CN104916763B - 一种芯片级封装led的封装方法 - Google Patents
一种芯片级封装led的封装方法 Download PDFInfo
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- CN104916763B CN104916763B CN201510286051.XA CN201510286051A CN104916763B CN 104916763 B CN104916763 B CN 104916763B CN 201510286051 A CN201510286051 A CN 201510286051A CN 104916763 B CN104916763 B CN 104916763B
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- led chip
- glue
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- led
- layer
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000012856 packing Methods 0.000 title claims abstract description 19
- 239000003292 glue Substances 0.000 claims abstract description 41
- 239000010410 layer Substances 0.000 claims abstract description 32
- 239000012790 adhesive layer Substances 0.000 claims abstract description 29
- 238000005520 cutting process Methods 0.000 claims abstract description 13
- 238000000227 grinding Methods 0.000 claims abstract description 7
- 238000009826 distribution Methods 0.000 claims abstract description 5
- 239000000853 adhesive Substances 0.000 claims abstract description 3
- 230000001070 adhesive effect Effects 0.000 claims abstract description 3
- 239000011521 glass Substances 0.000 claims description 10
- 238000000926 separation method Methods 0.000 claims description 4
- 239000004568 cement Substances 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000010422 painting Methods 0.000 claims description 2
- 238000000605 extraction Methods 0.000 abstract description 8
- 230000003760 hair shine Effects 0.000 abstract description 3
- 239000000084 colloidal system Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005507 spraying Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000005422 blasting Methods 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000035922 thirst Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
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CN201510286051.XA CN104916763B (zh) | 2015-05-29 | 2015-05-29 | 一种芯片级封装led的封装方法 |
Applications Claiming Priority (1)
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CN201510286051.XA CN104916763B (zh) | 2015-05-29 | 2015-05-29 | 一种芯片级封装led的封装方法 |
Publications (2)
Publication Number | Publication Date |
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CN104916763A CN104916763A (zh) | 2015-09-16 |
CN104916763B true CN104916763B (zh) | 2018-05-08 |
Family
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Family Applications (1)
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CN201510286051.XA Active CN104916763B (zh) | 2015-05-29 | 2015-05-29 | 一种芯片级封装led的封装方法 |
Country Status (1)
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CN (1) | CN104916763B (zh) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105242456A (zh) * | 2015-10-27 | 2016-01-13 | 深圳市华星光电技术有限公司 | 光源组件及背光模组 |
CN105826449A (zh) * | 2016-03-11 | 2016-08-03 | 导装光电科技(深圳)有限公司 | 白光芯片的成型制备方法和*** |
CN106097908A (zh) * | 2016-07-30 | 2016-11-09 | 深圳浩翔光电技术有限公司 | Led显示屏表层塑封膜与灯板的连接结构及工艺方法 |
CN106340581A (zh) * | 2016-08-25 | 2017-01-18 | 深圳市晶仕德光电有限公司 | 一种csp灯珠封装的方法 |
CN106129223A (zh) * | 2016-08-25 | 2016-11-16 | 深圳市晶仕德光电有限公司 | 一种led倒装晶粒的csp封装灯珠的贴装体及封装方法 |
