CN104549892A - Dispensing curing mechanism for assembling small components of electronic product - Google Patents
Dispensing curing mechanism for assembling small components of electronic product Download PDFInfo
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- CN104549892A CN104549892A CN201510054323.3A CN201510054323A CN104549892A CN 104549892 A CN104549892 A CN 104549892A CN 201510054323 A CN201510054323 A CN 201510054323A CN 104549892 A CN104549892 A CN 104549892A
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Abstract
The invention relates to a dispensing curing mechanism for assembling small components of an electronic product. A Y-axis mechanism is installed on a base; an X-axis mechanism is installed on the Y-axis mechanism through an XY connecting plate; a Z-axis mechanism is installed on the X-axis mechanism through an XZ connecting block a and an XZ connecting block b; an R-axis mechanism is installed at the front part of the Z-axis mechanism through a ZR connecting plate; a CCD mechanism is installed at the front part of the R-axis mechanism; a dispensing laser mechanism is installed on the right side of the R-axis mechanism through a laser fixed plate; the R-axis mechanism is transported to an operation position by the X-axis, Y-axis and Z-axis mechanisms; the CCD mechanism moves to a material tray to take a photo, the position of the component is precisely positioned, and a clamping claw moves to a component clamping position to clamp the component; the CCD mechanism moves to a product to take a photo, and a dispensing position is determined; laser moves to the dispensing position on the product to measure the dispensing height; a dispensing valve moves to the dispensing position to dispense glue; finally the clamping claw moves to the dispensing position to be fit to the component and to cure the component by virtue of UV. By adopting the dispensing curing mechanism, precision for assembling the components of the electronic product can be realized, and convenience in operation can be realized.
Description
Technical field:
The present invention relates to an adhesive curing structural establishment field, relating to a kind of some adhesive curing mechanism for assembling electronic product finding in particular.
Background technology:
In electronic product production process, need to assemble some findings on electronic product.In some midget plants, be all by manually completing.Because finding volume is little, contrast locating is more difficult, easily causes workman tired, such that the production time is long, production efficiency is low, and loosening, locating the quality problems such as inaccurate easily appears in the finding be assembled on product.At this moment, just need a kind ofly accurately to assemble the some glue laminating curing mechanism of finding to electronic product, can manpower be saved, enhance productivity, reduce company's production cost.
Summary of the invention:
The object of the invention is for the deficiencies in the prior art part, provide a kind of some adhesive curing mechanism for assembling electronic product finding, it is simple to operate, and some glue position is accurate.
Technology solution of the present invention is as follows:
A kind of some adhesive curing mechanism for assembling electronic product finding, it comprises base, described base is provided with Y-axis mechanism, Y-axis mechanism is connected with X-axis mechanism by XY connecting plate, described X-axis mechanism is connected with XZ contiguous block a, XZ contiguous block a is connected with XZ contiguous block b, the z axis module slide block of XZ contiguous block b and Z-axis mechanism links together, the back of the z axis module of described Z-axis mechanism is connected to ZR connecting plate, and the sidepiece of z axis module is connected to side fixed head; Described Z-axis mechanism front portion is provided with R axis mechanism by ZR connecting plate; Described R axis mechanism front portion is provided with CCD mechanism; Installed by radium-shine fixed head on the right side of the fixed head of described side and have a glue laser mechanism.
Described R axis mechanism comprises R spindle motor, R axle decelerator and R axle decelerator installing plate, and described R axle decelerator upper end and R spindle motor link together, and lower end is fixed on R axle decelerator installing plate; Described R axle decelerator lower end is provided with R axle clip claw mechanism; Described ZR connecting plate left side is provided with UV light fixtures, UV light fixtures is fixed with UV lamp clamp, and UV lamp clamp is provided with UV lamp; Described side fixed head is provided with UV lamp fixed block, UV lamp fixed block is fixed with the UV lamp clamp described in two pieces, every block UV lamp clamp is separately installed with described UV lamp; Described R axle clip claw mechanism comprises R axle extending shaft, R axle portable plate, R axle slide rail, R axle slide block, R axle sensing chip, LOAD CELLS, LOAD CELLS fixed block, LOAD CELLS fixed mount, spring, jaw cylinder, jaw and cylinder limiting plate, R axle slide rail is installed inside R axle extending shaft, R axle slide rail coordinates R axle slide block is installed; Described R axle portable plate is linked together by R axle slide block and R axle extending shaft; Described R axle portable plate centre position is provided with LOAD CELLS by LOAD CELLS fixed block and LOAD CELLS fixed mount, and between LOAD CELLS and R axle extending shaft, spring is installed, described R axle portable plate lower end position is provided with jaw cylinder, jaw cylinder front portion is provided with cylinder limiting plate, and jaw cylinder lower end is provided with jaw; The focus point of described three UV lamps is positioned at immediately below jaw.
