CN103917053A - Application of nickel as alkaline etching resistant layer materials - Google Patents
Application of nickel as alkaline etching resistant layer materials Download PDFInfo
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- CN103917053A CN103917053A CN201410161687.7A CN201410161687A CN103917053A CN 103917053 A CN103917053 A CN 103917053A CN 201410161687 A CN201410161687 A CN 201410161687A CN 103917053 A CN103917053 A CN 103917053A
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Abstract
The invention provides an application of nickel as alkaline etching resistant layer materials in the process of manufacturing a printed circuit board. An alkaline etching resistant layer is a nickel or a nickel alloy layer formed on a graphic copper layer of the printed circuit board, a cladding layer of the alkaline etching resistant layer is compact, has no current density sensitivity and is good in protectiveness, and the requirement for alkaline etching resisting can be met with a quite small thickness of the cladding layer. A special etching resistant layer removal solution is used and will not generate sediment which blocks small holes with a high ratio between the hole diameter and the hole depth, the yield is improved, and the manufacturing cost is lowered.
Description
Technical field
The present invention relates to the making of printed circuit board, relate in particular to the application process of novel alkaline etching resist layer in printed circuit board manufacturing process.
Background technology
Printed circuit board manufacturing process, needs etching solution etched copper to form line pattern conventionally.Conventionally there are two kinds of conventional circuit forming methods: acid etching method and alkali etching method.
Acid etching method generally adopts acidic etching liquid, and its chief component is: Lvization Tong ﹑ Yan Suan ﹑ sodium chloride or ammonium chloride.In acid etching, the copper layer that need to remain generally adopts organic resist layer such as dry film or wet film as protective layer, and the thickness of protective layer is generally at 25-40 micron.These organic resist layers generally, by exposing and the means such as development, form protection figure on copper layer.In follow-up acid etching, the copper layer of this organic resist layer protection is retained; Then by alkaline solution such as sodium hydroxide solution, soak remove organic resist layer, finally form copper conducting line pattern.
Alkali etching method is generally used for printed circuit board outer-layer circuit and makes.Alkaline etching liquid generally consists of: Lvization Tong ﹑ An Shui ﹑ ammonium chloride, auxiliary element is sodium chloride, ammonium chloride or other sulfur-containing compound that can improve etching performance.Because solution presents alkalescence, so general organic resist layer can be etched, cause line defct, therefore, in alkali etching method, resist layer used is generally metal resist layer.The basic procedure of alkalescence resist layer: make to resist being coated with machine film pattern on the copper face first not needing protection, leave the copper face needing protection; The second, add copper plate at the copper face place needing protection, and plate corrosion resistant metal layer on this layer of copper face; The 3rd, remove anti-plating organic film; The 4th, utilize alkali etching to remove exposed copper layer, leave the line pattern with matcoveredn; The 5th, remove metal resist layer, leave line layer.Compare with acid etching, due to the thickness reduction of protective layer, therefore easily overcome the pool effect in etching, be conducive to the making of fine-line.Selecting of corrosion resistant metal layer, has several key conditions: the first, and this metal level must be able to adopt the mode of plating or chemical plating can be coated in copper layer surface; The second, metal level must be enough fine and close, and stable chemical nature, can be substantially not etched in alkaline etching liquid, plays the effect of protection copper face; The 3rd, metal level also must easily be removed, and removal liquid used is attacked very little to copper face.The 4th, the necessary price of corrosion resistant metal layer is lower, can meet printed circuit board and reduce costs requirement.At printed circuit board industry; meet the metal level of above four conditions; first the earliest successful Application is leypewter layer, and it can complete copper face by electroplating lead tin alloy and apply, and the thickness of this metal level is generally 5-10 micron; in alkali etching, can play a protective role; in follow-up removal, adopt nitric acid/ferric nitrate system, and by adding copper surface protecting agent; can remove fast tin lead layer, and attack less to copper face.But due to the impact of lead on environment; along with the raising of environmental requirement; industry has been invented again new pure tin plating solution; can on copper face, apply one deck pure tin coating by plating; pure tin coating approximately needs 5-10 micron; in alkali etching, play a protective role, can also in follow-up removing step, adopt nitric acid/ferric nitrate system to remove fast.Other meets the above metal level requiring few, such as, gold plate, although protective value is fine, expensive, and be difficult to remove, therefore cannot serve as alkaline resist layer; And for example, zinc metal level, although low price is also unstable in alkalescence moment liquid, does not therefore become the alternative of protective layer yet.Apply because needs solve, protect and take off except all many-sided technical requirements and application, therefore tin and ashbury metal novel alkaline resist layer metal is not in addition suggested.
