CN104752280B - Adhesive tape joining method and adhesive tape joining apparatus - Google Patents
Adhesive tape joining method and adhesive tape joining apparatus Download PDFInfo
- Publication number
- CN104752280B CN104752280B CN201410834919.0A CN201410834919A CN104752280B CN 104752280 B CN104752280 B CN 104752280B CN 201410834919 A CN201410834919 A CN 201410834919A CN 104752280 B CN104752280 B CN 104752280B
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- adhesive tape
- cover
- wafer
- chamber
- semiconductor crystal
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 227
- 238000005304 joining Methods 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 46
- 238000003825 pressing Methods 0.000 claims abstract description 43
- 239000000853 adhesive Substances 0.000 claims abstract description 19
- 230000001070 adhesive effect Effects 0.000 claims abstract description 19
- 239000013078 crystal Substances 0.000 claims description 52
- 239000004065 semiconductor Substances 0.000 claims description 45
- 230000007246 mechanism Effects 0.000 claims description 32
- 238000005520 cutting process Methods 0.000 claims description 23
- 230000008569 process Effects 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims description 5
- 238000002372 labelling Methods 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 125
- 238000011282 treatment Methods 0.000 description 24
- 238000004026 adhesive bonding Methods 0.000 description 15
- 239000000758 substrate Substances 0.000 description 9
- 230000006837 decompression Effects 0.000 description 7
- 238000002955 isolation Methods 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000002224 dissection Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
- H01L21/447—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428 involving the application of pressure, e.g. thermo-compression bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides adhesive tape joining method and adhesive tape joining apparatus.By the joint portion of the width adhesive tape joining bigger than the internal diameter of chamber being used on a cover in the pairs of upper cover and lower cover for being used to constitute chamber pairs of upper cover and lower cover engagement, after forming chamber with clipping adhesive tape, adhesive tape is preheated using heater.Later, make wafer close to the adhesive surface of adhesive tape and opposite with the adhesive surface of adhesive tape, by adhesive tape joining in wafer while making the air pressure for accommodating and keeping the air pressure in the space of the lower cover of wafer lower than the space of upper cover.It is pressurizeed using the flat surface of pressing element come the surface of the adhesive tape to the circuit forming face for being pasted on wafer and makes its planarization.
Description
Technical field
The present invention relates to adhesive tape joining method and adhesive tape joining apparatus, which includes being formed on for protecting
The protection band of the circuit pattern of semiconductor crystal wafer, the semiconductor crystal wafer across ring frame and the center for being positioned in the ring frame
The cutting belt etc. that the back side is pasted.
Background technique
In general, forming the circuit pattern there are many element on the surface of semiconductor crystal wafer (hereinafter, being properly termed as " wafer ").
For example, being formed with convex block, fine circuitry in crystal column surface.Therefore, protection band is pasted in order to protect the circuit surface.
The influence of the bumps such as convex block due to crystal column surface and the surface of the protection band after stickup also generate identical recessed
It is convex.Therefore, after the gluing treatment of protection band, protection band is pressed from the surface side of the protection band and makes to constitute the protection band
The surface planarisation (referring to patent document 1) of substrate.
Patent document 1: Japanese Unexamined Patent Publication 2010-45189 bulletin
Summary of the invention
Problems to be solved by the invention
However, in the previous methods, the problem of producing as follows.
In recent years, due to TSV (Through-Silicon Via: through silicon via), IGBT (Insulated Gate
Bipolar Transistor: insulated gate bipolar transistor), MEMS (Micro Electro Mechanical System: micro-
Electronic mechanical system) etc. encapsulation, the circuit for being formed in crystal column surface is required to include convex narrower than previous spacing of spacing
Fining including the previous bulky convex block of block, volume ratio.In addition, correspondingly making respectively with these manufactured encapsulation
With the protection band of different characteristics.For example it is difficult to handle the adhesive tape with following characteristic: the increase of the hardness of substrate has
The increase or the two characteristics of the thickness of the adhesive tape of substrate and adhesive.
In the previous device documented by the patent document 1, protection band is pasted on crystal column surface under atmospheric condition.This
When, on one side to band-like protection band along conveying direction apply tension, make on one side Sticking roller in the surface scrolls of the protection band by
The protection band is pressed, so that protection band is pasted on crystal column surface.Thus, the tension of the length direction of protection band is greater than protection band
The tension of width direction, protection band can be pasted on crystal column surface in the state of being easy to generate fold.Therefore, adhesive cannot chase after
With and completely into the bumps that are formed by the narrow spacing etc. of the convex block on crystal column surface.In other words, protection band is not complete
It is entirely closely sealed with crystal column surface, also occur the concaveconvex shapes such as the convex block of crystal column surface on the surface of protection band.
Therefore, in order to keep the surface of protection band flat, after protection band is pasted on wafer, using with flat surface
Pressing member pressurizes while heating to protection band.
However, adhesive phase does not soften, therefore there are such problems: adhesive phase can not when pasting protection band
Completely between convex block, and then bubble is involved in the bonding interface between wafer and protection band.
Also, after pasting adhesive tape, in the feelings heated to keep the surface of protection band flat to protection band
Under condition, the increase of the thickness of adhesive may create the problem that, the increase of hardness of the substrate of protection band can make make adhesive
The processing time of previous time or more is spent Deng softening aspect.
Given this situation the present invention is made into, no matter main purpose, which is to provide, is formed in semiconductor crystal wafer
Circuit state how can precisely paste adhesive tape and efficiently carry out gluing treatment adhesive tape joining side
Method and adhesive tape joining apparatus.
The solution to the problem
Therefore, the present invention adopts the following technical scheme that reach such purpose.
That is, a kind of adhesive tape joining method, is by adhesive tape joining in the bonding of the circuit forming face of semiconductor crystal wafer
Band method of attaching, which is characterized in that the adhesive tape joining method includes following procedure: the 1st paste process was pasted the 1st
Cheng Zhong, by the width adhesive tape joining bigger than the internal diameter of chamber in pairs of the 1st cover and the 2nd cover for being used to constitute the chamber
In a cover on the joint portion for the 1st pairs of cover and the 2nd cover engagement；Preheating process, it is preheated at this
Cheng Zhong preheats adhesive tape using heater after forming chamber with clipping the adhesive tape；2nd paste process,
In the 2nd paste process, make semiconductor crystal wafer close to the adhesive surface of the adhesive tape and with the adhesive surface phase of the adhesive tape
It is right, while making to accommodate and keep air pressure of the air pressure in the 2nd space covered of the semiconductor crystal wafer lower than the space of the 1st cover incite somebody to action
The adhesive tape joining is in semiconductor crystal wafer；And pressure process, in the pressure process, using the flat surface of pressing element come pair
It is pressurizeed and makes its planarization in the surface for being pasted on the adhesive tape of the circuit forming face of the semiconductor crystal wafer.