Described some glue laser mechanism comprises described radium-shine fixed head, radium-shine, glue dispensing valve lift cylinder, sensor installing plate, sensor fixed block, sensor, packing element, meets glue elbow, glue dispensing valve, glue dispensing valve clamp a and glue dispensing valve clamp b, the outside of described radium-shine fixed head fixedly mounts radium-shine, and the inner side of radium-shine fixed head fixedly mounts glue dispensing valve lift cylinder; Described glue dispensing valve lift cylinder is connected to lifter plate, and described glue dispensing valve clamp a is fixed on lifter plate, and described glue dispensing valve is arranged on lifter plate by glue dispensing valve clamp a and glue dispensing valve clamp b; Described sensor installing plate is arranged on the upside of lifter plate, and described sensor fixed block is arranged on sensor installing plate, and sensor fixed block is provided with sensor; Sensor is close in described packing element side, and packing element lower end is by connecing glue elbow and glue dispensing valve is connected together; Described sensor is for detecting the glue amount in packing element.
R axis mechanism is transported to job position by described X-axis mechanism, Y-axis mechanism and Z-axis mechanism; CCD mechanism kinematic to charging tray is taken pictures, and accurately the position of finding is got in location, and the jaw action of R axis mechanism is to the position gripping finding getting finding; Then CCD mechanism kinematic to product is taken pictures, determine a glue position; The radium-shine some glue position moved on product of some glue laser mechanism, measurement point glue height; Glue dispensing valve moves to a glue location point glue; Last jaw action is to putting glue position laminating finding and UV solidification.
As preferably, described ZR connecting plate left side is provided with R axis photoelectric sensor fixed block, described side fixed head is provided with R axis photoelectric sensor fixed mount, and R axis photoelectric sensor fixed block and R axis photoelectric sensor fixed mount are separately installed with R axis photoelectric sensor; Described R axle extending shaft top is provided with R axle sensing chip by being spirally connected, two R axis photoelectric sensors are for determining the angle that R axle rotates.
As preferably, described CCD mechanism comprises CCD fixed head, CCD adjustable plate, CCD adjusting knob, CCD adjusting knob holder, CCD, clamp, annular light source and annular light source fixed mount, and described CCD adjustable plate, CCD adjusting knob holder and clamp are arranged on CCD fixed head respectively; Described CCD adjustable plate is provided with CCD; Described annular light source fixed mount is arranged on CCD fixed head by two, left and right clamp, and annular light source fixed mount is provided with annular light source, and annular light source and CCD coaxial; Described CCD adjusting knob is installed together through CCD adjusting knob holder and CCD adjustable plate, and CCD adjusting knob can finely tune the position of CCD.
As preferably, described clamp is provided with a round slot bore and clamping slot, and round slot bore is connected with clamping slot, utilizes bolt annular light source fixed mount can be locked on clamp by clamping slot.
As preferably, described CCD fixed head is provided with connecting hole, CCD adjustable plate is provided with grooved hole, utilizes connecting hole and grooved hole CCD adjustable plate can be fixed on CCD fixed head by the mode that is spirally connected, and the position-adjustable of CCD adjustable plate on CCD fixed head.
As preferably, described glue dispensing valve clamp a and glue dispensing valve clamp b is respectively equipped with a semicircle slotted eye, glue dispensing valve clamp b can be linked together with glue dispensing valve clamp a by the mode be spirally connected, and forms a round slot bore, and glue dispensing valve is clamped in round slot bore place.