Protect metal using tin or ashbury metal as alkali etching; although used by electronic circuit board industry for many years always; but there are following four point defects: one, the price of tin is more expensive; and the compactness of tin is inadequate; therefore need enough thickness, necessary 5-10 micron thickness, just can play a protective role to ensure yield; therefore, cause manufacturing cost high.Two, the electrode potential of tin is extremely low, therefore electroplates difficulty, although by the coupling of additive; can meet the requirement of use, but tin electroplating is still to current density sensitivity, current density is slightly high; such as 20 amperes/square feet, coarse with regard to formative tissue, protective value declines.And; the plating occasion of tin application is graphic plating; therefore; in the time that the printed circuit board figure being plated is too isolated, even if adopt lower current density, such as 12 amperes/square feet; but concentrate and cause current density excessive at the easy power line in isolation pattern district; thereby cause tin face coarse loose, in alkaline etching liquid, cannot play a protective role, cause yield problem.In Here it is Tin plating so-called " bright border phenomenon ".Three, taking off except process of tin, cheap nitric acid/ferric nitrate the system of general use takes off tin, in the tin stripping liquid of this strong oxidizing property, tin very easily forms tetravalent tin ion, and the hydrolysis of tetravalent tin ion forms metastannic acid, thereby in solution, forms flocculent deposit, this flocculent deposit is in follow-up use, easily block high aperture hole depth rate aperture, cause tin stripping liquid cannot enter in hole the processing to subsequent handling and bring problem, cause yield to decline.Four, adopt the above-mentioned tin liquor that takes off to take off tin owing to easily occurring precipitation having with sludge form after tin is taken off and removes, cause and reclaim difficulty, contaminated environment.
For reason given above be necessary to invent a kind of new alkali etching resist layer completely, solve conventional tin and the existing problem of ashbury metal resist layer at present.
Summary of the invention
In view of existing alkaline resist layer tin or the existing deficiency of ashbury metal; the present invention proposes a kind of application of novel alkali etching resist layer; its this resist layer coating densification; no current density sensitiveness, protectiveness is good, and low-down thickness of coating just can meet alkali etching demand against corrosion; and use the special resist layer solution that goes; can not form precipitation, stop up the aperture of high aperture hole depth rate, when improving rate of finished products, reduce manufacturing cost.
A first aspect of the present invention is nickel purposes as alkaline resist layer material in printed circuit board manufacturing process.
In the embodiment of purposes of the present invention, alkali etching resist layer is nickel or the nickel alloy layer being formed on the figure copper layer of printed circuit board.
Preferably, wherein the thickness of alkali etching resist layer is 0.01-10 micron.
Preferably, wherein alkali etching resist layer is the nickel dam forming by plating, and thickness is 0.1-5 micron.
The invention still further relates to a kind of method of preparing printed circuit board, comprising: (1) needs the figure copper layer surface of protection to form nickel or nickel alloy layer as alkali etching resist layer on printed circuit board; (2) remove with alkaline etching liquid etching the copper layer that there is no the protection of alkali etching resist layer, form the figure circuit with alkali etching resist layer; And (3) take off except alkali etching resist layer with nickel or nickel alloy etching solution, form the figure circuit that only has copper layer composition.
In a preferred method of the invention, alkali etching resist layer is by electroplating or chemical plating formation, and its thickness is 0.01 micron～10 microns.
In a preferred method of the invention, alkali etching resist layer is the nickel dam forming by plating, and thickness is 0.1-5 micron.
In a preferred method of the invention, alkali etching resist layer forms by carry out electronickelling in nickelous sulfate or nickel sulfamic acid solution, and its thickness is 0.2-2 micron.
