the upper and lower surfaces of plating leakage plate.
Adhesive tape (PCB commonly covers protective glue band in manufacturing) corresponding with plating leakage board size is selected, rubberizing is utilized
Band machine is taped on monolith plating leakage plate, therefore the size of plating leakage plate is unrestricted, and plating leakage plate can be molded plate.
(2) cut off corresponding with plating leakage position adhesive tape with blade, make the exposing of plating leakage position, i.e., on adhesive tape with plating leakage position corresponding position
Windowing.
(3) progress immersion Ni/Au pre-treatment according to the following steps: the microetch → 2 time overflow washing soft brushing plate of → 1000 mesh →
Sandblasting (diamond dust) → dirt removal water → overflow washing → ultrasonic wave embathes → DI washing.
In above-mentioned microetch, Na in microetch liquid medicine2S2O8Concentration be 65-70g/L, H2SO4Concentration be 15-20mL/L (make
Prepared with the aqueous sulfuric acid that mass fraction is 70%, similarly hereinafter), Cu2+Concentration be 10-20g/L, the temperature of microetch liquid medicine is
28-35 DEG C, the microetch time is 30-60S.
(4) progress immersion Ni/Au processing according to the following steps: oil removing → washing → microetch → washing → pickling → washing →
Preimpregnation → activation → rear leaching → washing → heavy nickel → washing → turmeric → washing.
Technique control is as follows:
Oil removing: removing the oxide layer and greasy dirt of plating leakage plate plate face with degreaser, guarantees plate face cleaning.
Microetch: in microetch liquid medicine, Na2S2O8Concentration be 60-80g/L, H2SO4Concentration be 10-30mL/L, Cu2+It is dense
Degree is 5-15g/L, and the temperature of microetch liquid medicine is 24-28 DEG C, and the microetch time is 60-90S.
Pickling: H in pickling liquid medicine2SO4Concentration be 20-40mL/L, the temperature of pickling liquid medicine is 25-35 DEG C, pickling time
For 60-90S.
Preimpregnation: plating leakage plate is immersed into 60-90S in the aqueous sulfuric acid that concentration is 10-30mL/L at room temperature, maintains activation
The acidity of cylinder and make copper face exposed at plating leakage position in the case where oxide-free enter active cylinder.
Activation: in activation liquid medicine, Pd2+Concentration be 10-16ppm, activate liquid medicine temperature be 25-29 DEG C, activation time
For 2-3min.
It soaks afterwards: plating leakage plate being immersed into 60-90S in the aqueous sulfuric acid that concentration is 20-40mL/L at room temperature, to guarantee to leak
Exposed copper face has enough activity at plating position, prepares for heavy nickel.
Heavy nickel: in heavy nickel liquid medicine, NaH2PO4Concentration be 26-30g/L, Ni2+With NaH2PO4Molar ratio be 0.40-
0.45, pH 4.1-4.7.
Turmeric: in turmeric liquid medicine, KAu (CN)2Concentration be 0.8-1.2g/L, pH 4.8-5.2.
(5) adhesive tape on plating leakage plate is removed, then dries plate.
In immersion Ni/Au pre-treatment and immersion Ni/Au treatment process, need to some processes parameter carry out especially monitoring with
The caking property for avoiding influencing adhesive tape and plating leakage plate, to prevent plating problem.By control microetch, pickling, preimpregnation, after
Key process parameter during leaching, activation, heavy nickel, turmeric, processing and immersion Ni/Au treatment process before immersion Ni/Au
In, the associativity of adhesive tape and plating leakage plate is uninfluenced, and adhesive tape can reach protective effect, does not occur plating problem.
By taping on plating leakage plate, then expose plating leakage position with the adhesive tape at blade excision plating leakage position, by adhesive tape
The protective layer of immersion Ni/Au is formed, and then carries out immersion Ni/Au processing, film coating process, plating leakage are substituted using the mode of taping
The size of plate is unrestricted, and is applicable to molded plating leakage plate.It, can since the adhesive tape at plating leakage position is cut off by blade
The adhesive tape on plating leakage plate at any plating leakage position is cut off, therefore there are the plating leakage plates of plating leakage for reworkable any position.In addition, directly existing
It tapes to form protective layer on plating leakage plate, can shorten compared to film coating process and reprocess the period, efficiency is reprocessed in raising.The method of the present invention is suitable
Wide with property, Rework cycle is shorter, and reworkable there are the plating leakage plates of different plating leakage situations, reduces plating leakage and scraps, reduces production cost.