Using this method, adhesive tape joining is being played the adhesive tape joining in the joint portion on a cover in semiconductor
During until wafer, which is pre-heated to defined temperature.Thus, at the stickup moment of adhesive tape, adhesive is
It is softened, therefore, even if not utilizing pressing member etc., between the two spaces being only separated by keeping chamber indoor by adhesive tape
Generate pressure difference, also can on one side make uniformly to press act on the whole surface of adhesive tape while by adhesive tape joining in partly leading
Body crystal column surface.In other words, adhesive tape can be glued in the case where that will not make the convex block on surface etc. damaged because excessively pressing
It is affixed on semiconductor crystal wafer.In addition, bubble can be made to deviate from from the recess portion of semiconductor wafer surface using depressurization, and make to bond
Agent follows the concaveconvex shape of the semiconductor wafer surface and closely sealed with the concaveconvex shape on the surface of semiconductor crystal wafer.Also, it bonds
The preheating of band can be implemented in the indoor decompression process of the chamber before will pasting adhesive tape, therefore, with it is previous such,
The case where heating while the surface planarisation for making adhesive tape to adhesive tape is compared, being capable of the cripetura processing time.
In addition, in the method, in preheating process, such as being preferably, make the pressurization structure of embedded having heaters
The pressurized plane of part is connected to adhesive tape to be preheated.
In this case, due to the pressurized plane of pressing element be it is flat, pressurized plane can be in close contact with adhesive tape.
Thus, it is possible to which the whole surface to adhesive tape equably heats.
In addition, in the method, in pressure process, it is preferred that carried out on one side using pressing element to adhesive tape
Heating is pressurizeed on one side.
In this case, it is able to use in the concave-convex efficiently flat of the substrate for constituting adhesive tape.
In addition, the present invention adopts the following technical scheme that reach the purpose.
That is, a kind of adhesive tape joining apparatus, is used for the adhesive tape joining of surface protection in the electricity of semiconductor crystal wafer
Road forming face, which is characterized in that the adhesive tape joining apparatus includes: holding station, is used to keep the semiconductor crystal wafer；Chamber
Room is made of pairs of the 1st cover and the 2nd cover for accommodating the holding station；Band supply unit, is used to supply width and compares institute
State the big adhesive tape of the internal diameter of chamber；Band labelling machine is used for adhesive tape joining in the 1st pairs of cover and the
The joint portion for the 1st pairs of cover and the 2nd cover engagement on a cover in 2 covers；Heater is used for being pasted on
The adhesive tape at the joint portion is preheated；Pressing mechanism, using be provided in the indoor pressing element of the chamber come to
The mode that pressure difference is generated between the two spaces for keeping chamber indoor to be separated by the adhesive tape is pasted on semiconductor crystal wafer
Adhesive tape pressurize；Cutting mechanism is used for the shape cutting adhesive tape along the semiconductor crystal wafer；Mechanism for stripping,
It is used for being partially stripped after the shape for being cut the semiconductor crystal wafer by adhesive tape；And it with recoverer, is used for back
The adhesive tape of the closing stripping from after.
In addition, a kind of adhesive tape joining apparatus, it is used to paste the viscous of bearing across semiconductor crystal wafer and ring frame
Crossed belt, which is characterized in that the adhesive tape joining apparatus includes: wafer holding station, is used to keep the semiconductor crystal wafer；Frame is protected
Platform is held, is used to keep the ring frame；Chamber, by pairs of the 1st cover and the 2nd cover for accommodating the wafer holding station
It constitutes；Band supply unit, is used to supply the adhesive tape；Band labelling machine is used for adhesive tape joining in the 1st pairs of cover
With the joint portion and the ring frame for the 1st pairs of cover and the 2nd cover engagement on a cover in the 2nd cover；Heater,
For being preheated to the adhesive tape for being pasted on the ring frame and joint portion；Pressing mechanism utilizes and is provided in the chamber
The flat surface of indoor pressing element comes pair so as to generate between the indoor two spaces being separated by the adhesive tape of chamber
It pressurizes on the surface that the mode of pressure difference is pasted on the adhesive tape of semiconductor crystal wafer；Cutting mechanism is used in the annular
Adhesive tape is cut on frame；Mechanism for stripping is used for the adhesive tape except what be cut is pasted on the ring frame
With being partially stripped other than the part of semiconductor crystal wafer；And with recoverer, it is used to recycle stripping down for the adhesive tape
Part.
In any device, by adhesive tape joining before semiconductor crystal wafer, to what is depressurized in chamber
In the process, adhesive tape can be preheated to defined temperature.Thus, even if the shape of semiconductor crystal wafer when pasting adhesive tape
State is different, also can suitably implement the method.
In addition, in said device, it is preferred that be equipped with heater in the pressing element of pressing mechanism.
It, can be to viscous since the flat pressurized plane of pressing element can be made to be connected to adhesive tape using the structure
The whole surface of crossed belt is equably heated.
The effect of invention
Using adhesive tape joining apparatus of the invention and adhesive tape joining method, no matter it is formed in the surface of semiconductor crystal wafer
The state of circuit how adhesive tape can precisely and be efficiently pasted on to semiconductor crystal wafer.
Detailed description of the invention
Fig. 1 is the whole main view for indicating the adhesive tape joining apparatus of surface protection.
Fig. 2 is the whole main view for indicating the adhesive tape joining apparatus of surface protection.
Fig. 3 is the main view for indicating structure possessed by rotary drive mechanism.
Fig. 4 is the main view for indicating the structure of chamber.
Fig. 5 is the longitudinal section view for indicating the structure of chamber.
Fig. 6 is the main view for indicating the movement of embodiment device.
Fig. 7 is the main view for indicating the movement of embodiment device.
Fig. 8 is the main view for indicating the movement of embodiment device.
Fig. 9 is the top view for indicating the movement of embodiment device.
