CN201533447U - Surface mounting device and printed circuit board - Google Patents
Surface mounting device and printed circuit board Download PDFInfo
- Publication number
- CN201533447U CN201533447U CN2009201103902U CN200920110390U CN201533447U CN 201533447 U CN201533447 U CN 201533447U CN 2009201103902 U CN2009201103902 U CN 2009201103902U CN 200920110390 U CN200920110390 U CN 200920110390U CN 201533447 U CN201533447 U CN 201533447U
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- surface mounting
- pcb
- test point
- via hole
- mounting component
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Abstract
The utility model provides a surface mounting device and a printed circuit board. The surface mounting device comprises a surface mounting bonding pad and an insulating element frame, and is placed on a testing point. In the utility model, the testing point can be selectively and purposefully added at the distributing stage of the PCB, so that a board manufacturer can directly carry out the green oil removal treatment to a through hole of the additional testing point according to the information of the surface mounting device on the testing point, thereby effectively solving the problems that the board manufacturer manually and selectively remove green oil, which is error-prone; the through hole green oil is integrally removed; and the manufacturing and welding reliabilities are low.
Description
Technical field
The utility model relates to a kind of surface mounting component and printed circuit board (PCB), belongs to data communication technology field.
Background technology
After a communication equipment completes, need to come the performance index of checkout equipment whether to reach pre-provisioning request through a large amount of signal testings.For this reason, must on printed circuit board (PCB) (Printed CircuitBoard is called for short PCB), reserve many test points.Along with development of Communication Technique, PCB is as the carrier of electronic component, and its electronic component density is more and more higher, and this brings many challenges for the design of test point and placement.
PCB is the supporter of electronic devices and components, and its is realized the wiring between the various electronic devices and components such as integrated circuit and is electrically connected or electric insulation.PCB has the branch of lamina, doubling plate and multi-layer sheet.Multi-layer sheet generally is made up of signals layer, stratum 11 and dielectric layer 12 (insulating material), wherein signals layer has the branch of surface layer signal layer 13 (comprising top layer and bottom) and internal layer signals layer 14 again, connection between the signals layer is finished by via hole 15 (perhaps screw hole), as shown in Figure 1.
Place test point at present on PCB, it is to utilize via hole on the holding wire as test point that a kind of method is arranged.Via hole is to be used for the electric path that signals layer switches, and its inwall has conduction with copper, and via hole mainly is made up of two parts, the one, and middle boring, the 2nd, the copper pad area around the boring.Shown in stratum among Fig. 1, two inner stratum copper sheets are just coupled together by via hole.And do not need the aspect that connects with via hole, and its copper cash (perhaps copper sheet) keeps certain distance with via hole, for example internal layer signals layer among Fig. 1 and surface layer signal layer,
On high density PCB, because the surface has occupied electronic component, holding wire generally all is distributed in the signal internal layer.Therefore top and the end at signal generally all has a via hole that holding wire is drawn 21 to the PCB top layer, to realize the connection with electronic component.Since the special construction of via hole, as shown in Figure 2, can be with via hole as test point.
As shown in Figure 2, via hole is to be used for the electric path that signals layer switches, and its inwall has conduction with copper.Via hole mainly is made up of two parts, and the one, middle boring 22, two, the copper pad area around the boring.Pad 23 is copper sheets that PCB goes up the soldering of electronic components pin, and this copper sheet connects with the circuit copper cash, and the copper cash that electronic component is welded on pad both sides, back on the copper sheet has just had annexation.Electroplating ventilating hole also has pad as via hole and insert hole in addition, is to be used for connecting different circuit layers, and this copper sheet connects with the circuit copper cash, makes different circuit layers that annexation arranged.As shown in Figure 3.
Via hole all has pad on top layer and internal layer, and generally speaking, the pad on top layer has the width of 20 mils (mil, mil).If the pad green oil on top layer is removed, expose copper-clad surface, just can be used as test point.The general method of removing green oil is that artificial selection of plate mill man removed behind the via hole.But the via hole on the pcb board is thousands of, if go one by one to select, is easy to generate mistake.So the present way of producer is with after the whole selection of via hole, the unified green oil of removing.Such processing can make via hole top layer pads all on the pcb board come out (not covering green oil), if component density is too high, is easy to cause short circuit when element welds.
