CN104584707A - EM-shielding film and method for covering electronic component - Google Patents
EM-shielding film and method for covering electronic component Download PDFInfo
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- CN104584707A CN104584707A CN201380043449.XA CN201380043449A CN104584707A CN 104584707 A CN104584707 A CN 104584707A CN 201380043449 A CN201380043449 A CN 201380043449A CN 104584707 A CN104584707 A CN 104584707A
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- electromagnetic wave
- layer
- wave shielding
- shielding film
- substrate
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/027—Thermal properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/03—3 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
This EM-shielding film is used to cover convexities on a substrate and comprises a base layer and an EM-blocking layer laminated to one surface of said base layer. The base layer is designed so as to exhibit a storage elastic modulus of 2.0*105 to 5.0*108 Pa at 150 DEG C. The present invention provides an EM-shielding film that increases the degree of freedom available when designing a substrate, allows reductions in weight and thickness, and exhibits good shape-following performance with respect to electronic components that have convexities with sizes greater than or equal to 500 [mu]m. The present invention also provides a method wherein said EM-shielding film is used to cover an electronic component.
Description
Technical field
The present invention relates to the covering method of electromagnetic wave shielding film and electronic unit.
Background technology
In the past, be easy to be subject to the exothermicity electronic unit such as electronic unit or semiconductor element of electromagnetic wave influence and the various electronic unit such as capacitor, coil like this or in the electronic equipment that these electronic units is installed on circuit substrate and obtains at portable phone, Medical Devices, in order to alleviate the impact of the noise caused because of electromagnetic wave, attach electromagnetic wave shielding film on its surface.
As such electromagnetic wave shielding film, such as, develop the electromagnetic wave shielding film (for example, referring to patent document 1) of the metal level in the substrate layer having and be made up of Ins. ulative material and one or two face being stacked on substrate layer.
But, as described in patent document 1, which, when electromagnetic wave shielding film has metal level, exist cannot tackle require in recent years to improve constantly lightweight, slimming problem.
Prior art document
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2006-156946 publication
Summary of the invention
Invent problem to be solved
In addition, in the prior art, in addition to the above problems, want with electromagnetic wave shielding film cover there is the electronic unit of the substrate possessing protuberance time, there is this electromagnetic wave shielding film for the bad problem of the product having shape-following-up properties of protuberance.Therefore, for the electronic unit with the substrate possessing protuberance, implement the screen method using the metal can shielding formed by aluminium or SUS.But the screen method of this use metal can shielding, cannot implement respectively to each parts on substrate, but implements for the component set body according to type configured.Therefore, the configuration of each parts on substrate is restricted, and thus the design freedom of substrate is not talkative from function aspects must be optimum.
Therefore, the object of the present invention is to provide a kind of electromagnetic wave shielding film, it can improve the design freedom of substrate, and realizes lightweight, slimming, and for having the electronic unit of the substrate possessing protuberance, has good product having shape-following-up properties.Another object of the present invention is the covering method providing the electronic unit using above-mentioned electromagnetic wave shielding film.
For solving the method for problem
Such object is realized by the present invention described in following (1) ~ (18).
(1) an electromagnetic wave shielding film, is characterized in that:
It is the electromagnetic wave shielding film of the protuberance on covered substrate,
This electromagnetic wave shielding film comprise substrate layer and be stacked on this substrate layer side, a face electromagnetic wave intercepting layer and form,
Storage elastic modelling quantity during 150 DEG C of above-mentioned substrate layer is 2.0E+05 ~ 5.0E+08Pa.
(2) the electromagnetic wave shielding film as described in above-mentioned (1), wherein, storage elastic modelling quantity when 120 of above-mentioned substrate layer DEG C is set to A [Pa], 150 DEG C of above-mentioned substrate layer time storage elastic modelling quantity when being set to B [Pa], meet the relation of 0.02≤A/B≤1.00.
(3) the electromagnetic wave shielding film as described in above-mentioned (1) or (2), wherein, above-mentioned substrate layer is the laminated body of the formation three-decker having ground floor, the second layer and third layer from another side, face successively lamination.
(4) the electromagnetic wave shielding film as described in above-mentioned (3), wherein, average coefficient of linear expansion during 25 ~ 150 DEG C of above-mentioned ground floor is 40 ~ 1000 [ppm/ DEG C].
(5) the electromagnetic wave shielding film as described in above-mentioned (3) or (4), wherein, the thickness T (A) of above-mentioned ground floor is more than 5 μm, less than 100 μm.
(6) the electromagnetic wave shielding film according to any one of above-mentioned (3) ~ (5), wherein, average coefficient of linear expansion during 25 ~ 150 DEG C of above-mentioned third layer is 40 ~ 1000 [ppm/ DEG C].
(7) the electromagnetic wave shielding film according to any one of above-mentioned (3) ~ (6), wherein, the thickness T (B) of above-mentioned third layer is more than 5 μm, less than 100 μm.
(8) the electromagnetic wave shielding film according to any one of above-mentioned (3) ~ (7), wherein, average coefficient of linear expansion during 25 ~ 150 DEG C of the above-mentioned second layer is more than 400 [ppm/ DEG C].
(9) the electromagnetic wave shielding film according to any one of above-mentioned (3) ~ (8), wherein, the thickness T (C) of the above-mentioned second layer is more than 10 μm, less than 100 μm.
(10) the electromagnetic wave shielding film according to any one of above-mentioned (3) ~ (9), wherein, the thickness T (C) of the thickness T (A) of above-mentioned ground floor, the thickness T (B) of above-mentioned third layer and the above-mentioned second layer meets following relational expression (I):
0.05＜T(C)/(T(A)+T(B))＜10 ···(I)。
(11) the electromagnetic wave shielding film according to any one of above-mentioned (1) ~ (10), wherein, storage elastic modelling quantity during 150 DEG C of above-mentioned electromagnetic wave intercepting layer is 1.0E+05 ~ 1.0E+09Pa.
(12) the electromagnetic wave shielding film according to any one of above-mentioned (1) ~ (11), wherein, above-mentioned electromagnetic wave intercepting layer is made up of reflecting layer and absorbed layer, above-mentioned electromagnetic wave intercepting layer be this reflecting layer and this absorbed layer from the side, an above-mentioned face of above-mentioned substrate layer lamination and the laminated body that obtains successively.
(13) the electromagnetic wave shielding film according to any one of above-mentioned (1) ~ (12), wherein, under temperature 150 DEG C, pressure 2MPa, the condition of 5 minutes time, product having shape-following-up properties when this electromagnetic wave shielding film hot pressing being connected to the raised part on aforesaid substrate is more than 500 μm, 3, less than 000 μm.
(14) the electromagnetic wave shielding film according to any one of above-mentioned (1) ~ (13), wherein, also comprises the insulating barrier be stacked between above-mentioned substrate layer and above-mentioned electromagnetic wave intercepting layer.
(15) the electromagnetic wave shielding film as described in above-mentioned (14), wherein, above-mentioned insulating barrier and above-mentioned electromagnetic wave intercepting layer are formed as the laminated body of the lamination successively from the side, an above-mentioned face of above-mentioned substrate layer.
(16) the electromagnetic wave shielding film as described in above-mentioned (14) or (15), wherein, above-mentioned insulating barrier is formed by having thermoplastic insulating resin.
(17) the electromagnetic wave shielding film according to any one of above-mentioned (14) ~ (16), wherein, the thickness T (D) of above-mentioned insulating barrier is more than 3 μm, less than 50 μm.
(18) covering method for electronic unit, is characterized in that, comprising:
Attach operation, the electromagnetic wave shielding film according to any one of above-mentioned (1) ~ (17) is attached at raised part on aforesaid substrate to make the above-mentioned electromagnetic wave intercepting layer mode bonding with electronic unit; With
Stripping process, after above-mentioned attaching operation, peels off above-mentioned substrate layer from above-mentioned electromagnetic wave intercepting layer.
The effect of invention
According to the present invention, storage elastic modelling quantity during 150 DEG C of the substrate layer possessed by making electromagnetic wave shielding film is 2.0E+05 ~ 5.0E+08Pa, can improve the design freedom of the substrate covered by electromagnetic wave shielding film, and realize lightweight, slimming.In addition, for the electronic unit with the substrate possessing protuberance, good product having shape-following-up properties can be played.
Accompanying drawing explanation
Fig. 1 is the profilograph of the first embodiment representing electromagnetic wave shielding film of the present invention.
Fig. 2 is the profilograph for illustration of the method using the electromagnetic wave shielding film overlay electronic parts shown in Fig. 1.
Fig. 3 is the profilograph of the second embodiment representing electromagnetic wave shielding film of the present invention.
Fig. 4 is the profilograph of the 3rd embodiment representing electromagnetic wave shielding film of the present invention.
Fig. 5 is the profilograph of the 4th embodiment representing electromagnetic wave shielding film of the present invention.
Fig. 6 is the profilograph of the 5th embodiment representing electromagnetic wave shielding film of the present invention.
Fig. 7 is the profilograph of the 6th embodiment representing electromagnetic wave shielding film of the present invention.
Fig. 8 is the profilograph for illustration of the method using the electromagnetic wave shielding film overlay electronic parts shown in Fig. 7.
Fig. 9 is the profilograph of the 7th embodiment representing electromagnetic wave shielding film of the present invention.
Figure 10 is the profilograph of the 8th embodiment representing electromagnetic wave shielding film of the present invention.
Figure 11 is the profilograph of the 9th embodiment representing electromagnetic wave shielding film of the present invention.
Figure 12 is the profilograph of the tenth embodiment representing electromagnetic wave shielding film of the present invention.
Figure 13 is the profilograph of the 11 embodiment representing electromagnetic wave shielding film of the present invention.
Figure 14 is the profilograph of the 12 embodiment representing electromagnetic wave shielding film of the present invention.
Detailed description of the invention
Below, the preferred embodiment with reference to the accompanying drawings, describes the covering method of electromagnetic wave shielding film of the present invention and electronic unit in detail.
Electromagnetic wave shielding film of the present invention is the electromagnetic wave shielding film of the protuberance on covered substrate.This electromagnetic wave shielding film comprise substrate layer and be stacked on this substrate layer side, a face electromagnetic wave intercepting layer and form.Storage elastic modelling quantity when the feature of above-mentioned substrate layer is 150 DEG C is 2.0E+05 ~ 5.0E+08Pa.
In addition, the feature of the covering method of electronic unit of the present invention is, comprising: attach operation, be attached on aforesaid substrate by above-mentioned electromagnetic wave shielding film to make the above-mentioned electromagnetic wave intercepting layer mode bonding with the electronic unit as protuberance; And stripping process, after above-mentioned attaching operation, above-mentioned substrate layer is peeled off from above-mentioned electromagnetic wave intercepting layer.
When using the protuberance on such electromagnetic wave shielding film covered substrate, by in above-mentioned attaching operation, the film of heating electromagnetic ripple shielding on one side, while press with electromagnetic wave shielding film and substrate mode close to each other, the base material that substrate layer has product having shape-following-up properties as electromagnetic wave intercepting layer for protuberance thus plays function.Thereby, it is possible to by electromagnetic wave intercepting layer to follow the state press-in recess of lobe shape.Its result, the substrate electromagnetic wave intercepting layer that this can be provided with protuberance reliably covers.Therefore, by this electromagnetic wave intercepting layer, the electromagnetic wave shielding performance being provided with the substrate of protuberance improves.
< electromagnetic wave shielding film >
First, electromagnetic wave shielding film of the present invention is described.
< first embodiment >
Fig. 1 is the profilograph of the first embodiment representing electromagnetic wave shielding film of the present invention.Wherein, in the following description, for convenience of description, the upside in Fig. 1 is called " on ", downside is called D score.
Electromagnetic wave shielding film of the present invention is the electromagnetic wave shielding film for the protuberance 61 on covered substrate 5.
As shown in Figure 1, in the present embodiment, electromagnetic wave shielding film 100 comprises substrate layer 1 and electromagnetic wave intercepting layer 3 and forms.Electromagnetic wave intercepting layer 3 (face) side below substrate layer 1 contacts with substrate layer 1 and lamination.
In addition, substrate layer 1 is made up of ground floor 11, the second layer 13 and third layer 12.They are (another face) side lamination successively above substrate layer 1.
Wherein, under regard to following situation and be described: namely, carry (mounting) electronic unit 4 on the substrate 5, lift-launch due to this electronic unit 4 forms protuberance 61 and on the substrate 5 at protuberance 61 recess 62 each other, by the situation that this protuberance 61 covers with electromagnetic wave shielding film 100.Wherein, as the electronic unit 4 carried on the substrate 5, can enumerate such as: at the upper LCD drive IC of lift-launch of flexible circuit board (FPC), the IC+ capacitor of touch panel periphery or electronic circuit board (mainboard).
< substrate layer 1 >
First, substrate layer 1 is described.
In attaching operation, the electromagnetic wave intercepting layer 3 of electromagnetic wave shielding film 100 is pressed into by recess 62 on the substrate 5, when covering this protuberance 61, electromagnetic wave intercepting layer 3 is pressed into (imbedding), substrate layer 1 as improve this electromagnetic wave intercepting layer 3 for the product having shape-following-up properties of protuberance 61 base material play function.In addition, substrate layer 1, in stripping process, is pressed into the state of recess 62 with electromagnetic wave intercepting layer 3, peel off from electromagnetic wave intercepting layer 3.
In the present invention, storage elastic modelling quantity during 150 DEG C of this substrate layer 1 is 2.0E+05 ~ 5.0E+08Pa.
Like this, by being set in above-mentioned scope as the storage elastic modelling quantity of substrate layer 1 when heating being used for improving the base material of electromagnetic wave intercepting layer 3 for the product having shape-following-up properties of protuberance 61 and playing function, when using the protuberance 61 of electromagnetic wave shielding on film 100 covered substrate 5, electromagnetic wave intercepting layer 3 reliably can be covered with the state corresponding with the shape of protuberance 61.Its result, can reliably cover by electromagnetic wave intercepting layer 3 substrate 5 being provided with this protuberance 61, and therefore, by this electromagnetic wave intercepting layer 3, electromagnetic wave shielding (blocking) property for the substrate 5 being provided with protuberance 61 improves.
In addition, by storage elastic modelling quantity when 150 of substrate layer 1 DEG C is located in above-mentioned scope, even if the height being arranged at the protuberance 61 of substrate 5 is more than 500 μm and then large to 1.0 ~ 3.0mm, raised part 61 distance (spacing) of leaving each other is less than 200 μm and then little of 100 μm ~ 150 μm, also electromagnetic wave intercepting layer 3 reliably can be pressed into recess 62 with the state corresponding with the shape of protuberance 61.
In addition, storage elastic modelling quantity during 150 DEG C of substrate layer 1 is 2.0E+05 ~ 5.0E+08Pa, but is preferably 1.0E+06 ~ 3.0E+08Pa, is more preferably 3.0E+06 ~ 9.0E+07Pa.Thereby, it is possible to play above-mentioned effect more significantly.
In addition, storage elastic modelling quantity during 25 DEG C of substrate layer 1 is preferably 1.0E+07 ~ 1.0E+10Pa, is more preferably 5.0E+08 ~ 5.0E+09Pa.Like this, by by normal temperature (room temperature) time, 25 DEG C time storage elastic modelling quantity be set in above-mentioned scope, can make substrate layer 1 not for liquid and be solid-state before the heating of electromagnetic wave shielding film 100, be semisolid (gel) when the heating of electromagnetic wave shielding film 100.Therefore, when substrate layer 1 (electromagnetic wave shielding film 100) attaches to substrate 5, substrate layer 1 can not produced the ground such as fold and be attached at substrate 5.In addition, workability when electromagnetic wave shielding film 100 being cut into given size also improves.In addition, when being pressed into the recess 62 being arranged at substrate 5, this substrate layer 1 also can be utilized electromagnetic wave intercepting layer 3 to be reliably pressed in recess 62.In addition, in the substrate layer 1 of characteristic with above-mentioned storage elastic modelling quantity, preferably at least ground floor 11 and third layer 12 are made up of thermoplastic resin, even if preferably after attaching the heating of the electromagnetic wave shielding in operation with film 100, storage elastic modelling quantity when these 25 DEG C also maintains in above-mentioned scope.Thus, in stripping process, substrate layer 1 easily can be peeled off from electromagnetic wave intercepting layer 3.
