CN104425334B - 半导体装置的制造方法以及半导体制造装置 - Google Patents

半导体装置的制造方法以及半导体制造装置 Download PDF

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Publication number
CN104425334B
CN104425334B CN201310741341.XA CN201310741341A CN104425334B CN 104425334 B CN104425334 B CN 104425334B CN 201310741341 A CN201310741341 A CN 201310741341A CN 104425334 B CN104425334 B CN 104425334B
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China
Prior art keywords
chip
workbench
band
semiconductor
semiconductor wafer
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Expired - Fee Related
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CN201310741341.XA
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English (en)
Chinese (zh)
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CN104425334A (zh
Inventor
藤田努
杉沢佳史
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Kioxia Corp
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Toshiba Memory Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
CN201310741341.XA 2013-09-09 2013-12-27 半导体装置的制造方法以及半导体制造装置 Expired - Fee Related CN104425334B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-186101 2013-09-09
JP2013186101A JP6017388B2 (ja) 2013-09-09 2013-09-09 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
CN104425334A CN104425334A (zh) 2015-03-18
CN104425334B true CN104425334B (zh) 2018-11-13

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CN201310741341.XA Expired - Fee Related CN104425334B (zh) 2013-09-09 2013-12-27 半导体装置的制造方法以及半导体制造装置

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Country Link
JP (1) JP6017388B2 (ja)
CN (1) CN104425334B (ja)
TW (1) TWI529793B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6934327B2 (ja) * 2017-06-07 2021-09-15 株式会社ディスコ ウエーハの分割方法及び分割装置
JP7115862B2 (ja) * 2018-02-13 2022-08-09 株式会社ディスコ 分割装置及び分割方法
JP7511981B2 (ja) 2020-08-05 2024-07-08 株式会社ディスコ 接着用フィルム付きチップの製造方法
TWI754344B (zh) * 2020-08-07 2022-02-01 志聖工業股份有限公司 貼膜裝置及貼膜方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1581443A (zh) * 2003-08-12 2005-02-16 株式会社迪斯科 晶片加工方法
CN1655327A (zh) * 2004-02-09 2005-08-17 株式会社迪斯科 晶片的分割方法
CN1731560A (zh) * 2004-08-05 2006-02-08 株式会社迪斯科 安装在晶片上的粘接膜的断裂方法及断裂装置
CN101026126A (zh) * 2006-02-14 2007-08-29 株式会社迪斯科 半导体芯片制造方法
CN101079374A (zh) * 2006-05-23 2007-11-28 株式会社瑞萨科技 半导体装置的制造方法
CN101297394A (zh) * 2005-11-10 2008-10-29 株式会社瑞萨科技 半导体器件的制造方法以及半导体器件
CN101447411A (zh) * 2007-11-27 2009-06-03 株式会社迪思科 晶片背面安装的粘接薄膜的断开方法和粘接薄膜
CN101515565A (zh) * 2008-02-20 2009-08-26 株式会社迪思科 半导体芯片的制造方法
CN101577217A (zh) * 2008-05-09 2009-11-11 株式会社迪思科 膜状粘接剂的断裂装置和断裂方法
CN101620984A (zh) * 2008-07-04 2010-01-06 株式会社迪思科 安装有粘接膜的器件的拾取方法
CN101887841A (zh) * 2009-05-11 2010-11-17 株式会社迪思科 粘接带的扩展方法
CN102405509A (zh) * 2009-03-31 2012-04-04 安森美半导体贸易公司 半导体装置及其制造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58147129A (ja) * 1982-02-26 1983-09-01 Nitto Electric Ind Co Ltd 半導体ウエハの固定方法
JPS6312836U (ja) * 1986-07-11 1988-01-27
JPH07120645B2 (ja) * 1990-01-11 1995-12-20 富士通株式会社 半導体製造装置
JPH04177860A (ja) * 1990-11-13 1992-06-25 Hitachi Ltd ピックアップ装置
JP3017827B2 (ja) * 1991-03-26 2000-03-13 沖電気工業株式会社 ダイスボンディング装置におけるウエハリング保持機構
JP3176645B2 (ja) * 1991-04-18 2001-06-18 株式会社日立製作所 半導体集積回路装置の製造方法
JP3816253B2 (ja) * 1999-01-19 2006-08-30 富士通株式会社 半導体装置の製造方法
JP4471747B2 (ja) * 2004-06-24 2010-06-02 アピックヤマダ株式会社 半導体装置の製造装置
JP5085452B2 (ja) * 2008-07-29 2012-11-28 株式会社ディスコ テープ拡張装置

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1581443A (zh) * 2003-08-12 2005-02-16 株式会社迪斯科 晶片加工方法
CN1655327A (zh) * 2004-02-09 2005-08-17 株式会社迪斯科 晶片的分割方法
CN1731560A (zh) * 2004-08-05 2006-02-08 株式会社迪斯科 安装在晶片上的粘接膜的断裂方法及断裂装置
CN101297394A (zh) * 2005-11-10 2008-10-29 株式会社瑞萨科技 半导体器件的制造方法以及半导体器件
CN101026126A (zh) * 2006-02-14 2007-08-29 株式会社迪斯科 半导体芯片制造方法
CN101079374A (zh) * 2006-05-23 2007-11-28 株式会社瑞萨科技 半导体装置的制造方法
CN101447411A (zh) * 2007-11-27 2009-06-03 株式会社迪思科 晶片背面安装的粘接薄膜的断开方法和粘接薄膜
CN101515565A (zh) * 2008-02-20 2009-08-26 株式会社迪思科 半导体芯片的制造方法
CN101577217A (zh) * 2008-05-09 2009-11-11 株式会社迪思科 膜状粘接剂的断裂装置和断裂方法
CN101620984A (zh) * 2008-07-04 2010-01-06 株式会社迪思科 安装有粘接膜的器件的拾取方法
CN102405509A (zh) * 2009-03-31 2012-04-04 安森美半导体贸易公司 半导体装置及其制造方法
CN101887841A (zh) * 2009-05-11 2010-11-17 株式会社迪思科 粘接带的扩展方法

Also Published As

Publication number Publication date
TWI529793B (zh) 2016-04-11
TW201511107A (zh) 2015-03-16
CN104425334A (zh) 2015-03-18
JP2015053419A (ja) 2015-03-19
JP6017388B2 (ja) 2016-11-02

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