CN104704035B - 用于水清除层的可辐射固化的组合物及其制备方法 - Google Patents
用于水清除层的可辐射固化的组合物及其制备方法 Download PDFInfo
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- CN104704035B CN104704035B CN201380038541.7A CN201380038541A CN104704035B CN 104704035 B CN104704035 B CN 104704035B CN 201380038541 A CN201380038541 A CN 201380038541A CN 104704035 B CN104704035 B CN 104704035B
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/151—Copolymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Polymerisation Methods In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (3)
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EP12177006 | 2012-07-19 | ||
EP12177006.9 | 2012-07-19 | ||
PCT/EP2013/065012 WO2014012931A1 (en) | 2012-07-19 | 2013-07-16 | Radiation curable composition for water scavenging layer, and method of manufacturing the same |
Publications (2)
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CN104704035A CN104704035A (zh) | 2015-06-10 |
CN104704035B true CN104704035B (zh) | 2018-10-19 |
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CN201380038541.7A Active CN104704035B (zh) | 2012-07-19 | 2013-07-16 | 用于水清除层的可辐射固化的组合物及其制备方法 |
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US (1) | US10559777B2 (zh) |
EP (1) | EP2875070B1 (zh) |
JP (1) | JP6270837B2 (zh) |
KR (1) | KR102108867B1 (zh) |
CN (1) | CN104704035B (zh) |
HK (1) | HK1207874A1 (zh) |
MY (1) | MY176545A (zh) |
SG (1) | SG11201500374RA (zh) |
WO (1) | WO2014012931A1 (zh) |
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WO2014012931A1 (en) | 2012-07-19 | 2014-01-23 | Huntsman Advanced Materials (Switzerland) Gmbh | Radiation curable composition for water scavenging layer, and method of manufacturing the same |
JP6247125B2 (ja) * | 2014-03-20 | 2017-12-13 | 積水化学工業株式会社 | 有機光デバイスの製造方法 |
JP2017531049A (ja) | 2014-07-25 | 2017-10-19 | カティーバ, インコーポレイテッド | 有機薄膜インク組成物および方法 |
JP6681876B2 (ja) | 2014-07-31 | 2020-04-15 | ビーエーエスエフ コーティングス ゲゼルシャフト ミット ベシュレンクテル ハフツングBASF Coatings GmbH | 反射防止性を組み入れたoledディスプレイのための封止構造 |
EP3183759B1 (en) * | 2014-08-22 | 2018-09-26 | OLEDWorks GmbH | Light-emitting device |
KR20160053750A (ko) * | 2014-10-29 | 2016-05-13 | 삼성에스디아이 주식회사 | 디스플레이 밀봉재용 조성물, 이를 포함하는 유기보호층, 및 이를 포함하는 디스플레이 장치 |
EP3034548A1 (en) * | 2014-12-18 | 2016-06-22 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Barrier film laminate comprising submicron getter particles and electronic device comprising such a laminate |
EP3234035B1 (en) * | 2014-12-18 | 2021-06-02 | BASF Coatings GmbH | Radiation curable composition comprising hydrophilic nanoparticles |
KR20160093560A (ko) * | 2015-01-29 | 2016-08-08 | 모멘티브퍼포먼스머티리얼스코리아 주식회사 | 유기 전자 소자 봉지재용 조성물 및 이를 이용하여 형성된 봉지재 |
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EP2875070B1 (en) | 2020-09-09 |
MY176545A (en) | 2020-08-16 |
KR102108867B1 (ko) | 2020-05-12 |
US20150179976A1 (en) | 2015-06-25 |
US10559777B2 (en) | 2020-02-11 |
SG11201500374RA (en) | 2015-02-27 |
CN104704035A (zh) | 2015-06-10 |
WO2014012931A1 (en) | 2014-01-23 |
KR20150038183A (ko) | 2015-04-08 |
JP2015524494A (ja) | 2015-08-24 |
JP6270837B2 (ja) | 2018-01-31 |
HK1207874A1 (zh) | 2016-02-12 |
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