In addition, storage elastic modelling quantity when 120 of substrate layer 1 DEG C is set to A [Pa], 150 DEG C of substrate layer 1 time storage elastic modelling quantity when being set to B [Pa], preferably meet the relation of 0.02≤A/B≤1.00, more preferably meet the relation of 0.02≤A/B≤0.50.The substrate layer 1 meeting above-mentioned relation is when it heats, and the amplitude of the change of the storage elastic modelling quantity of substrate layer 1 caused because of variations in temperature during heating is little.Therefore, even if temperature conditions when changing heating, also the amplitude of the change of the storage elastic modelling quantity of the substrate layer 1 caused by this variations in temperature can be limited in necessary Min..Therefore, it is possible to utilize this substrate layer 1 electromagnetic wave intercepting layer 3 to be more reliably pressed in recess 62.
Wherein, 25 DEG C, 120 DEG C of each layer and 150 DEG C time storage elastic modelling quantity such as use Measurement of Dynamic Viscoelasticity device (Seiko Instruments Inc. system, " DMS6100 ") to obtain.Specifically, with under the condition of 25 ~ 200 DEG C of stretch mode at the constant load of 49mN, programming rate 5 DEG C/min, frequency 1Hz, measure the storage elastic modelling quantity of each layer that will measure.Read storage elastic modelling quantity when 25 DEG C, 120 DEG C of Measurement of Dynamic Viscoelasticity device and 150 DEG C respectively.Thereby, it is possible to try to achieve storage elastic modelling quantity.
In the present embodiment, substrate layer 1 is made up of ground floor 11, the second layer 13 and third layer 12.Substrate layer 1 by these layers above substrate layer 1 (another face) side successively lamination form.In order to play the characteristic of above-mentioned substrate layer 1, can the kind and thickness etc. of these each layers 11 ~ 13 appropriately combined.
Below, respectively these each layers 11 ~ 13 are described.
Ground floor 11 has following function: in attaching operation, such as, when using vacuum pressure type laminating machine etc. that electromagnetic wave intercepting layer 3 is pressed into the recess 62 on substrate 5, makes the press section demoulding that vacuum pressure type laminating machine etc. has.In addition, ground floor 11 has the function of the second layer 13 side applying from the pressing force of press section.
As the constituent material of this ground floor (the first release layer) 11, be not particularly limited, can enumerate such as: the resin material etc. of syndiotactic polytyrene, polymethylpentene, polybutylene terephthalate (PBT), polypropylene, cyclic olefin polymer, organosilicon and so on.Among these, preferably use syndiotactic polytyrene.Like this, by using the polystyrene with syndiotactic structure as polystyrene, polystyrene possesses crystallinity.Thereby, it is possible to make ground floor 11 become excellent with the release property of device and heat resistance and product having shape-following-up properties.
When ground floor 11 uses above-mentioned syndiotactic polytyrene, its content is not particularly limited, and is preferably more than 60 % by weight, is more preferably more than 70 % by weight, less than 95 % by weight, more preferably more than 80 % by weight, less than 90 % by weight.When the content of syndiotactic polytyrene is lower than above-mentioned lower limit, the release property of ground floor 11 likely reduces.In addition, when the content of syndiotactic polytyrene exceedes above-mentioned higher limit, the product having shape-following-up properties of ground floor 11 likely reduces.
In addition, ground floor 11 also can be only made up of syndiotactic polytyrene.In addition, ground floor 11, except containing except above-mentioned syndiotactic polytyrene, can also contain styrenic elastomer, polyethylene or polypropylene etc.
The thickness T (A) of ground floor 11 is not particularly limited, and is preferably more than 5 μm, less than 100 μm, is more preferably more than 10 μm, less than 70 μm, more preferably more than 20 μm, less than 50 μm.When the thickness of ground floor 11 is lower than above-mentioned lower limit, ground floor 11 may break, and its release property reduces.In addition, when the thickness of ground floor 11 exceedes above-mentioned higher limit, the product having shape-following-up properties of substrate layer 1 may reduce, and the product having shape-following-up properties of electromagnetic wave intercepting layer 3 reduces.
In addition, average coefficient of linear expansion during 25 ~ 150 DEG C of ground floor 11 is preferably 40 ~ 1000 [ppm/ DEG C], is more preferably 80 ~ 700 [ppm/ DEG C].By being set in above-mentioned scope by the average coefficient of linear expansion of ground floor 11, when the heating of electromagnetic wave shielding with film 100, ground floor 11 has excellent retractility.Therefore, it is possible to more reliably improve the product having shape-following-up properties of electromagnetic wave intercepting layer 3 for protuberance 61.
Wherein, the average coefficient of linear expansion of each layer such as can use thermo-mechanical analysis device (Seiko Instruments Inc. system, " TMASS6100 ") to obtain.Specifically, with under the condition of 25 ~ 200 DEG C of stretch mode at the constant load of 49mN, programming rate 5 DEG C/min, measure the storage elastic modelling quantity of each layer that will measure.Read average coefficient of linear expansion during 25 DEG C ~ 150 DEG C of thermo-mechanical analysis device now respectively.Thereby, it is possible to obtain average coefficient of linear expansion.
In addition, the surface tension of ground floor 11 is preferably 20 ~ 40 [mN/m], is more preferably 25 ~ 35 [mN/m].The capillary ground floor 11 had in above-mentioned scope possesses excellent release property.In addition, after the press-in technique using vacuum pressure type laminating machine etc. to carry out, ground floor 11 can be made to peel off from press section.
Third layer 12 has following function: in attaching operation, after using the press-in of the enforcement electromagnetic wave intercepting layer 3 such as vacuum pressure type laminating machine for the recess 62 on substrate 5, in stripping process, when being peeled off from electromagnetic wave intercepting layer 3 by substrate layer 1, give substrate layer 1 with fissility.In addition, third layer 12 shape had corresponding to the protuberance 61 on substrate 5 carries out the function of the tracing ability of following, and has both the function applying from the pressing force of press section to electromagnetic wave intercepting layer 3 side.
As the constituent material of this third layer (the second release layer) 12, be not particularly limited, can enumerate such as: the resin material of syndiotactic polytyrene, polymethylpentene, polybutylene terephthalate (PBT), polypropylene, cyclic olefin polymer, organosilicon and so on.Among these, preferably use syndiotactic polytyrene.By using the polystyrene with syndiotactic structure as polystyrene like this, polystyrene has crystallinity.Thereby, it is possible to make third layer 12 become excellent with the release property of electromagnetic wave intercepting layer 3 and heat resistance and product having shape-following-up properties.
The content of the above-mentioned syndiotactic polytyrene in third layer 12 is not particularly limited, also can only be made up of syndiotactic polytyrene, be preferably more than 60 % by weight, be more preferably more than 70 % by weight, less than 95 % by weight, more preferably more than 80 % by weight, less than 90 % by weight.When the content of syndiotactic polytyrene is lower than above-mentioned lower limit, the release property of third layer 12 likely reduces.In addition, when the content of syndiotactic polytyrene exceedes above-mentioned higher limit, the product having shape-following-up properties of third layer 12 likely reduces.
In addition, third layer 12, except containing except above-mentioned syndiotactic polytyrene, can also contain styrenic elastomer, polyethylene or polypropylene etc.In addition, the resin forming third layer 12 and above-mentioned ground floor 11 both can be the same or different.
The thickness T (B) of third layer 12 is not particularly limited, and is preferably more than 5 μm, less than 100 μm, is more preferably more than 10 μm, less than 70 μm, more preferably more than 20 μm, less than 50 μm.When the thickness of third layer 12 is lower than above-mentioned lower limit, likely cause heat resistance to reduce, in thermo-compressed operation, the heat resistance of substrate layer reduces, and deforms, and electromagnetic wave intercepting layer is out of shape.In addition, when the thickness of third layer 12 exceedes above-mentioned higher limit, the gross thickness of electromagnetic wave shielding film entirety is thickening, and the workability of cutting etc. may be caused to reduce.And cost aspect is also uneconomical.
Further, the thickness of third layer 12 and ground floor 11 both can be the same or different.
In addition, average coefficient of linear expansion during 25 ~ 150 DEG C of third layer 12 is preferably 40 ~ 1000 [ppm/ DEG C], is more preferably 80 ~ 700 [ppm/ DEG C].By being set in above-mentioned scope by the average coefficient of linear expansion of third layer 12, when the heating of electromagnetic wave shielding with film 100, third layer 12 has excellent retractility.Therefore, it is possible to improve third layer 12 and then electromagnetic wave intercepting layer 3 product having shape-following-up properties for protuberance 61 more reliably.
In addition, the surface tension of third layer 12 is preferably 20 ~ 40 [mN/m], is more preferably 25 ~ 35 [mN/m].The capillary third layer 12 had in above-mentioned scope possesses excellent release property.In addition, after the press-in technique using vacuum pressure type laminating machine etc. to carry out, when substrate layer 1 is peeled off from electromagnetic wave intercepting layer 3, at the interface of third layer 12 with electromagnetic wave intercepting layer 3, substrate layer 1 reliably can be peeled off.
The second layer 13 has following pooling feature: when using substrate layer 1 to be pressed into electromagnetic wave intercepting layer 3 as the base material be pressed into the recess 62 on substrate 5 in attaching operation, in recess 62, be pressed into (imbedding) third layer 12.In addition, the second layer 13 also has the function this pressing-in force being applied to equably third layer 12 and then being applied to electromagnetic wave intercepting layer 3 via this third layer 12 equably.Thus, do not produce space between electromagnetic wave intercepting layer 3 and recess 62 and protuberance 61, with the seal of excellence, electromagnetic wave intercepting layer 3 can be pressed into recess 62.
As the constituent material of this second layer (cushion) 13, can enumerate such as: the alpha-olefines polymer of polyethylene, polypropylene etc., have the engineering plastics resinoid as the alpha-olefines copolymer, polyether sulfone, polyphenylene sulfide etc. of copolymer composition such as ethene, propylene, butylene, amylene, hexene, methylpentene, they can be used alone or and with multiple.Among them, preferably use alpha-olefines copolymer.Specifically, the copolymer of the copolymer of alpha-olefin with (methyl) acrylate of ethene etc., ethene and vinyl acetate, ethene and (methyl) acrylic acid copolymer (EMMA) and their part ion cross-linking agent etc. can be enumerated.The product having shape-following-up properties of alpha-olefines copolymer is excellent, and compared with the constituent material of third layer 12, flexibility is excellent.Thereby, it is possible to reliably give the pooling feature for third layer 12 being pressed into (imbedding) recess 62 to the second layer 13 be made up of such constituent material.
The thickness T (C) of the second layer 13 is not particularly limited, and is preferably more than 10 μm, less than 100 μm, is more preferably more than 20 μm, less than 80 μm, more preferably more than 30 μm, less than 60 μm.When the thickness of the second layer 13 is less than above-mentioned lower limit, the product having shape-following-up properties of the second layer 13 may reduce, and reduces in thermo-compressed operation to the tracing ability of protuberance 61.In addition, when the thickness of the second layer 13 exceedes above-mentioned higher limit, in thermo-compressed operation, may cause oozing out from the resin of the second layer 13 increasing, it is attached to the heat dish of compression bonding apparatus, and workability reduces.
In addition, average coefficient of linear expansion during 25 ~ 150 DEG C of the second layer 13 is preferably more than 400 [ppm/ DEG C], is more preferably more than 800 [ppm/ DEG C].By being set in above-mentioned scope by the average coefficient of linear expansion of the second layer 13, when the heating of electromagnetic wave shielding with film 100, the second layer 13 easily has the retractility more excellent than third layer 12.Therefore, it is possible to reliably improve the second layer 13 and then electromagnetic wave intercepting layer 3 for concavo-convex 6 product having shape-following-up properties.
In addition, by the average coefficient of linear expansion of each layer 11 ~ 13 is suitably set in above-mentioned scope respectively, can easily storage elastic modelling quantity when 150 of substrate layer 1 DEG C be set in the scope of 2.0E+05 ~ 5.0E+08Pa.
In addition, the thickness T (C) of the thickness T (A) of ground floor 11, the thickness T (B) of third layer 12 and the second layer 13 such as preferably meets following relational expression:
0.05＜T(C)/(T(A)+T(B))＜10，
More preferably following relational expression is met:
0.14＜T(C)/(T(A)+T(B))＜4，
Preferably meet following relational expression further:
0.3＜T(C)/(T(A)+T(B))＜1.5。
Because the thickness T (C) of the thickness T (A) of ground floor 11, the thickness T (B) of third layer 12 and the second layer 13 meets above-mentioned relation formula, product having shape-following-up properties improves further.
The thickness T (F) of substrate layer 1 entirety is not particularly limited, and is preferably more than 20 μm, less than 300 μm, is more preferably more than 40 μm, less than 220 μm, more preferably more than 70 μm, less than 160 μm.When the thickness of substrate layer 1 entirety is less than above-mentioned lower limit, ground floor 11 may be caused to break, the release property of substrate layer 1 reduces.In addition, when the thickness of substrate layer 1 entirety exceedes above-mentioned higher limit, the product having shape-following-up properties of substrate layer 1 may be caused to reduce, the product having shape-following-up properties of electromagnetic wave intercepting layer 3 reduces.
< electromagnetic wave intercepting layer 3 >
Then, electromagnetic wave intercepting layer (intercepting layer) 3 is described.
Electromagnetic wave intercepting layer 3 has blocking (shielding) from the electronic unit 4 (protuberance 61) be arranged at substrate 5 be arranged in the electromagnetic function produced with at least one of other electronic units of substrate 5 (electronic unit 4) opposition side etc. across this electromagnetic wave intercepting layer 3.
This electromagnetic wave intercepting layer 3 is not particularly limited, can be interdict electromagnetic layer with any form, can enumerate such as: carry out interdicting the reflecting layer of (covering) by making the reflection of electromagnetic wave inciding electromagnetic wave intercepting layer 3 and carry out interdicting the absorbed layer of (covering) by being absorbed into the electromagnetic wave being mapped to electromagnetic wave intercepting layer 3.
Below, reflecting layer and absorbed layer are described respectively.
As mentioned above, reflecting layer is reflection of electromagnetic wave by making to incide reflecting layer and carries out the layer that interdicts.
As this reflecting layer, can enumerate such as: conductive adhesive layer, metal film layer, wire netting, implement the surface-treated layer etc. of the conductive materials such as ITO.They can be used alone or and use.Among them, preferably use conductive adhesive layer.Even if conductive adhesive layer is set as thinner thickness (thickness), also can play excellent electromagnetic wave shielding performance, therefore preferably to use as reflecting layer.
As above-mentioned conductive adhesive layer, form containing metal powder and adhesive resin.Metal powder can enumerate such as gold, silver, copper or silver-colored copper-clad, nickel etc.Among them, from the reason of excellent electromagnetic wave shielding performance, preferably use silver.
The ratio that contains of the metal powder in above-mentioned conductive adhesive layer and adhesive resin is not particularly limited, and with mass ratio range, is preferably 40:60 ~ 90:10, is more preferably 50:50 ~ 80:20, more preferably 55:45 ~ 70:30.When metal powder and adhesive resin containing ratio lower than above-mentioned lower limit, be likely difficult to show electric conductivity.In addition, when metal powder and adhesive resin exceed above-mentioned higher limit containing ratio, flexibility may be caused or reduce with the adaptation of electronic equipment part.
Above-mentioned conductive adhesive layer, except containing except above-mentioned metal powder and adhesive resin, can also contain fire retardant, levelling agent, viscosity modifier etc.
The thickness T (E1) in reflecting layer is not particularly limited, and is preferably more than 5 μm, less than 100 μm, is more preferably more than 8 μm, less than 50 μm, more preferably more than 10 μm, less than 30 μm.When the thickness in reflecting layer is less than above-mentioned lower limit, according to the constituent material etc. in reflecting layer, resistance to edge-rolling may be caused to reduce, and boarded parts is in broken end.When the thickness in reflecting layer exceedes above-mentioned higher limit, according to the constituent material etc. in reflecting layer, product having shape-following-up properties is likely caused to reduce.In addition, when being set in above-mentioned scope by the thickness T (E1) in reflecting layer, excellent electromagnetic wave shielding performance can be played.Therefore, it is possible to realize the filming of the thickness T (E1) in reflecting layer, and the lightweight of the substrate 5 being equipped with electronic unit 4 covered by electromagnetic wave intercepting layer (reflecting layer) 3 can be realized.
As mentioned above, absorbed layer is mapped to the electromagnetic wave of absorbed layer by being absorbed into, and electromagnetic energy is converted to heat energy to interdict electromagnetic wave.
As this absorbed layer, can enumerate such as: the conduction absorbed layer formed using the conduction absorbing material of metal powder and conductive polymer material etc. as main material, the DIELECTRIC ABSORPTION layer formed using the DIELECTRIC ABSORPTION material of carbon class material and conductive polymer material etc. as main material, the magnetic absorbed layer etc. formed using the magnetic absorbing material of soft magnetic metal etc. as main material, they can be used alone or and use.