In a preferred method of the invention, alkali etching resist layer forms by carry out electronickelling in the solution that contains following composition: nickel sulfamic acid 150-200g/l, boric acid 30-60g/l, nickel chloride 400-600g/l; Described solution temperature is 50-60 DEG C, and printed circuit plate current density is 10-20 ampere/square feet, and electroplating time is 1-10 minute.
In a preferred method of the invention, the consisting of of nickel etching solution in step (3): nitric acid 150-200ml/l, hydrogen peroxide 40-50ml/l, BTA 8-12g/l, imidazoles 8-12g/l, urea 15-30g/l, takes off nickel temperature 30-50 DEG C.
Adopt the present invention alkaline resist layer used to there is good protective value, and the thickness needing is compared with low and have low-cost advantage, and takes off the clarification of nickel liquid without muddy, therefore can not stop up aperture.
Brief description of the drawings
Fig. 1 illustrates wiring board to be processed in embodiment;
Fig. 2 illustrates that this wiring board completes graphic plating;
Fig. 3 illustrates that this wiring board has continued nickel plating;
Fig. 4 illustrates that this wiring board completes and takes off after film;
Fig. 5 illustrates that this wiring board completes alkali etching; And
Fig. 6 illustrates that this wiring board completes nickel coating and removes, and forms figure.
In accompanying drawing: 101 is blind hole, 102 is through hole, and 103 is dry film, and 104 is copper layer, and 105 is dielectric layer, and 201 is that figure electrolytic copper layer 301 is nickel coating.
Embodiment
Of the present invention completing based on finding the excellent properties of nickeliferous metal resist layer as alkaline resist layer.It is nickel or nickel alloy layer that the alkaline resist layer of utilization of the present invention is prepared the metal resist layer using in printed circuit board process.Its concrete steps can be by as follows:
A. prepare the printed circuit board of pattern plating copper layer.By posting the printed circuit board of the anti-coating of copper facing, put into plating
Copper solution, electroplates, and has prepared the printed circuit board through pattern plating copper layer.
B. complete printed circuit board copper layer after copper facing surface preparation one nickel or nickel alloy layer as resist layer.
C. put into and take off coating solution with the printed circuit board of nickel or nickel alloy layer, take off the anti-coating of copper facing except plate face.
D. take off except the printed circuit board of anti-coating and put into alkaline etching liquid, etching is removed does not have nickel or nickel alloy protection
Copper layer, form with the figure circuit of nickel or nickel alloy protective layer.
E. putting into the special etching solution of resist layer with the printed circuit board of nickel or nickel alloy protective layer, remove nickel
Or nickel alloy protective layer, forms the figure circuit that only has copper layer composition.
In step a, anti-coating is generally photoresist, and main component is photosensitive resin, in the industry cycle has two kinds of dry film or wet films.Through the printed circuit board of exposure imaging, a part is that dry film or wet film cover, and needs to electroplate the copper face of thickening outside exposed.This printed circuit board is put into acid copper plating solution, electroplates.Solution described in this, generally formed by copper sulphate and sulfuric acid solution, generally speaking, cupric sulfate pentahydrate concentration range is 50-250 grams per liter, and sulfuric acid concentration ranges 50-250 grams per liter, in this solution, can add 10-90ppm chloride ion, meanwhile, in solution, can be added with as required organic additive, ensure that copper electroplating layer light is fine and close.Thickness of coated copper layer is generally at 5-20 micron.
In step b, nickel is generally pure-nickel-layer, and nickel alloy layer is other alloy-layers such as nickel phosphorus or nickel chromium triangle, and other nickel alloy that this patent is not specifically noted is also at this patent protection range.Preparing nickel dam can, the printed circuit board completing in step a after the pretreatment procedure such as microetch and preimpregnation, immerse nickelous sulfate or nickel sulfamic acid solution, electroplates, and nickel coating thickness is generally 0.1-5 micron, preferably 0.2-2 micron.Nickel-phosphorus alloy described herein can adopt the mode of chemical plating to carry out, the pretreatment procedure such as printed circuit board process microetch and activation completing in step a, then immerse chemical nickel-plating solution, chemical Ni-P layer thickness is generally 0.01-2 micron, preferably 0.05-1 micron.In step b, also can become the anti-coating of nickel plating or nickel alloy as the dry film of the anti-coating of copper facing or wet film, therefore only on exposed copper layer, just can prepare the required nickel of one deck or nickel alloy layer.
