CN106132089A - A kind of printed wiring board buries copper billet method - Google Patents
A kind of printed wiring board buries copper billet method Download PDFInfo
- Publication number
- CN106132089A CN106132089A CN201610511453.XA CN201610511453A CN106132089A CN 106132089 A CN106132089 A CN 106132089A CN 201610511453 A CN201610511453 A CN 201610511453A CN 106132089 A CN106132089 A CN 106132089A
- Authority
- CN
- China
- Prior art keywords
- copper billet
- groove
- base material
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention relates to printed wiring board and manufacture field, particularly relate to a kind of printed wiring board and bury copper billet method, mainly comprise the steps that gong goes out groove on base material, described groove size is more than copper billet size；Base material and copper billet are carried out surface process；One side the two-sided of base material He copper billet sticks protecting film, and is cut off by the protecting film of base material upper groove position, makes groove hollow out；Resin is loaded onto four limits of groove；One side at the non-pasting protective film of copper billet is coated with last layer solventfree resin, is then fitted with groove in this face, is inserted in groove by copper billet；The base material inserting copper billet is carried out pressing, makes resin solidify；The protecting film of base material and copper block surface is torn off.
Description
Technical field
The present invention relates to printed wiring board and manufacture field, particularly relate to a kind of printed wiring board and bury copper billet method.
Background technology
With electronic product to light, thin, little, high density, multifunction direction high speed development so that electronic component, logic
Circuit volume reduces exponentially, and operating frequency sharply increases, and power consumption constantly increases, and causes components and parts working environment to height
The change of temperature direction, proposes the highest requirement to the thermal diffusivity of PCB product.
In printed wiring board, directly imbed high thermal conductive metallic copper billet, be one of effective way solving heat dissipation problem.
But existing processing technology exists, and copper billet and base material adhesion are not enough, is connected weak effect, glue difficulty of overflowing grinding, conforming product rate are low etc. asks
Topic, seriously limits printed wiring board and buries development and the popularization of copper billet technology.
Summary of the invention
The deficiency existed for prior art, it is an object of the invention to provide a kind of printed wiring board and buries copper billet method.
For achieving the above object, the present invention can be achieved by the following technical programs:
A kind of printed wiring board buries copper billet method, comprises the following steps:
(1) on base material, gong goes out groove, and described groove size is more than copper billet size；
(2) base material and copper billet are carried out surface process；
(3) one side the two-sided of base material He copper billet sticks protecting film, and is cut off by the protecting film of base material upper groove position, makes
Groove hollow out；
(4) resin is loaded onto four limits of groove；
(5) one side at the non-pasting protective film of copper billet is coated with last layer solventfree resin, is then fitted with groove in this face, by copper
Block is inserted in groove；
(6) base material inserting copper billet is carried out pressing, make resin solidify；
(7) protecting film of base material and copper block surface is torn off.
Further, groove size 0.1-0.5mm bigger than copper billet size described in step (1).
Further, deep for base material control gong is gone out groove with CNC by step (1).
Further, surface described in step (2) is processed as brown process.
Further, described in step (3), protecting film is high temperature dwell cuticula.
Further, the resin that pre-coordination is good is loaded onto four limits of groove by step (4) with spot gluing equipment.
Further, the filling width of described resin is 3-5mm.
Further, described resin is low-viscosity solvent-free resin.
Further, step (5) use screen process press the one side of non-for copper billet pasting protective film is coated with last layer solvent-free
Resin.
Further, the thickness of described solventfree resin is 20-40um.
Compared with prior art, the method have the advantages that
(1) copper billet is good with base material adhesion, and copper billet and base material lamination do not occur in machining and thermal stress test；
(2), there is not gap, cavity in copper billet and base material good connecting effect；
(3) the excessive glue produced after copper billet embedment is all within protecting film, base material and copper billet does not exist excessive glue, therefore is not required to
Except the glue that overflows；
(4) conforming product rate is high.