Wherein, converting electromagnetic energy to heat energy at the electric current of material internal flowing when conduction absorbed layer applies electric field by utilizing, carrying out electromagnetic wave absorption thus.Electromagnetic power conversion is become heat energy by utilizing dielectric loss by DIELECTRIC ABSORPTION layer, carrys out electromagnetic wave absorption thus.The power conversion of electric wave, by utilizing the magnetic losses such as overcurrent loss, magnetic hystersis loss, magnetic resonance, is become heat and consumes electromagnetic wave absorption by magnetic absorbed layer.
Among them, preferably use DIELECTRIC ABSORPTION layer, conduction absorbed layer.Even if DIELECTRIC ABSORPTION layer and conduction absorbed layer are set as thinner thickness (thickness), electromagnetic wave shielding performance excellent especially also can be played.Therefore, preferably use as absorbed layer.In addition, little and its addition of the particle diameter due to material contained in this layer also can reduce, so relatively easily its thickness can be set as thinner thickness, can also realize lightweight.
In addition, as conduction absorbing material, can enumerate such as: the metal oxide of electroconductive polymer, ATO etc., conductive ceramic.
In addition, as electroconductive polymer, can enumerate such as: polyacetylene, polypyrrole, PEDOT (poly-ethyldioxythiophene, poly-ethylenedioxythiophene), PEDOT/PSS, polythiophene, polyaniline, poly-(to phenylene), polyfluorene, polycarbazole, polysilane or their derivative etc., in them a kind or combinationally use two or more can be used.
As DIELECTRIC ABSORPTION material, carbon class material, electroconductive polymer etc. can be enumerated.
In addition, as carbon class material, can enumerate such as: the carbon etc. of the CNT of single-layer carbon nano-tube, multilayer carbon nanotube and so on, carbon nano-fiber, CN nanotube, CN nanofiber, BCN nanotube, BCN nanofiber, Graphene or the micro-coil of carbon, carbon nanocoil, carbon nanohorn, carbon nm wall and so on, in them a kind or combinationally use two or more can be used.
In addition, as magnetic absorbing material, can enumerate such as: the soft magnetic metal, ferrite etc. of iron, silicon steel, magnetic stainless steel (Fe-Cr-Al-Si alloy), Sen Dasite AL-Si-Fe alloy (Fe-Si-Al alloy), permalloy (Fe-Ni alloy/C), copper silicon (Fe-Cu-Si alloy), Fe-Si alloy, Fe-Si-B (-Cu-Nb) alloy and so on.
The thickness T (E2) of absorbed layer is not particularly limited, and is preferably more than 1 μm, less than 100 μm, is more preferably more than 2 μm, less than 80 μm, more preferably more than 3 μm, less than 50 μm.When the thickness of absorbed layer is lower than above-mentioned lower limit, according to the constituent material etc. of absorbed layer, substrate boarded parts may be caused in broken end.In addition, when the thickness of absorbed layer exceedes above-mentioned higher limit, according to the constituent material etc. of absorbed layer, product having shape-following-up properties may be caused to reduce.In addition, when being set in above-mentioned scope by the thickness T (E2) of absorbed layer, excellent electromagnetic wave shielding performance can be played.Therefore, it is possible to realize the filming of the thickness T (E2) of absorbed layer, and the lightweight of the substrate 5 being equipped with electronic unit 4 covered by electromagnetic wave intercepting layer (absorbed layer) 3 can be realized.
Electromagnetic wave intercepting layer 3 is as above interdicted (shielding) electromagnetic electromagnetic wave shielding performance and is preferably more than 5dB, is more preferably more than 30dB, more preferably more than 50dB.The electromagnetic wave intercepting layer 3 with such electromagnetic wave shielding performance has excellent electromagnetic wave shielding performance, more reliably can interdict electromagnetic wave.
In addition, storage elastic modelling quantity during 150 DEG C of electromagnetic wave intercepting layer 3 is preferably 1.0E+05 ~ 1.0E+09Pa, is more preferably 5.0E+05 ~ 5.0E+08Pa.By above-mentioned storage elastic modelling quantity is set in above-mentioned scope, in attaching operation, after the heating of electromagnetic wave shielding with film 100, by the pressing force from substrate layer 1, electromagnetic wave intercepting layer 3 is pressed into the recess 62 on substrate 5, thus, when covering this protuberance 61, can, according to the pressing force from above-mentioned substrate layer 1, electromagnetic wave intercepting layer 3 be out of shape accordingly with the shape of protuberance 61.That is, the product having shape-following-up properties of electromagnetic wave intercepting layer 3 relative to protuberance 61 can be improved.
In addition, as mentioned above, electromagnetic wave intercepting layer 3 can be any one of reflecting layer and absorbed layer, but when they have roughly the same electromagnetic wave shielding performance, is preferably absorbed layer.In absorbed layer, being absorbed into the electromagnetic wave being mapped to absorbed layer, interdicting electromagnetic wave by converting electromagnetism wave energy to heat energy.Therefore, electromagnetic wave disappears due to this absorption, so can reliably prevent the electromagnetic wave reflected as reflecting layer from the miscellaneous part do not covered by electromagnetic wave intercepting layer 3 etc. is carried out to the harmful effect of misoperation etc.
With temperature 150 DEG C, pressure 2MPa, the condition of 5 minutes time, when electromagnetic wave shielding film 100 hot pressing formed as above being connected to recess 62, the protuberance 61 formed by carrying electronic unit 4 on the substrate 5, the product having shape-following-up properties of electromagnetic wave shielding film 100 is preferably more than 500 μm, be more preferably more than 800 μm, more preferably more than 1000 μm.Namely, preferably can with electromagnetic wave shielding film 100 cover protuberance 61 above with the difference of the bottom surface of recess 62, namely, be highly the protuberance 61 of more than 500 μm, more preferably can the protuberance 61 of cover height more than 800 μm, further preferably can the protuberance 61 of cover height more than 1000 μm.Like this, the electromagnetic wave shielding film 100 of the high protuberance 61 (difference of height is large) of cover height excellent product having shape-following-up properties can be had.In addition, utilize electromagnetic wave intercepting layer 3, protuberance 61 can be covered for recess 62 with the rate of imbedding of excellence.
Wherein, above-mentioned product having shape-following-up properties can be obtained as follows.
That is, first, on the printing distributing board (motherboard) of long 100mm × wide 100mm × high 2mm, with 0.2mm interval with the groove of the difference of height of chessboard trellis formation width 0.2mm, regulation, printed wiring board is obtained thus.Then, use vacuum pressure type laminating machine, with the condition of 150 DEG C × 2MPa × 5 minute, electromagnetic wave shielding mould is connected to printing distributing board and is attached at printing distributing board.After attaching, substrate layer is peeled off from electromagnetic wave shielding film.Then, judge to be attached between the groove on the intercepting layer of printing distributing board and printing distributing board whether have space.Wherein, space whether is had to utilize Microscope or microscopic examination to evaluate.
The covering method > of < electronic unit
Then, the covering method of electronic unit of the present invention is described.
The feature of the covering method of electronic unit of the present invention is, comprising: attach operation, be attached on aforesaid substrate by above-mentioned electromagnetic wave shielding film in the mode that above-mentioned electromagnetic wave intercepting layer is bonding with electronic unit; And stripping process, after above-mentioned attaching operation, above-mentioned substrate layer is peeled off from above-mentioned electromagnetic wave intercepting layer.
Fig. 2 is the profilograph for illustration of the method using the electromagnetic wave shielding film overlay electronic parts shown in Fig. 1.
Below, each operation of the covering method of electronic unit is described successively.
(attaching operation)
Above-mentioned attaching operation refers to, such as, as shown in Fig. 2 (a), electromagnetic wave shielding film 100 is attached at the operation on substrate 5 in the mode covering the protuberance 61 be arranged on substrate 5.
As the method attached, be not particularly limited, the empty method of forming of such as Vacuum Pressure can be enumerated.
The empty method of forming of Vacuum Pressure refers to, such as, use vacuum pressure type laminating machine, by the method for the protuberance 61 on electromagnetic wave shielding film 100 covered substrate 5.First, can be set as in the confined space of vacuum atmosphere, in the mode that the face being formed with the side of protuberance 61 of substrate 5 is relative with the face of electromagnetic wave intercepting layer 3 side of electromagnetic wave shielding film 100, the state that substrate 5 overlaps with electromagnetic wave shielding film 100 is arranged.Then, by them under heating, under making above-mentioned confined space be in vacuum atmosphere, to make electromagnetic wave shielding film 100 from electromagnetic wave shielding film 100 side equably close to substrate 5.Then, to they pressurizations.Thus, the empty method of forming of Vacuum Pressure is implemented.
Now, in the present invention, storage elastic modelling quantity during 150 DEG C of substrate layer 1 is 2.0E+05 ~ 2.0E+08Pa.Therefore, substrate layer 1, when the heating of the empty method of forming of Vacuum Pressure, plays the product having shape-following-up properties for protuberance 61 excellence.
Therefore, in this condition, pressurize equably from electromagnetic wave shielding film 100 side to electromagnetic wave shielding film 100, while under making above-mentioned confined space be in vacuum atmosphere, substrate layer 1 corresponds to the shape of protuberance 61 and deforms thus.Further, together with this distortion, be positioned at and more deform corresponding to the shape of protuberance 61 by the electromagnetic wave intercepting layer 3 of substrate 5 side than substrate layer 1.Thus, under the state that electromagnetic wave intercepting layer 3 is pressed into recess 62 with corresponding to the shape of protuberance 61, protuberance 61 is covered by electromagnetic wave intercepting layer 3.
In such attaching operation, the temperature of attaching is not particularly limited, and is preferably more than 100 DEG C, less than 200 DEG C, is more preferably more than 120 DEG C, less than 180 DEG C.
In addition, the pressure of attaching is not particularly limited, and is preferably more than 0.5MPa, below 5.0MPa, is more preferably more than 1.0MPa, below 3.0MPa.
In addition, the time of attaching is not particularly limited, and is preferably more than 1 minute, less than 30 minutes, is more preferably more than 5 minutes, less than 15 minutes.
By being set in above-mentioned scope by the condition attaching operation, electromagnetic wave intercepting layer 3 to be pressed into the state of the recess 62 on substrate 5, reliably protuberance 61 can be covered by this electromagnetic wave intercepting layer 3.
(stripping process)
Above-mentioned stripping process refers to, such as, as shown in Fig. 2 (b), after above-mentioned attaching operation, by the operation that substrate layer 1 is peeled off from electromagnetic wave shielding film 100.
By this stripping process, in the present embodiment, be peeling with the interface of electromagnetic wave intercepting layer 3 at the substrate layer 1 of electromagnetic wave shielding film 100, its result, substrate layer 1 is peeled off from electromagnetic wave intercepting layer 3.Thus, to have peeled off the state of substrate layer 1 from electromagnetic wave intercepting layer 3, protuberance 61 has been covered by electromagnetic wave intercepting layer 3.
In addition, use such electromagnetic wave shielding film 100 utilize electromagnetic wave intercepting layer 3 to cover protuberance 61 time, as shown in Figure 2, the shape of the electromagnetic wave shielding film 100 attached can be corresponded to, cover protuberance 61 by electromagnetic wave intercepting layer 3.Therefore, suitably set the shape of electromagnetic wave shielding film 100 accordingly by the shape with the protuberance 61 that will cover, optionally can cover the protuberance 61 that will cover by electromagnetic wave intercepting layer 3.That is, electromagnetic wave intercepting layer 3 can be utilized to carry out the optionally electromagnetic wave shielding of protuberance 61.
In addition, as the method for stripping group sheet material layers 1, be not particularly limited, because the empty method of forming of Vacuum Pressure terminates the electromagnetic wave shielding film 100 after (above-mentioned attaching operation) under the state of high temperature, substrate layer 1 extends, and occurs resin residue etc., there is the possibility that overburden operation reduces, therefore, the stripping utilizing manual operation to carry out can be enumerated.
When the stripping that this utilizes manual operation to carry out, such as, an end of substrate layer 1 is first held.Then, using the end that this is held as starting point, substrate layer 1 is taken off from electromagnetic wave intercepting layer 3.Then, by substrate layer 1 from this end towards the central portion of substrate layer 1 and then another end towards substrate layer 1, take off from electromagnetic wave intercepting layer 3 successively.By such operation, substrate layer 1 is stripped from electromagnetic wave intercepting layer 3.
The temperature peeled off is preferably less than 180 DEG C, is more preferably less than 150 DEG C, more preferably less than 100 DEG C.
By through operation such above, to have peeled off the state of substrate layer 1 from electromagnetic wave intercepting layer 3, protuberance 61 can be covered by electromagnetic wave intercepting layer 3.
Wherein, in the present embodiment, as shown in Figure 1, for the electromagnetic wave shielding film 100 using lamination successively to have substrate layer 1 (ground floor 11, the second layer 13, third layer 12), electromagnetic wave intercepting layer 3, be described with the situation of the protuberance 61 on electromagnetic wave intercepting layer 3 covered substrate 5.But the Rotating fields of electromagnetic wave shielding film 100 is not limited to such situation, such as, also can be the electromagnetic wave shielding film 100 being formed as the such Rotating fields of the second ~ the 12 embodiment like that as follows.
< second embodiment >
Below, the second embodiment of electromagnetic wave shielding film of the present invention is described.
Fig. 3 is the profilograph of the second embodiment representing electromagnetic wave shielding film of the present invention.Wherein, in the following description, for convenience of description, the upside in Fig. 3 is called " on ", downside is called D score.
Below, the electromagnetic wave shielding film 100 shown in Fig. 3 is described, but by with the difference of the electromagnetic wave shielding film 100 shown in Fig. 1 centered by be described, for same item, the description thereof will be omitted.
At the electromagnetic wave shielding shown in Fig. 3 with in film 100, except omitting the formation of the ground floor 11 that substrate layer 1 possesses, identical with the electromagnetic wave shielding film 100 shown in Fig. 1.
That is, in the present embodiment, electromagnetic wave shielding film 100 is formed as the laminated body of the substrate layer 1 and electromagnetic wave intercepting layer 3 successively lamination be made up of the second layer 13 and third layer 12.
At the electromagnetic wave shielding formed like this with in film 100, in attaching operation, the press section that the vacuum pressure type laminating machine etc. used when electromagnetic wave intercepting layer 3 being pressed into the recess 62 on substrate 5 has, possesses the release property with the second layer 13, thus, the formation of ground floor 11 can be omitted.
Now, the degree of the release property of the contact surface contacted with the second layer 13 of above-mentioned press section can represent by the surface tension of above-mentioned contact surface.The surface tension of above-mentioned contact surface is preferably 20 ~ 40mN/m, is more preferably 25 ~ 35mN/m.Because above-mentioned contact surface has the surface tension in such scope, after the press-in technique using vacuum pressure type laminating machine etc., press section can be made reliably to peel off from the second layer 13.
The electromagnetic wave shielding film 100 of the present embodiment of such formation also can use in the same manner as the electromagnetic wave shielding film 100 of above-mentioned first embodiment, obtains the effect same with the electromagnetic wave shielding film 100 of above-mentioned first embodiment.
< the 3rd embodiment >
Then, the 3rd embodiment of electromagnetic wave shielding film of the present invention is described.
Fig. 4 is the profilograph of the 3rd embodiment representing electromagnetic wave shielding film of the present invention.Wherein, in the following description, for convenience of description, the upside in Fig. 4 is called " on ", downside is called D score.
Below, the film 100 of the electromagnetic wave shielding shown in key diagram 4, but by with the difference of the electromagnetic wave shielding film 100 shown in Fig. 1 centered by be described, for same item, the description thereof will be omitted.
At the electromagnetic wave shielding shown in Fig. 4 with in film 100, except omitting the formation of the third layer 12 that substrate layer 1 possesses, identical with the electromagnetic wave shielding film 100 shown in Fig. 1.
That is, in the present embodiment, electromagnetic wave shielding film 100 is formed as the laminated body of the substrate layer 1 and electromagnetic wave intercepting layer 3 successively lamination be made up of ground floor 11 and the second layer 13.
At the electromagnetic wave shielding formed like this with in film 100, in stripping process, when substrate layer 1 is peeled off from electromagnetic wave intercepting layer 3, peel off from electromagnetic wave intercepting layer 3 at the interface substrate layer 1 of the second layer 13 with electromagnetic wave intercepting layer 3.In such stripping, electromagnetic wave intercepting layer 3 possesses the release property with the second layer 13, thus, omits the formation of third layer 12.