The utility model content
The purpose of this utility model provides a kind of surface mounting component and printed circuit board (PCB), can add the test point of printed circuit board (PCB) flexibly, improves the reliability that printed circuit board (PCB) is produced.
To achieve these goals, the utility model provides a kind of surface mounting component that is used to be placed on the test point, and described surface mounting component comprises the element frame of Surface Mount pad and insulation.
To achieve these goals, the utility model provides a kind of printed circuit board (PCB) again, and described circuit board comprises above-mentioned surface mounting component, and described surface mounting component is placed on the test point of printed circuit board (PCB).
The utility model can have selection in the PCB fabric swatch stage, on purpose add test point, make that making sheet producer can be according to the surface mounting component information of test point when making sheet, directly the via hole that adds test point being removed green oil handles, thereby having solved making sheet producer effectively manually selects to remove green oil and easily makes mistakes, and whole removing is removed the via hole green oil, the low problem of production soldering reliability.
Description of drawings
Fig. 1 is the printed circuit board arrangement schematic diagram
Fig. 2 is the via structure schematic diagram
Fig. 3 is the pad structure schematic diagram
Fig. 4 is a kind of surface mounting component structural representation of the utility model
Fig. 5 is the via hole schematic diagram after windowing
Fig. 6 is a principle logical base schematic diagram
Embodiment
Below in conjunction with accompanying drawing the utility model is carried out specific description.
The utility model provides a kind of surface mounting component, and described surface mounting component has the opening one side window function, and is placed on the test point, can be according to described surface mounting component in the test point processing of windowing when making sheet.Fig. 4 has provided a kind of surface mounting component structural representation of the utility model.
Because surface mounting component has windowing function, therefore when test point is placed surface mounting component, can make the test point single face dew copper of windowing, thereby form the test point that to test.
Described surface mounting component can comprise the element frame 42 of Surface Mount pad 41 and insulation.
At the test point dew copper of windowing, its shape and size can be defined as consistent with via pad on the PCB when Surface Mount pad specifically was used for making sheet, and the via shape among the PCB is generally circle, and its size needs different sizes according to wiring.Because its shape and size are consistent with via hole, can not take additional space, can not change live width, influence signal quality.
Can add the element frame of the insulation of a white oil protection around the Surface Mount pad, for example 5 arrive the 6mil place on every side at the Surface Mount pad, its effect is when placing test point, can maintain a certain distance with other devices or other via hole, get a little during with convenient test, also reduce simultaneously the short circuit chance, increase reliability.
Described surface mounting component can be used in the PCB fabric swatch stage selection being arranged, on purpose adding test point: at first determine the position of printed circuit board (PCB) test point, and place the surface mounting component that single face is windowed on test point; During last making sheet in the test point processing of windowing.
Described surface mounting component can be positioned on the via hole, for example be positioned at the top layer or the bottom of via hole, specifically can be by electric design automation (Electronic Design Automation, be called for short EDA) instrument, the surface mounting component that to place on via hole is designed to an element that possesses principle logical base and PCB physical package, promptly on via hole, place a kind of surface mounting component that has top layer opening one side window function, make the via hole single face dew copper of windowing, thereby form the test point that to test, for example go green oil to window at Surface Mount pad locations place.
The principle logical base is meant when the design circuit principle, is used for the corresponding logic diagram of representing each device.Comprise information such as the pin title of name, device of device and number in the logic diagram.When principle design, also can the device of logical base be defined with reference to various parameters such as items.
The PCB physical package is meant on PCB, is used for the corresponding planar graph of representing each true device, and this figure comprises important informations such as the apparent size, number of pins, bond pad shapes, size of this device.
Green oil is windowed and is meant that the surface at PCB can cover one deck green oil, short circuit when preventing to weld.The place that needs welding or specific (special) requirements to be electrically connected, green oil is removed in this zone as required by PCB making sheet producer.