Figure 10 is the main view for indicating the movement of embodiment device.
Figure 11 is the top view for indicating the movement of embodiment device.
Figure 12 is the main view for indicating the movement of embodiment device.
Figure 13 be indicate in embodiment device by adhesive tape joining in the enlarged front view of the movement of wafer.
Figure 14 be indicate in embodiment device by adhesive tape joining in the enlarged front view of the movement of wafer.
Figure 15 is the main view for indicating the movement of embodiment device.
Figure 16 is the main view for indicating the movement of embodiment device.
Figure 17 is the main view for indicating the movement of embodiment device.
Figure 18 is the main view for indicating the movement of embodiment device.
Figure 19 is the main view for indicating the movement of embodiment device.
Figure 20 is the main view of the adhesive tape joining apparatus of bearing.
Figure 21 is the top view of the adhesive tape joining apparatus of bearing.
Figure 22 is the main view for indicating the structure of chamber.
Figure 23 is the main view for indicating the movement of variation device.
Figure 24 is the main view for indicating the movement of variation device.
Figure 25 is the enlarged front view for indicating the movement of the adhesive tape joining by bearing in variation device in wafer.
Figure 26 is the enlarged front view for indicating the movement of the adhesive tape joining by bearing in variation device in wafer.
Figure 27 is the main view for indicating the movement of variation device.
Figure 28 is the main view for indicating the movement of variation device.
Figure 29 is the main view for indicating the movement of variation device.
Description of symbols
4, band supply unit；5, application unit；6, band cutting mechanism；7, chamber；8, presser unit；9, stripping unit；10, band
Recoverer；20, peeling member；22, Sticking roller；23, cutter unit；33A, upper cover；33B, 33C, lower cover；37, holding station；60,
Control unit；61, pressing element；63, heater；77, frame holding station；PT, surface protection adhesive tape；W, semiconductor crystal wafer；
F, ring frame；DT, bearing adhesive tape.
Specific embodiment
Hereinafter, being described with reference to one embodiment of the invention.In addition, in the present embodiment, by surface protection
Adhesive tape joining is illustrated in case where the circuit forming face of semiconductor crystal wafer (hereinafter referred to as work " wafer ").
Fig. 1 shows the integrally-built main view of the adhesive tape joining apparatus of one embodiment of the invention, Fig. 2 is adhesive tape
The top view of sticker.
Adhesive tape joining apparatus includes wafer supply/recoverer 1, wafer conveying mechanism 2, alignment tool 3, band supply unit 4, glues
Paste unit 5, band cutting mechanism 6, chamber 7, presser unit 8, stripping unit 9 and with recoverer 10 etc..Hereinafter, explanation is described each
The specific structure of formations and mechanism etc..
Box C1, C2 there are two being loaded side by side in wafer supply/recoverer 1.More wafers W is with circuit forming face (surface) court
On flat-hand position multilayer be inserted into and be contained in each box C.
Wafer conveying mechanism 2 includes two mechanical arms 11A, 11B.Two mechanical arm 11A, 11B are configured to along level side
To moving forward and backward, and integrally it is able to carry out rotation and lifting.Also, it is equipped with and is formed on the top of mechanical arm 11A, 11B
The wafer maintaining part of horseshoe-shaped vacuum adsorption type.Wafer maintaining part is contained between the wafer W in box C with being inserted into multilayer
Gap in, so that absorption keeps wafer W from the back side of wafer W.The wafer W that being adsorbed remains is pulled out from box C, and according to
Alignment tool 3, holding station 37 and wafer supply/recoverer 1 are sequentially supplied to alignment tool 3, holding station 37 and wafer and supply
To/recoverer 1.
Alignment tool 3 be used for according to the recess formed on the periphery of wafer W for being inputted and being loaded by wafer conveying mechanism 2,
Plane is positioned to align to wafer W.
As shown in Figure 1, being installed on supply unit 4, application unit 5, isolation film recoverer 12 and cutter unit 23 same
Longitudinal plate 14.The longitudinal direction plate 14 can be moved horizontally by movable table 15 along the frame 16 on top.
Band supply unit 4 is configured to, and the adhesive tape PT of the wide cut rolled into a roll is loaded on supply spool 17, will be from the supply spool
17 release after the adhesive tape PT with isolation film s guide and be wound in 18 groups of guide reel, the adhesive tape after isolation film s will have been removed
PT is guided to application unit 5.In addition, being configured to, apply appropriate rotational resistance to supply spool 17, without releasing excessively
Band.
In isolation film recoverer 12, to the recycling spool 19 for batching the isolation film s that auto-adhesive tape PT is stripped down
Rotation driving is carried out along take-up direction.
As shown in figure 3, application unit 5 includes peeling member 20, dance roller 21 and Sticking roller 22.In addition, application unit 5
It is equivalent to band labelling machine of the invention.
The cutting edge component that peeling member 20 has top sharp.By the removing structure for being equipped with the cutting edge component obliquely
Part 20 come make isolation film s turn back, so that adhesive tape PT be removed.That is, protruding adhesive tape PT forwards from peeling member 2.
Dance roller 21 is in time clamping adhesive tape PT in a manner of with 20 co-operating of peeling member.
Sticking roller 22 is for gluing this to being pressed from the top of the top of peeling member 20 adhesive tape PT outstanding
The top of crossed belt PT is pasted on the joint portion 70 of aftermentioned lower cover 33B, 33C.
Cutter unit 23 includes: movable table 25, can be moved along the frame 24 for the front side for being set to peeling member 20；And knife
Tool 26, the lower part of the movable table 25 is installed on by knife rest.That is, cutter unit 23 is used for the width direction pair along adhesive tape PT
Adhesive tape PT is cut.
As depicted in figs. 1 and 2, band cutting mechanism 6 is equipped with knife unit 30 by supporting arm 29, and the supporting arm 29 is by energy
The top lower part of the arm of enough 28 cantilever supports of movable table gone up and down along frame 27 radially extends.On knife unit 30, by
Knife rest is equipped with point of a knife cutter 31 directed downwardly.In addition, knife unit 30 can adjust radius of turn by supporting arm 29.This
Outside, cutting mechanism of the invention is equivalent to cutting mechanism 6.
Chamber 7 is made of the cover pairs of up and down with the internal diameter smaller than the width of adhesive tape T.In the present embodiment, chamber
Room 7 includes 1 upper cover 33A and two lower covers 33B, 33C.