Now, the degree of the release property of the contact surface contacted with the second layer 13 of electromagnetic wave intercepting layer 3 can represent by the surface tension of above-mentioned contact surface.The surface tension of above-mentioned contact surface is preferably 20 ~ 40mN/m, is more preferably 25 ~ 35mN/m.Because above-mentioned contact surface has the surface tension in such scope, after the press-in technique using vacuum pressure type laminating machine etc., the second layer 13 reliably can be peeled off from electromagnetic wave intercepting layer 3.
As having so capillary electromagnetic wave intercepting layer 3, can enumerate such as: make electroconductive polymer or carbon class material dispersion and the resin etc. that obtains in the such thermosetting resin of polyurethane.
The electromagnetic wave shielding film 100 of the present embodiment of such formation also can use in the same manner as the electromagnetic wave shielding film 100 of above-mentioned first embodiment, obtains the effect same with the electromagnetic wave shielding film 100 of above-mentioned first embodiment.
< the 4th embodiment >
Then, the 4th embodiment of electromagnetic wave shielding film of the present invention is described.
Fig. 5 is the profilograph of the 4th embodiment representing electromagnetic wave shielding film of the present invention.Wherein, in the following description, for convenience of description, the upside in Fig. 5 is called " on ", downside is called D score.
Below, the film 100 of the electromagnetic wave shielding shown in key diagram 5, but by with the difference of the electromagnetic wave shielding film 100 shown in Fig. 1 centered by be described, for same item, the description thereof will be omitted.
At the electromagnetic wave shielding shown in Fig. 5 with in film 100, electromagnetic wave intercepting layer 3 is not single layer structure, but form the laminated body be made up of absorbed layer 31 and reflecting layer 32, they below substrate layer 1 (face) side with said sequence lamination, absorbed layer 31 contacts with substrate layer 1 (third layer 12), in addition, identical with the electromagnetic wave shielding film 100 shown in Fig. 1.
That is, in the present embodiment, electromagnetic wave shielding film 100 is formed as the laminated body of the substrate layer 1 and intercepting layer 3 be made up of absorbed layer 31, reflecting layer 32 successively lamination be made up of ground floor 11, the second layer 13, third layer 12.By using the protuberance 61 possessed on electromagnetic wave shielding film 100 covered substrate 5 of intercepting layer 3 be made up of such laminated body, absorbed layer 31 be configured in the side contrary with protuberance 61 in reflecting layer 32, reflecting layer 32 be configured in the state of the side contacted with protuberance 61, cover protuberance 61 by electromagnetic wave intercepting layer 3.Like this, in the present embodiment, because intercepting layer 3 is made up of the laminated body comprising absorbed layer 31 and reflecting layer 32, so the electromagnetic wave shielding performance of electromagnetic wave intercepting layer 3 can be improved further.
In addition, in the electromagnetic wave intercepting layer 3 formed like this, storage elastic modelling quantity during 150 DEG C of absorbed layer 31 is preferably 1.0E+05 ~ 1.0E+09Pa, is more preferably 5.0E+05 ~ 5.0E+08Pa.
Further, storage elastic modelling quantity during 150 DEG C of reflecting layer 32 is preferably 1.0E+05 ~ 1.0E+09Pa, is more preferably 5.0E+05 ~ 5.0E+08Pa.
By being set in above-mentioned scope respectively with the storage elastic modelling quantity of the absorbed layer 31 of said sequence lamination and reflecting layer 32, can according to the pressing force from above-mentioned substrate layer 1, the shape making the electromagnetic wave intercepting layer 3 possessing absorbed layer 31 and reflecting layer 32 correspond to protuberance 61 is more reliably out of shape.
The electromagnetic wave shielding film 100 of the present embodiment of such formation also can use in the same manner as the electromagnetic wave shielding film 100 of above-mentioned first embodiment, obtains the effect same with the electromagnetic wave shielding film 100 of above-mentioned first embodiment.
< the 5th embodiment >
Then, the 5th embodiment of electromagnetic wave shielding film of the present invention is described.
Fig. 6 is the profilograph of the 5th embodiment representing electromagnetic wave shielding film of the present invention.Wherein, in the following description, for convenience of description, the upside in Fig. 6 is called " on ", downside is called D score.
Below, the film 100 of the electromagnetic wave shielding shown in key diagram 6, but by with the difference of the electromagnetic wave shielding film 100 shown in Fig. 1 centered by be described, for same item, the description thereof will be omitted.
At the electromagnetic wave shielding shown in Fig. 6 with in film 100, electromagnetic wave intercepting layer 3 is not single layer structure, but form the laminated body be made up of reflecting layer 32 and absorbed layer 31, they below substrate layer 1 (face) side according to said sequence lamination, reflecting layer 32 contacts with substrate layer 1 (third layer 12), in addition, identical with the electromagnetic wave shielding film 100 shown in Fig. 1.
That is, in the present embodiment, electromagnetic wave shielding film 100 is formed as the laminated body of the substrate layer 1 and intercepting layer 3 be made up of reflecting layer 32, absorbed layer 31 successively lamination be made up of ground floor 11, the second layer 13, third layer 12.By using the protuberance 61 possessed on electromagnetic wave shielding film 100 covered substrate 5 of intercepting layer 3 be made up of such laminated body, reflecting layer 32 be configured in the side contrary with protuberance 61 of absorbed layer 31, absorbed layer 31 be configured in the state of the side contacted with protuberance 61, cover protuberance 61 by electromagnetic wave intercepting layer 3.Like this, in the present embodiment, intercepting layer 3 is made up of the laminated body comprising reflecting layer 32 and absorbed layer 31, therefore, it is possible to improve the electromagnetic wave shielding performance of electromagnetic wave intercepting layer 3 further.
In addition, in the intercepting layer 3 formed like this, storage elastic modelling quantity during 150 DEG C of reflecting layer 32 is preferably 1.0E+05 ~ 1.0E+09Pa, is more preferably 5.0E+05 ~ 5.0E+08Pa.
In addition, storage elastic modelling quantity during 150 DEG C of absorbed layer 31 is preferably 1.0E+05 ~ 1.0E+09Pa, is more preferably 5.0E+05 ~ 5.0E+08Pa.
Owing to being set in above-mentioned scope respectively with the storage elastic modelling quantity in the reflecting layer 32 of said sequence lamination and absorbed layer 31, can according to the pressing force from above-mentioned substrate layer 1, the shape making the intercepting layer 3 possessing reflecting layer 32 and absorbed layer 31 correspond to protuberance 61 is more reliably out of shape.
The electromagnetic wave shielding film 100 of the present embodiment of such formation also can use in the same manner as the electromagnetic wave shielding film 100 of above-mentioned first embodiment, obtains the effect same with the electromagnetic wave shielding film 100 of above-mentioned first embodiment.
In addition, in the electromagnetic wave shielding film 100 of above-mentioned 4th embodiment and the electromagnetic wave shielding film 100 of above-mentioned 5th embodiment, except the reflecting layer 32 had except intercepting layer 3 is different with the laminated layer sequence of absorbed layer 31, mutually the same.As mentioned above, absorbed layer 31 be absorbed into be mapped to absorbed layer 31 electromagnetic wave to interdict electromagnetic wave, therefore by this absorption, electromagnetic wave is disappeared.It can thus be appreciated that, the electromagnetic wave shielding film 100 of the 4th embodiment have can reliably prevent reflecting layer 32 reflect electromagnetic wave for not brought dysgenic advantage by the miscellaneous part etc. that intercepting layer 3 covers.Therefore, at the electromagnetic wave shielding of these the 4th and the 5th embodiments with in film 100, that preferably absorbed layer 31 is configured in reflecting layer 32 with electromagnetic wave shielding film 100 that is the 4th embodiment of protuberance 61 opposite side.
In addition, in the electromagnetic wave shielding film 100 of above-mentioned 4th embodiment and the electromagnetic wave shielding film 100 of above-mentioned 5th embodiment, intercepting layer 3 is the laminated body of 2 Rotating fields possessing reflecting layer 32 and each 1 layer of absorbed layer 31 respectively.But intercepting layer 3 is not limited to the laminated body of 2 such Rotating fields, also can be made up of at least either party laminated body possessing more than 2 layers more than 3 layers of reflecting layer 32 and absorbed layer 31.
< the 6th embodiment >
Then, the 6th embodiment of electromagnetic wave shielding film of the present invention is described.
Fig. 7 is the profilograph of the 6th embodiment representing electromagnetic wave shielding film of the present invention.Wherein, in the following description, for convenience of description, the upside in Fig. 7 is called " on ", downside is called D score.
Below, the film 100 of the electromagnetic wave shielding shown in key diagram 7, but by with the difference of the electromagnetic wave shielding film 100 shown in Fig. 1 centered by be described, for same item, the description thereof will be omitted.
At the electromagnetic wave shielding shown in Fig. 7 with in film 100, except being formed except insulating barrier 2 between substrate layer 1 and electromagnetic wave intercepting layer 3, identical with the electromagnetic wave shielding film 100 shown in Fig. 1.
That is, as shown in Figure 7, in the present embodiment, electromagnetic wave shielding film 100 comprises substrate layer 1, insulating barrier 2 and electromagnetic wave intercepting layer 3 and forms.Insulating barrier 2 and electromagnetic wave intercepting layer 3 be (face) side lamination successively below substrate layer 1, and insulating barrier 2 contacts with substrate layer 1.
< substrate layer 1 >
First, the difference with the substrate layer 1 of the electromagnetic wave shielding film 100 shown in Fig. 1 is described.
Wherein, storage elastic modelling quantity during 150 DEG C of substrate layer 1 is 2.0E+05 ~ 2.0E+08Pa, but is preferably 1.0E+06 ~ 1.0E+08Pa, is more preferably 3.0E+06 ~ 6.0E+07Pa.Thereby, it is possible to play above-mentioned effect more significantly.
In addition, average coefficient of linear expansion during 25 ~ 150 DEG C of ground floor 11 is preferably 50 ~ 1000 [ppm/ DEG C], is more preferably 100 ~ 700 [ppm/ DEG C].By being set in above-mentioned scope by the average coefficient of linear expansion of ground floor 11, when the heating of electromagnetic wave shielding with film 100, ground floor 11 has excellent retractility.Therefore, it is possible to reliably improve electromagnetic wave intercepting layer 3 and insulating barrier 2 product having shape-following-up properties for protuberance 61 further.
In addition, average coefficient of linear expansion during 25 ~ 150 DEG C of third layer 12 is preferably 50 ~ 1000 [ppm/ DEG C], is more preferably 100 ~ 700 [ppm/ DEG C].By the average coefficient of linear expansion of third layer 12 is set in above-mentioned scope, when the heating of electromagnetic wave shielding with film 100, third layer 12 has excellent retractility, therefore, it is possible to reliably improve third layer 12 and then electromagnetic wave intercepting layer 3 and insulating barrier 2 product having shape-following-up properties for protuberance 61 further.
In addition, average coefficient of linear expansion during 25 ~ 150 DEG C of the second layer 13 is preferably more than 500 [ppm/ DEG C], is more preferably more than 1000 [ppm/ DEG C].By being set in above-mentioned scope by the average coefficient of linear expansion of the second layer 13, when the heating of electromagnetic wave shielding with film 100, the second layer 13 more easily has excellent retractility compared with third layer 12.Therefore, it is possible to reliably improve the second layer 13 and then electromagnetic wave intercepting layer 3 and insulating barrier 2 product having shape-following-up properties for protuberance 61 further.
In addition, by the average coefficient of linear expansion of each layer 11 ~ 13 is suitably set in above-mentioned scope respectively, can easily storage elastic modelling quantity when 150 of substrate layer 1 DEG C be set in the scope of 2.0E+05 ~ 2.0E+08Pa.
< insulating barrier 2 >
Then, insulating barrier 2 is described.
Insulating barrier 2 contacts with substrate layer 1 (third layer 12) in the present embodiment and arranges.Insulating barrier 2, electromagnetic wave intercepting layer 3 is had from substrate layer 1 side successively lamination.By using the protuberance 61 possessed on the insulating barrier 2 of such lamination and electromagnetic wave shielding film 100 covered substrate 5 of electromagnetic wave intercepting layer 3, electromagnetic wave intercepting layer 3 contacts with electronic unit 4 with substrate 5, from substrate 5 side with the order overlay electronic parts 4 of electromagnetic wave intercepting layer 3, insulating barrier 2.
Like this, in the present embodiment, insulating barrier 2 is across electromagnetic wave intercepting layer 3 covered substrate 5 and electronic unit 4.Thus, by insulating barrier 2, substrate 5, electronic unit 4 and electromagnetic wave intercepting layer 3 and the miscellaneous part (electronic unit etc.) being positioned at substrate 5 opposition side are insulated.
As this insulating barrier 2, can enumerate and such as there is heat cured insulating resin or there is thermoplastic insulating resin (dielectric film).Among these, preferably use and there is thermoplastic insulating resin.There is the film that thermoplastic insulating resin is flexibility excellence.Thus, in attaching operation, use substrate layer 1 as the base material be pressed into recess 62, when being pressed into insulating barrier 2 and electromagnetic wave intercepting layer 3 for the recess 62 on substrate 5, the shape that insulating barrier 2 can be made to correspond to protuberance 61 is reliably followed.In addition, there is thermoplastic insulating resin when being heated to its softening point temperature, can peel off again from the substrate of adhering object, therefore particularly useful when the repairing of substrate.
As having thermoplastic insulating resin, can enumerate such as: thermoplastic polyester, alpha-olefin, vinyl acetate, Pioloform, polyvinyl acetal, ethylene vinyl acetate, vinyl chloride, acrylic acid, polyamide, cellulose.Among these, from the adaptation of substrate, the reason such as flexibility, resistance to chemical reagents is excellent, preferably use thermoplastic polyester, alpha-olefin.
In addition, have in thermoplastic insulating resin, in the scope not damaging the performance such as heat resistance and flexible resistance, phenolic resinoid, silicone based resin, urea air aldehyde resin, acrylic resin, polyester resin, polyamide-based resin, polyimide based resin etc. can be contained.In addition, have in thermoplastic insulating resin, also can in the same manner as the situation of conductive adhesive layer described later, in the scope not making cementability, reflux-resisting welded property reduce, add silane coupler, antioxidant, pigment, dyestuff, bonding imparting resin, plasticizer, ultra-violet absorber, defoamer, levelling conditioning agent, filler, fire retardant etc.
The thickness T (D) of insulating barrier 2 is not particularly limited, and is preferably more than 3 μm, less than 50 μm, is more preferably more than 4 μm, less than 30 μm, more preferably more than 5 μm, less than 20 μm.When the thickness of insulating barrier 2 is lower than above-mentioned lower limit, resistance to edge-rolling reduces, and may produce crack after protuberance 61 thermo-compressed at bend.In addition, film-strength reduces, and is difficult to the effect of the insulating properties supporter born as conductive adhesive layer.When exceeding above-mentioned higher limit, product having shape-following-up properties likely reduces.That is, by being set in above-mentioned scope by the thickness T (D) of insulating barrier 2, the flexibility more excellent of insulating barrier 2 can be made.In addition, in attaching operation, use substrate layer 1 as the base material be pressed into recess 62, when being pressed into insulating barrier 2 and electromagnetic wave intercepting layer 3 for the recess 62 on substrate 5, the shape that insulating barrier 2 can be made to correspond to protuberance 61 is more reliably followed.
In addition, average coefficient of linear expansion during 25 ~ 150 DEG C of insulating barrier 2 is preferably 50 ~ 1000 [ppm/ DEG C], is more preferably 100 ~ 700 [ppm/ DEG C].By being set in above-mentioned scope by the average coefficient of linear expansion of insulating barrier 2, when the heating of electromagnetic wave shielding with film 100, insulating barrier 2 has excellent retractility.Therefore, it is possible to improve insulating barrier 2 and then electromagnetic wave intercepting layer 3 product having shape-following-up properties for protuberance 61 more reliably.
In addition, this insulating barrier 2, except forming by 1 layer as shown in Figure 7,8, can also be the laminated body of more than 2 layers making layer laminate different in above-mentioned dielectric film and obtain.
The electromagnetic wave shielding film 100 of the present embodiment of such formation also can use equally with the electromagnetic wave shielding film 100 of above-mentioned first embodiment, obtains the effect same with the electromagnetic wave shielding film 100 of above-mentioned first embodiment.
< the 7th embodiment >
Below, the 7th embodiment of electromagnetic wave shielding film of the present invention is described.