In step c, take off except the solution of anti-coating is generally alkalescence and take off film liquid or organic solvent.This alkalescence takes off the alkaline hydrogen sodium hydroxide solution that film liquid can be 1-3%, can also be other alkaline solutions such as monoethanolamine, and general solution can be heated to 40-60 degree Celsius and take off film.Organic solvent can be the solvent that ethanol isopolarity is stronger, by suitable heating, can also effectively remove above-mentioned organic anti-coating.Take off except in the operation of anti-coating at these, the nickel of copper layer and preparation and nickel alloy layer can keep original performance, are attacked hardly.
In steps d; described etching solution is alkaline etching liquid; its chief component is Lvization Tong ﹑ An Shui ﹑ ammonium chloride; auxiliary element is sodium chloride, ammonium chloride or other sulfur-containing compound that can improve etching performance, in this kind of alkaline etching liquid, after exposed copper layer reaction, generates copper ion; by fast-etching; nickel and nickel alloy layer react hardly, and copper layer under therefore can protecting well, retains needed conducting metal level.
In step e, adopt the special etching solution that removes resist layer to be generally acid solution.This acid solution can be nitric acid hydrogen peroxide system, can also be sulfate sulfatase copper system, can certainly be other acid solution.In these systems, generally all need to add a large amount of complexing agents to protect copper layer, and retain the etching action of solution to nickel dam or nickel alloy layer.These etching solutions form nickel ion solution, can not produce precipitation, keep limpid, therefore solution does not exist and stops up the possibility of aperture.The printed circuit board surface of the complete nickel of etching or nickel alloy layer has retained our required conductive copper wire road, can enter subsequent handling and proceed processing, finally forms client's required product.
Below in conjunction with embodiment and with reference to accompanying drawing, the present invention will be further described.
Embodiment 1
The main manufacturing process that the present invention forms copper figure circuit on printed circuit board is as follows:
The 1st step, figure copper facing.By the wiring board to be processed (as shown in Figure 1) preparing, dry film is the dry film YQ-40 of Asahi Chemical Industry, puts into copper sulphate sulfuric acid solution, and wherein the concentration of cupric sulfate pentahydrate is 75 grams per liters, and the concentration of sulfuric acid is 120 milliliters/liter.In solution, being added with chlorine ion concentration is 60ppm.Meanwhile, in solution, added 1 milliliter/liter of 901 copper brightener of ROHM AND HAAS, 40 milliliters/liter, 5 milliliters/liter of leveling agents and surfactant.When plating, cathode-current density is 15 amperes/square feet, and electroplating time is 42 minutes.Above the copper layer covering at not anti-coating, copper layer 201 is thickened 15 microns.Copper facing completes, and through twice, washing washes copper plating solution residual on wiring board.Complete rear board figure as shown in Figure 2.
The 2nd step, figure nickel plating.Complete the wiring board (as Fig. 2) after figure copper facing, after washing is cleaned through twice, enter 5% quality than dilute hydrochloric acid solution preimpregnation.Wiring board after preimpregnation, in nickel sulfamic acid solution, electroplates, and wherein, sulfamic acid nickel concentration is 180g/l, and boric acid concentration is 45g/l, and nickel chloride concentration is 500g/l, nickel plating wetting agent 0.15ml/l, nickel plating brightener 1ml/l.Heated solution temperature is 55 degrees Celsius, and wiring board current density is 12 amperes/square feet, and electroplating time is 4 minutes, is not electroplating on the copper face of anti-coating, and nickel coating thickness 301 is about 1 micron.The wiring board completing after nickel plating passes through the operations such as cleaning, drying.Complete rear board figure as shown in Figure 3.