As shown in Figure 3 and Figure 4, lower cover 33B, 33C, which is separately positioned on, is fixedly linked on the rotating drivers such as motor 34
The both ends of rotating arm 36 in rotary shaft 35.That is, being for example configured to, when a lower cover 33B and upper cover 33A forms chamber 7, separately
One lower cover 33C is located at the band paste position by the side of application unit 5.In addition, the upper and lower surfaces of lower cover 33B, 33C
It is applied with the demouldings processing such as fluorine processing.
The holding station 37 that can be gone up and down is equipped in two lower covers 33B, 33C.Holding station 37 and the bar for running through lower cover 33B, 33C
38 are connected.The other end of bar 38 is connected with the driver 39 being made of motor etc. and is driven by driver 39.Thus, it protects
Holding platform 37 can go up and down in lower cover 33B, 33C.In addition, burying having heaters 49 in holding station 37.
Upper cover 33A is set to lift drive mechanism 40.The lift drive mechanism 40 includes: movable table 43, can be along vertical
The track 42 that the back of wall 41 longitudinally configures is gone up and down；Movable frame 44, it is movable to be supported on this in a manner of it can adjust height
Platform 43；And arm 45, extend from the movable frame 44 towards front.Upper cover 33A be installed on from the top end part of the arm 45 to
The support shaft 46 that lower section is extended.
Movable table 43 using motor 48 by making 47 positive and reverse return of lead screw transfer to carry out screw thread feeding lifting.
As shown in figure 5, upper lower cover 33A~33C is connected to vacuum plant 51 via flow path 50, connect.In addition, in flow path 50
The side by upper cover 33A part be equipped with solenoid valve 52.In addition, respectively cover 33A~33C respectively with the electricity with atmosphere opening
The connection of flow path 55, the connection of magnet valve 53,54.Also, upper cover 33A with have for being come in a manner of leakage to after temporary decompression
The connection of flow path 57, the connection for the solenoid valve 56 that internal pressure is adjusted.In addition, the opening and closing operations of the solenoid valve 52,53,54,56
Work with vacuum plant 51 is carried out by control unit 60.
Presser unit 8 has pressing element 61 in upper cover 33A.Pressing element 61 is the plate with flat bottom surface.
It is connected with cylinder 62 on the top of the pressing element, so that the pressing element is gone up and down in upper cover 33A.In addition, in pressurization structure
Having heaters 63 is assembled in part 61.In addition, presser unit 8 is equivalent to pressing mechanism of the invention.
As shown in Figure 1, Figure 2 and shown in Figure 18, stripping unit 9 includes: movable table 65, can be moved along 64 left and right horizontal of guide rail
It is dynamic；Fixed bearing piece 66 can be gone up and down in the movable table 65；And movable plate 68, and it should under the drive of cylinder 67
Fixed bearing piece 66 is adjacent to, separates.That is, stripping unit 9 is used to clamp adhesive tape using fixed bearing piece 66 and movable plate 68
The one end of the unwanted part in addition to being cut the part of shape of wafer W with cutting mechanism 6 of PT, and by the bonding
Unwanted with PT is partially stripped.In addition, stripping unit 9 is equivalent to mechanism for stripping of the invention.
It is configured with returnable 69 in band recoverer 10, the removing which is located at stripping unit 9 terminates end side,
For being stripped down by the stripping unit 9 for adhesive tape PT is partially recycled.
Next, the adhesive tape PT a series of movement for being pasted on wafer W is said to using the embodiment device
It is bright.
Firstly, exporting wafer W from box C1 using mechanical arm 11A, and wafer W is placed in alignment tool 3.Utilizing alignment tool
After 3 couples of wafer W are aligned, wafer W is delivered to using mechanical arm 11A and is located at the holding station 37 with paste position.
As shown in fig. 6, above pushing away more fulcrum posts 71 makes the more tops of the fulcrum post 71 than lower cover 33B in holding station 37
(joint portion) 70 height receives wafer W.The fulcrum post 71 for having received wafer W declines, and the retaining surface that wafer W is kept platform 37 is inhaled
Attached holding.At this point, the surface of wafer W is located at the position lower than joint portion 70.
As shown in fig. 7, application unit 5 is made to be moved to stickup starting end.Be synchronously carried out on one side adhesive tape PT supply and
It batches, makes adhesive tape PT from the prominent specific length of peeling member 20 on one side.Decline Sticking roller 22 and by the top of adhesive tape PT
It is pasted on the joint portion 70 of lower cover 33B.Later, make application unit 5 mobile on one side, adhesive tape PT is pasted on the joint portion on one side
70 whole surface.At this point, the surface of wafer W and the adhesive surface of adhesive tape PT approach in a manner of with predetermined gap
And it is opposite.
Application unit 5 stops in the position that the distance away from the joint portion 70 by pasting end side is more than predetermined distance.Such as Fig. 8
With shown in Fig. 9, cutter unit 23 works and carries out cutter 26 to the rear end side of adhesive tape PT along the width direction of adhesive tape PT
Cutting.In addition, the band sticking placement for ease of understanding application unit 5, makes the left side for being recorded in Fig. 7, Fig. 8 and aftermentioned Figure 13
The lower cover 33B of side has rotated 90 degree to be recorded.
As shown in Figure 10 and Figure 11, rotating driver 34 is made to work and be rotatably moved to lower cover 33B under upper cover 33A
Side.At this point, the lower cover 33C for being installed on the another side of rotating arm 36 is moved to band paste position.
As shown in figure 12, decline upper cover 33A, so that upper cover 33A clamps adhesive tape PT together with lower cover 33B and forms chamber
Room 7.
Control unit 60 make heater 49 work and by the wafer W in holding station 37 be heated to predetermined temperature and substantially at the same into
Decompression in the pre-add heat treatment of row adhesive tape PT and chamber 7.
Pre-add heat treatment is implemented in the following way.It starts to work together with device, heater 63 is maintained at defined
Temperature.That is, softening adhesive moderately and convex block for entering wafer W etc.
Gap and it is closely sealed with wafer W, and carry out temperature control, so that the substrate of adhesive tape PT is moderately deformed such temperature to reach.
Thus, forming substantially making pressing element 61 drop to specified altitude simultaneously and pressurized plane is made to be connected to adhesive tape PT for chamber 7
And start to preheat.Become in addition, preheating temperature can carry out setting appropriate according to the characteristic of used adhesive tape
More.