Fig. 9 is the profilograph of the 7th embodiment representing electromagnetic wave shielding film of the present invention.Wherein, in the following description, for convenience of description, the upside in Fig. 9 is called " on ", downside is called D score.
Below, the film 100 of the electromagnetic wave shielding shown in key diagram 9, but by with the difference of the electromagnetic wave shielding film 100 shown in Fig. 3 centered by be described, for same item, the description thereof will be omitted.
At the electromagnetic wave shielding shown in Fig. 9 with in film 100, except being formed except insulating barrier between substrate layer 1 and electromagnetic wave intercepting layer 3, identical with the electromagnetic wave shielding film 100 shown in Fig. 3.
That is, in the present embodiment, electromagnetic wave shielding film 100 substrate layer 1, the laminated body with insulating barrier 2, electromagnetic wave intercepting layer 3 successively lamination that are formed as being made up of the second layer 13 and third layer 12.Wherein, insulating barrier 2 is identical with the insulating barrier 2 of the 6th embodiment, and therefore the description thereof will be omitted.
The electromagnetic wave shielding film 100 of the present embodiment of such formation also can use in the same manner as the electromagnetic wave shielding film 100 of above-mentioned second embodiment, obtains the effect same with the electromagnetic wave shielding film 100 of above-mentioned second embodiment.In addition, because the electromagnetic wave shielding film 100 of present embodiment has insulating barrier 2, so can use in the same manner as the electromagnetic wave shielding film 100 of above-mentioned 6th embodiment, obtain the effect same with the electromagnetic wave shielding film 100 of above-mentioned 6th embodiment.
< the 8th embodiment >
Then, the 8th embodiment of electromagnetic wave shielding film of the present invention is described.
Figure 10 is the profilograph of the 8th embodiment representing electromagnetic wave shielding film of the present invention.Wherein, in the following description, for convenience of description, the upside in Figure 10 is called " on ", downside is called D score.
Below, the electromagnetic wave shielding film 100 shown in Figure 10 is described, but by with the difference of the electromagnetic wave shielding film 100 shown in Fig. 4 centered by be described, for same item, the description thereof will be omitted.
At the electromagnetic wave shielding shown in Figure 10 with in film 100, except being formed except insulating barrier 2 between substrate layer 1 and electromagnetic wave intercepting layer 3, identical with the electromagnetic wave shielding film 100 shown in Fig. 4.
That is, in the present embodiment, electromagnetic wave shielding film 100 is formed as the laminated body of the substrate layer 1, insulating barrier 2 and the electromagnetic wave intercepting layer 3 that are made up of ground floor 11 and the second layer 13 lamination successively.Wherein, insulating barrier 2 is identical with the insulating barrier 2 of the 6th embodiment, and therefore the description thereof will be omitted.
The electromagnetic wave shielding film 100 of the present embodiment of such formation also can use in the same manner as the electromagnetic wave shielding film 100 of above-mentioned first embodiment, obtains the effect same with the electromagnetic wave shielding film 100 of above-mentioned first embodiment.In addition, because the electromagnetic wave shielding film 100 of present embodiment has insulating barrier 2, so can use in the same manner as the electromagnetic wave shielding film 100 of above-mentioned 6th embodiment, obtain the effect same with the electromagnetic wave shielding film 100 of above-mentioned 6th embodiment.
< the 9th embodiment >
Then, the 9th embodiment of electromagnetic wave shielding film of the present invention is described.
Figure 11 is the profilograph of the 9th embodiment representing electromagnetic wave shielding film of the present invention.Wherein, in the following description, for convenience of description, the upside in Figure 11 is called " on ", downside is called D score.
Below, the electromagnetic wave shielding film 100 shown in Figure 11 is described, but by with the difference of the electromagnetic wave shielding film 100 shown in Fig. 7 centered by be described, for same item, the description thereof will be omitted.
At the electromagnetic wave shielding shown in Figure 11 with in film 100, omit the formation of the third layer 12 that substrate layer 1 possesses, and, the laminated layer sequence reversion of insulating barrier 2 and electromagnetic wave intercepting layer 3, in addition, same with the electromagnetic wave shielding film 100 shown in Fig. 7.
That is, in the present embodiment, electromagnetic wave shielding film 100 is formed as the laminated body of the substrate layer 1, electromagnetic wave intercepting layer 3 and the insulating barrier 2 that are made up of ground floor 11 and the second layer 13 lamination successively.
At the electromagnetic wave shielding formed like this with in film 100, in stripping process, when being peeled off from electromagnetic wave intercepting layer 3 by substrate layer 1, substrate layer 1 is peeled off from electromagnetic wave intercepting layer 3 at the interface of the second layer 13 with electromagnetic wave intercepting layer 3.In such stripping, electromagnetic wave intercepting layer 3 possesses the release property with the second layer 13, thus omits the formation of third layer 12.
Now, the degree of the release property of the contact surface contacted with the second layer 13 of electromagnetic wave intercepting layer 3 can be represented by the surface tension of above-mentioned contact surface.The surface tension of above-mentioned contact surface is preferably 20 ~ 40mN/m, is more preferably 25 ~ 35mN/m.Because above-mentioned contact surface has the surface tension in above-mentioned scope, after the press-in technique using vacuum pressure type laminating machine etc., the second layer 13 reliably can be peeled off from electromagnetic wave intercepting layer 3.
As having so capillary electromagnetic wave intercepting layer 3, can enumerate and such as make carbon class material or electroconductive polymer disperse in the thermosetting resin of polyurethane etc. and the resin etc. obtained.
The electromagnetic wave shielding film 100 of the present embodiment of such formation also can use in the same manner as the electromagnetic wave shielding film 100 of above-mentioned 6th embodiment, obtains the effect same with the electromagnetic wave shielding film 100 of above-mentioned 6th embodiment.
< the tenth embodiment >
Then, the tenth embodiment of electromagnetic wave shielding film of the present invention is described.
Figure 12 is the profilograph of the tenth embodiment representing electromagnetic wave shielding film of the present invention.Wherein, in the following description, for convenience of description, the upside in Figure 12 is called " on ", downside is called D score.
Below, the electromagnetic wave shielding film 100 shown in Figure 12 is described, but by with the difference of the electromagnetic wave shielding film 100 shown in Fig. 7 centered by be described, for same item, the description thereof will be omitted.
At the electromagnetic wave shielding shown in Figure 12 with in film 100, except the laminated layer sequence reversion of insulating barrier 2 and electromagnetic wave intercepting layer 3, identical with the electromagnetic wave shielding film 100 shown in Fig. 7.
That is, in the present embodiment, electromagnetic wave shielding film 100 is formed as the laminated body of the substrate layer 1, insulating barrier 2 and the electromagnetic wave intercepting layer 3 that are made up of ground floor 11, the second layer 13 and third layer 12 lamination successively.By using the protuberance 61 possessed on electromagnetic wave shielding film 100 covered substrate 5 of electromagnetic wave intercepting layer 3 and insulating barrier 2 of such lamination, insulating barrier 2 contacts with electronic unit 4 with substrate 5, from substrate 5 side with the order overlay electronic parts 4 of insulating barrier 2, electromagnetic wave intercepting layer 3.
Like this, in the present embodiment, insulating barrier 2 by substrate 5 with electronic unit 4 with the state coverage contacted with them.Thus, by insulating barrier 2, substrate 5 and electronic unit 4 are insulated with the electromagnetic wave intercepting layer 3 and miscellaneous part (electronic unit etc.) being positioned at substrate 5 opposition side.
Therefore, at the electromagnetic wave shielding formed like this with in film 100, such as, even if electromagnetic wave intercepting layer 3 is containing conductive material, also by insulating barrier 2, adjacent electronic unit 4 reliably can be insulated each other.
The electromagnetic wave shielding film 100 of the present embodiment of such formation also can use in the same manner as the electromagnetic wave shielding film 100 of above-mentioned 6th embodiment, obtains the effect same with the electromagnetic wave shielding film 100 of above-mentioned 6th embodiment.
< the 11 embodiment >
Then, the 11 embodiment of electromagnetic wave shielding film of the present invention is described.
Figure 13 is the profilograph of the 11 embodiment representing electromagnetic wave shielding film of the present invention.Wherein, in the following description, for convenience of description, the upside in Figure 13 is called " on ", downside is called D score.
Below, the electromagnetic wave shielding film 100 shown in Figure 13 is described, but by with the difference of the electromagnetic wave shielding film 100 shown in Fig. 5 centered by be described, for same item, the description thereof will be omitted.
At the electromagnetic wave shielding shown in Figure 13 with in film 100, except being formed except insulating barrier 2 between electromagnetic wave intercepting layer 3 and substrate layer 1, identical with the electromagnetic wave shielding film 100 shown in Fig. 5.
That is, in the present embodiment, the laminated body of electromagnetic wave shielding film 100 substrate layer 1, insulating barrier 2 and the electromagnetic wave intercepting layer 3 that is made up of absorbed layer 31, reflecting layer 32 that are formed as being made up of ground floor 11, the second layer 13 and third layer 12 lamination successively.Wherein, insulating barrier 2 is identical with the insulating barrier 2 of the 6th embodiment, and therefore the description thereof will be omitted.
The electromagnetic wave shielding film 100 of the present embodiment of such formation also can use in the same manner as the electromagnetic wave shielding film 100 of above-mentioned 4th embodiment, obtains the effect same with the electromagnetic wave shielding film 100 of above-mentioned 4th embodiment.In addition, because the electromagnetic wave shielding film 100 of present embodiment has insulating barrier 2, so can use in the same manner as the electromagnetic wave shielding film 100 of above-mentioned 6th embodiment, obtain the effect same with the electromagnetic wave shielding film 100 of above-mentioned 6th embodiment.
< the 12 embodiment >
Then, the 12 embodiment of electromagnetic wave shielding film of the present invention is described.
Figure 14 is the profilograph of the 12 embodiment representing electromagnetic wave shielding film of the present invention.Wherein, in the following description, for convenience of description, the upside in Figure 14 is called " on ", downside is called D score.
Below, the electromagnetic wave shielding film 100 shown in Figure 14 is described, but by with the difference of the electromagnetic wave shielding film 100 shown in Fig. 6 centered by be described, for same item, the description thereof will be omitted.
At the electromagnetic wave shielding shown in Figure 14 with in film 100, except being formed except insulating barrier 2 between electromagnetic wave intercepting layer 3 and substrate layer 1, identical with the electromagnetic wave shielding film 100 shown in Fig. 6.
That is, in the present embodiment, the laminated body of electromagnetic wave shielding film 100 substrate layer 1, insulating barrier 2 and the electromagnetic wave intercepting layer 3 that is made up of reflecting layer 32, absorbed layer 31 that are formed as being made up of ground floor 11, the second layer 13 and third layer 12 lamination successively.Wherein, insulating barrier 2 is identical with the insulating barrier 2 of the 6th embodiment, and therefore the description thereof will be omitted.
The electromagnetic wave shielding film 100 of the present embodiment of such formation also can use in the same manner as the electromagnetic wave shielding film 100 of above-mentioned first embodiment, obtains the effect same with the electromagnetic wave shielding film 100 of above-mentioned first embodiment.In addition, because the electromagnetic wave shielding film 100 of present embodiment has insulating barrier 2, so can use in the same manner as the electromagnetic wave shielding film 100 of above-mentioned 6th embodiment, obtain the effect same with the electromagnetic wave shielding film 100 of above-mentioned 6th embodiment.
In addition, in the electromagnetic wave shielding film 100 of above-mentioned 11 embodiment and the electromagnetic wave shielding film 100 of above-mentioned 12 embodiment, except the reflecting layer 32 had except electromagnetic wave intercepting layer 3 is different with the laminated layer sequence of absorbed layer 31, all identical each other.As mentioned above, absorbed layer 31 interdicts electromagnetic wave by being absorbed into the electromagnetic wave being mapped to absorbed layer 31, therefore by this absorption, electromagnetic wave is disappeared.It can thus be appreciated that, the electromagnetic wave shielding film 100 of the 11 embodiment have can reliably prevent reflecting layer 32 reflect electromagnetic wave for not brought dysgenic advantage by the miscellaneous part etc. that electromagnetic wave intercepting layer 3 covers.Therefore, at the electromagnetic wave shielding of these the 11 and the 12 embodiments with in film 100, that preferably absorbed layer 31 is arranged on reflecting layer 32 with electromagnetic wave shielding film 100 that is the 11 embodiment of protuberance 61 opposition side.
In addition, in the electromagnetic wave shielding film 100 of above-mentioned 11 embodiment and the electromagnetic wave shielding film 100 of above-mentioned 12 embodiment, electromagnetic wave intercepting layer 3 is the laminated body that reflecting layer 32 and absorbed layer 31 respectively have 2 Rotating fields of 1 layer respectively.But electromagnetic wave intercepting layer 3 is not limited to the laminated body of 2 such Rotating fields, also can be made up of at least either party laminated body possessing more than 2 layers more than 3 layers of reflecting layer 32 and absorbed layer 31.
In addition, in the above-described embodiment, to describe on electromagnetic wave intercepting layer 3 or below the situation of either party lamination 1 insulating barrier 2, but be not limited to such situation, also can the above and below both sides of electromagnetic wave intercepting layer 3 as other layer of each lamination 1 layer insulating 2.
Above, describe the covering method of electromagnetic wave shielding film of the present invention and electronic unit, but the present invention is not limited to these.
Such as, in electromagnetic wave shielding film of the present invention, also can combine the arbitrary formation of above-mentioned first ~ the 12 embodiment.
In addition, the arbitrary layer that can play said function can also be added in electromagnetic wave shielding film of the present invention.
In addition, the arbitrary operation of more than 1 or 2 can also be added in the covering method of electronic unit of the present invention.
Embodiment
Below, explain the present invention based on embodiment, but the present invention is not limited to this.
1. about the research that the layer of electromagnetic wave shielding film is formed
(embodiment 1A)
The manufacture > of < electromagnetic wave shielding film
In order to obtain electromagnetic wave shielding film, prepare syndiotactic polytyrene (Idemitsu Kosen Co., Ltd.'s system, trade name: XAREC S107) as the resin forming ground floor (the first release layer).As the resin forming third layer (the second release layer), prepare syndiotactic polytyrene (Idemitsu Kosen Co., Ltd.'s system, trade name: XAREC S107).As the resin forming the second layer (cushion), prepare ethylene-methyl acrylate copolymer (Sumitomo Chemical Co's system, trade name: ACRYFT WD106).As the resin forming electromagnetic wave intercepting layer, prepare conductive adhesive layer (Co., Ltd.'s system is spun by Japan, trade name: DW-260H-1).
Use feed block and branch manifold mould, by coextrusion, the above-mentioned syndiotactic polytyrene as ground floor, the above-mentioned syndiotactic polytyrene as third layer and the above-mentioned ethylene-methyl acrylate copolymer as the second layer are carried out membranization.Above-mentioned conductive adhesive layer as electromagnetic wave intercepting layer is coated substrate layer, makes electromagnetic wave shielding film.
The thickness of the entirety of the electromagnetic wave shielding film of embodiment 1A is 140 μm, and the thickness of ground floor is 30 μm, and the thickness of third layer is 30 μm, and the thickness of the second layer is 60 μm, and the thickness of electromagnetic wave intercepting layer is 20 μm.
In addition, measure the average coefficient of linear expansion of ground floor, the second layer and the third layer in the electromagnetic wave shielding film of embodiment 1A, result is respectively 420,2400 and 420ppm/ DEG C.
In addition, measure storage elastic modelling quantity during substrate layer and electromagnetic wave intercepting layer 150 DEG C, result is respectively 1.8E+07Pa, 1.2E+07Pa.
The manufacture > of < electronic unit
By obtained electromagnetic wave shielding film under the condition of temperature 150 degree, pressure 2.0MPa, computer memory substrate (Samsung Electronics Co., Ltd.'s system is attached at by the empty method of forming of Vacuum Pressure with 5 minutes, trade name: DDR2 667 M470T6554EZ3-CE6 PC2-5300) surface of (difference of height 1,000 μm).After attaching, by manual work, only substrate layer is peeled off from electromagnetic wave intercepting layer, manufacture electronic unit.
(embodiment 2A)
Except being set to except 80 μm by the thickness of ground floor, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1A.
(embodiment 3A)
Except being set to except 10 μm by the thickness of ground floor, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1A.
(embodiment 4A)
Except being set to except 90 μm by the thickness of the second layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1A.
(embodiment 5A)
Except being set to except 20 μm by the thickness of the second layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1A.
(embodiment 6A)
Except being set to except 10 μm by the thickness of third layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1A.