Accompanying drawing explanation
Fig. 1 is the flow chart of the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing and detailed description of the invention, the present invention is further illustrated:
As it is shown in figure 1, printed wiring board of the present invention buries copper billet method, comprise the following steps:
(1) with CNC, deep for base material control gong being gone out groove, described groove size is more than copper billet size, it is preferred that groove size ratio
The big 0.1-0.5mm of copper billet size；
(2) base material and copper block surface are carried out brown process；
(3) one side the two-sided of base material He copper billet sticks protecting film, and described protecting film is preferably high temperature dwell cuticula, and will
The protecting film of base material upper groove position cuts off, and makes groove hollow out；
(4) resin that pre-coordination is good loads onto four limits of groove with spot gluing equipment, and filling width is 3-5mm, resin
It is preferably low-viscosity solvent-free resin；
(5) using screen process press to be coated with last layer solventfree resin in the one side of the non-pasting protective film of copper billet, thickness is 20-
40um, then fits this face with groove, is inserted in groove by copper billet；
(6) base material inserting copper billet is carried out pressing, make resin solidify；
(7) protecting film of base material and copper block surface is torn off.
According to the Making programme of double side printed wiring board, the printed wiring board after pressing is holed, PTH, circuit, figure
Electricity, etching and anti-welding, final molding.
Present invention mainly solves techniques below problem:
(1) copper billet is not enough with base material adhesion, and copper billet and base material lamination easily occur in machining and thermal stress test；
(2) copper billet is connected weak effect with base material, there is more gap, cavity；
(3) more excessive glue can be produced after copper billet embedment, it is difficult to grind clean；
(4) conforming product rate is low.
For a person skilled in the art, can be made other various accordingly according to above technical scheme and design
Change and deformation, and within all these changes and deformation all should belong to the protection domain of the claims in the present invention.
Claims (10)
1. a printed wiring board buries copper billet method, it is characterised in that comprise the following steps:
(1) on base material, gong goes out groove, and described groove size is more than copper billet size；
(2) base material and copper billet are carried out surface process；
(3) one side the two-sided of base material He copper billet sticks protecting film, and is cut off by the protecting film of base material upper groove position, makes groove
Hollow out；
(4) resin is loaded onto four limits of groove；
(5) one side at the non-pasting protective film of copper billet is coated with last layer solventfree resin, is then fitted with groove in this face, is filled out by copper billet
Enter in groove；
(6) base material inserting copper billet is carried out pressing, make resin solidify；
(7) protecting film of base material and copper block surface is torn off.
Printed wiring board the most according to claim 1 buries copper billet method, it is characterised in that: groove chi described in step (1)
Very little bigger 0.1-0.5mm than copper billet size.
Printed wiring board the most according to claim 1 buries copper billet method, it is characterised in that: with CNC by base material in step (1)
Control deep gong and go out groove.
Printed wiring board the most according to claim 1 buries copper billet method, it is characterised in that: surface described in step (2)
Manage and process for brown.
Printed wiring board the most according to claim 1 buries copper billet method, it is characterised in that: protecting film described in step (3)
For high temperature dwell cuticula.
Printed wiring board the most according to claim 1 buries copper billet method, it is characterised in that: step uses spot gluing equipment in (4)
The resin that pre-coordination is good is loaded onto four limits of groove.
Printed wiring board the most according to claim 6 buries copper billet method, it is characterised in that: the filling width of described resin is
3-5mm。
Printed wiring board the most according to claim 6 buries copper billet method, it is characterised in that: described resin is that low viscosity is without molten
Agent resin.
Printed wiring board the most according to claim 1 buries copper billet method, it is characterised in that: step (5) uses screen printing
The one side of non-for copper billet pasting protective film is coated with last layer solventfree resin by brush machine.