CN106449621A (zh) * | 2016-10-14 | 2017-02-22 | 佛山市顺德区蚬华多媒体制品有限公司 | 一种led封装方法及其结构 |
CN108615805B (zh) * | 2016-12-12 | 2020-06-09 | 晶能光电(江西)有限公司 | 一种芯片级封装白光芯片及其封装方法 |
CN107731996A (zh) * | 2017-09-28 | 2018-02-23 | 惠州市华瑞光源科技有限公司 | Led灯珠及其制备方法 |
CN109713110A (zh) * | 2017-10-26 | 2019-05-03 | 深圳市聚飞光电股份有限公司 | 芯片级封装led及其制作方法 |
CN109980069A (zh) * | 2017-12-27 | 2019-07-05 | 深圳市聚飞光电股份有限公司 | Led器件及封装方法、背光模组、液晶显示模组和终端 |
CN109980068A (zh) * | 2017-12-27 | 2019-07-05 | 深圳市聚飞光电股份有限公司 | Led器件及封装方法、背光模组、液晶显示模组和终端 |
CN109980072A (zh) * | 2017-12-27 | 2019-07-05 | 深圳市聚飞光电股份有限公司 | Led器件及封装方法、背光模组、液晶显示模组和终端 |
CN108767100A (zh) * | 2018-05-04 | 2018-11-06 | 惠州市华瑞光源科技有限公司 | 背光模组及其制作方法 |
CN108767086A (zh) * | 2018-05-04 | 2018-11-06 | 惠州市华瑞光源科技有限公司 | Led灯珠及其制作方法 |
CN111162149B (zh) * | 2018-11-07 | 2022-06-10 | 深圳市聚飞光电股份有限公司 | 一种led芯片封装方法及led灯珠 |
CN111162151A (zh) * | 2018-11-07 | 2020-05-15 | 深圳市聚飞光电股份有限公司 | 一种led芯片封装方法及led灯珠 |
CN111162156A (zh) * | 2018-11-07 | 2020-05-15 | 深圳市聚飞光电股份有限公司 | 一种led芯片封装方法及led灯珠 |
CN110845988A (zh) * | 2019-11-06 | 2020-02-28 | 安晟技术(广东)有限公司 | 一种遮光胶、其制备方法及应用 |
CN110854108B (zh) * | 2019-11-06 | 2021-08-27 | 安晟技术(广东)有限公司 | 一种倒装led芯片csp制造方法 |
WO2021109009A1 (zh) * | 2019-12-03 | 2021-06-10 | 重庆康佳光电技术研究院有限公司 | 发光二极管及其制造方法、发光二极管模组、显示设备 |
CN112911810B (zh) * | 2021-01-19 | 2023-04-25 | 潍坊歌尔微电子有限公司 | Pcb的切割方法及传感器封装结构 |
CN113809220A (zh) * | 2021-07-15 | 2021-12-17 | 深圳市德辰光电科技有限公司 | 一种色光晶片的封装方法及其色光晶片 |
CN113764547B (zh) * | 2021-08-30 | 2023-06-09 | 东莞市中麒光电技术有限公司 | 一种Mini-LED器件的制作方法 |
CN114447192B (zh) * | 2022-01-20 | 2023-09-19 | 东莞市中麒光电技术有限公司 | 显示模块制造方法、显示模块及显示屏 |
CN114709319B (zh) * | 2022-04-11 | 2023-07-11 | 东莞市中麒光电技术有限公司 | 色转换结构制作方法、色转换结构、晶粒制作方法及晶粒 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104253194A (zh) * | 2014-09-18 | 2014-12-31 | 易美芯光(北京)科技有限公司 | 一种芯片尺寸白光led的封装结构及方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5860289B2 (ja) * | 2012-01-05 | 2016-02-16 | シチズン電子株式会社 | Led装置の製造方法 |
WO2014091914A1 (ja) * | 2012-12-10 | 2014-06-19 | シチズンホールディングス株式会社 | Led装置及びその製造方法 |
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2015
- 2015-05-29 CN CN201510286051.XA patent/CN104916763B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104253194A (zh) * | 2014-09-18 | 2014-12-31 | 易美芯光(北京)科技有限公司 | 一种芯片尺寸白光led的封装结构及方法 |
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Publication number | Publication date |
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CN104916763A (zh) | 2015-09-16 |
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Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Applicant after: HONGLI ZHIHUI GROUP Co.,Ltd. Address before: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Applicant before: GUANGZHOU HONGLI OPTO-ELECTRONIC Co.,Ltd. |
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Application publication date: 20150916 Assignee: Jiangxi Simide Semiconductor Co.,Ltd. Assignor: HONGLI ZHIHUI GROUP Co.,Ltd. Contract record no.: X2023980048529 Denomination of invention: A chip level packaging method for LED packaging Granted publication date: 20180508 License type: Common License Record date: 20231127 |
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