(embodiment 7A)
Except being set to except 90 μm by the thickness of third layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1A.
(embodiment 8A)
Except being set to except 5 μm by the thickness of electromagnetic wave intercepting layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1A.
(embodiment 9A)
Except being set to except 150 μm by the thickness of electromagnetic wave intercepting layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1A.
(embodiment 10A)
As ground floor, prepare syndiotactic polytyrene (Idemitsu Kosen Co., Ltd.'s system, trade name: XAREC S107) and styrene-ethylene-butylene-styrene block copolymer (KURARAY Co., Ltd. system, trade name: SEPTON S8007) do not coordinate the cooperation product of 60wt%, 40wt% with weight percent concentration score, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1A.
(embodiment 11A)
As ground floor, prepare syndiotactic polytyrene (Idemitsu Kosen Co., Ltd.'s system, trade name: XAREC S107) and styrene-ethylene-butylene-styrene block copolymer (KURARAY Co., Ltd. system, trade name: SEPTON S8007) do not coordinate the cooperation product of 80wt%, 20wt% with weight percent concentration score, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1A.
(embodiment 12A)
As ground floor, prepare polymethylpentene (Mitsui Chemicals, Inc's system, trade name: TPX MX004), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1A.
(embodiment 13A)
As ground floor, prepare polybutylene terephthalate (PBT) (Mitsubishi engineering Plastics Co., Ltd's system, trade name: Novaduran 5505S), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1A.
(embodiment 14A)
As the second layer, prepare ethylene-methyl acrylate copolymer (Sumitomo Chemical Co's system, trade name: ACRYFT WD106) and polypropylene (Sumitomo Chemical Co's system, trade name: Nobrene FS2011DG2) do not coordinate the cooperation product of 70wt%, 30wt% with weight percent concentration score, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1A.
(embodiment 15A)
As the second layer, prepare ethylene-methyl acrylate copolymer (Sumitomo Chemical Co's system, trade name: ACRYFT WD106) and polyethylene (Ube Industries, Ltd's system, trade name: UBE polyethylene F222NH) do not coordinate the cooperation product of 70wt%, 30wt% with weight percent concentration score, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1A.
(embodiment 16A)
As the second layer, prepare ethylene-methyl acrylate copolymer (Sumitomo Chemical Co's system, trade name: ACRYFT WD106), polyethylene (Ube Industries, Ltd's system, trade name: UBE polyethylene F222NH) and polypropylene (Sumitomo Chemical Co's system, trade name: Nobrene FS2011DG2) do not coordinate the cooperation product of 60wt%, 20wt%, 20wt% with weight percent concentration score, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1A.
(embodiment 17A)
Except being set to except 5 μm by the thickness of ground floor, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1A.
(embodiment 18A)
Except being set to except 120 μm by the thickness of the second layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1A.
(embodiment 19A)
Except being set to except 3 μm by the thickness of third layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1A.
(embodiment 20A)
Except the thickness of the second layer being set to 80 μm, being set to except 10 μm by the thickness of ground floor, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1A.
(embodiment 21A)
Except the thickness of ground floor being set to 5 μm, the thickness of the second layer being set to 80 μm, being set to except 5 μm by the thickness of third layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1A.
(embodiment 22A)
Omit the formation of ground floor, electromagnetic wave intercepting layer uses electroconductive polymer dispersing polyaniline liquid (Regulus Inc. PANI-PD), in addition, manufactures electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1A.
(embodiment 23A)
Except omitting the formation of third layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1A.
(comparative example 1A)
As substrate layer, only prepare PETG (Toray Co., Ltd. system, trade name: Lumirror S10), the thickness of substrate layer is set to 30 μm, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1A.
(comparative example 2A)
As substrate layer, only prepare PETG (Toray Co., Ltd. system, trade name: Lumirror S10), the thickness of substrate layer is set to 100 μm, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1A.
< evaluation test >
For the electromagnetic wave shielding film made in embodiment 1A ~ 23A and comparative example 1A, 2A or electronic unit, carry out the evaluation of cutting-stamping-out workability of the second layer exudative, heat resistance, electromagnetic wave shielding of product having shape-following-up properties, release property, resistance to edge-rolling, substrate layer.Below, these evaluation methods are described.
<< product having shape-following-up properties >>
Above-mentioned product having shape-following-up properties can operate to obtain as follows.
At the printing distributing board (motherboard) of long 100mm × wide 100mm × high 3mm with 0.2mm interval, the groove of difference of height (degree of depth) forming wide 0.2mm, regulation chessboard trellis.Then, use the empty shaped device of Vacuum Pressure, make electromagnetic wave shielding mould be connected to printing distributing board with 150 DEG C × 1MPa × 10 minute, make it be attached at printing distributing board.After attaching, substrate layer is peeled off from electromagnetic wave intercepting layer.Then, judge to be attached between the groove on the electromagnetic wave intercepting layer of printing distributing board and printing distributing board whether have space.Wherein, space whether is had to utilize Microscope or microscopic examination to evaluate.
Each symbol is as follows.× for defective, the situation beyond it is qualified.
×: difference of height is less than 500 μm.
Zero: difference of height is more than 500 μm, is less than 1000 μm.
◎: difference of height is more than 1000 μm, is less than 2000 μm.
◎ ◎: difference of height is more than 2000 μm.
<< release property >>
Above-mentioned release property can operate to obtain as follows.
Thermo-compressed electromagnetic wave shielding film on the printing distributing board identical with the evaluation method of above-mentioned product having shape-following-up properties.Then, utilize manual work only by substrate layer from electromagnetic wave intercepting layer peel off, with now peel off easness to evaluate.
Each symbol is as follows.× for defective, the situation beyond it is qualified.
×: remain resin at substrate layer.
Zero: there is no resin residue at substrate layer, but the stripping of substrate layer is slightly serious.
◎: at substrate layer not cull, can easily stripping group sheet material layers.
The << >> of resistance to edge-rolling
Above-mentioned resistance to edge-rolling can operate to obtain as follows.
Electromagnetic wave shielding film is fitted in have flexibility substrate, such as, flexible circuit board etc.The plate of laminating is carried out crimping, utilizes its crooked position of microscopic examination.Wherein, bending hand carries out, and bends and is only 1 time.
Each symbol is as follows.× for defective, the situation beyond it is qualified.
×: bend produces crack.
Zero: bend exists some folds.
◎: bend does not produce crack.
The exudative >> of the << second layer
The second layer of above-mentioned substrate layer is exudative can be operated to obtain as follows.
Substrate layer is carried out hot pressing with 150 DEG C × 2.0MPa × 5 minute.The ultimate range of the end of the constituent material distance second layer of the second layer oozed out is measured with slide measure etc.
Each symbol is as follows.× for defective, the situation beyond it is qualified.
×: ultimate range is more than 1.0mm.
Zero: ultimate range is more than 0.5mm, is less than 1.0mm.
◎: ultimate range is less than 0.5mm.
<< heat resistance >>
The heat resistance of above-mentioned substrate layer can operate to obtain as follows.
In the same manner as the evaluation method of above-mentioned product having shape-following-up properties, use the empty shaped device of Vacuum Pressure, with 150 DEG C × 2MPa × 5 minute, electromagnetic wave shielding mould is connected to printing distributing board, and is attached at printing distributing board.After attaching, substrate layer is peeled off from electromagnetic wave intercepting layer.Then, whether the electromagnetic wave intercepting layer that visual observations is attached at printing distributing board has fold.
Each symbol is as follows.× for defective, the situation beyond it is qualified.
×: electromagnetic wave intercepting layer creates fold.
Zero: electromagnetic wave intercepting layer creates fine fold.
◎: electromagnetic wave intercepting layer does not produce fold.
<< cutting-stamping-out workability >>
Cutting-stamping-out the workability of above-mentioned electromagnetic wave shielding can operate to obtain as follows.
During the size and dimension becoming to specify by electromagnetic wave shielding film cutting, stamping-out, need a large amount of process number, whether obviously reduce by workability and judge.
Each symbol is as follows.× for defective, the situation beyond it is qualified.
×: workability obviously reduces.
Zero: workability is in a slight decrease.
◎: workability is no problem.
Above each embodiment, the evaluation result of comparative example represent in Table 1.
[table 1]
As known from Table 1, the electromagnetic wave shielding film of embodiment 1A ~ 23A shows good product having shape-following-up properties, and the second layer about release property, resistance to edge-rolling, substrate layer is exudative, the cutting of electromagnetic wave shielding-stamping-out workability also balances good and excellent.In contrast, the electromagnetic wave shielding film of comparative example 1A, 2A is compared with the electromagnetic wave shielding film of embodiment 1A ~ 23A, result is that product having shape-following-up properties is insufficient.
2. about the storage springform quantifier elimination of substrate layer
(embodiment 1B)
The manufacture > of < electromagnetic wave shielding film
In order to obtain electromagnetic wave shielding film, as the resin forming ground floor (the first release layer), prepare syndiotactic polytyrene (Idemitsu Kosen Co., Ltd.'s system, trade name: XAREC S107).As the resin forming third layer (the second release layer), prepare syndiotactic polytyrene (Idemitsu Kosen Co., Ltd.'s system, trade name: XAREC S107).As the resin forming the second layer (cushion), prepare ethylene-methyl acrylate copolymer (Sumitomo Chemical Co's system, trade name: ACRYFT WD106).As the resin forming electromagnetic wave intercepting layer, prepare conductive adhesive layer (Co., Ltd.'s system is spun by Japan, trade name: DW-260H-1).
Use feed block and branch manifold mould, by coextrusion, the above-mentioned syndiotactic polytyrene as ground floor, the above-mentioned syndiotactic polytyrene as third layer and the above-mentioned ethylene-methyl acrylate copolymer as the second layer are carried out membranization.Above-mentioned conductive adhesive layer as electromagnetic wave intercepting layer is coated substrate layer, makes electromagnetic wave shielding film.
The thickness of the entirety of the electromagnetic wave shielding film of embodiment 1B is 140 μm, and the thickness of ground floor is 30 μm, and the thickness of third layer is 30 μm, and the thickness of the second layer is 60 μm, and the thickness of electromagnetic wave intercepting layer is 20 μm.
In addition, measure the average coefficient of linear expansion of ground floor, the second layer and the third layer in the electromagnetic wave shielding film of embodiment 1B, result is respectively 420,2400 and 420ppm/ DEG C.
In addition, measure storage elastic modelling quantity during substrate layer and electromagnetic wave intercepting layer 150 DEG C, result is respectively 1.8E+07Pa, 1.2E+07Pa.
The manufacture > of < electronic unit
Under the condition of temperature 150 DEG C, pressure 2.0MPa, by the empty method of forming of Vacuum Pressure, obtained electromagnetic wave shielding film was attached at computer memory substrate (Samsung Electronics Co., Ltd.'s system with 5 minutes, trade name: DDR2 667 M470T6554EZ3-CE6 PC2-5300) surface of (difference of height 1,000 μm).After attaching, by manual work, only substrate layer is peeled off from electromagnetic wave intercepting layer, manufacture electronic unit.
(embodiment 2B)
As the second layer, prepare ethylene-methyl acrylate copolymer (Sumitomo Chemical Co's system, trade name: ACRYFT WD106) and polypropylene (Sumitomo Chemical Co's system, trade name: Nobrene FS2011DG2) do not coordinate the cooperation product of 70wt%, 30wt% with weight percent concentration score, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1B.
(embodiment 3B)
Except being set to except 10 μm by the thickness of ground floor, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1B.
(embodiment 4B)
Except being set to except 90 μm by the thickness of the second layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1B.
(embodiment 5B)
As ground floor, prepare syndiotactic polytyrene (Idemitsu Kosen Co., Ltd.'s system, trade name: XAREC S107) and styrene-ethylene-butylene-styrene block copolymer (KURARAY Co., Ltd. system, trade name: SEPTON S8007) do not coordinate the cooperation product of 60wt%, 40wt% with weight percent concentration score, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1B.
(embodiment 6B)
Except being set to except 80 μm by the thickness of ground floor, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1B.
(embodiment 7B)
Except being set to except 100 μm by the thickness of ground floor, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1B.
(embodiment 8B)
As ground floor, prepare syndiotactic polytyrene (Idemitsu Kosen Co., Ltd.'s system, trade name: XAREC S107) and polypropylene (Sumitomo Chemical Co's system, trade name: Nobrene FS2011DG2) do not coordinate the cooperation product of 60wt%, 40wt% with weight percent concentration score, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1B.
(embodiment 9B)
As the second layer, prepare polypropylene (Sumitomo Chemical Co's system, trade name: Nobrene FS2011DG2), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1B.
(embodiment 10B)
As ground floor, prepare polybutylene terephthalate (PBT) (Mitsubishi engineering Plastics Co., Ltd's system, trade name: Novaduran 5020), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1B.
(embodiment 11B)
As ground floor, prepare 6-nylon (Ube Industries, Ltd's system, trade name: UBE Nylon 1022B), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1B.
(comparative example 1B)
As substrate layer, prepare cyclic olefin analog copolymer (Polyplastics Co., Ltd. system, trade name: TOPAS6017), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1B.
(comparative example 2B)
The thickness of third layer is set to 1 μm, the thickness of ground floor is set to 1 μm, in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1B.
< evaluation test >
For the electromagnetic wave shielding film made in embodiment 1B ~ 11B and comparative example 1B, 2B or electronic unit, also operate in the same manner as the test implemented with the electromagnetic wave shielding film made in for embodiment 1A ~ 23A and comparative example 1A, 2A or electronic unit, carry out the evaluation of cutting-stamping-out workability of the second layer exudative, heat resistance, electromagnetic wave shielding of product having shape-following-up properties, release property, resistance to edge-rolling, substrate layer.
Above each embodiment, the evaluation result of comparative example represent in table 2.
[table 2]
As known from Table 2, in the electromagnetic wave shielding film of embodiment 1B ~ 11B, storage elastic modelling quantity during due to substrate layer 150 DEG C is set in suitable scope, thus shows good product having shape-following-up properties.Further, the second layer about release property, resistance to edge-rolling, substrate layer is exudative, the cutting of heat resistance, electromagnetic wave shielding-stamping-out workability result is also that balance is good and excellent.
In contrast, in the electromagnetic wave shielding film of comparative example 1B, 2B, storage elastic modelling quantity during 150 DEG C of substrate layer is not set in suitable scope, and result product having shape-following-up properties is insufficient.
3. the layer about intercepting layer is formed and storage springform quantifier elimination
(embodiment 1C)
The manufacture > of < electromagnetic wave shielding film
In order to obtain electromagnetic wave shielding film, as the resin forming ground floor (the first release layer), prepare syndiotactic polytyrene (Idemitsu Kosen Co., Ltd.'s system, trade name: XAREC S107).As the resin forming third layer (the second release layer), prepare syndiotactic polytyrene (Idemitsu Kosen Co., Ltd.'s system, trade name: XAREC S107).As the resin forming the second layer (cushion), prepare ethylene-methyl acrylate copolymer (Sumitomo Chemical Co's system, trade name: ACRYFT WD106).As the resin forming electromagnetic wave intercepting layer, prepare conductive adhesive layer (Co., Ltd.'s system is spun by Japan, trade name: DW-260H-1).
Use feed block and branch manifold mould, by coextrusion, the above-mentioned syndiotactic polytyrene as ground floor, the above-mentioned syndiotactic polytyrene as third layer and the above-mentioned ethylene-methyl acrylate copolymer as the second layer are carried out membranization.Above-mentioned conductive adhesive layer as electromagnetic wave intercepting layer is coated substrate layer, makes electromagnetic wave shielding film.
The thickness of the entirety of the electromagnetic wave shielding film of embodiment 1C is 140 μm, and the thickness of ground floor is 30 μm, and the thickness of third layer is 30 μm, and the thickness of the second layer is 60 μm, and the thickness of electromagnetic wave intercepting layer is 20 μm.
In addition, measure the average coefficient of linear expansion of ground floor, the second layer and the third layer in the electromagnetic wave shielding film of embodiment 1C, result is respectively 420,2400 and 420.
In addition, measure storage elastic modelling quantity during substrate layer and electromagnetic wave intercepting layer 150 DEG C, result is respectively 1.8E+07Pa, 1.2E+07Pa.
The manufacture > of < electronic unit
Under the condition of temperature 150 DEG C, pressure 2.0MPa, with 5 minutes by the empty method of forming of Vacuum Pressure, obtained electromagnetic wave shielding film is attached at computer memory substrate (Samsung Electronics Co., Ltd.'s system, trade name: DDR2 667 M470T6554EZ3-CE6 PC2-5300) surface of (difference of height 1,000 μm).After attaching, by manual work, only substrate layer is peeled off from electromagnetic wave intercepting layer, manufacture electronic unit.
(embodiment 2C)
As electromagnetic wave intercepting layer, be set to conductive adhesive layer (Co., Ltd.'s system is spun by Japan, trade name: DW-250H-5), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1C.
(embodiment 3C)
As electromagnetic wave intercepting layer, be set to conductive adhesive layer (Co., Ltd.'s system is spun by Japan, trade name: DW-250H-23), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1C.
(embodiment 4C)
As electromagnetic wave intercepting layer, be set to conductive adhesive layer (Dayan Chemical Industrial Co., Ltd's system, trade name: CA-2503-4B), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1C.
(embodiment 5C)
As the resin forming intercepting layer, the conduction absorbed layer had as the function of absorbed layer prepares dispersing polyaniline liquid (Regulus Inc., trade name: PANI-PD, thickness 20 μm), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1C.
(embodiment 6C)
As the resin forming intercepting layer, the DIELECTRIC ABSORPTION layer had as the function of absorbed layer prepares multilayer carbon nanotube dispersion liquid (hodogaya chemical Co., Ltd. system, trade name: NT-7K, thickness 20 μm), in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1C.
(embodiment 7C)
As the resin forming intercepting layer, the conduction absorbed layer had as the function of absorbed layer prepares PEDOT/PSS (Zhong jing grease Co., Ltd. system, trade name: S-941, thickness 20 μm), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1C.
(embodiment 8C)
As the resin forming intercepting layer, (Co., Ltd.'s system is spun to the conductive adhesive layer preparing to have as the function in reflecting layer by Japan, trade name: DW260-H1, thickness 10 μm), the conduction absorbed layer had as the function of absorbed layer prepares dispersing polyaniline liquid (Regulus Co., Ltd. system, trade name: PANI-PD, thickness 10 μm), by them with the sequential application of reflecting layer, absorbed layer in film, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1C.
(embodiment 9C)
As the resin forming intercepting layer, prepare conductive adhesive layer (Dayan Chemical Industrial Co., Ltd's system of the function had as reflecting layer, trade name: CA-2503-4B, thickness 10 μm) and there is DIELECTRIC ABSORPTION layer PEDOT/PSS (Zhong jing grease Co., Ltd. system of the function as absorbed layer, trade name: S-941, thickness 10 μm), by them with the sequential application of reflecting layer, absorbed layer in film, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1C.
(embodiment 10C)
As the resin forming intercepting layer, (Co., Ltd.'s system is spun to the conductive adhesive layer preparing to have as the function in reflecting layer by Japan, trade name: DW260-H1, thickness 10 μm), the conduction absorbed layer had as the function of absorbed layer prepares dispersing polyaniline liquid (Regulus Co., Ltd. system, trade name: PANI-PD, thickness 10 μm), by them with the sequential application in absorbed layer, reflecting layer in film, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1C.
(embodiment 11C)
As the resin forming intercepting layer, prepare conductive adhesive layer (Dayan Chemical Industrial Co., Ltd's system of the function had as reflecting layer, trade name: CA-2503-4B, thickness 10 μm) and there is DIELECTRIC ABSORPTION layer PEDOT/PSS (Zhong jing grease society system of the function as absorbed layer, trade name: S-941, thickness 10 μm), by them with the sequential application in absorbed layer, reflecting layer in film, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1C.
< evaluation test >
For the electromagnetic wave shielding film made in embodiment 1C ~ 11C or electronic unit, also operate in the same manner as the test implemented with the electromagnetic wave shielding film made in for embodiment 1A ~ 23A and comparative example 1A, 2A or electronic unit, carry out the evaluation of cutting-stamping-out workability of the second layer exudative, heat resistance, electromagnetic wave shielding of product having shape-following-up properties, release property, resistance to edge-rolling, substrate layer.
Above each embodiment, the evaluation result of comparative example represent in table 3.
[table 3]
* X: reflecting layer contact insulation layer and with the situation of the order lamination of reflecting layer, absorbed layer
Y: absorbed layer contact insulation layer and with the situation of the order lamination in absorbed layer, reflecting layer
As known from Table 3, as shown in embodiment 1C ~ 11C, by not only storage elastic modelling quantity when 150 of substrate layer DEG C being set in suitable scope, and storage elastic modelling quantity when 150 of electromagnetic wave intercepting layer DEG C being set in suitable scope, showing good product having shape-following-up properties.In addition, the second layer about release property, resistance to edge-rolling, substrate layer is exudative, the cutting of heat resistance, electromagnetic wave shielding-stamping-out workability, is also judged to be that balance is good and excellent.
4. about the research that the layer of electromagnetic wave shielding film is formed
(embodiment 1D)
The manufacture > of < electromagnetic wave shielding film
In order to obtain electromagnetic wave shielding film, as the resin forming ground floor (the first release layer), prepare syndiotactic polytyrene (Idemitsu Kosen Co., Ltd.'s system, trade name: XAREC S107).As the resin forming third layer (the second release layer), prepare syndiotactic polytyrene (Idemitsu Kosen Co., Ltd.'s system, trade name: XAREC S107).As the resin forming the second layer (cushion), prepare ethylene-methyl acrylate copolymer (Sumitomo Chemical Co's system, trade name: ACRYFT WD106).As the resin forming insulating barrier, prepare TPO emulsion (Unitika Co., Ltd. system, trade name: ARROW BASE (ア ロ ー ベ ー ス) TC-4010).As the resin forming electromagnetic wave intercepting layer, prepare conductive adhesive layer (Co., Ltd.'s system is spun by Japan, trade name: DW-260H-1).
Use feed block and branch manifold mould, by coextrusion, the above-mentioned syndiotactic polytyrene as ground floor, the above-mentioned syndiotactic polytyrene as third layer and the above-mentioned ethylene-methyl acrylate copolymer as the second layer are carried out membranization.Above-mentioned conductive adhesive layer as electromagnetic wave intercepting layer and the said polyolefins class emulsion as insulating barrier are coated substrate layer successively, makes electromagnetic wave shielding film.
The thickness of the entirety of the electromagnetic wave shielding film of embodiment 1D is 160 μm, and the thickness of ground floor is 30 μm, and the thickness of third layer is 30 μm, and the thickness of the second layer is 60 μm, and the thickness of insulating barrier is 20 μm, and the thickness of electromagnetic wave intercepting layer is 20 μm.
In addition, measure the average coefficient of linear expansion of ground floor, the second layer and the third layer in the electromagnetic wave shielding film of embodiment 1D, result is respectively 420,2400 and 420ppm/ DEG C.
In addition, measure storage elastic modelling quantity during substrate layer and electromagnetic wave intercepting layer 150 DEG C, result is respectively 1.8E+07Pa, 1.2E+07Pa.
The manufacture > of < electronic unit
Under the condition of temperature 150 degree, pressure 2.0MPa, by the empty method of forming of Vacuum Pressure, obtained electromagnetic wave shielding film was attached at computer memory substrate (Samsung Electronics Co., Ltd.'s system with 5 minutes, trade name: DDR2 667 M470T6554EZ3-CE6 PC2-5300) surface of (difference of height 1,000 μm).After attaching, by manual work, only substrate layer is peeled off from electromagnetic wave intercepting layer, manufacture electronic unit.
(embodiment 2D)
Except being set to except 80 μm by the thickness of ground floor, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1D.
(embodiment 3D)
Except being set to except 10 μm by the thickness of ground floor, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1D.
(embodiment 4D)
Except being set to except 90 μm by the thickness of the second layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1D.
(embodiment 5D)
Except being set to except 20 μm by the thickness of the second layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1D.
(embodiment 6D)
Except being set to except 10 μm by the thickness of third layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1D.
(embodiment 7D)
Except being set to except 90 μm by the thickness of third layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1D.
(embodiment 8D)
Except being set to except 5 μm by the thickness of insulating barrier, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1D.
(embodiment 9D)
Except being set to except 50 μm by the thickness of insulating barrier, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1D.
(embodiment 10D)
Except being set to except 5 μm by the thickness of electromagnetic wave intercepting layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1D.
(embodiment 11D)
Except being set to except 150 μm by the thickness of electromagnetic wave intercepting layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1D.
(embodiment 12D)
As ground floor, prepare syndiotactic polytyrene (Idemitsu Kosen Co., Ltd.'s system, trade name: XAREC S107) and styrene-ethylene-butylene-styrene block copolymer (KURARAY Co., Ltd. system, trade name: SEPTON S8007) do not coordinate the cooperation product of 60wt%, 40wt% with weight percent concentration score, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1D.
(embodiment 13D)
As ground floor, prepare syndiotactic polytyrene (Idemitsu Kosen Co., Ltd.'s system, trade name: XAREC S107) and styrene-ethylene-butylene-styrene block copolymer (KURARAY Co., Ltd. system, trade name: SEPTON S8007) do not coordinate the cooperation product of 80wt%, 20wt% with weight percent concentration score, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1D.
(embodiment 14D)
As ground floor, prepare polymethylpentene (Mitsui Chemicals, Inc's system, trade name: TPX MX004), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1D.
(embodiment 15D)
As ground floor, prepare polybutylene terephthalate (PBT) (Mitsubishi engineering Plastics Co., Ltd's system, trade name: Novaduran 5505S), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1D.
(embodiment 16D)
As the second layer, prepare ethylene-methyl acrylate copolymer (Sumitomo Chemical Co's system, trade name: ACRYFT WD106) and polypropylene (Sumitomo Chemical Co's system, trade name: Nobrene FS2011DG2) do not coordinate the cooperation product of 70wt%, 30wt% with weight percent concentration score, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1D.
(embodiment 17D)
As the second layer, prepare ethylene-methyl acrylate copolymer (Sumitomo Chemical Co's system, trade name: ACRYFT WD106) and polyethylene (Ube Industries, Ltd's system, trade name: UBE polyethylene F222NH) do not coordinate the cooperation product of 70wt%, 30wt% with weight percent concentration score, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1D.
(embodiment 18D)
As the second layer, prepare ethylene-methyl acrylate copolymer (Sumitomo Chemical Co's system, trade name: ACRYFT WD106), polyethylene (Ube Industries, Ltd's system, trade name: UBE polyethylene F222NH) and polypropylene (Sumitomo Chemical Co's system, trade name: Nobrene FS2011DG2) do not coordinate the cooperation product of 60wt%, 20wt%, 20wt% with weight percent concentration score, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1D.
(embodiment 19D)
As insulating barrier, prepare saturated copolyester emulsion (Unitika Co., Ltd. system, trade name: Elitel KT-8803), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1D.
(embodiment 20D)
Except being set to except 5 μm by the thickness of ground floor, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1D.
(embodiment 21D)
Except being set to except 120 μm by the thickness of the second layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1D.
(embodiment 22D)
Except being set to except 3 μm by the thickness of third layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1D.
(embodiment 23D)
Except the thickness of the second layer being set to 80 μm, being set to except 10 μm by the thickness of ground floor, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1D.
(embodiment 24D)
Except the thickness of ground floor being set to 5 μm, the thickness of the second layer being set to 80 μm, being set to except 5 μm by the thickness of third layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1D.
(embodiment 25D)
Omit the formation of ground floor, electromagnetic wave intercepting layer uses electroconductive polymer dispersing polyaniline liquid (Regulus Inc. PANI-PD), in addition, manufactures electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1D.
(embodiment 26D)
Except omitting the formation of third layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1D.
(comparative example 1D)
As substrate layer, only prepare PETG (Toray Co., Ltd. system, trade name: Lumirror S10), the thickness of substrate layer is set to 30 μm, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1D.
(comparative example 2D)
As substrate layer, only prepare PETG (Toray Co., Ltd. system, trade name: Lumirror S10), the thickness of substrate layer is set to 100 μm, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1D.
< evaluation test >
For the electromagnetic wave shielding film made in embodiment 1D ~ 26D and comparative example 1D, 2D or electronic unit, also evaluate the cutting-stamping-out workability of the second layer exudative, heat resistance, electromagnetic wave shielding of product having shape-following-up properties, release property, resistance to edge-rolling, substrate layer in the same manner as above-mentioned < evaluation test >.
Above each embodiment, the evaluation result of comparative example represent in table 4.
[table 4]
As known from Table 4, the electromagnetic wave shielding film of embodiment 1D ~ 26D shows good product having shape-following-up properties, and cutting-stamping-out workability that is exudative about the second layer of release property, resistance to edge-rolling, substrate layer, electromagnetic wave shielding also balances good and excellent.In contrast, the electromagnetic wave shielding film of comparative example 1D, 2D is compared with embodiment 1D ~ 26D, its product having shape-following-up properties of result is insufficient.
5. about the storage springform quantifier elimination of substrate layer
(embodiment 1E)
The manufacture > of < electromagnetic wave shielding film
In order to obtain electromagnetic wave shielding film, as the resin forming ground floor (the first release layer), prepare syndiotactic polytyrene (Idemitsu Kosen Co., Ltd.'s system, trade name: XAREC S107).As the resin forming third layer (the second release layer), prepare syndiotactic polytyrene (Idemitsu Kosen Co., Ltd.'s system, trade name: XAREC S107).As the resin forming the second layer (cushion), prepare ethylene-methyl acrylate copolymer (Sumitomo Chemical Co's system, trade name: ACRYFT WD106).As the resin forming insulating barrier, prepare TPO emulsion (Unitika Co., Ltd. system, trade name: ARROW BASE TC-4010).As the resin forming electromagnetic wave intercepting layer, prepare conductive adhesive layer (Co., Ltd.'s system is spun by Japan, trade name: DW-260H-1).
Use feed block and branch manifold mould, by coextrusion, the above-mentioned syndiotactic polytyrene as ground floor, the above-mentioned syndiotactic polytyrene as third layer and the above-mentioned ethylene-methyl acrylate copolymer as the second layer are carried out membranization.Above-mentioned conductive adhesive layer as electromagnetic wave intercepting layer and the said polyolefins class emulsion as insulating barrier are coated substrate layer successively, makes electromagnetic wave shielding film.
The thickness of the entirety of the electromagnetic wave shielding film of embodiment 1E is 160 μm, and the thickness of ground floor is 30 μm, and the thickness of third layer is 30 μm, and the thickness of the second layer is 60 μm, and the thickness of insulating barrier is 20 μm, and the thickness of electromagnetic wave intercepting layer is 20 μm.
In addition, measure the average coefficient of linear expansion of ground floor, the second layer and the third layer in the electromagnetic wave shielding film of embodiment 1E, result is respectively 420,2400 and 420ppm/ DEG C.
In addition, measure storage elastic modelling quantity during substrate layer and electromagnetic wave intercepting layer 150 DEG C, result is respectively 1.8E+07Pa, 1.2E+07Pa.
The manufacture > of < electronic unit
Under the condition of temperature 150 DEG C, pressure 2.0MPa, by the empty method of forming of Vacuum Pressure, obtained electromagnetic wave shielding film was attached at computer memory substrate (Samsung Electronics Co., Ltd.'s system with 5 minutes, trade name: DDR2 667 M470T6554EZ3-CE6 PC2-5300) surface of (difference of height 1,000 μm).After attaching, by manual work, only substrate layer is peeled off from electromagnetic wave intercepting layer, manufacture electronic unit.
(embodiment 2E)
As the second layer, prepare ethylene-methyl acrylate copolymer (Sumitomo Chemical Co's system, trade name: ACRYFT WD106) and polypropylene (Sumitomo Chemical Co's system, trade name: Nobrene FS2011DG2) do not coordinate the cooperation product of 70wt%, 30wt% with weight percent concentration score, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1E.
(embodiment 3E)
Except being set to except 10 μm by the thickness of ground floor, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1E.
(embodiment 4E)
Except being set to except 90 μm by the thickness of the second layer, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1E.
(embodiment 5E)
As ground floor, prepare syndiotactic polytyrene (Idemitsu Kosen Co., Ltd.'s system, trade name: XAREC S107) and styrene-ethylene-butylene-styrene block copolymer (KURARAY Co., Ltd. system, trade name: SEPTON S8007) do not coordinate the cooperation product of 60wt%, 40wt% with weight percent concentration score, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1E.
(embodiment 6E)
Except being set to except 80 μm by the thickness of ground floor, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1E.
(embodiment 7E)
Except being set to except 100 μm by the thickness of ground floor, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1E.
(embodiment 8E)
As ground floor, prepare syndiotactic polytyrene (Idemitsu Kosen Co., Ltd.'s system, trade name: XAREC S107) and polypropylene (Sumitomo Chemical Co's system, trade name: Nobrene FS2011DG2) do not coordinate the cooperation product of 60wt%, 40wt% with weight percent concentration score, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1E.