Start the decompression in chamber 7 in the state that pressing element 61 is connected to adhesive tape PT.That is, closing solenoid valve
53, vacuum plant 51 is made in the state of 54,56 to work and depressurize in upper cover 33A and in lower cover 33B.At this point, adjustment electricity
The aperture of magnet valve 52 depressurizes to be covered in 33A, 33B with identical speed to two.
After air pressure as defined in being decompressed in by two cover 33A, 33B, control unit 60, which closes solenoid valve 52, simultaneously makes vacuum plant
51 work stops.
Later, air pressure in upper cover 33A is slowly improved while the aperture of adjusting solenoid valve 56 leaks it
To defined air pressure.At this point, the air pressure in lower cover 33B becomes lower than the air pressure in upper cover 33A, under the action of the pressure difference,
As shown in Figure 13 and Figure 14, adhesive tape PT is inhaled into lower cover 33B from its center, from the wafer W configured proximate to itly
Center wafer W is slowly pasted on towards periphery.
After reaching preset air pressure in upper cover 33A, the aperture of 60 adjusting solenoid valve 54 of control unit and make lower cover 33B
Interior air pressure is identical as the air pressure in upper cover 33A.The upper table for increase holding station 37 and making wafer W is adjusted with the air pressure
The surface at face and the joint portion of lower cover 33B 70 is located at identical height.
As shown in figure 15, make to be further lowered into predetermined height by the pressing element 61 that heater 63 heats,
The whole surface of adhesive tape PT is heated and pressurizeed in stipulated time.The predetermined height according to the thickness of adhesive tape PT,
Height of convex block on wafer W etc. and being redefined for will not make the height of the circuit breakage with the convex block.
After completing pressurized treatments, control unit 60 makes upper cover 33A rise and make in upper cover 33A to atmosphere opening, and makes
54 standard-sized sheet of solenoid valve and make the side lower cover 33B also to atmosphere opening.
In addition, during adhesive tape PT is pasted on wafer W in chamber 7, it on one side will be defeated from box C2 using mechanical arm 11B
Wafer W out adsorbs the holding station 37 being held in lower cover 33C, and adhesive tape PT is pasted on to the joint portion of lower cover 33C on one side
70。
The gluing treatment that adhesive tape PT is pasted on to wafer W and pressurized treatments in chamber 7 utilize application unit 5 will
Adhesive tape PT is pasted on after the completion of the gluing treatment of lower cover 33C, as shown in figure 16, reversely rotates rotating arm 36.That is, making one
Lower cover 33B is moved to the band paste position by 5 side of application unit, another lower cover 33C is made to be moved to connecing for the lower section of upper cover 33A
Coincidence is set.
So that band cutting mechanism 6 is worked, as shown in figure 17, knife unit 30 is made to drop to specified altitude, puncture cutter 31
Adhesive tape PT between wafer W and lower cover 33B.In this state, adhesive tape PT is cut along the periphery of wafer W.At this point, bonding
Surface with PT is held horizontally.After the cutting for completing adhesive tape PT, knife unit 30 rises and returns to position of readiness.
Stripping unit 9 is set to be moved to removing starting position.As shown in figure 18, it is pressed from both sides using fixed bearing piece 66 and movable plate 68
Firmly two end sides from lower cover 33B stretching of adhesive tape PT.As shown in figure 19, move stripping unit 9 obliquely upward
Dynamic predetermined distance on one side moves horizontally stripping unit 9 later, on one side by the portion of adhesive tape PT being cut after wafer shape
Divide removing.
After stripping unit 9 reaches band recoverer 10, releases the clamping to adhesive tape PT and fall to back adhesive tape PT
In receptacle 69.
The original position being contained in the wafer W for being pasted with adhesive tape PT using mechanical arm 11A in box C1.
In addition, the side lower cover 33B carry out adhesive tape PT cutting and lift-off processing during, the side lower cover 33C carry out by
Adhesive tape PT is pasted on the gluing treatment of wafer.More than, it completes and moves the adhesive tape T a series of stickup for being pasted on wafer W
Make, after, repeat identical processing.
Using the embodiment device, since the tip side of adhesive tape PT is pasted on cover 33B, 33C with free state
Joint portion 70, therefore adhesive tape PT can be pasted in the state of pasting the tension on direction inhibiting.Thus, it is possible to make to press
Power difference acts on the non-uniform adhesive tape PT of no tension, so as to make radial uniform tension force effect in the adhesive tape
PT.Thus, it is possible to which adhesive tape PT to be pasted on to the surface of wafer W in the case where not generating fold etc..
In addition, controlling the heater 63 for being set to the pressing element 61 in chamber 7 in predetermined temperature.It therefore, can be in shape
So that the pressurized plane of pressing element 61 is connected to adhesive tape PT while at chamber 7 and immediately begin to preheating make adhesive tape PT reach
Predetermined temperature.In addition, identical being decompressed to the two spaces of chamber 7 being separated by adhesive tape PT with identical speed
Air pressure or during making the two spaces vacuum, can be preheated to predetermined temperature for adhesive tape PT.Thus, with added
It is compared come heating bonding with the previous method of PT while pressure processing using heater 63, is capable of the stickup of cripetura adhesive tape PT
Time.
In addition, by making the two spaces in chamber 7 generate pressure difference, it can be by the bonding in the state of moderately having softened
With PT with radial stickup from the center of wafer W.
Thus, due to will not excessively press wafer W as when pasting component using Sticking roller etc., can not make
Circuit with convex block etc. is damaged.In addition, bubble can be made to deviate from from the recess portion of wafer W and chase after adhesive using depressurization
With the concaveconvex shape on the surface of wafer W, and it is closely sealed with the concaveconvex shape on the surface of wafer W.
In addition, due to carrying out pressurized treatments again after the gluing treatment for carrying out adhesive tape PT, make to constitute adhesive tape
The surface of the substrate of PT is flat.Therefore, the deviation of the thickness of the wafer W after being able to suppress back mill.That is, regardless of the spy of adhesive tape PT
How are property, the state of the circuit forming face of wafer W, can make the surface planarisation of adhesive tape PT.
Also, it, can be parallel during carrying out the gluing treatment and pressurized treatments of adhesive tape PT to wafer W in chamber 7
Ground carries out the gluing treatment of adhesive tape PT to another lower cover simultaneously, band is cut and with lift-off processing.Thus, it is possible to shorten life
Produce pitch time.
In addition, the present invention can also be implemented by mode below.
(1) in the described embodiment, it is described in case where the adhesive tape PT of adhesive surface protection, but can also
To apply the present invention to the adhesive tape across the wafer W and ring frame stickup bearing for being formed with circuit on surface and the back side
The case where (cutting belt).Thus, identical appended drawing reference is marked to structure identical with the embodiment device, and describe in detail
The different part of structure.
As shown in Figure 20 and Figure 21, which includes the frame supply unit that the embodiment device does not have
75, mechanical arm 76, frame holding station 77 and cutter unit 78.
Frame supply unit 75 is set to one side of box C1.The space of the frame supply unit 75 and the goods for being laminated and accommodating ring frame f
The waggon 79 of vehicle type is connected.Lifting platform is equipped in the inside of the waggon 79.Ring frame f is laminated on the lifting platform,
The lifting platform is configured to that ring frame f is handed off to mechanical arm 76 one by one from the opening of top on one side with the lifting of regulation spacing on one side.
Mechanical arm 76 utilizes upper surface and the conveying annular frame f that ring frame f is kept in the absorption of horseshoe-shaped maintaining part.
Frame holding station 77 is to surround the ring-type of the periphery of lower cover 33B, 33C, is set on rotating arm 36.Thus, frame is kept
Platform 77 is integrally rotated with lower cover 33B, 33C.When ring frame f is placed in the frame holding station 77, the height of frame holding station 77
The face on the joint surface and ring frame f that are set so that lower cover 33B, 33C is in same level.
Cutter unit 78 is provided to the lift drive mechanism 40 for going up and down upper cover 33A.That is, cutter unit 78 includes borrowing
The hub 80 for helping bearing 79 shown in Figure 22 to rotate around support shaft 46.The bearing radially extended is equipped at the center of the hub 80
4 supporting arms as 81~supporting arm of arm 84.
The knife rest of cutter 85 for trunnion axis support plate disc shape is installed on a bearing in a manner of it can move up and down
The top of arm 81, and pressing roller 87 be installed in a manner of it can move up and down by swing arm 88 other supporting arms 82~
The top of supporting arm 84.
It is equipped with linking part 89 on the top of hub 80, which is connected with the rotary shaft for the motor 90 for being set to arm 45
It ties and is driven by motor 90.
Next, adhesive tape DT is pasted on a series of dynamic of ring frame f and wafer W by the embodiment device by explanation
Make.
During wafer W is exported and is aligned using alignment tool 3 to wafer W from box C1 using mechanical arm 11A, benefit
Ring frame f is exported with mechanical arm 76 and is placed in and is located at the frame holding station 77 with paste position.
After wafer W after completing contraposition is handed off to holding station 37 using mechanical arm 11A, as shown in figure 23, utilize
Application unit 5 pastes adhesive tape DT across the joint portion 70 of ring frame f and lower cover 33B.At this point, surface and the adhesive tape of wafer W
The adhesive surface of DT is close and opposite in a manner of with predetermined gap.In addition, the band for ease of understanding application unit 5
Sticking placement makes the side lower cover 33B in the left side for being recorded in Figure 23 have rotated 90 degree to be recorded.
After application unit 5 reaches and pastes terminal position, adhesive tape DT is cut using cutter unit 23.At this point, after cutting
Adhesive tape DT rear end from ring frame f stretch out specific length.
The lower section for making rotating driver 34 work and lower cover 33B being made to be rotatably moved to upper cover 33A.At this point, being installed on rotation
The lower cover 33C of the another side of arm 36 is moved to band paste position.
As shown in figure 24, decline upper cover 33A, so that upper cover 33A clamps adhesive tape DT together with lower cover 33B and forms chamber
Room 7.
Control unit 60 makes heater 49 work and the wafer W in holding station 37 is heated to predetermined temperature, and substantially simultaneously
Carry out the decompression in the pre-add heat treatment and chamber 7 of adhesive tape DT.
Pre-add heat treatment can be implemented in the following way.It starts to work together with device, heater 63 is maintained at rule
Fixed temperature.That is, make at the time of adhesive tape DT is in contact with wafer W adhesive moderately softening and it is closely sealed with wafer W, and into
Trip temperature control makes the substrate of adhesive tape DT moderately deform such temperature to reach.Thus, forming the substantially same of chamber 7
When so that pressing element 61 is dropped to specified altitude and so that pressurized plane is connected to adhesive tape DT and start to preheat.In addition, preheating
Temperature setting appropriate change can be carried out according to the characteristic of used adhesive tape.
Start the decompression in chamber 7 in the state that pressing element 61 is connected to adhesive tape DT.That is, closing solenoid valve
53, vacuum plant 51 is made in the state of 54,56 to work and depressurize in upper cover 33A and in lower cover 33B.At this point, adjustment electricity
The aperture of magnet valve 52 depressurizes to be covered in 33A, 33B with identical speed to two.
After air pressure as defined in being decompressed in by two cover 33A, 33B, control unit 60, which closes solenoid valve 52, simultaneously makes vacuum plant
51 work stops.
Later, air pressure in upper cover 33A is slowly improved while the aperture of adjusting solenoid valve 56 leaks it
To defined air pressure.At this point, the air pressure in lower cover 33B becomes lower than the air pressure in upper cover 33A, under the action of the pressure difference,
As illustrated in figs. 25 and 26, adhesive tape DT is inhaled into lower cover 33B from its center, from the wafer W configured proximate to itly
Center wafer W is slowly pasted on towards periphery.Later, make the air pressure in lower cover 33B identical as the air pressure in upper cover 33A.
Adjusting with the air pressure correspondingly rises holding station 37 and the surface of ring frame f and the upper surface of wafer W is made to be located at identical height.
As shown in figure 27, make to drop to predetermined height by the pressing element 61 that heater 63 heats, in regulation
It is interior that the whole surface of adhesive tape DT is heated and pressurizeed.The predetermined height is according on the thickness of adhesive tape DT, wafer W
The height of convex block etc. and be redefined for that the height of the circuit breakage with the convex block will not be made.
In addition, cutter unit 78 works during carrying out the gluing treatment and pressurized treatments of adhesive tape DT in chamber 7.
