CN104582240B - 电路板及电路板制作方法 - Google Patents
电路板及电路板制作方法 Download PDFInfo
- Publication number
- CN104582240B CN104582240B CN201310510000.1A CN201310510000A CN104582240B CN 104582240 B CN104582240 B CN 104582240B CN 201310510000 A CN201310510000 A CN 201310510000A CN 104582240 B CN104582240 B CN 104582240B
- Authority
- CN
- China
- Prior art keywords
- layer
- substance
- circuit board
- insulating barrier
- metal simple
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
电路基板 | 110 |
第一绝缘层 | 111 |
外层导电线路层 | 112 |
第二绝缘层 | 113 |
内层导电线路层 | 114 |
基底层 | 115 |
电磁屏蔽形成区 | 110a |
普通区 | 110b |
开孔 | 1111 |
信号线路 | 1121 |
接地线路 | 1122 |
第一线路 | 1141 |
第二线路 | 1142 |
含金属离子的油墨 | 120 |
含金属单质的油墨层 | 130 |
电磁屏蔽结构 | 140 |
化学镀铜层 | 141 |
电镀铜层 | 142 |
防焊层 | 150 |
电路板 | 100 |
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310510000.1A CN104582240B (zh) | 2013-10-25 | 2013-10-25 | 电路板及电路板制作方法 |
TW102139509A TWI484875B (zh) | 2013-10-25 | 2013-10-31 | 電路板及電路板製作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310510000.1A CN104582240B (zh) | 2013-10-25 | 2013-10-25 | 电路板及电路板制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104582240A CN104582240A (zh) | 2015-04-29 |
CN104582240B true CN104582240B (zh) | 2017-08-25 |
Family
ID=53097144
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310510000.1A Active CN104582240B (zh) | 2013-10-25 | 2013-10-25 | 电路板及电路板制作方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN104582240B (zh) |
TW (1) | TWI484875B (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104934670B (zh) * | 2015-07-02 | 2018-04-27 | 上海安费诺永亿通讯电子有限公司 | 一种低损耗扁平传输线 |
CN105657958B (zh) * | 2015-12-29 | 2018-09-04 | 广东欧珀移动通信有限公司 | 移动终端、柔性电路板及其制造方法 |
CN107305848B (zh) * | 2016-04-20 | 2019-08-20 | 碁鼎科技秦皇岛有限公司 | 封装基板、封装结构及其制作方法 |
CN108738226B (zh) * | 2018-05-04 | 2020-11-13 | 华显光电技术(惠州)有限公司 | 柔性电路板结构、背光组件与移动终端 |
CN108767063A (zh) * | 2018-05-31 | 2018-11-06 | 上海空间电源研究所 | 柔性塑料衬底薄膜砷化镓太阳电池焊接模块制作方法 |
CN110859022A (zh) * | 2018-08-24 | 2020-03-03 | 三赢科技(深圳)有限公司 | 电路板及应用该电路板的电子装置 |
CN111565551B (zh) * | 2019-02-13 | 2022-09-20 | 鹏鼎控股(深圳)股份有限公司 | 电磁屏蔽结构、电磁屏蔽结构的制作方法及电路板 |
CN112020199B (zh) * | 2019-05-29 | 2022-03-08 | 鹏鼎控股(深圳)股份有限公司 | 内埋式电路板及其制作方法 |
CN112449514B (zh) * | 2019-08-31 | 2022-12-20 | 鹏鼎控股(深圳)股份有限公司 | 多层线路板及其制作方法 |
CN111913612A (zh) * | 2020-09-15 | 2020-11-10 | 南京华睿川电子科技有限公司 | 一种电容式触摸屏及其制造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201322836A (zh) * | 2011-11-24 | 2013-06-01 | Tatsuta Densen Kk | 遮罩膜、遮罩印刷電路板以及遮罩膜的製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4914262B2 (ja) * | 2006-03-29 | 2012-04-11 | タツタ電線株式会社 | シールドフィルム及びシールドプリント配線板 |
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2013
- 2013-10-25 CN CN201310510000.1A patent/CN104582240B/zh active Active
- 2013-10-31 TW TW102139509A patent/TWI484875B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201322836A (zh) * | 2011-11-24 | 2013-06-01 | Tatsuta Densen Kk | 遮罩膜、遮罩印刷電路板以及遮罩膜的製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI484875B (zh) | 2015-05-11 |
CN104582240A (zh) | 2015-04-29 |
TW201517710A (zh) | 2015-05-01 |
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Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170302 Address after: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
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Address after: Guangdong Province, Shenzhen city Baoan District Street Community Yan Luo Yan Chuan song Luo Ding way Peng Park plant to building A3 building A1 Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |