CN104416682A - 基板切断装置 - Google Patents

基板切断装置 Download PDF

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Publication number
CN104416682A
CN104416682A CN201410171803.3A CN201410171803A CN104416682A CN 104416682 A CN104416682 A CN 104416682A CN 201410171803 A CN201410171803 A CN 201410171803A CN 104416682 A CN104416682 A CN 104416682A
Authority
CN
China
Prior art keywords
substrate
protrusion
conveyer
elastomeric element
cut according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410171803.3A
Other languages
English (en)
Chinese (zh)
Inventor
村上健二
武田真和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN104416682A publication Critical patent/CN104416682A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0215—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the ribbon being in a substantially vertical plane
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
CN201410171803.3A 2013-08-23 2014-04-25 基板切断装置 Pending CN104416682A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-173557 2013-08-23
JP2013173557A JP6262960B2 (ja) 2013-08-23 2013-08-23 基板分断装置

Publications (1)

Publication Number Publication Date
CN104416682A true CN104416682A (zh) 2015-03-18

Family

ID=52694295

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410171803.3A Pending CN104416682A (zh) 2013-08-23 2014-04-25 基板切断装置

Country Status (4)

Country Link
JP (1) JP6262960B2 (ja)
KR (1) KR20150022638A (ja)
CN (1) CN104416682A (ja)
TW (1) TWI591030B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104843488A (zh) * 2015-04-10 2015-08-19 京东方科技集团股份有限公司 一种输出装置和切割裂片***
CN110587824A (zh) * 2019-10-12 2019-12-20 苏州鸣动智能设备有限公司 一种陶瓷基板折粒机构

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI580067B (zh) * 2016-07-01 2017-04-21 新日光能源科技股份有限公司 裂片裝置及其裂片方法
WO2023176068A1 (ja) * 2022-03-16 2023-09-21 ナルックス株式会社 マイクロレンズ及びマイクロレンズアレイの製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS577139A (en) * 1980-06-16 1982-01-14 Mitsubishi Electric Corp Splitting of semiconductor wafer
JPS60164385A (ja) * 1984-02-06 1985-08-27 Rohm Co Ltd 半導体レ−ザのチツプ製造方法
JPS6153741A (ja) * 1984-08-22 1986-03-17 Mitsubishi Electric Corp 半導体ウエハの分割装置
JPS63278804A (ja) * 1987-05-11 1988-11-16 Fujitsu Ltd 半導体チップの分割方法
JPH01148512A (ja) * 1987-12-07 1989-06-09 Tadao Totsuka 基板の分割装置
JPH0938956A (ja) * 1995-08-01 1997-02-10 敏行 ▲村▼上 タイル切断機のタイル保持装置
CN102555082A (zh) * 2010-11-30 2012-07-11 三星钻石工业股份有限公司 脆性材料基板的分断方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4838636B2 (ja) * 2006-05-31 2011-12-14 日本特殊陶業株式会社 分割装置及びセラミック配線基板の製造方法
JP5216040B2 (ja) * 2010-03-31 2013-06-19 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS577139A (en) * 1980-06-16 1982-01-14 Mitsubishi Electric Corp Splitting of semiconductor wafer
JPS60164385A (ja) * 1984-02-06 1985-08-27 Rohm Co Ltd 半導体レ−ザのチツプ製造方法
JPS6153741A (ja) * 1984-08-22 1986-03-17 Mitsubishi Electric Corp 半導体ウエハの分割装置
JPS63278804A (ja) * 1987-05-11 1988-11-16 Fujitsu Ltd 半導体チップの分割方法
JPH01148512A (ja) * 1987-12-07 1989-06-09 Tadao Totsuka 基板の分割装置
JPH0938956A (ja) * 1995-08-01 1997-02-10 敏行 ▲村▼上 タイル切断機のタイル保持装置
CN102555082A (zh) * 2010-11-30 2012-07-11 三星钻石工业股份有限公司 脆性材料基板的分断方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104843488A (zh) * 2015-04-10 2015-08-19 京东方科技集团股份有限公司 一种输出装置和切割裂片***
CN104843488B (zh) * 2015-04-10 2017-12-29 京东方科技集团股份有限公司 一种输出装置和切割裂片***
CN110587824A (zh) * 2019-10-12 2019-12-20 苏州鸣动智能设备有限公司 一种陶瓷基板折粒机构

Also Published As

Publication number Publication date
JP6262960B2 (ja) 2018-01-17
TWI591030B (zh) 2017-07-11
TW201507984A (zh) 2015-03-01
KR20150022638A (ko) 2015-03-04
JP2015039872A (ja) 2015-03-02

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