At this point, the adhesive tape DT for being pasted on ring frame f is cut into the shape of ring frame f by cutter 85, and pressing roller 87 follows cutter
85 and on one side on ring frame f band cutting part on roll while pressed.That is, after through lower cover 33B and decline
When upper cover 33A constitutes chamber 7, the cutter 85 and pressing roller 87 of cutter unit 78 also reach dissection position.
After completing pressurized treatments, as shown in figure 28, control unit 60 makes upper cover 33A rise and make in upper cover 33A to atmosphere
It is open, and make 54 standard-sized sheet of solenoid valve and make the side lower cover 33B also to atmosphere opening.
In addition, during adhesive tape DT is pasted on wafer W in chamber 7, using mechanical arm 11A, 76 by wafer W and ring
Shape frame f is placed in respectively is located at lower cover 33C and frame holding station 77 with paste position, and carries out the gluing treatment of adhesive tape DT.
Adhesive tape joining will be glued in the gluing treatment and pressurized treatments of wafer W, using application unit 5 in chamber 7
Crossed belt DT is pasted on after the completion of the gluing treatment of lower cover 33C, reversely rotates rotating arm 36.
Stripping unit 9 is set to be moved to removing starting position.As shown in figure 29, it is pressed from both sides using fixed bearing piece 66 and movable plate 68
Firmly two end sides from ring frame f stretching of adhesive tape DT.Stripping unit 9 is set to move predetermined distance obliquely upward in this state,
Later, it on one side moves horizontally stripping unit 9, adhesive tape DT is cut being partially stripped after ring frame shape on one side.
After stripping unit 9 reaches band recoverer 10, releases the clamping to adhesive tape DT and fall to back adhesive tape DT
In receptacle 69.
In addition, completing the cutting process and lift-off processing and will be by wafer W and ring frame f of adhesive tape DT in the side lower cover 33B
During the output of installing frame (Japanese: マ ウ Application ト Off レ ー system) made of production is integral, will bond in the side lower cover 33C
Gluing treatment, pressurized treatments and the cutting process of wafer are pasted on DT.More than, it completes and adhesive tape T is pasted on wafer W
A series of sticking placement, after, repeat identical processing.
Using the embodiment device, even if being glued in the case where the two sides of wafer W is formed with circuit with by adhesive tape DT
The previous methods heated when planarization process after patch are compared, also can be by adhesive tape DT in a short time and precision is good
It is pasted on wafer W well.
In addition, being also possible to be set to be equipped with by cutter unit 78 in the same manner as main embodiment to glue in the embodiment device
Paste the structure with paste position side of unit 5.
(2) in each embodiment, it is preferred that preheating time is generated pressure with the two spaces made in chamber 7
Decompression time until power difference is adjusted to identical.It however, it can be, following deformation time is adjusted to be included in preheating
In time: making to generate pressure difference in chamber 7 and adhesive tape DT is pasted on to the deformation time before wafer W.
(3) in two embodiment device, two lower covers 33B, 33C are provided with, but 1 lower cover also can be set.?
In this case, lower cover both can carry out moving in rotation using rotating arm 36 in the same manner as the embodiment, it can also be along straight line
Track is slidably moved into.
(4) in the described embodiment, it is also possible to that heater 63 is only arranged in pressing element 61.
(5) in the described embodiment, identical wafer W has been contained in box C1, C2, but can also will be formed with difference
The wafer W of circuit is dividually contained in box C1, C2.For example, the wafer W and tool that will there are lesser bumps in circuit forming face
There is the wafer W of biggish bumps to be dividually contained in box.Two wafer W use identical adhesive tape PT and adhesive tape DT.
In this case, using pressure difference that the adhesive tape (such as PET base material) with harder substrate is viscous in chamber 7
When being affixed on wafer W, generated on the surface for the adhesive tape for being pasted on wafer W of the surface with larger bumps concave-convex.It is being pasted on tool
There is the surface of the adhesive tape of the wafer of smaller bumps not generate bumps.
Thus, it is possible to generate concave-convex wafer W to bonding belt surface carries out pressurized treatments in chamber 7, and to bonding
Belt surface does not generate concave-convex wafer W and carries out band gluing treatment merely with pressure difference.In other words, 1 device pair can be utilized
Different types of wafer W carries out the stickup of adhesive tape.
Alternatively, it is also possible to be, after carrying out adhesive tape joining processing using pressure difference, adhesive tape table is measured using sensor
The flatness in face decides whether to carry out pressurized treatments according to there is no concave-convex.
Industrial availability
As described above, the present invention be applied to can regardless of being formed in the state of the circuit on the surface of semiconductor crystal wafer
Precision is good and efficiently by adhesive tape joining in the semiconductor crystal wafer the case where.
Claims (7)
1. a kind of adhesive tape joining method is by adhesive tape joining in the adhesive tape joining of the circuit forming face of semiconductor crystal wafer
Method, which is characterized in that
The adhesive tape joining method includes following procedure:
1st paste process, in the 1st paste process, by the width adhesive tape joining bigger than the internal diameter of chamber in being used for
Constitute on a cover in pairs of the 1st cover and the 2nd cover of the chamber for the 1st pairs of cover and the 2nd cover engagement
Joint portion；
Preheating process, in the preheating process, after forming chamber with clipping the adhesive tape, using heater to viscous
Crossed belt is preheated；
2nd paste process, in the 2nd paste process, make semiconductor crystal wafer close to the adhesive surface of the adhesive tape and with it is described
The adhesive surface of adhesive tape is opposite, makes to accommodate and keep the air pressure in the 2nd space covered of the semiconductor crystal wafer lower than the 1st cover on one side
The air pressure in space is on one side by the adhesive tape joining in semiconductor crystal wafer；And
Pressure process, in the pressure process, using the flat surface of pressing element come to the electricity for being pasted on the semiconductor crystal wafer
The surface of the adhesive tape of road forming face is pressurizeed and makes its planarization,
In the preheating process, the pressurized plane of the pressing element of embedded having heaters is made to be connected to adhesive tape to carry out pre-add
Heat.
2. adhesive tape joining method according to claim 1, which is characterized in that
In the pressure process, pressurizeed while heating using pressing element to adhesive tape.
3. adhesive tape joining method according to claim 1 or 2, which is characterized in that
In the pressure process, adhesive tape is entered while heating on one side using the heater for being set to the 2nd cover side
Row pressurization.
