CN104977805A - 固化性树脂组合物、用于形成永久覆膜的组合物、干膜以及印刷电路板 - Google Patents

固化性树脂组合物、用于形成永久覆膜的组合物、干膜以及印刷电路板 Download PDF

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Publication number
CN104977805A
CN104977805A CN201510152795.2A CN201510152795A CN104977805A CN 104977805 A CN104977805 A CN 104977805A CN 201510152795 A CN201510152795 A CN 201510152795A CN 104977805 A CN104977805 A CN 104977805A
Authority
CN
China
Prior art keywords
resin composition
compound
resin
hardening resin
overlay film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201510152795.2A
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English (en)
Chinese (zh)
Inventor
播磨英司
福田晋一朗
三谷毅
近藤忍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of CN104977805A publication Critical patent/CN104977805A/zh
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/066—Copolymers with monomers not covered by C08L33/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201510152795.2A 2014-04-01 2015-04-01 固化性树脂组合物、用于形成永久覆膜的组合物、干膜以及印刷电路板 Withdrawn CN104977805A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-075218 2014-04-01
JP2014075218A JP2015196764A (ja) 2014-04-01 2014-04-01 硬化性樹脂組成物、永久被膜形成用組成物、ドライフィルムおよびプリント配線板

Publications (1)

Publication Number Publication Date
CN104977805A true CN104977805A (zh) 2015-10-14

Family

ID=54274431

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510152795.2A Withdrawn CN104977805A (zh) 2014-04-01 2015-04-01 固化性树脂组合物、用于形成永久覆膜的组合物、干膜以及印刷电路板

Country Status (4)

Country Link
JP (1) JP2015196764A (ko)
KR (1) KR20150114385A (ko)
CN (1) CN104977805A (ko)
TW (1) TW201538614A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112638969A (zh) * 2018-08-30 2021-04-09 昭和电工株式会社 乙烯基酯树脂组合物、包含该组合物的复合材料、和该组合物或复合材料的固化物

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6061234B1 (ja) * 2016-03-11 2017-01-18 山栄化学株式会社 アルカリ現像型ソルダーレジストインキ及びそのプリント配線板加工法とその配線板
WO2018150771A1 (ja) * 2017-02-20 2018-08-23 Jsr株式会社 感光性樹脂組成物、硬化膜およびその製造方法ならびに電子部品
CN110753881B (zh) * 2018-03-30 2024-06-21 太阳控股株式会社 碱显影型感光性树脂组合物、干膜、固化物和印刷电路板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004287267A (ja) * 2003-03-24 2004-10-14 Hitachi Chem Co Ltd 永久レジスト用感光性フィルム、レジストパターンの形成方法及びプリント配線板
JP2011075923A (ja) * 2009-09-30 2011-04-14 Taiyo Holdings Co Ltd 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002308952A (ja) * 2001-04-12 2002-10-23 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2006323089A (ja) * 2005-05-18 2006-11-30 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性フィルム
JP5050707B2 (ja) * 2006-10-18 2012-10-17 日立化成工業株式会社 感光性樹脂組成物及び感光性フィルム
JP5218828B2 (ja) * 2008-05-15 2013-06-26 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた感光性フィルム、レジストパターンの形成方法及び永久レジスト
JP5250479B2 (ja) * 2009-05-18 2013-07-31 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP2013041227A (ja) * 2011-08-19 2013-02-28 Fujifilm Corp 感光性樹脂組成物、並びにこれを用いた感光性フイルム、感光性積層体、永久パターン形成方法およびプリント基板
JP5523592B2 (ja) * 2013-01-08 2014-06-18 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004287267A (ja) * 2003-03-24 2004-10-14 Hitachi Chem Co Ltd 永久レジスト用感光性フィルム、レジストパターンの形成方法及びプリント配線板
JP2011075923A (ja) * 2009-09-30 2011-04-14 Taiyo Holdings Co Ltd 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112638969A (zh) * 2018-08-30 2021-04-09 昭和电工株式会社 乙烯基酯树脂组合物、包含该组合物的复合材料、和该组合物或复合材料的固化物

Also Published As

Publication number Publication date
KR20150114385A (ko) 2015-10-12
TW201538614A (zh) 2015-10-16
JP2015196764A (ja) 2015-11-09

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Application publication date: 20151014