CN102548066A - PCB (Printed Circuit Board) surface treatment technology - Google Patents
PCB (Printed Circuit Board) surface treatment technology Download PDFInfo
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- CN102548066A CN102548066A CN2012100273211A CN201210027321A CN102548066A CN 102548066 A CN102548066 A CN 102548066A CN 2012100273211 A CN2012100273211 A CN 2012100273211A CN 201210027321 A CN201210027321 A CN 201210027321A CN 102548066 A CN102548066 A CN 102548066A
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Abstract
The invention relates to a PCB (Printed Circuit Board) surface treatment technology. The PCB surface treatment technology comprises the following steps of: (1) removing oil and washing a PCB; (2) micro-etching, and coarsening a copper surface of the PCB; (3) dip rinsing the PCB by adopting ammonia water with the concentration of 2%-4%, and cleaning the PCB by matching with ultrasonic wave vibration; (4) washing again, dewatering and drying; (5) carrying out an organic film covering treatment at a copper foil surface of the PCB; and (6) drying. According to the PCB surface treatment technology disclosed by the invention, during the surface treatment process of the PCB after molding, the step of matching the ultrasonic wave section with the ammonia water cleaning is added, metal impurities at the PCB surface can be effectively removed, the problems of film generation and nigrescence at a gold surface and a silver surface of the PCB when subjecting to an OSB (Organic Solderability Preservatives) process after selectively adopting a gold melting or a silver melting technology can be improved, the appearance of the PCB and the wiring and tin soldering quality of a terminal client are ensured, unnecessary abandonment of the PCB is reduced, the production quality is increased, and the production cost of an enterprise is reduced.
Description
Technical field
The present invention relates to PCB and make the field, be specifically related to a kind of pcb board process of surface treatment.
Background technology
In the PCB industry, for reducing cost and protecting environment, selectivity OSP technology has appearred, and its application will become the new development trend of pcb board.OSP (Organic Solderability Preservatives) has been meant organizational security weldering film, claims again to protect the copper agent, and be that the printed circuit board (PCB) copper foil surface is handled so that it meets a kind of technology of RoHS command request.Briefly, OSP is exactly on the naked copper surface of cleaning, grows the organic epithelium of one deck with the method for chemistry.That this tunic has is anti-oxidation, heat shock resistance, moisture-proof, in normal environment, no longer continues get rusty (oxidation or sulfuration etc.) in order to protection copper surface.In follow-up welding high temperature, this diaphragm is easy to removed rapidly by scaling powder, is beneficial to welding.On the other hand, have solderability, conductivity and non-oxidizability preferably in order to guarantee pad on the pcb board (PAD), PCB manufacturing factory is usually at PAD surface employingization gold or silver process.But, reaction be can produce during the OSP surface treatment and film or blackening on the gold, silver surface caused, have a strong impact on pcb board outward appearance and the terminal client scolding tin quality of reaching the standard grade, severe patient more can cause the pcb board finished product to be scrapped, and increases entreprise cost.
Summary of the invention
The problem that the present invention need solve provides a kind of pcb board process of surface treatment of can effectively prevent to come to the surface gold or the damage of silver soldering point.
The technical scheme that the present invention takes is: a kind of pcb board process of surface treatment may further comprise the steps:
1) pcb board after the moulding is carried out oil removing, washing;
2) adopt the sulfuric acid solution etch pcb board that contains strong oxidizer, make its copper surface micro alligatoring;
3) adopt ammoniacal liquor that pcb board is embathed, cooperate ultrasonic vibration to clean;
4) once more after the washing, dewater and dry;
5) copper-clad surface to pcb board carries out organic overlay film processing;
6) oven dry.
Concrete, the middle employing of step (3) concentration is that the ammonia spirit of 2-4% embathes.
Concrete, adopt in the step (2) and contain hydrogen peroxide solution 0.5-0.9%, the acid solution etch pcb board of sulfuric acid 1-3%.
More specifically, the etch solution temperature is controlled at 26-28 ℃ in the step (2).
Concrete, oil removing described in the step (1) is that to adopt concentration be the sodium hydroxide solution of 0.6-1.2g/L is removed the pcb board copper-clad surface through the spray mode greasy dirt and foreign material.