The 3rd step, takes off the anti-plating dry film of film.Wiring board is immersed and taken off in film liquid.Take off the sodium hydroxide solution that film liquid adopts 1.5% mass ratio, solution temperature is controlled at 50 degrees Celsius, and approximately 1 minute, visible dry film was stripped from totally, and wiring board completes and takes off film flow process after washing, enters follow-up flow process.Complete rear board figure as shown in Figure 4.
The 4th step, alkali etching.Complete anti-plating dry film and take off the wiring board removing, enter alkali etching groove.In alkali etching groove, pH value is 8.0, and solution temperature is 50 DEG C, and in solution, copper ion concentration is 160g/L.Through etching in 1 minute, exposed copper layer was etched to dielectric material position, had the position of nickel dam protection, and except having part lateral etch, copper layer is got off by complete preservation, formed the conductive pattern with alkali etching resist layer.Complete rear board figure as shown in Figure 5.
The 5th step, removes nickel protection layer.With alkali etching nickel corrosion resistance wiring board layer by layer, proceeded in the solution of resist layer, this solution is nickel etching solution.Nickel etching solution consists of: 180 milliliters/liter of concentration of nitric acid, and 60 milliliters/liter of hydrogen peroxide concentrations, BTA 10 grams per liters, imidazoles 10 grams per liters, urea 20 grams per liters, take off 40 DEG C of nickel temperature.Through etching in approximately 2 minutes, nickel dam was removed, and leaves conductive pattern.Complete rear board figure as shown in Figure 6.
Embodiment 2
The making of circuit board pattern is substantially the same manner as Example 1, and difference is that the current density that the 2nd step figure nickel plating adopts is 20 amperes/square feet, and electroplating time is 2.4 minutes, and thickness of coating is approximately 1 micron.Observe nickel plating solution in the present invention and whether be suitable for higher current density, coating meets protection and takes off except requiring, to enhance productivity.Result is in table 1.
Embodiment 3
The making of circuit board pattern is substantially the same manner as Example 1, and difference is that the current density that the 2nd step figure nickel plating adopts is 12 amperes/square feet, and electroplating time is 16 minutes, and thickness of coating is approximately 4 microns.
Embodiment 4
The making of circuit board pattern is substantially the same manner as Example 1, difference is that the nickel plating that the 2nd step figure nickel plating adopts is chemical nickel plating, institute's coated coating is nickel-phosphorus alloy, basic composition is of chemical nickel plating: nickelous sulfate 20 grams per liters, sodium hypophosphite 15 grams per liters, 10 milliliters/liter of triethanolamines, potassium ferricyanide 15ppm, pH value is 4.5, temperature is 87 DEG C, plating time is 2 minutes, and nickel plating thickness is about 0.5 micron.
Comparative example 1
Method similar to Example 1 is made the copper layer pattern circuit of printed circuit board:
The 1st step and embodiment 1 the 1st step are in full accord.
The 2nd step, pattern tin plating.Complete the wiring board after figure copper facing, after washing is cleaned through twice, enter 5% quality than dilution heat of sulfuric acid preimpregnation.Wiring board after preimpregnation, in stannous sulfate solution, electroplates, and wherein, stannous sulfate concentration is 40g/l, and sulfuric acid concentration is 180g/l, the zinc-plated additive 10ml/l of DOW Chemical.Wiring board current density is 12 amperes/square feet, and electroplating time is 1.5 minutes, is not electroplating on the copper face of anti-coating, and tin coating thickness is about 1 micron.The wiring board completing after nickel plating passes through the operations such as cleaning, drying.
The 3rd step and embodiment 1 the 3rd step are in full accord.
The 4th step and embodiment 1 the 4th step are in full accord.
The 5th step, removes tin protective layer.With alkali etching tin wiring board layer by layer against corrosion, proceeded in the solution of resist layer, this solution is tin etching solution.Nickel etching solution consists of: 180 milliliters/liter of concentration of nitric acid, and ferric trichloride 60 grams per liters, imidazoles 10 grams per liters, take off 40 DEG C of nickel temperature.Through etching in approximately 1 minute, tin layer was removed, and leaves conductive pattern.