As preferably, described sensor installing plate is provided with grooved hole, sensor fixed block is provided with connecting hole, also adopt the mode be spirally connected sensor fixed block can be packed on sensor installing plate by grooved hole and connecting hole, and the position of sensor fixed block relative sensors installing plate regulate by grooved hole.
As preferably, described radium-shine fixed head is Z-type structure, and radium-shine fixed head is longitudinally provided with row's connecting hole, can be fixed on the side of side fixed head by connecting hole.
Beneficial effect of the present invention is:
R axis mechanism is transported to job position by X-axis mechanism of the present invention, Y-axis mechanism and Z-axis mechanism; R axis mechanism can gripping finding finding is rotated to standard operation position.
CCD mechanism kinematic to charging tray of the present invention is taken pictures, and accurately the position of finding is got in location; CCD mechanism is capable of taking pictures determines a glue position; CCD adjustable plate is provided with grooved hole, and can be arranged on CCD fixed head by adjustable for CCD adjustable plate by grooved hole, adjustable like this CCD adjustable plate is relative to the position of CCD fixed head; Clamp is provided with a round slot bore and clamping slot simultaneously, round slot bore is connected with clamping slot, utilize bolt annular light source fixed mount can be locked on clamp by clamping slot, and the position of adjustable annular light source fixing frame, be convenient to the upper-lower position regulating annular light source; By the position of the fine-tuning CCD of CCD adjusting knob, it is easy to adjust, easy accessibility, is convenient to change annular light source.
Glue dispensing valve lift cylinder of the present invention drives, glue dispensing valve can be driven to move up and down, thus make glue dispensing valve carry out a glue to product, radium-shine can measurement point glue height, calculate gel quantity, sensor is for detecting the glue amount in packing element, and some glue position of the present invention is accurate, accurate positioning, point glue amount is controlled, glue amount in packing element can detect, and glue dispensing valve moves to a glue location point glue, and last jaw action is to putting glue position laminating finding and UV solidification; Finding after assembling there will not be loosening, and it achieves full automatic working, improves production efficiency, improves product quality.
The present invention accurately can assemble finding on electronic product, and its glue position is accurate, can realize fully automatic working, improve product quality, improve operating efficiency, reduce the labour intensity of workman, reduce costs, easy to operate.
Accompanying drawing illustrates:
Below in conjunction with accompanying drawing, the present invention is described further:
Fig. 1 is structural representation of the present invention;
Fig. 2 is another structural representation of the present invention;
Fig. 3 is the front view of Fig. 1;
Fig. 4 is the top view of Fig. 1;
Fig. 5 is the left view of Fig. 1;
Fig. 6 is the upward view of Fig. 1;
Fig. 7 is the structural representation of R axis mechanism of the present invention;
Fig. 8 is the structural representation of the R axle clip claw mechanism in Fig. 7;
Fig. 9 is the structural representation of CCD mechanism of the present invention;
Figure 10 is the structural representation of of the present invention some glue laser mechanism;
Figure 11 is another structural representation of of the present invention some glue laser mechanism;
Figure 12 is the top view of Figure 10.
Detailed description of the invention:
Embodiment, see accompanying drawing 1 ~ 12, a kind of some adhesive curing mechanism for assembling electronic product finding, it comprises base 1, described base is provided with Y-axis mechanism I, Y-axis mechanism is connected with X-axis mechanism II by XY connecting plate 2, described X-axis mechanism is connected with XZ contiguous block a3, XZ contiguous block a is connected with XZ contiguous block b4, the z axis module slide block of XZ contiguous block b and Z-axis mechanism III links together, the back of the z axis module of described Z-axis mechanism is connected to ZR connecting plate 5, and the sidepiece of z axis module is connected to side fixed head 6; Described Z-axis mechanism front portion is provided with R axis mechanism IV by ZR connecting plate; Described R axis mechanism front portion is provided with CCD mechanism V; Installed by radium-shine fixed head on the right side of the fixed head of described side and have a glue laser mechanism VI.