More specifically, the sodium hydroxide solution temperature is controlled at 35 ± 5 ℃ in the said deoiling step.
Compare prior art; The present invention has following remarkable result: increase the step that supersonic range cooperates ammoniacal liquor to clean in the surface treatment process after the PCB moulding, can effectively remove the metal impurities on pcb board surface in the cleaning process, improve pcb board selectivityization gold, the problem of film, blackout on the gold, silver face when changing the silver back and crossing organic overlay film and handle (OSP); Guarantee pcb board outward appearance and the terminal client scolding tin quality of reaching the standard grade; Reduced that pcb board is unnecessary to be scrapped, improved the production quality, reduced the enterprise production cost.
Embodiment
For the ease of those skilled in the art's understanding, will combine specific embodiment that the present invention is described in further detail below.
Purport of the present invention is in the pcb board surface treatment process, and the process that increases ultrasonic wave and cooperate ammoniacal liquor to clean when making the pcb board that carried out selectivityization gold, the silver-colored step of change cross OSP, can effectively be avoided the problem of film, blackout on the gold, silver face.
Said pcb board process of surface treatment idiographic flow is: oil removing → washing → little erosion → ultrasonic wave, ammoniacal liquor are washed → are washed, dewater, the organic overlay film of drying → copper-clad surface is handled (OSP) → oven dry.
Wherein, oil removing is meant that adopting concentration is that the sodium hydroxide solution of 0.6-1.2g/L is removed the process of the greasy dirt and the foreign material of pcb board copper-clad surface through the spray mode, and solution temperature generally is controlled at 35 ± 5 ℃ in this process.After the oil removing, need water that the pcb board upper and lower surfaces is carried out hydro-peening, further the cleaner plate face.
Wherein, little erosion is meant adopts the sulfuric acid solution etch pcb board surface of containing 0.5-0.9% hydrogen peroxide solution, 1-3% sulfuric acid, and in the process, solution temperature is controlled between 26-28 ℃.Hydrogen peroxide solution is a kind of strong oxidizer, cooperates sulfuric acid can make the copper surface micro alligatoring on the pcb board, is beneficial to the later stage welding.
Ultrasonic wave, ammoniacal liquor are washed the process that step is meant that the ammoniacal liquor that adopts 2-4% concentration embathes pcb board, but the metal impurities at aurification silver position are particularly changed on ammoniacal liquor complexing pcb board surface.The ultrasonic waves generator is installed in soaker, and ultrasonic wave can make to produce overvoltage and negative pressure in the liquid to previous irradiation in density interphase ground in cleaning fluid, produces bubble simultaneously, and bubble strengthens cleaning effect in the pcb board surface vibration.In order to guarantee that ultrasonic wave, ammoniacal liquor washes the effect of step, solution concentration in aforementioned oil removing and the little erosion step and temperature control need strictness to carry out on request.
After ammoniacal liquor is washed step, need cleaner plate face remaining impurities and embathe solution through clear water hydro-peening pcb board up and down; Afterwards, adopt water-absorbing sponge and air knife drop to remove moisture in plate face and the hole.
It is OSP that organic overlay film is handled, and specifically is meant the spirit of vinegar system that adopts, and the chemical reaction of utilization imdazole derivatives and copper forms on pcb board copper surface and hole wall and thin and uniform organic overlay film.Because in the overlay film process, the equal haptoreaction thing of whole pcb board carried out the selectivityization gold, changed the position of silver processing owing to there are metal impurities; Be easy to also react; Cause film on the gold, silver face, blackout is after the step of washing through above-mentioned ammoniacal liquor; Effectively complexing plate face metal remained impurity is avoided the problems referred to above.
At last, through under 80 ℃ high temperature with the aqueous vapor bone dry in pcb board face and the hole, again the cooling get final product.
The not concrete step of introducing all can adopt this area conventional means to realize among the present invention, repeats no more at this.
The foregoing description is merely preferred implementation of the present invention, and in addition, the present invention can also have other implementations.That is to say that under the prerequisite that does not break away from the present invention's design, any conspicuous replacement all should fall within protection scope of the present invention.
