CN104884920B - 压敏传感器 - Google Patents

压敏传感器 Download PDF

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Publication number
CN104884920B
CN104884920B CN201480003666.0A CN201480003666A CN104884920B CN 104884920 B CN104884920 B CN 104884920B CN 201480003666 A CN201480003666 A CN 201480003666A CN 104884920 B CN104884920 B CN 104884920B
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CN
China
Prior art keywords
electrode
substrate
mentioned
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spacer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201480003666.0A
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English (en)
Chinese (zh)
Other versions
CN104884920A (zh
Inventor
立川泰之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
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Fujikura Ltd
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Publication date
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Publication of CN104884920A publication Critical patent/CN104884920A/zh
Application granted granted Critical
Publication of CN104884920B publication Critical patent/CN104884920B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/20Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2287Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G01L9/0044Constructional details of non-semiconductive diaphragms
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
CN201480003666.0A 2013-02-04 2014-01-30 压敏传感器 Expired - Fee Related CN104884920B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-019176 2013-02-04
JP2013019176 2013-02-04
PCT/JP2014/052083 WO2014119658A1 (ja) 2013-02-04 2014-01-30 感圧センサ

Publications (2)

Publication Number Publication Date
CN104884920A CN104884920A (zh) 2015-09-02
CN104884920B true CN104884920B (zh) 2017-03-15

Family

ID=51262369

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480003666.0A Expired - Fee Related CN104884920B (zh) 2013-02-04 2014-01-30 压敏传感器

Country Status (4)

Country Link
JP (1) JP5938111B2 (ja)
CN (1) CN104884920B (ja)
TW (1) TWI586946B (ja)
WO (1) WO2014119658A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6316371B2 (ja) * 2016-10-13 2018-04-25 Nissha株式会社 圧力センサ
WO2019200463A1 (en) * 2018-04-16 2019-10-24 Orpyx Medical Technologies Inc. High-resistance sensor and method for using same
CN117109782A (zh) * 2023-08-31 2023-11-24 广州埔慧科技有限公司 压力传感器及其制备方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001165788A (ja) * 1999-12-06 2001-06-22 Alps Electric Co Ltd 感圧装置
CN1440504A (zh) * 2000-07-04 2003-09-03 株式会社山武 电容式压力传感器及其制造方法
CN1605870A (zh) * 2002-05-13 2005-04-13 株式会社和广 加速度传感器及其制造方法
CN1789940A (zh) * 2004-12-17 2006-06-21 电子科技大学 一种复合封装的箔式锰铜超高压力传感器
EP1775738A2 (en) * 2000-09-07 2007-04-18 Fujikura Ltd. Film pressure sensitive resistor and pressure sensitive sensor
CN101079342A (zh) * 2007-05-28 2007-11-28 上海神沃电子有限公司 表面贴装型高分子esd保护元件及其制备方法
WO2009075403A1 (en) * 2007-12-10 2009-06-18 Korea Research Institute Of Standards And Science High-temperature tactile sensor and method of manufacturing the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4978775U (ja) * 1972-10-26 1974-07-08
JP2002131155A (ja) * 2000-10-30 2002-05-09 Denso Corp 感圧抵抗センサ
JP2004028883A (ja) * 2002-06-27 2004-01-29 Denso Corp 感圧センサ
JP2004205377A (ja) * 2002-12-25 2004-07-22 Kyocera Corp 圧力検出装置用パッケージ
JP2008175570A (ja) * 2007-01-16 2008-07-31 Fujikura Ltd 感圧メンブレンセンサ
CN102483363B (zh) * 2009-08-28 2014-05-07 日本写真印刷株式会社 压力检测单元以及压力检测装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001165788A (ja) * 1999-12-06 2001-06-22 Alps Electric Co Ltd 感圧装置
CN1440504A (zh) * 2000-07-04 2003-09-03 株式会社山武 电容式压力传感器及其制造方法
EP1775738A2 (en) * 2000-09-07 2007-04-18 Fujikura Ltd. Film pressure sensitive resistor and pressure sensitive sensor
CN1605870A (zh) * 2002-05-13 2005-04-13 株式会社和广 加速度传感器及其制造方法
CN1789940A (zh) * 2004-12-17 2006-06-21 电子科技大学 一种复合封装的箔式锰铜超高压力传感器
CN101079342A (zh) * 2007-05-28 2007-11-28 上海神沃电子有限公司 表面贴装型高分子esd保护元件及其制备方法
WO2009075403A1 (en) * 2007-12-10 2009-06-18 Korea Research Institute Of Standards And Science High-temperature tactile sensor and method of manufacturing the same

Also Published As

Publication number Publication date
TW201447249A (zh) 2014-12-16
JPWO2014119658A1 (ja) 2017-01-26
CN104884920A (zh) 2015-09-02
WO2014119658A1 (ja) 2014-08-07
JP5938111B2 (ja) 2016-06-22
TWI586946B (zh) 2017-06-11

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Granted publication date: 20170315

Termination date: 20210130