Described Y-axis mechanism comprises y-axis motor 7, y-axis motor installing plate 8, Y-axis shaft coupling 9, the linear module of Y-axis 10, the linear module slide block 11 of Y-axis, Y-axis slide rail 12, Y-axis slide block 13, Y-axis mounting bar 14, Y-axis photoelectric sensor 15, Y-axis sensing chip 16, cover plate 17 and limiting plate 18, the linear module of described Y-axis, Y-axis slide rail and Y-axis mounting bar are arranged on base respectively, and the linear module of Y-axis and Y-axis slide rail are parallel to each other, described Y-axis mounting bar is provided with three Y-axis photoelectric sensors, the linear module of described Y-axis is provided with cover plate, cover plate is fixed with limiting plate; Described Y-axis slide rail coordinates Y-axis slide block is installed; Described y-axis motor is arranged on y-axis motor installing plate, and y-axis motor front end is linked together by Y-axis shaft coupling and the linear module of Y-axis; The linear module of described Y-axis coordinates the linear module slide block of Y-axis is installed; The linear module slide block of described Y-axis and Y-axis slide block are provided with XY connecting plate, and Y-axis sensing chip is arranged on the bottom of XY connecting plate.
Described y-axis motor drives, Y-axis linear module slide block is moved on the linear module of Y-axis, and move along the direction of Y-axis slide rail, the distance of motion is determined by Y-axis photoelectric sensor, final drive XY connecting plate moves in the Y-axis direction, and the maximum distance that limiting plate moves in Y-axis mechanism for limiting X-axis mechanism.
Described X-axis mechanism comprises X-axis motor 19, X-axis motor mounting plate 20, X-axis shaft coupling 21, the linear module of X-axis 22, the linear module slide block 23 of X-axis, X-axis mounting bar 24, X-axis photoelectric sensor 25 and X-axis sensing chip 26, described X-axis motor is arranged on X-axis motor mounting plate, and linked together by X-axis shaft coupling and the linear module of X-axis, the linear module back of X-axis is connected on XY connecting plate, XY connecting plate top is provided with X-axis mounting bar, X-axis mounting bar is provided with three X-axis photoelectric sensors; Described XZ contiguous block a is arranged on the linear module slide block of X-axis, and XZ contiguous block a top is provided with X-axis sensing chip.
Described X-axis motor drives, and X-axis linear module slide block is moved on the linear module of X-axis, and the distance of motion is determined by X-axis photoelectric sensor, and the final XZ contiguous block a that drives moves in the X-axis direction.
Described Z-axis mechanism comprises Z axis motor 27, Z axis motor mounting plate 28, Z axis shaft coupling 29, z axis module 30, z axis module slide block 31, Z axis mounting bar 32, Z axis photoelectric sensor 33 and Z axis sensing chip 34, described Z axis motor is arranged on Z axis motor mounting plate, and linked together by Z axis shaft coupling and z axis module, z axis module is provided with z axis module slide block; Described side fixed head is provided with Z axis mounting bar, Z axis mounting bar is provided with three Z axis photoelectric sensors; Described XZ contiguous block b and XZ contiguous block a is fixed together, and XZ contiguous block b is arranged on z axis module slide block, and XZ contiguous block b sidepiece is provided with Z axis sensing chip.
Described R axis mechanism comprises R spindle motor 35, R axle decelerator 36 and R axle decelerator installing plate 37, and described R axle decelerator upper end and R spindle motor link together, and lower end is fixed on R axle decelerator installing plate; Described R axle decelerator lower end is provided with R axle clip claw mechanism VII; Described ZR connecting plate left side is provided with UV light fixtures 38, UV light fixtures is fixed with on UV lamp clamp 39, UV lamp clamp and is provided with UV lamp 40; Described side fixed head is provided with UV lamp clamp UV lamp fixed block 41, UV lamp fixed block is fixed with described in two pieces, every block UV lamp clamp is separately installed with described UV lamp; Described R axle clip claw mechanism comprises R axle extending shaft 42, R axle portable plate 43, R axle slide rail 44, R axle slide block 45, R axle sensing chip 46, LOAD CELLS 47, LOAD CELLS fixed block 48, LOAD CELLS fixed mount 49, spring 50, jaw cylinder 51, jaw 52 and cylinder limiting plate 53, R axle slide rail is installed inside R axle extending shaft, R axle slide rail coordinates R axle slide block is installed; Described R axle portable plate is linked together by R axle slide block and R axle extending shaft; Described R axle portable plate centre position is provided with LOAD CELLS by LOAD CELLS fixed block and LOAD CELLS fixed mount, and between LOAD CELLS and R axle extending shaft, spring is installed, described R axle portable plate lower end position is provided with jaw cylinder, jaw cylinder front portion is provided with cylinder limiting plate, and jaw cylinder lower end is provided with jaw; The focus point of described three UV lamps is positioned at immediately below jaw.Described ZR connecting plate left side is provided with R axis photoelectric sensor fixed block 54, described side fixed head is provided with R axis photoelectric sensor fixed mount 55, and R axis photoelectric sensor fixed block and R axis photoelectric sensor fixed mount are separately installed with a R axis photoelectric sensor 56, two R axis photoelectric sensors is 90 ° of structural configuration; Described R axle extending shaft top is provided with R axle sensing chip by being spirally connected.R axle sensing chip can rotate with R axle extending shaft, and R axle sensing chip can match with R axis photoelectric sensor, thus can determine the anglec of rotation of R axle extending shaft, finally accurately can determine the installation site of finding on jaw.
Described R spindle motor drives, R axle clip claw mechanism can be driven to rotate, make jaw rotate to assigned address and carry out gripping finding, the jaw of R axle clip claw mechanism moves to a glue position laminating finding on product under the drive of X-axis mechanism, Y-axis mechanism and Z-axis mechanism, during laminating, R axle portable plate can move on R axle slide rail, under the action of the spring, pressure when measuring laminating by LOAD CELLS, when reaching required pressure, just no longer exert pressure, because the focus point of three UV lamps is positioned at immediately below jaw after laminating, such UV lamp can be cured.
Described CCD mechanism comprises CCD fixed head 57, CCD adjustable plate 58, CCD adjusting knob 59, CCD adjusting knob holder 60, CCD61, clamp 62, annular light source 63 and annular light source fixed mount 64, and described CCD adjustable plate, CCD adjusting knob holder and clamp are arranged on CCD fixed head respectively; Described CCD adjustable plate is provided with CCD; Described annular light source fixed mount is arranged on CCD fixed head by two, left and right clamp, and annular light source fixed mount is provided with annular light source, and annular light source and CCD coaxial; Described CCD adjusting knob is installed together through CCD adjusting knob holder and CCD adjustable plate, and CCD adjusting knob can finely tune the position of CCD.
Described clamp is provided with a round slot bore 65 and clamping slot 66, and round slot bore is connected with clamping slot, utilizes bolt annular light source fixed mount can be locked on clamp by clamping slot.
Described CCD fixed head is provided with connecting hole, and CCD adjustable plate is provided with grooved hole, utilizes connecting hole and grooved hole CCD adjustable plate can be fixed on CCD fixed head by the mode that is spirally connected, and the position-adjustable of CCD adjustable plate on CCD fixed head.
Described some glue laser mechanism comprises described radium-shine fixed head 67, radium-shine 68, glue dispensing valve lift cylinder 69, sensor installing plate 70, sensor fixed block 71, sensor 72, packing element 73, meets glue elbow 74, glue dispensing valve 75, glue dispensing valve clamp a76 and glue dispensing valve clamp b77, the outside of described radium-shine fixed head fixedly mounts radium-shine, and the inner side of radium-shine fixed head fixedly mounts glue dispensing valve lift cylinder; Described glue dispensing valve lift cylinder is connected to lifter plate, and described glue dispensing valve clamp a is fixed on lifter plate, and described glue dispensing valve is arranged on lifter plate by glue dispensing valve clamp a and glue dispensing valve clamp b; Described sensor installing plate is arranged on the upside of lifter plate, and described sensor fixed block is arranged on sensor installing plate, and sensor fixed block is provided with sensor; Sensor is close in described packing element side, and packing element lower end is by connecing glue elbow and glue dispensing valve is connected together; Described sensor is for detecting the glue amount in packing element.
Described glue dispensing valve clamp a and glue dispensing valve clamp b is respectively equipped with a semicircle slotted eye, and glue dispensing valve clamp b can be linked together with glue dispensing valve clamp a by the mode be spirally connected, and forms a round slot bore, and glue dispensing valve is clamped in round slot bore place.
Described sensor installing plate is provided with grooved hole, sensor fixed block is provided with connecting hole, also adopt the mode be spirally connected sensor fixed block can be packed on sensor installing plate by grooved hole and connecting hole, and the position of sensor fixed block relative sensors installing plate regulate by grooved hole.
Described radium-shine fixed head is Z-type structure, and radium-shine fixed head is longitudinally provided with row's connecting hole, can be fixed on the side of side fixed head by connecting hole.
Described glue dispensing valve lift cylinder drives, and glue dispensing valve can be driven to move up and down, thus make glue dispensing valve carry out a glue to product, radium-shine can measurement point glue height, calculate gel quantity, sensor, can control point glue amount for detecting the glue amount in packing element.
Operation principle of the present invention: R axis mechanism is transported to job position by X-axis mechanism, Y-axis mechanism and Z-axis mechanism; CCD mechanism kinematic to charging tray is taken pictures, and accurately the position of finding is got in location, and the jaw action of R axis mechanism is to the position gripping finding getting finding; Then CCD mechanism kinematic to product is taken pictures, determine a glue position; The radium-shine some glue position moved on product of some glue laser mechanism, measurement point glue height; Glue dispensing valve moves to a glue location point glue; Last jaw action is to putting glue position laminating finding and UV solidification.
Above-described embodiment is the specific descriptions of carrying out the present invention; just the present invention is further described; can not be interpreted as limiting the scope of the present invention, those skilled in the art makes some nonessential improvement according to the content of foregoing invention and adjustment all falls within protection scope of the present invention.
Claims (8)
1. one kind for assembling the some adhesive curing mechanism of electronic product finding, it comprises base, described base is provided with Y-axis mechanism, Y-axis mechanism is connected with X-axis mechanism by XY connecting plate, described X-axis mechanism is connected with XZ contiguous block a, XZ contiguous block a is connected with XZ contiguous block b, the z axis module slide block of XZ contiguous block b and Z-axis mechanism links together, it is characterized in that: the back of the z axis module of described Z-axis mechanism is connected to ZR connecting plate, the sidepiece of z axis module is connected to side fixed head; Described Z-axis mechanism front portion is provided with R axis mechanism by ZR connecting plate; Described R axis mechanism front portion is provided with CCD mechanism; Installed by radium-shine fixed head on the right side of the fixed head of described side and have a glue laser mechanism;
Described R axis mechanism comprises R spindle motor, R axle decelerator and R axle decelerator installing plate, and described R axle decelerator upper end and R spindle motor link together, and lower end is fixed on R axle decelerator installing plate; Described R axle decelerator lower end is provided with R axle clip claw mechanism; Described ZR connecting plate left side is provided with UV light fixtures, UV light fixtures is fixed with UV lamp clamp, and UV lamp clamp is provided with UV lamp; Described side fixed head is provided with UV lamp fixed block, UV lamp fixed block is fixed with the UV lamp clamp described in two pieces, every block UV lamp clamp is separately installed with described UV lamp; Described R axle clip claw mechanism comprises R axle extending shaft, R axle portable plate, R axle slide rail, R axle slide block, R axle sensing chip, LOAD CELLS, LOAD CELLS fixed block, LOAD CELLS fixed mount, spring, jaw cylinder, jaw and cylinder limiting plate, R axle slide rail is installed inside R axle extending shaft, R axle slide rail coordinates R axle slide block is installed; Described R axle portable plate is linked together by R axle slide block and R axle extending shaft; Described R axle portable plate centre position is provided with LOAD CELLS by LOAD CELLS fixed block and LOAD CELLS fixed mount, and between LOAD CELLS and R axle extending shaft, spring is installed, described R axle portable plate lower end position is provided with jaw cylinder, jaw cylinder front portion is provided with cylinder limiting plate, and jaw cylinder lower end is provided with jaw; The focus point of described three UV lamps is positioned at immediately below jaw;
Described some glue laser mechanism comprises described radium-shine fixed head, radium-shine, glue dispensing valve lift cylinder, sensor installing plate, sensor fixed block, sensor, packing element, meets glue elbow, glue dispensing valve, glue dispensing valve clamp a and glue dispensing valve clamp b, the outside of described radium-shine fixed head fixedly mounts radium-shine, and the inner side of radium-shine fixed head fixedly mounts glue dispensing valve lift cylinder; Described glue dispensing valve lift cylinder is connected to lifter plate, and described glue dispensing valve clamp a is fixed on lifter plate, and described glue dispensing valve is arranged on lifter plate by glue dispensing valve clamp a and glue dispensing valve clamp b; Described sensor installing plate is arranged on the upside of lifter plate, and described sensor fixed block is arranged on sensor installing plate, and sensor fixed block is provided with sensor; Sensor is close in described packing element side, and packing element lower end is by connecing glue elbow and glue dispensing valve is connected together; Described sensor is for detecting the glue amount in packing element;
R axis mechanism is transported to job position by described X-axis mechanism, Y-axis mechanism and Z-axis mechanism; CCD mechanism kinematic to charging tray is taken pictures, and accurately the position of finding is got in location, and the jaw action of R axis mechanism is to the position gripping finding getting finding; Then CCD mechanism kinematic to product is taken pictures, determine a glue position; The radium-shine some glue position moved on product of some glue laser mechanism, measurement point glue height; Glue dispensing valve moves to a glue location point glue; Last jaw action is to putting glue position laminating finding and UV solidification.