It is described above that technology contents of the invention are only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (6)
1. a kind of repair method of immersion Ni/Au plating leakage plate, the position that plating nickel gold is leaked on the plating leakage plate is plating leakage position, special
Sign is, comprising the following steps:
S1, one layer tape is pasted respectively in the upper and lower surfaces of plating leakage plate；
S2, adhesive tape corresponding with plating leakage position is cut off with blade, exposes plating leakage position；
S3, immersion Ni/Au processing is carried out to plating leakage plate, is sequentially depositing nickel layer and layer gold on plating leakage position；
S4, adhesive tape on plating leakage plate is removed.
2. the repair method of immersion Ni/Au plating leakage plate according to claim 1, which is characterized in that described in step S3
Immersion Ni/Au processing include successively carry out S31 deoiling step, S32 microetching step, S33 activation step, S34 sink nickel step and
S35 turmeric step；
The S34 sinks in nickel step, in heavy nickel liquid medicine, NaH2PO4Concentration be 26-30g/L, Ni2+With NaH2PO4Molar ratio
For 0.40-0.45, pH 4.1-4.7.
3. the repair method of immersion Ni/Au plating leakage plate according to claim 2, which is characterized in that the S35 turmeric step
In rapid, in turmeric liquid medicine, KAu (CN)2Concentration be 0.8-1.2g/L, pH 4.8-5.2.
4. the repair method of immersion Ni/Au plating leakage plate according to claim 2, which is characterized in that the S33 activation step
In rapid, activate in liquid medicine, Pd2+Concentration be 10-16ppm, activate liquid medicine temperature be 25-29 DEG C, activation time 2-3min.
5. the repair method of immersion Ni/Au plating leakage plate according to claim 2, which is characterized in that the S32 microetch step
In rapid, in microetch liquid medicine, Na2S2O8Concentration be 60-80g/L, H2SO4Concentration be 10-30mL/L, Cu2+Concentration be 5-
15g/L, the temperature of microetch liquid medicine are 24-28 DEG C, and the microetch time is 60-90S.
6. the repair method of immersion Ni/Au plating leakage plate according to claim 2, which is characterized in that the S32 microetch step
It further include acid pickling step, H in pickling liquid medicine before S33 activation step after rapid2SO4Concentration be 20-40mL/L, pickling liquid medicine
Temperature is 25-35 DEG C, pickling time 60-90S.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910553035.0A CN110290647A (en) | 2019-06-24 | 2019-06-24 | A kind of repair method of immersion Ni/Au plating leakage plate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910553035.0A CN110290647A (en) | 2019-06-24 | 2019-06-24 | A kind of repair method of immersion Ni/Au plating leakage plate |
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| CN110290647A true CN110290647A (en) | 2019-09-27 |
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| CN201910553035.0A Pending CN110290647A (en) | 2019-06-24 | 2019-06-24 | A kind of repair method of immersion Ni/Au plating leakage plate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111479400A (en) * | 2020-04-10 | 2020-07-31 | 大连崇达电路有限公司 | Chemical gold-depositing plate plating-missing treatment method for circuit board |
| CN117047324A (en) * | 2023-09-06 | 2023-11-14 | 四川富乐华半导体科技有限公司 | Reworking method for laser engraving of two-dimensional code on ceramic copper-clad carrier plate |
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| CN117047324A (en) * | 2023-09-06 | 2023-11-14 | 四川富乐华半导体科技有限公司 | Reworking method for laser engraving of two-dimensional code on ceramic copper-clad carrier plate |
| CN117047324B (en) * | 2023-09-06 | 2024-02-13 | 四川富乐华半导体科技有限公司 | Reworking method for laser engraving of two-dimensional code on ceramic copper-clad carrier plate |
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Application publication date: 20190927 |
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