(embodiment 9E)
As the second layer, prepare polypropylene (Sumitomo Chemical Co's system, trade name: Nobrene FS2011DG2), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1B.
(embodiment 10E)
As ground floor, prepare polybutylene terephthalate (PBT) (Mitsubishi engineering Plastics Co., Ltd's system, trade name: Novaduran 5020), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1E.
(comparative example 1E)
As substrate layer, prepare cyclic olefin analog copolymer (Polyplastics Co., Ltd. system, trade name: TOPAS6017), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1E.
(comparative example 2E)
Except the thickness of third layer being set to 1 μm, being set to except 1 μm by the thickness of ground floor, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1E.
< evaluation test >
For the electromagnetic wave shielding film made in embodiment 1E ~ 10E and comparative example 1E, 2E or electronic unit, also equally with the test implemented for the electromagnetic wave shielding film made in embodiment 1D ~ 26D and comparative example 1D, 2D or electronic unit to operate, carry out the evaluation of cutting-stamping-out workability of the second layer exudative, heat resistance, electromagnetic wave shielding of product having shape-following-up properties, release property, resistance to edge-rolling, substrate layer.
Above each embodiment, the evaluation result of comparative example represent in table 5.
[table 5]
As known from Table 5, in embodiment 1E ~ 10E, storage elastic modelling quantity during due to substrate layer 150 DEG C is set in suitable scope, so show good product having shape-following-up properties.Further, the second layer about release property, resistance to edge-rolling, substrate layer is exudative, the cutting of electromagnetic wave shielding-stamping-out workability, and result is also for balance is good and excellent.
In contrast, in comparative example 1E, 2E, storage elastic modelling quantity during 150 DEG C of substrate layer is not set in suitable scope, and result is that product having shape-following-up properties is insufficient.
6. the layer about intercepting layer is formed and storage springform quantifier elimination
(embodiment 1F)
The manufacture > of < electromagnetic wave shielding film
In order to obtain electromagnetic wave shielding film, as the resin forming ground floor (the first release layer), prepare syndiotactic polytyrene (Idemitsu Kosen Co., Ltd.'s system, trade name: XAREC S107).As the resin forming third layer (the second release layer), prepare syndiotactic polytyrene (Idemitsu Kosen Co., Ltd.'s system, trade name: XAREC S107).As the resin forming the second layer (cushion), prepare ethylene-methyl acrylate copolymer (Sumitomo Chemical Co's system, trade name: ACRYFT WD106).As the resin forming insulating barrier, prepare TPO emulsion (Unitika Co., Ltd. system, trade name: ARROW BASE TC-4010).As the resin forming electromagnetic wave intercepting layer, prepare conductive adhesive layer (Co., Ltd.'s system is spun by Japan, trade name: DW-260H-1).
Use feed block and branch manifold mould, by coextrusion, the above-mentioned syndiotactic polytyrene as ground floor, the above-mentioned syndiotactic polytyrene as third layer and the above-mentioned ethylene-methyl acrylate copolymer as the second layer are carried out membranization.Above-mentioned conductive adhesive layer as electromagnetic wave intercepting layer and the said polyolefins class emulsion as insulating barrier are coated substrate layer successively, makes electromagnetic wave shielding film.
The thickness of the entirety of the electromagnetic wave shielding film of embodiment 1F is 160 μm, and the thickness of ground floor is 30 μm, and the thickness of third layer is 30 μm, and the thickness of the second layer is 60 μm, and the thickness of insulating barrier is 20 μm, and the thickness of electromagnetic wave intercepting layer is 20 μm.
In addition, measure the average coefficient of linear expansion of ground floor, the second layer and the third layer in the electromagnetic wave shielding film of embodiment 1F, result is respectively 420,2400 and 420.
In addition, measure storage elastic modelling quantity during substrate layer and electromagnetic wave intercepting layer 150 DEG C, result is respectively 1.8E+07Pa, 1.2E+07Pa.
The manufacture > of < electronic unit
Under the condition of temperature 150 DEG C, pressure 2.0MPa, by the empty method of forming of Vacuum Pressure, obtained electromagnetic wave shielding film was attached at computer memory substrate (Samsung Electronics Co., Ltd.'s system with 5 minutes, trade name: DDR2 667 M470T6554EZ3-CE6 PC2-5300) surface of (difference of height 1,000 μm).After attaching, by manual work, only substrate layer is peeled off from electromagnetic wave intercepting layer, manufacture electronic unit.
(embodiment 2F)
As electromagnetic wave intercepting layer, be set to conductive adhesive layer (Co., Ltd.'s system is spun by Japan, trade name: DW-250H-5), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1F.
(embodiment 3F)
As electromagnetic wave intercepting layer, be set to conductive adhesive layer (Co., Ltd.'s system is spun by Japan, trade name: DW-250H-23), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1F.
(embodiment 4F)
As electromagnetic wave intercepting layer, be set to conductive adhesive layer (Dayan Chemical Industrial Co., Ltd's system, trade name: CA-2503-4B), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1F.
(embodiment 5F)
As the resin forming intercepting layer, the conduction absorbed layer had as the function of absorbed layer prepares dispersing polyaniline liquid (Regulus Inc., trade name: PANI-PD, thickness 20 μm), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1F.
(embodiment 6F)
As the resin forming intercepting layer, the DIELECTRIC ABSORPTION layer had as the function of absorbed layer prepares multilayer carbon nanotube dispersion liquid (hodogaya chemical society system, trade name: NT-7K, thickness 20 μm), in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1F.
(embodiment 7F)
As the resin forming intercepting layer, the conduction absorbed layer had as the function of absorbed layer prepares PEDOT/PSS (Zhong jing grease Co., Ltd. system, trade name: S-941, thickness 20 μm), in addition, manufacture electromagnetic wave shielding film and electronic unit in the same manner as embodiment 1F.
(embodiment 8F)
As the resin forming intercepting layer, (Co., Ltd.'s system is spun to the conductive adhesive layer preparing to have as the function in reflecting layer by Japan, trade name: DW260-H1, thickness 10 μm), the conduction absorbed layer had as the function of absorbed layer prepares dispersing polyaniline liquid (Regulus Inc., trade name: PANI-PD, thickness 10 μm), by them with the sequential application of reflecting layer, absorbed layer in film, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1F.
(embodiment 9F)
As the resin forming intercepting layer, prepare conductive adhesive layer (Dayan Chemical Industrial Co., Ltd's system of the function had as reflecting layer, trade name: CA-2503-4B, thickness 10 μm) and there is DIELECTRIC ABSORPTION layer PEDOT/PSS (Zhong jing grease Co., Ltd. system of the function as absorbed layer, trade name: S-941, thickness 10 μm), by them with the sequential application of reflecting layer, absorbed layer in film, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1F.
(embodiment 10F)
As the resin forming intercepting layer, (Co., Ltd.'s system is spun to the conductive adhesive layer preparing to have as the function in reflecting layer by Japan, trade name: DW260-H1, thickness 10 μm), the conduction absorbed layer had as the function of absorbed layer prepares dispersing polyaniline liquid (Regulus Inc., trade name: PANI-PD, thickness 10 μm), by them with the sequential application in absorbed layer, reflecting layer in film, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1F.
(embodiment 11F)
As the resin forming intercepting layer, prepare conductive adhesive layer (Dayan Chemical Industrial Co., Ltd's system of the function had as reflecting layer, trade name: CA-2503-4B, thickness 10 μm), there is the DIELECTRIC ABSORPTION layer of the function as absorbed layer, prepare PEDOT/PSS (Zhong jing grease Co., Ltd. system, trade name: S-941, thickness 10 μm), by them with the sequential application in absorbed layer, reflecting layer in film, in addition, electromagnetic wave shielding film and electronic unit is manufactured in the same manner as embodiment 1F.
< evaluation test >
For the electromagnetic wave shielding film made in embodiment 1F ~ 11F or electronic unit, also operate in the same manner as the test implemented with the electromagnetic wave shielding film made in about embodiment 1D ~ 26D and comparative example 1D, 2D or electronic unit, carry out the evaluation of cutting-stamping-out workability of the second layer exudative, heat resistance, electromagnetic wave shielding of product having shape-following-up properties, release property, resistance to edge-rolling, substrate layer.
Above each embodiment, the evaluation result of comparative example represent in table 6.
[table 6]
* X: reflecting layer contact insulation layer and with the situation of the order lamination of reflecting layer, absorbed layer
Y: absorbed layer contact insulation layer and with the situation of the order lamination in absorbed layer, reflecting layer
As known from Table 6, as shown in embodiment 1F ~ 11F, by not only storage elastic modelling quantity when 150 of substrate layer DEG C being set in suitable scope, and storage elastic modelling quantity when 150 of electromagnetic wave intercepting layer DEG C being set in suitable scope, showing good product having shape-following-up properties.Further, the second layer about release property, resistance to edge-rolling, substrate layer is exudative, the cutting of heat resistance, electromagnetic wave shielding-stamping-out workability, is also judged to be that balance is good and excellent.
Industrial utilizability
The electromagnetic wave shielding film that the present invention relates to be can improve substrate design freedom and lightweight, slimming and the protuberance 61 of more than 500 μm is also had to the electromagnetic wave shielding film of good product having shape-following-up properties can be realized.
Claims (18)
1. an electromagnetic wave shielding film, is characterized in that:
It is the electromagnetic wave shielding film of the protuberance on covered substrate,
This electromagnetic wave shielding film comprise substrate layer and be stacked on this substrate layer side, a face electromagnetic wave intercepting layer and form,
Storage elastic modelling quantity during 150 DEG C of described substrate layer is 2.0E+05 ~ 5.0E+08Pa.
2. electromagnetic wave shielding film as claimed in claim 1, is characterized in that:
Storage elastic modelling quantity when 120 of described substrate layer DEG C is set to A [Pa], 150 DEG C of described substrate layer time storage elastic modelling quantity when being set to B [Pa], meet the relation of 0.02≤A/B≤1.00.
3. electromagnetic wave shielding film as claimed in claim 1 or 2, is characterized in that:
Described substrate layer is the laminated body of the formation three-decker having ground floor, the second layer and third layer from another side, face successively lamination.
4. electromagnetic wave shielding film as claimed in claim 3, is characterized in that:
Average coefficient of linear expansion during 25 ~ 150 DEG C of described ground floor is 40 ~ 1000 [ppm/ DEG C].
5. the electromagnetic wave shielding film as described in claim 3 or 4, is characterized in that:
The thickness T (A) of described ground floor is more than 5 μm, less than 100 μm.
6. the electromagnetic wave shielding film according to any one of claim 3 ~ 5, is characterized in that:
Average coefficient of linear expansion during 25 ~ 150 DEG C of described third layer is 40 ~ 1000 [ppm/ DEG C].
7. the electromagnetic wave shielding film according to any one of claim 3 ~ 6, is characterized in that:
The thickness T (B) of described third layer is more than 5 μm, less than 100 μm.
8. the electromagnetic wave shielding film according to any one of claim 3 ~ 7, is characterized in that:
Average coefficient of linear expansion during 25 ~ 150 DEG C of the described second layer is more than 400 [ppm/ DEG C].
9. the electromagnetic wave shielding film according to any one of claim 3 ~ 8, is characterized in that:
The thickness T (C) of the described second layer is more than 10 μm, less than 100 μm.
10. the electromagnetic wave shielding film according to any one of claim 3 ~ 9, is characterized in that:
The thickness T (B) of the thickness T (A) of described ground floor, described third layer and the thickness T (C) of the described second layer meets following relational expression (I):
0.05＜T(C)/(T(A)+T(B))＜10···(I)。
11. electromagnetic wave shielding films according to any one of claim 1 ~ 10, is characterized in that:
Storage elastic modelling quantity during 150 DEG C of described electromagnetic wave intercepting layer is 1.0E+05 ~ 1.0E+09Pa.
12. electromagnetic wave shielding films according to any one of claim 1 ~ 11, is characterized in that:
Described electromagnetic wave intercepting layer is made up of reflecting layer and absorbed layer, described electromagnetic wave intercepting layer be this reflecting layer and this absorbed layer from the side, a described face of described substrate layer lamination and the laminated body that obtains successively.
13. electromagnetic wave shielding films according to any one of claim 1 ~ 12, is characterized in that:
Under temperature 150 DEG C, pressure 2MPa, the condition of 5 minutes time, product having shape-following-up properties when this electromagnetic wave shielding film hot pressing being connected to the described protuberance on described substrate is more than 500 μm, 3, less than 000 μm.
14. electromagnetic wave shielding films according to any one of claim 1 ~ 13, is characterized in that:
Also comprise the insulating barrier be stacked between described substrate layer and described electromagnetic wave intercepting layer.
15. electromagnetic wave shielding films as claimed in claim 14, is characterized in that:
Described insulating barrier and described electromagnetic wave intercepting layer are formed as the laminated body of the lamination successively from the side, a described face of described substrate layer.
16. electromagnetic wave shielding films as described in claims 14 or 15, is characterized in that:
Described insulating barrier is formed by having thermoplastic insulating resin.
17. electromagnetic wave shielding films according to any one of claim 14 ~ 16, is characterized in that:
The thickness T (D) of described insulating barrier is more than 3 μm, less than 50 μm.
The covering method of 18. 1 kinds of electronic units, is characterized in that, comprising:
Attach operation, the electromagnetic wave shielding film according to any one of claim 1 ~ 17 is attached at described protuberance on described substrate to make the described electromagnetic wave intercepting layer mode bonding with electronic unit; With
Stripping process, after described attaching operation, peels off described substrate layer from described electromagnetic wave intercepting layer.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-180537 | 2012-08-16 | ||
| JP2012180537 | 2012-08-16 | ||
| JP2013051098A JP6263846B2 (en) | 2012-08-16 | 2013-03-13 | Electromagnetic wave shielding film and method for coating electronic component |
| JP2013-051098 | 2013-03-13 | ||
| JP2013-051100 | 2013-03-13 | ||
| JP2013051100A JP6263847B2 (en) | 2012-08-16 | 2013-03-13 | Electromagnetic wave shielding film and method for coating electronic component |
| PCT/JP2013/071923 WO2014027673A1 (en) | 2012-08-16 | 2013-08-14 | Em-shielding film and method for covering electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104584707A true CN104584707A (en) | 2015-04-29 |
Family
ID=50614085
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380043449.XA Pending CN104584707A (en) | 2012-08-16 | 2013-08-14 | EM-shielding film and method for covering electronic component |
| CN201380043490.7A Pending CN104584708A (en) | 2012-08-16 | 2013-08-14 | EM-shielding film and method for covering electronic component |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380043490.7A Pending CN104584708A (en) | 2012-08-16 | 2013-08-14 | EM-shielding film and method for covering electronic component |
Country Status (6)
| Country | Link |
|---|---|
| JP (4) | JP6225436B2 (en) |
| KR (2) | KR101799631B1 (en) |
| CN (2) | CN104584707A (en) |
| SG (2) | SG11201501165XA (en) |
| TW (2) | TWI675617B (en) |
| WO (2) | WO2014027672A1 (en) |
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| CN111050463A (en) * | 2016-04-27 | 2020-04-21 | 欧姆龙株式会社 | Electronic device and method for manufacturing the same |
| CN112292917A (en) * | 2018-06-12 | 2021-01-29 | 东洋油墨Sc控股株式会社 | Electromagnetic wave shielding sheet |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6263847B2 (en) | 2018-01-24 |
| TW201419997A (en) | 2014-05-16 |
| JP6225437B2 (en) | 2017-11-08 |
| JP2014057042A (en) | 2014-03-27 |
| JP6263846B2 (en) | 2018-01-24 |
| JP2014057041A (en) | 2014-03-27 |
| JP6225436B2 (en) | 2017-11-08 |
| SG11201501165XA (en) | 2015-05-28 |
| WO2014027672A1 (en) | 2014-02-20 |
| WO2014027673A1 (en) | 2014-02-20 |
| JP2014057040A (en) | 2014-03-27 |
| TWI675617B (en) | 2019-10-21 |
| KR101799630B1 (en) | 2017-11-20 |
| TW201419996A (en) | 2014-05-16 |
| KR101799631B1 (en) | 2017-11-20 |
| CN104584708A (en) | 2015-04-29 |
| JP2014057043A (en) | 2014-03-27 |
| KR20150042747A (en) | 2015-04-21 |
| KR20150044853A (en) | 2015-04-27 |
| SG11201501162UA (en) | 2015-04-29 |
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Application publication date: 20150429 |