2. a kind of some adhesive curing mechanism for assembling electronic product finding according to claim 1, it is characterized in that: described ZR connecting plate left side is provided with R axis photoelectric sensor fixed block, described side fixed head is provided with R axis photoelectric sensor fixed mount, and R axis photoelectric sensor fixed block and R axis photoelectric sensor fixed mount are separately installed with R axis photoelectric sensor; Described R axle extending shaft top is provided with R axle sensing chip by being spirally connected, two R axis photoelectric sensors are for determining the angle that R axle rotates.
3. a kind of some adhesive curing mechanism for assembling electronic product finding according to claim 1, it is characterized in that: described CCD mechanism comprises CCD fixed head, CCD adjustable plate, CCD adjusting knob, CCD adjusting knob holder, CCD, clamp, annular light source and annular light source fixed mount, and described CCD adjustable plate, CCD adjusting knob holder and clamp are arranged on CCD fixed head respectively; Described CCD adjustable plate is provided with CCD; Described annular light source fixed mount is arranged on CCD fixed head by two, left and right clamp, and annular light source fixed mount is provided with annular light source, and annular light source and CCD coaxial; Described CCD adjusting knob is installed together through CCD adjusting knob holder and CCD adjustable plate, and CCD adjusting knob can finely tune the position of CCD.
4. a kind of some adhesive curing mechanism for assembling electronic product finding according to claim 3, it is characterized in that: described clamp is provided with a round slot bore and clamping slot, round slot bore is connected with clamping slot, utilizes bolt annular light source fixed mount can be locked on clamp by clamping slot.
5. a kind of some adhesive curing mechanism for assembling electronic product finding according to claim 3, it is characterized in that: described CCD fixed head is provided with connecting hole, CCD adjustable plate is provided with grooved hole, utilize connecting hole and grooved hole CCD adjustable plate can be fixed on CCD fixed head by the mode that is spirally connected, and the position-adjustable of CCD adjustable plate on CCD fixed head.
6. a kind of some adhesive curing mechanism for assembling electronic product finding according to claim 1, it is characterized in that: described glue dispensing valve clamp a and glue dispensing valve clamp b is respectively equipped with a semicircle slotted eye, glue dispensing valve clamp b can be linked together with glue dispensing valve clamp a by the mode be spirally connected, and forming a round slot bore, glue dispensing valve is clamped in round slot bore place.
7. a kind of some adhesive curing mechanism for assembling electronic product finding according to claim 1, it is characterized in that: described sensor installing plate is provided with grooved hole, sensor fixed block is provided with connecting hole, also adopt the mode be spirally connected sensor fixed block can be packed on sensor installing plate by grooved hole and connecting hole, and the position of sensor fixed block relative sensors installing plate regulate by grooved hole.
8. a kind of some adhesive curing mechanism for assembling electronic product finding according to claim 1, it is characterized in that: described radium-shine fixed head is Z-type structure, radium-shine fixed head is longitudinally provided with row's connecting hole, can be fixed on the side of side fixed head by connecting hole.
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