When placing test point on via hole, need can select certain via hole of test signal as required, for example can be transmitting terminal or the receiving terminal near signal, and perhaps two ends all need to add.Also can decide the aspect of placing test point by taking all factors into consideration the convenience of choosing signal when testing in addition, for example test point can be placed on the top layer or the bottom of via hole.
The utility model can have selection in the PCB fabric swatch stage, on purpose add test point, make that making sheet producer can be according to the surface mounting component information of test point when making sheet, directly the via hole that adds test point being removed green oil handles, thereby having solved making sheet producer effectively manually selects to remove green oil and easily makes mistakes, and whole removing is removed the via hole green oil, the low problem of production soldering reliability.
The utility model provides a kind of printed circuit board (PCB) again, and described circuit board comprises above-mentioned any one surface mounting component, and described surface mounting component is placed on the test point of printed circuit board (PCB).
Fig. 5 is for after the via hole top layer has been placed the surface mounting component that has top layer opening one side window function, and the via hole schematic diagram through windowing.Wherein the pad of top layer is removed green oil and has exposed Copper Foil, forms test point.
According to the surface mounting component that the utility model provides, can realize the interpolation of test point on the printed circuit board (PCB) by the following method:
1, by eda tool, at first the surface mounting component that will place on via hole is designed to an element that possesses principle logical base and PCB physical package, and the position of placing described surface mounting component is test point.
The principle logical base is meant when the design circuit principle, is used for the corresponding logic diagram of representing each device.Comprise information such as the pin title of name, device of device and number in the logic diagram.When principle design, also can the device of logical base be defined with reference to various parameters such as items.
The PCB physical package is meant on PCB, is used for the corresponding planar graph of representing each true device, and this figure comprises important informations such as the apparent size, number of pins, bond pad shapes, size of this device.
Detailed method is as follows:
(1) elder generation is designed to the form that surface mounting component encapsulates with the PCB physical package of test point, as shown in Figure 6.
This encapsulation is made up of a Surface Mount pad and element frame.The shape of Surface Mount pad and size are defined as consistent with via pad commonly used on the PCB, and the via shape among the PCB is generally circle, and its size needs different sizes according to wiring.
The copper sheet of pad is defined as the top layer that is positioned at pcb board, and is defined in this pad copper sheet position and goes green oil to window.
5 arrive the 6mil place on every side at its pad in addition, add a white oil protective element frame, when effect is to place test point, can maintain a certain distance with other devices or other via hole, get a little during with convenient test, the while also reduces the short circuit chance, the increase reliability.
(2) test point principle logical base is designed to have only logic Figure 61 of a pin, and can define its element with reference to item 62 when principle design, and as shown in Figure 6,63 is principle logical base title among the figure; Element is to use the identification of the device of literal definition to sort out symbol in design with reference to item.
After test point possessed the principle logical base, when principle design, the designer can repeat to call in component library; In addition, when test, the tester can distinguish the signal of being tested according to its element with reference to item; The tester can also choose test point fast and effectively by recognition component with reference to item.
2, in the PCB circuit theory design phase, pre-determine the signal that needs test, more promptly need to verify, the signal of debugging or monitoring performance index.During the generating principle design drawing, from element principle storehouse, call the principle logical base of test point, be connected with the signal of needs tests, simultaneously to test point definition element with reference to item, so that choose needed test point during test.
3, in the PCB fabric swatch stage, Ce Shi signal determines to place the position of test point as required.During multi-layer sheet PCB fabric swatch, have a large amount of signals and switch to internal layer to finish cabling by via hole.All top layer pads all are little copper sheets, are used for welding the pin of device.The connection of signal generally is to draw by the top layer cabling to switch to internal layer via via hole again, finishes connection.
When placing test point on via hole, can select certain via hole of signal as required, for example can be transmitting terminal or the receiving terminal near signal, and perhaps two ends all need to add.Also can decide the aspect of placing test point by taking all factors into consideration the convenience of choosing signal when testing in addition, for example test point can be placed on the top layer or the bottom of via hole.
4, in the PCB fabric swatch stage, from the element tabulation, access the PCB physical package of the test point that needs test signal, place test point in the mode of mask placement device in selected crossing on the hole site.