Claims (6)
1. pcb board process of surface treatment may further comprise the steps:
1) pcb board after the moulding is carried out oil removing, washing;
2) adopt the sulfuric acid solution etch pcb board that contains strong oxidizer, make its copper surface micro alligatoring;
3) adopt ammoniacal liquor that pcb board is embathed, cooperate ultrasonic vibration to clean;
4) once more after the washing, dewater and dry;
5) copper-clad surface to pcb board carries out organic overlay film processing;
6) oven dry.
2. pcb board process of surface treatment according to claim 1 is characterized in that, the middle employing of step (3) concentration is that the ammonia spirit of 2-4% embathes.
3. pcb board process of surface treatment according to claim 1 is characterized in that, adopts in the step (2) and contains hydrogen peroxide solution 0.5-0.9%, the acid solution etch pcb board of sulfuric acid 1-3%.
4. pcb board process of surface treatment according to claim 3 is characterized in that, the etch solution temperature is controlled at 26-28 ℃ in the step (2).
5. pcb board process of surface treatment according to claim 1 is characterized in that, oil removing described in the step (1) is that to adopt concentration be the sodium hydroxide solution of 0.6-1.2g/L is removed the pcb board copper-clad surface through the spray mode greasy dirt and foreign material.
6. pcb board process of surface treatment according to claim 5 is characterized in that, the sodium hydroxide solution temperature is controlled at 35 ± 5 ℃ in the said deoiling step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100273211A CN102548066A (en) | 2012-02-08 | 2012-02-08 | PCB (Printed Circuit Board) surface treatment technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100273211A CN102548066A (en) | 2012-02-08 | 2012-02-08 | PCB (Printed Circuit Board) surface treatment technology |
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| CN102548066A true CN102548066A (en) | 2012-07-04 |
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| CN2012100273211A Pending CN102548066A (en) | 2012-02-08 | 2012-02-08 | PCB (Printed Circuit Board) surface treatment technology |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102937611A (en) * | 2012-12-06 | 2013-02-20 | 华为技术有限公司 | Corrosion risk prompting method and early warning system |
| CN104066278A (en) * | 2014-06-19 | 2014-09-24 | 四川普瑞森电子有限公司 | Resistance welding pretreatment method of printed circuit board and resistance welding pretreatment roughening micro-etching agent |
| CN104270893A (en) * | 2014-08-27 | 2015-01-07 | 无锡长辉机电科技有限公司 | PCB surface processing technology |
| CN105072815A (en) * | 2015-07-07 | 2015-11-18 | 安徽中大印制电路有限公司 | Manufacturing process of flexible circuit board |
| CN105149287A (en) * | 2015-09-30 | 2015-12-16 | 景旺电子科技(龙川)有限公司 | Cleaning method for FPC heat dissipation substrate |
| CN105578768A (en) * | 2015-12-16 | 2016-05-11 | 昆山铨莹电子有限公司 | Processing method for improving copper surface roughness of circuit board |
| CN106413275A (en) * | 2016-09-06 | 2017-02-15 | 江门崇达电路技术有限公司 | Organic metal shielded welding film and preparation method thereof |
| CN106929852A (en) * | 2015-12-31 | 2017-07-07 | 苏州市吴通电子有限公司 | A kind of pcb board surface automatic film coating technique |
| CN107124831A (en) * | 2017-05-31 | 2017-09-01 | 安徽金诚天骏汽车零部件制造有限公司 | The surface treatment method of PCB |
| CN109302809A (en) * | 2017-07-25 | 2019-02-01 | 王家富 | A kind of printed circuit board surface treatment process |
| CN109688722A (en) * | 2019-01-11 | 2019-04-26 | 昆山先胜电子科技有限公司 | Wiring board OSP surface treatment and finishing process |
| WO2022096000A1 (en) * | 2020-11-09 | 2022-05-12 | 广东科翔电子科技股份有限公司 | Process method for asymmetric multilayer rigid-flex board having air cavity |
