CN104582268B - 电路板组件及具有所述电路组件的电子装置 - Google Patents
电路板组件及具有所述电路组件的电子装置 Download PDFInfo
- Publication number
- CN104582268B CN104582268B CN201310516333.5A CN201310516333A CN104582268B CN 104582268 B CN104582268 B CN 104582268B CN 201310516333 A CN201310516333 A CN 201310516333A CN 104582268 B CN104582268 B CN 104582268B
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- CN
- China
- Prior art keywords
- circuit board
- radiator
- support block
- supporter
- board assemblies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310516333.5A CN104582268B (zh) | 2013-10-28 | 2013-10-28 | 电路板组件及具有所述电路组件的电子装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310516333.5A CN104582268B (zh) | 2013-10-28 | 2013-10-28 | 电路板组件及具有所述电路组件的电子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104582268A CN104582268A (zh) | 2015-04-29 |
CN104582268B true CN104582268B (zh) | 2017-12-08 |
Family
ID=53097161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201310516333.5A Active CN104582268B (zh) | 2013-10-28 | 2013-10-28 | 电路板组件及具有所述电路组件的电子装置 |
Country Status (1)
Country | Link |
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CN (1) | CN104582268B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107249249A (zh) * | 2017-04-24 | 2017-10-13 | 广东美的暖通设备有限公司 | 室外机电控装置、室外机及空调器 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201426229Y (zh) * | 2009-06-02 | 2010-03-17 | 英业达股份有限公司 | 散热及电磁干扰防止模块 |
DE102012213573B3 (de) * | 2012-08-01 | 2013-09-26 | Infineon Technologies Ag | Halbleitermodulanordnung und verfahren zur herstellung und zum betrieb einer halbleitermodulanordnung |
-
2013
- 2013-10-28 CN CN201310516333.5A patent/CN104582268B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201426229Y (zh) * | 2009-06-02 | 2010-03-17 | 英业达股份有限公司 | 散热及电磁干扰防止模块 |
DE102012213573B3 (de) * | 2012-08-01 | 2013-09-26 | Infineon Technologies Ag | Halbleitermodulanordnung und verfahren zur herstellung und zum betrieb einer halbleitermodulanordnung |
Also Published As
Publication number | Publication date |
---|---|
CN104582268A (zh) | 2015-04-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20171027 Address after: Metro Songshan Lake high tech Industrial Development Zone, Guangdong Province, Dongguan City Road 523808 No. 2 South Factory (1) project B2 -5 production workshop Applicant after: HUAWEI terminal (Dongguan) Co., Ltd. Address before: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No. Applicant before: Huawei Device Co., Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee after: Huawei Device Co., Ltd. Address before: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee before: HUAWEI terminal (Dongguan) Co., Ltd. |