Printed wiring board the most according to claim 9 buries copper billet method, it is characterised in that: the thickness of described solventfree resin
Degree is 20-40um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610511453.XA CN106132089B (en) | 2016-06-30 | 2016-06-30 | A kind of printed wiring board buries copper billet method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610511453.XA CN106132089B (en) | 2016-06-30 | 2016-06-30 | A kind of printed wiring board buries copper billet method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106132089A true CN106132089A (en) | 2016-11-16 |
| CN106132089B CN106132089B (en) | 2018-11-20 |
Family
ID=57467933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610511453.XA Active CN106132089B (en) | 2016-06-30 | 2016-06-30 | A kind of printed wiring board buries copper billet method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106132089B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109788651A (en) * | 2019-03-05 | 2019-05-21 | 胜宏科技（惠州）股份有限公司 | A kind of PCB transplantation method |
| CN110012620A (en) * | 2019-04-09 | 2019-07-12 | 深圳市景旺电子股份有限公司 | High frequency board fabrication method |
| CN110621123A (en) * | 2019-09-19 | 2019-12-27 | 生益电子股份有限公司 | Manufacturing method of heat-conducting PCB and PCB |
| CN110996520A (en) * | 2019-12-19 | 2020-04-10 | 珠海杰赛科技有限公司 | Manufacturing method for double-sided circuit board embedded copper block |
| CN112194881A (en) * | 2020-10-09 | 2021-01-08 | 付鹏 | Manufacturing method of double-sided circuit board with embedded copper block |
| CN114615830A (en) * | 2022-02-18 | 2022-06-10 | 江门崇达电路技术有限公司 | Method for improving copper block embedded circuit board stitching glue overflow |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020004124A1 (en) * | 2000-07-07 | 2002-01-10 | Yutaka Hirasawa | Copper foil circuit with a carrier, method for manufacturing printed wiring board using the same, and printed wiring board |
| CN104797085A (en) * | 2015-04-23 | 2015-07-22 | 广州杰赛科技股份有限公司 | Method for forming blind groove in buried copper block of circuit board |
| CN105430922A (en) * | 2015-12-18 | 2016-03-23 | 景旺电子科技(龙川)有限公司 | Manufacturing method for embedding metal matrix into printed board |
-
2016
- 2016-06-30 CN CN201610511453.XA patent/CN106132089B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020004124A1 (en) * | 2000-07-07 | 2002-01-10 | Yutaka Hirasawa | Copper foil circuit with a carrier, method for manufacturing printed wiring board using the same, and printed wiring board |
| CN104797085A (en) * | 2015-04-23 | 2015-07-22 | 广州杰赛科技股份有限公司 | Method for forming blind groove in buried copper block of circuit board |
| CN105430922A (en) * | 2015-12-18 | 2016-03-23 | 景旺电子科技(龙川)有限公司 | Manufacturing method for embedding metal matrix into printed board |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109788651A (en) * | 2019-03-05 | 2019-05-21 | 胜宏科技（惠州）股份有限公司 | A kind of PCB transplantation method |
| CN109788651B (en) * | 2019-03-05 | 2024-03-15 | 胜宏科技（惠州）股份有限公司 | PCB transplanting method |
| CN110012620A (en) * | 2019-04-09 | 2019-07-12 | 深圳市景旺电子股份有限公司 | High frequency board fabrication method |
| CN110012620B (en) * | 2019-04-09 | 2020-08-18 | 深圳市景旺电子股份有限公司 | Method for manufacturing high-frequency plate |
| CN110621123A (en) * | 2019-09-19 | 2019-12-27 | 生益电子股份有限公司 | Manufacturing method of heat-conducting PCB and PCB |
| WO2021052061A1 (en) * | 2019-09-19 | 2021-03-25 | 生益电子股份有限公司 | Manufacturing method for thermally-conductive pcb and pcb |
| CN110996520A (en) * | 2019-12-19 | 2020-04-10 | 珠海杰赛科技有限公司 | Manufacturing method for double-sided circuit board embedded copper block |
| CN112194881A (en) * | 2020-10-09 | 2021-01-08 | 付鹏 | Manufacturing method of double-sided circuit board with embedded copper block |
| CN114615830A (en) * | 2022-02-18 | 2022-06-10 | 江门崇达电路技术有限公司 | Method for improving copper block embedded circuit board stitching glue overflow |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106132089B (en) | 2018-11-20 |
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