Comparative example 2
Copper layer pattern circuit with the similar method making of comparative example 1 printed circuit board, difference is that, in the 2nd step, wiring board current density is 12 amperes/square feet, and electroplating time is 10 minutes, do not electroplating on the copper face of anti-coating, tin coating thickness is about 7 microns.
Comparative example 3
Copper layer pattern circuit with the similar method making of comparative example 1 printed circuit board, difference is that, in the 2nd step, wiring board current density is 20 amperes/square feet, and electroplating time is 6 minutes, do not electroplating on the copper face of anti-coating, tin coating thickness is about 7 microns.
Result comparison
The printed circuit board of above case making is detected and measure of merit.Embodiment 1, embodiment 2, embodiment 3 and embodiment 4 all can realize 100% yield; show to adopt the present invention's alkalescence used nickel against corrosion or nickel alloy layer all to there is good protective value at different-thickness and different current density; and need thickness lower (1 micron) and there is low-cost advantage; and take off the clarification of nickel liquid without muddy, therefore can not stop up aperture.Comparative example 1 yield is lower, is mainly because tin thickness is on the low side, due to tin layer protective value is inadequate; Comparative example 3 is under higher current density, and yield reduces, due to Yi Shi high current density undertissue is loose; Under higher caliper, tin layer resist layer has better protectiveness, but because thickness is higher, therefore cost is higher; And in all comparative examples, owing to adopting tin layer as protective layer, therefore muddy in tin stripping liquid, in high thickness to diameter ratio plate aperture, have the risk of stopping up aperture.
Table 1 Comparison of experiment results
Claims (10)
- Nickel in printed circuit board manufacturing process as the purposes of alkaline resist layer material.
- 2. purposes as claimed in claim 1, wherein alkali etching resist layer is nickel or the nickel alloy layer being formed on printed circuit board figure copper layer.
- 3. purposes as claimed in claim 2, wherein alkali etching resist layer is by electroplating or chemical plating formation, and its thickness is 0.01-10 micron.
- 4. purposes as claimed in claim 2, wherein alkali etching resist layer is the nickel dam forming by plating, and thickness is 0.1-5 micron.
- 5. a method of preparing printed circuit board, comprising:(1) on printed circuit board, need the figure copper layer surface of protection to form nickel or nickel alloy layer as alkali etching resist layer;(2) remove with alkaline etching liquid etching the copper layer that there is no the protection of alkali etching resist layer, form the figure circuit with alkali etching resist layer; And(3) take off except alkali etching resist layer with nickel or nickel alloy etching solution, form the figure circuit that only has copper layer composition.
- 6. method as claimed in claim 5, wherein alkali etching resist layer is by electroplating or chemical plating formation, and its thickness is 0.01-10 micron.
- 7. method as claimed in claim 5, wherein alkali etching resist layer is the nickel dam forming by plating, and thickness is 0.1-5 micron.
- 8. method as claimed in claim 5, wherein alkali etching resist layer forms by carry out electronickelling in nickelous sulfate or nickel sulfamic acid solution, and its thickness is 0.2-2 micron.
- 9. method as claimed in claim 5, wherein alkali etching resist layer forms by carry out electronickelling in the solution that contains following composition: nickel sulfamic acid 150-200g/l, boric acid 30-60g/l, nickel chloride 400-600g/l; Described solution temperature is 50-60 DEG C, and printed circuit plate current density is 10-20 ampere/square feet, and electroplating time is 1-10 minute.