| CN115334768A (en) * | 2022-08-29 | 2022-11-11 | 深圳和美精艺半导体科技股份有限公司 | Packaging substrate processing method for improving OSP appearance quality |
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| EP1630252A1 (en) * | 2004-08-27 | 2006-03-01 | ATOTECH Deutschland GmbH | Process for coating antimony containing substrate with tin or tin alloys |
| CN101508051A (en) * | 2009-03-11 | 2009-08-19 | 林原标 | Organic solderability preservative pre-soaking treating agent and organic solderability preservation film forming method |
| CN101868125A (en) * | 2010-05-25 | 2010-10-20 | 深圳市深联电路有限公司 | Method for preventing processed PCB board nickel-gold layer from being eroded |
| CN102181866A (en) * | 2011-04-14 | 2011-09-14 | 惠州中京电子科技股份有限公司 | Method for roughening surface of aluminum substrate |
| CN102256449A (en) * | 2011-06-17 | 2011-11-23 | 山东三新电子有限公司 | Organic soldering protective film manufacturing process for naked copper printed board |
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2012
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| EP1630252A1 (en) * | 2004-08-27 | 2006-03-01 | ATOTECH Deutschland GmbH | Process for coating antimony containing substrate with tin or tin alloys |
| CN101508051A (en) * | 2009-03-11 | 2009-08-19 | 林原标 | Organic solderability preservative pre-soaking treating agent and organic solderability preservation film forming method |
| CN101868125A (en) * | 2010-05-25 | 2010-10-20 | 深圳市深联电路有限公司 | Method for preventing processed PCB board nickel-gold layer from being eroded |
| CN102181866A (en) * | 2011-04-14 | 2011-09-14 | 惠州中京电子科技股份有限公司 | Method for roughening surface of aluminum substrate |
| CN102256449A (en) * | 2011-06-17 | 2011-11-23 | 山东三新电子有限公司 | Organic soldering protective film manufacturing process for naked copper printed board |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102937611A (en) * | 2012-12-06 | 2013-02-20 | 华为技术有限公司 | Corrosion risk prompting method and early warning system |
| CN104066278A (en) * | 2014-06-19 | 2014-09-24 | 四川普瑞森电子有限公司 | Resistance welding pretreatment method of printed circuit board and resistance welding pretreatment roughening micro-etching agent |
| CN104270893A (en) * | 2014-08-27 | 2015-01-07 | 无锡长辉机电科技有限公司 | PCB surface processing technology |
| CN105072815B (en) * | 2015-07-07 | 2018-05-08 | 安徽中大印制电路有限公司 | A kind of production technology of flexible PCB |
| CN105072815A (en) * | 2015-07-07 | 2015-11-18 | 安徽中大印制电路有限公司 | Manufacturing process of flexible circuit board |
| CN105149287A (en) * | 2015-09-30 | 2015-12-16 | 景旺电子科技(龙川)有限公司 | Cleaning method for FPC heat dissipation substrate |
| CN105578768A (en) * | 2015-12-16 | 2016-05-11 | 昆山铨莹电子有限公司 | Processing method for improving copper surface roughness of circuit board |
| CN106929852A (en) * | 2015-12-31 | 2017-07-07 | 苏州市吴通电子有限公司 | A kind of pcb board surface automatic film coating technique |
| CN106413275A (en) * | 2016-09-06 | 2017-02-15 | 江门崇达电路技术有限公司 | Organic metal shielded welding film and preparation method thereof |
| CN106413275B (en) * | 2016-09-06 | 2019-01-18 | 江门崇达电路技术有限公司 | A kind of organic metal protects weldering film and preparation method thereof |
| CN107124831A (en) * | 2017-05-31 | 2017-09-01 | 安徽金诚天骏汽车零部件制造有限公司 | The surface treatment method of PCB |
| CN109302809A (en) * | 2017-07-25 | 2019-02-01 | 王家富 | A kind of printed circuit board surface treatment process |
| CN109688722A (en) * | 2019-01-11 | 2019-04-26 | 昆山先胜电子科技有限公司 | Wiring board OSP surface treatment and finishing process |
| WO2022096000A1 (en) * | 2020-11-09 | 2022-05-12 | 广东科翔电子科技股份有限公司 | Process method for asymmetric multilayer rigid-flex board having air cavity |
| CN115334768A (en) * | 2022-08-29 | 2022-11-11 | 深圳和美精艺半导体科技股份有限公司 | Packaging substrate processing method for improving OSP appearance quality |
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Application publication date: 20120704 |