4. a kind of adhesive tape joining apparatus is used to form the adhesive tape joining of surface protection in the circuit of semiconductor crystal wafer
Face, which is characterized in that
The adhesive tape joining apparatus includes:
Holding station is used to keep the semiconductor crystal wafer；
Chamber is made of pairs of the 1st cover and the 2nd cover for accommodating the holding station；
Band supply unit is used to supply the width adhesive tape bigger than the internal diameter of the chamber；
Band labelling machine is used to be used for institute on a cover by adhesive tape joining in pairs of the 1st cover and the 2nd cover
State the joint portion of pairs of the 1st cover and the 2nd cover engagement；
Heater is used to preheat the adhesive tape for being pasted on the joint portion；
Pressing mechanism, using being provided in the indoor pressing element of the chamber come pair so that chamber is indoor is separated by the adhesive tape
Made of generate the mode of pressure difference between two spaces and be pasted on the adhesive tape of semiconductor crystal wafer and pressurize；
Cutting mechanism is used for the shape cutting adhesive tape along the semiconductor crystal wafer；
Mechanism for stripping, being partially stripped after being used for the shape for being cut the semiconductor crystal wafer by adhesive tape；And
Band recoverer, the adhesive tape after being used to recycle removing.
5. adhesive tape joining apparatus according to claim 4, which is characterized in that
Heater is equipped in the pressing element of the pressing mechanism.
6. a kind of adhesive tape joining apparatus, it is used to paste the adhesive tape of bearing across semiconductor crystal wafer and ring frame,
It is characterized in that,
The adhesive tape joining apparatus includes:
Wafer holding station is used to keep the semiconductor crystal wafer；
Frame holding station is used to keep the ring frame；
Chamber is made of pairs of the 1st cover and the 2nd cover for accommodating the wafer holding station；
Band supply unit, is used to supply the adhesive tape；
Band labelling machine, be used on a cover by adhesive tape joining in pairs of 1st cover and the 2nd cover be used for it is pairs of
The joint portion and the ring frame of 1st cover and the 2nd cover engagement；
Heater is used to preheat the adhesive tape for being pasted on the ring frame and joint portion；
Pressing mechanism, using the flat surface for being provided in the indoor pressing element of the chamber come pair so that chamber is indoor by described viscous
The surface for the adhesive tape that the mode that pressure difference is generated between the two spaces that crossed belt is separated is pasted on semiconductor crystal wafer carries out
Pressurization；
Cutting mechanism is used to cut adhesive tape on the ring frame；
Mechanism for stripping is used for the adhesive tape except the part for being pasted on the ring frame and semiconductor crystal wafer that cut
Being partially stripped in addition；And
Band recoverer, is used to recycle the part of the adhesive tape stripped down.
7. adhesive tape joining apparatus according to claim 6, which is characterized in that
Heater is equipped in the pressing element of the pressing mechanism.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-271458 | 2013-12-27 | ||
| JP2013271458A JP6276988B2 (en) | 2013-12-27 | 2013-12-27 | Adhesive tape application method and adhesive tape application device |
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| Publication Number | Publication Date |
|---|---|
| CN104752280A CN104752280A (en) | 2015-07-01 |
| CN104752280B true CN104752280B (en) | 2019-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410834919.0A Active CN104752280B (en) | 2013-12-27 | 2014-12-26 | Adhesive tape joining method and adhesive tape joining apparatus |
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| Country | Link |
|---|---|
| JP (1) | JP6276988B2 (en) |
| KR (1) | KR102327469B1 (en) |
| CN (1) | CN104752280B (en) |
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| JP6494451B2 (en) * | 2015-07-06 | 2019-04-03 | 株式会社ディスコ | Chuck table and cleaning device |
| JP6576786B2 (en) * | 2015-10-19 | 2019-09-18 | 株式会社ディスコ | Wafer grinding method |
| KR101896383B1 (en) | 2016-10-04 | 2018-09-07 | 주식회사 대성엔지니어링 | Vision aligning apparatus for vacuum laminator |
| JP2020031183A (en) * | 2018-08-24 | 2020-02-27 | 株式会社ディスコ | Wafer protection method, protective member, and protective member production method |
| JP7173792B2 (en) * | 2018-08-28 | 2022-11-16 | 株式会社ディスコ | Wafer protection method |
| KR102143715B1 (en) * | 2019-01-31 | 2020-08-11 | 한미반도체 주식회사 | Taping system and taping method |
| JP7451028B2 (en) * | 2019-12-27 | 2024-03-18 | 株式会社ディスコ | How to place the protective sheet |
| CN116387227B (en) * | 2023-06-01 | 2023-08-11 | 苏州赛肯智能科技有限公司 | Four-side positioning grabbing mechanism |
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| CN101651089A (en) * | 2008-08-12 | 2010-02-17 | 日东电工株式会社 | Method and apparatus for joining protective tape to semiconductor wafer |
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| US6537400B1 (en) * | 2000-03-06 | 2003-03-25 | Micron Technology, Inc. | Automated method of attaching flip chip devices to a substrate |
| JP4417893B2 (en) * | 2005-08-10 | 2010-02-17 | 芝浦メカトロニクス株式会社 | Adhesive tape sticking device and sticking method |
| JP4841355B2 (en) * | 2006-08-08 | 2011-12-21 | 日東電工株式会社 | Method for holding semiconductor wafer |
| JP2008166459A (en) * | 2006-12-28 | 2008-07-17 | Tateyama Machine Kk | Protective tape applying method and apparatus |
| JP5417131B2 (en) * | 2009-11-20 | 2014-02-12 | 日東電工株式会社 | Adhesive tape attaching apparatus and adhesive tape attaching method |
| JP5511441B2 (en) * | 2010-03-05 | 2014-06-04 | リンテック株式会社 | Sheet sticking device and sheet sticking method |
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| CN101651089A (en) * | 2008-08-12 | 2010-02-17 | 日东电工株式会社 | Method and apparatus for joining protective tape to semiconductor wafer |
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| CN104752280A (en) | 2015-07-01 |
| JP2015126183A (en) | 2015-07-06 |
| KR20150077338A (en) | 2015-07-07 |
| KR102327469B1 (en) | 2021-11-16 |
| JP6276988B2 (en) | 2018-02-07 |
| TWI639671B (en) | 2018-11-01 |
| TW201533205A (en) | 2015-09-01 |
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