- 10. method as claimed in claim 5, wherein consisting of of the middle nickel etching solution of step (3): nitric acid 150-200ml/l, hydrogen peroxide 40-50ml/l, BTA 8-12g/l, imidazoles 8-12g/l, urea 15-30g/l; Take off nickel temperature 30-50 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410161687.7A CN103917053A (en) | 2014-04-22 | 2014-04-22 | Application of nickel as alkaline etching resistant layer materials |
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| CN201410161687.7A CN103917053A (en) | 2014-04-22 | 2014-04-22 | Application of nickel as alkaline etching resistant layer materials |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105120600A (en) * | 2015-08-26 | 2015-12-02 | 江门崇达电路技术有限公司 | Nickel surface processing method |
| CN107846783A (en) * | 2017-11-13 | 2018-03-27 | 上海安费诺永亿通讯电子有限公司 | A kind of manufacturing process for metal circuit for being distributed in insulator different azimuth surface |
| CN108055784A (en) * | 2017-11-17 | 2018-05-18 | 江门崇达电路技术有限公司 | A kind of production method of wiring board |
| CN108598008A (en) * | 2018-04-16 | 2018-09-28 | 全讯射频科技(无锡)有限公司 | A kind of composition and its preparation and application that can be removed integrated circuit simultaneously and reroute layer and convex block |
| CN109195341A (en) * | 2018-09-12 | 2019-01-11 | 安捷利（番禺）电子实业有限公司 | A kind of preparation method for the precise printed circuit board improving route copper layer thickness and width |
| WO2019134208A1 (en) * | 2018-01-08 | 2019-07-11 | 昆山首源电子科技有限公司 | Gold-plating etching process for 5g communication high-frequency signal board |
| CN112074089A (en) * | 2020-08-31 | 2020-12-11 | 珠海智锐科技有限公司 | Method for manufacturing bonding pad |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1286734A (en) * | 1997-12-18 | 2001-03-07 | 电路研究公司 | Printed circuit mfg. process using tin-mickel plating |
| JP2001140084A (en) * | 1999-08-27 | 2001-05-22 | Mec Kk | Etching solution for nickel or nickel alloy |
| CN1319323A (en) * | 1998-09-18 | 2001-10-24 | 范蒂科股份公司 | Method for producing etched circuit |
| CN102905471A (en) * | 2012-10-21 | 2013-01-30 | 蔡新民 | Method for manufacturing polytetrafluoroethylene high-frequency circuit board |
| CN102917542A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Method for manufacturing copper PCB (Printed Circuit Board) circuit |
-
2014
- 2014-04-22 CN CN201410161687.7A patent/CN103917053A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1286734A (en) * | 1997-12-18 | 2001-03-07 | 电路研究公司 | Printed circuit mfg. process using tin-mickel plating |
| CN1319323A (en) * | 1998-09-18 | 2001-10-24 | 范蒂科股份公司 | Method for producing etched circuit |
| JP2001140084A (en) * | 1999-08-27 | 2001-05-22 | Mec Kk | Etching solution for nickel or nickel alloy |
| CN102917542A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Method for manufacturing copper PCB (Printed Circuit Board) circuit |
| CN102905471A (en) * | 2012-10-21 | 2013-01-30 | 蔡新民 | Method for manufacturing polytetrafluoroethylene high-frequency circuit board |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105120600A (en) * | 2015-08-26 | 2015-12-02 | 江门崇达电路技术有限公司 | Nickel surface processing method |
| CN105120600B (en) * | 2015-08-26 | 2018-02-02 | 江门崇达电路技术有限公司 | A kind of nickel surface processing method |
| CN107846783A (en) * | 2017-11-13 | 2018-03-27 | 上海安费诺永亿通讯电子有限公司 | A kind of manufacturing process for metal circuit for being distributed in insulator different azimuth surface |
| CN107846783B (en) * | 2017-11-13 | 2020-05-12 | 上海安费诺永亿通讯电子有限公司 | Method for manufacturing metal lines distributed on different orientation surfaces of insulator |
| CN108055784A (en) * | 2017-11-17 | 2018-05-18 | 江门崇达电路技术有限公司 | A kind of production method of wiring board |
| WO2019134208A1 (en) * | 2018-01-08 | 2019-07-11 | 昆山首源电子科技有限公司 | Gold-plating etching process for 5g communication high-frequency signal board |
| CN108598008A (en) * | 2018-04-16 | 2018-09-28 | 全讯射频科技(无锡)有限公司 | A kind of composition and its preparation and application that can be removed integrated circuit simultaneously and reroute layer and convex block |
| CN109195341A (en) * | 2018-09-12 | 2019-01-11 | 安捷利（番禺）电子实业有限公司 | A kind of preparation method for the precise printed circuit board improving route copper layer thickness and width |
| CN112074089A (en) * | 2020-08-31 | 2020-12-11 | 珠海智锐科技有限公司 | Method for manufacturing bonding pad |
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