CN104425334B - 半导体装置的制造方法以及半导体制造装置 - Google Patents
半导体装置的制造方法以及半导体制造装置 Download PDFInfo
- Publication number
- CN104425334B CN104425334B CN201310741341.XA CN201310741341A CN104425334B CN 104425334 B CN104425334 B CN 104425334B CN 201310741341 A CN201310741341 A CN 201310741341A CN 104425334 B CN104425334 B CN 104425334B
- Authority
- CN
- China
- Prior art keywords
- chip
- workbench
- band
- semiconductor
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-186101 | 2013-09-09 | ||
JP2013186101A JP6017388B2 (ja) | 2013-09-09 | 2013-09-09 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104425334A CN104425334A (zh) | 2015-03-18 |
CN104425334B true CN104425334B (zh) | 2018-11-13 |
Family
ID=52702212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310741341.XA Expired - Fee Related CN104425334B (zh) | 2013-09-09 | 2013-12-27 | 半导体装置的制造方法以及半导体制造装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6017388B2 (ja) |
CN (1) | CN104425334B (ja) |
TW (1) | TWI529793B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6934327B2 (ja) * | 2017-06-07 | 2021-09-15 | 株式会社ディスコ | ウエーハの分割方法及び分割装置 |
JP7115862B2 (ja) * | 2018-02-13 | 2022-08-09 | 株式会社ディスコ | 分割装置及び分割方法 |
JP7511981B2 (ja) | 2020-08-05 | 2024-07-08 | 株式会社ディスコ | 接着用フィルム付きチップの製造方法 |
TWI754344B (zh) * | 2020-08-07 | 2022-02-01 | 志聖工業股份有限公司 | 貼膜裝置及貼膜方法 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1581443A (zh) * | 2003-08-12 | 2005-02-16 | 株式会社迪斯科 | 晶片加工方法 |
CN1655327A (zh) * | 2004-02-09 | 2005-08-17 | 株式会社迪斯科 | 晶片的分割方法 |
CN1731560A (zh) * | 2004-08-05 | 2006-02-08 | 株式会社迪斯科 | 安装在晶片上的粘接膜的断裂方法及断裂装置 |
CN101026126A (zh) * | 2006-02-14 | 2007-08-29 | 株式会社迪斯科 | 半导体芯片制造方法 |
CN101079374A (zh) * | 2006-05-23 | 2007-11-28 | 株式会社瑞萨科技 | 半导体装置的制造方法 |
CN101297394A (zh) * | 2005-11-10 | 2008-10-29 | 株式会社瑞萨科技 | 半导体器件的制造方法以及半导体器件 |
CN101447411A (zh) * | 2007-11-27 | 2009-06-03 | 株式会社迪思科 | 晶片背面安装的粘接薄膜的断开方法和粘接薄膜 |
CN101515565A (zh) * | 2008-02-20 | 2009-08-26 | 株式会社迪思科 | 半导体芯片的制造方法 |
CN101577217A (zh) * | 2008-05-09 | 2009-11-11 | 株式会社迪思科 | 膜状粘接剂的断裂装置和断裂方法 |
CN101620984A (zh) * | 2008-07-04 | 2010-01-06 | 株式会社迪思科 | 安装有粘接膜的器件的拾取方法 |
CN101887841A (zh) * | 2009-05-11 | 2010-11-17 | 株式会社迪思科 | 粘接带的扩展方法 |
CN102405509A (zh) * | 2009-03-31 | 2012-04-04 | 安森美半导体贸易公司 | 半导体装置及其制造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58147129A (ja) * | 1982-02-26 | 1983-09-01 | Nitto Electric Ind Co Ltd | 半導体ウエハの固定方法 |
JPS6312836U (ja) * | 1986-07-11 | 1988-01-27 | ||
JPH07120645B2 (ja) * | 1990-01-11 | 1995-12-20 | 富士通株式会社 | 半導体製造装置 |
JPH04177860A (ja) * | 1990-11-13 | 1992-06-25 | Hitachi Ltd | ピックアップ装置 |
JP3017827B2 (ja) * | 1991-03-26 | 2000-03-13 | 沖電気工業株式会社 | ダイスボンディング装置におけるウエハリング保持機構 |
JP3176645B2 (ja) * | 1991-04-18 | 2001-06-18 | 株式会社日立製作所 | 半導体集積回路装置の製造方法 |
JP3816253B2 (ja) * | 1999-01-19 | 2006-08-30 | 富士通株式会社 | 半導体装置の製造方法 |
JP4471747B2 (ja) * | 2004-06-24 | 2010-06-02 | アピックヤマダ株式会社 | 半導体装置の製造装置 |
JP5085452B2 (ja) * | 2008-07-29 | 2012-11-28 | 株式会社ディスコ | テープ拡張装置 |
-
2013
- 2013-09-09 JP JP2013186101A patent/JP6017388B2/ja not_active Expired - Fee Related
- 2013-12-05 TW TW102144667A patent/TWI529793B/zh not_active IP Right Cessation
- 2013-12-27 CN CN201310741341.XA patent/CN104425334B/zh not_active Expired - Fee Related
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1581443A (zh) * | 2003-08-12 | 2005-02-16 | 株式会社迪斯科 | 晶片加工方法 |
CN1655327A (zh) * | 2004-02-09 | 2005-08-17 | 株式会社迪斯科 | 晶片的分割方法 |
CN1731560A (zh) * | 2004-08-05 | 2006-02-08 | 株式会社迪斯科 | 安装在晶片上的粘接膜的断裂方法及断裂装置 |
CN101297394A (zh) * | 2005-11-10 | 2008-10-29 | 株式会社瑞萨科技 | 半导体器件的制造方法以及半导体器件 |
CN101026126A (zh) * | 2006-02-14 | 2007-08-29 | 株式会社迪斯科 | 半导体芯片制造方法 |
CN101079374A (zh) * | 2006-05-23 | 2007-11-28 | 株式会社瑞萨科技 | 半导体装置的制造方法 |
CN101447411A (zh) * | 2007-11-27 | 2009-06-03 | 株式会社迪思科 | 晶片背面安装的粘接薄膜的断开方法和粘接薄膜 |
CN101515565A (zh) * | 2008-02-20 | 2009-08-26 | 株式会社迪思科 | 半导体芯片的制造方法 |
CN101577217A (zh) * | 2008-05-09 | 2009-11-11 | 株式会社迪思科 | 膜状粘接剂的断裂装置和断裂方法 |
CN101620984A (zh) * | 2008-07-04 | 2010-01-06 | 株式会社迪思科 | 安装有粘接膜的器件的拾取方法 |
CN102405509A (zh) * | 2009-03-31 | 2012-04-04 | 安森美半导体贸易公司 | 半导体装置及其制造方法 |
CN101887841A (zh) * | 2009-05-11 | 2010-11-17 | 株式会社迪思科 | 粘接带的扩展方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI529793B (zh) | 2016-04-11 |
TW201511107A (zh) | 2015-03-16 |
CN104425334A (zh) | 2015-03-18 |
JP2015053419A (ja) | 2015-03-19 |
JP6017388B2 (ja) | 2016-11-02 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
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TA01 | Transfer of patent application right |
Effective date of registration: 20170807 Address after: Tokyo, Japan, Japan Applicant after: Toshiba Storage Corporation Address before: Tokyo, Japan, Japan Applicant before: Toshiba Corporation |
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TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181113 Termination date: 20191227 |
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CF01 | Termination of patent right due to non-payment of annual fee |