5, by eda tool, whole part of PCB design generated light paint file.In the making sheet stage, the position of placing test point is painted in the file according to light by making sheet producer, carries out green oil processings of windowing automatically, and after PCB completed, the position of placing test point just formed the little copper sheet of the no green oil covering that can test.
The utility model can have selection in the PCB fabric swatch stage, on purpose add test point, make that making sheet producer can be according to the surface mounting component information of test point when making sheet, directly the via hole that adds test point being removed green oil handles, thereby having solved making sheet producer effectively manually selects to remove green oil and easily makes mistakes, and whole removing is removed the via hole green oil, the low problem of production soldering reliability.
The utility model can also select to add position, number and the aspect of test point as required flexibly, uses flexible way; The utility model need not will be put in order the processing of windowing of plate via hole, and having reduced windows because of large tracts of land causes the probability of solder shorts, thereby has improved the production qualification rate of PCB; Use the utility model, PCB making sheet producer is when handling test point, and is with strong points, handles without selectivity, can paint fileinfo according to PCB light, handles automatically, reduced PCB making sheet and produced the manual situation that green oil is made mistakes of removing.
It should be noted that at last: above embodiment only in order to the explanation the technical solution of the utility model, is not intended to limit; Although the utility model is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the spirit and scope of each embodiment technical scheme of the utility model.
Claims (4)
1. a surface mounting component that is used to be placed on the test point is characterized in that, described surface mounting component comprises the element frame of Surface Mount pad and insulation.
2. surface mounting component according to claim 1 is characterized in that, the shape size of described Surface Mount pad is identical with via pad.
3. surface mounting component according to claim 1 and 2 is characterized in that, described surface mounting component is placed on the top layer or the bottom of via hole.
4. a printed circuit board (PCB) is characterized in that, comprises the described surface mounting component of the arbitrary claim of claim 1-3, and described surface mounting component is placed on the test point of printed circuit board (PCB).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201103902U CN201533447U (en) | 2009-07-30 | 2009-07-30 | Surface mounting device and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201103902U CN201533447U (en) | 2009-07-30 | 2009-07-30 | Surface mounting device and printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201533447U true CN201533447U (en) | 2010-07-21 |
Family
ID=42528845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201103902U Expired - Fee Related CN201533447U (en) | 2009-07-30 | 2009-07-30 | Surface mounting device and printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201533447U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103761100A (en) * | 2014-01-24 | 2014-04-30 | 浪潮(北京)电子信息产业有限公司 | Method and system for quickly drawing wiring prohibition areas around differential-signal via holes |
| CN104411088A (en) * | 2014-12-02 | 2015-03-11 | 青岛歌尔声学科技有限公司 | Anti-dropping bonding pad, circuit board, and circuit board printing method |
| CN112291939A (en) * | 2020-11-09 | 2021-01-29 | 上海裕达实业有限公司 | Mass spectrometer circuit construction method and system based on stepped PCB processing technology |
| CN112698184A (en) * | 2020-12-17 | 2021-04-23 | 珠海杰赛科技有限公司 | Low resistance test method of PCB |
-
2009
- 2009-07-30 CN CN2009201103902U patent/CN201533447U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103761100A (en) * | 2014-01-24 | 2014-04-30 | 浪潮(北京)电子信息产业有限公司 | Method and system for quickly drawing wiring prohibition areas around differential-signal via holes |
| CN104411088A (en) * | 2014-12-02 | 2015-03-11 | 青岛歌尔声学科技有限公司 | Anti-dropping bonding pad, circuit board, and circuit board printing method |
| CN112291939A (en) * | 2020-11-09 | 2021-01-29 | 上海裕达实业有限公司 | Mass spectrometer circuit construction method and system based on stepped PCB processing technology |
| CN112698184A (en) * | 2020-12-17 | 2021-04-23 | 珠海杰赛科技有限公司 | Low resistance test method of PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| DD01 | Delivery of document by public notice |
Addressee: Zhou Jian Document name: Notification of Passing Examination on Formalities Addressee: Zhou Jian Document name: Notification to Go Through Formalities of Registration |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100721 Termination date: 20140730 |
|
| EXPY | Termination of patent right or utility model |