CN204206604U - A kind of slip-off preventing pad and circuit board - Google Patents
A kind of slip-off preventing pad and circuit board Download PDFInfo
- Publication number
- CN204206604U CN204206604U CN201420742266.9U CN201420742266U CN204206604U CN 204206604 U CN204206604 U CN 204206604U CN 201420742266 U CN201420742266 U CN 201420742266U CN 204206604 U CN204206604 U CN 204206604U
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- Prior art keywords
- copper foil
- pad
- oil reservoir
- slip
- solder mask
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a kind of slip-off preventing pad and circuit board, described slip-off preventing pad comprises the Copper Foil be mounted on board substrate, what described Copper Foil was electrically connected with the circuit trace on described board substrate that described Copper Foil comprises the center solder mask that is positioned at central area and be positioned at outer edge area covers oil reservoir, described in cover oil reservoir upper surface and be coated with green oil layer.Slip-off preventing pad of the present utility model, oil reservoir is covered by what whole Copper Foil is divided into the center solder mask that is positioned at central area and is positioned at outer edge area, and be coated with green oil layer at the described oil reservoir upper surface that covers, the fixed-area of large bonding pad and board substrate can be added on the one hand, when the external force that pad is upwards pulled out, discrete units area stressed, can not be pulled out easily, green oil layer has thrust to Copper Foil on the one hand in addition, pad can be further increased by the difficulty of pulling out, in operation difficult drop-off more.
Description
Technical field
The utility model belongs to circuit board technology field, specifically, relates to a kind of slip-off preventing pad and circuit board.
Background technology
PCB (printed circuit board (PCB)) often can use test point when scheduling and planning; often need out to be debugged by pads wire in test point when such as software burning debugging etc. are resolved; if use accidentally; often can run into the whole copper sheet of pad by the situation of pulling out; if pad draws whole circuit board substantially by chip source will be scrapped; higher and the waste resource of risk, increases scheduling and planning difficulty, is unfavorable for reducing costs.
Summary of the invention
The utility model, in order to solve existing pad easily from the problem that circuit board comes off, proposes a kind of slip-off preventing pad, and attachment is more firm, is not easy to come off.
In order to solve the problems of the technologies described above, the utility model is achieved by the following technical solutions:
A kind of slip-off preventing pad, comprise the Copper Foil be mounted on board substrate, described Copper Foil is electrically connected with the circuit trace on described board substrate, and what described Copper Foil comprised the center solder mask that is positioned at central area and was positioned at outer edge area covers oil reservoir, described in cover oil reservoir upper surface and be coated with green oil layer.
Further, described Copper Foil is formed in one structure.
Preferably, described Copper Foil is circular Copper Foil, and described center solder mask is circular, described in cover oil reservoir be annular.
Based on above-mentioned a kind of slip-off preventing pad, the utility model proposes a kind of circuit board simultaneously, the pad comprising board substrate, circuit trace and be electrically connected with described circuit trace, described pad comprises the Copper Foil be mounted on described board substrate, what described Copper Foil comprised the center solder mask that is positioned at central area and was positioned at outer edge area covers oil reservoir, described in cover oil reservoir upper surface and be coated with green oil layer.
Preferably, in order to prevent center solder mask just in case come off from circuit board, whole circuit board is unlikely to scrap, and described circuit trace and the described oil reservoir that covers are electrically connected.Therefore, by scraping the green oil covering oil reservoir surface off, the Copper Foil exposed can use as test point.
Further, described Copper Foil is formed in one structure.
Further again, described Copper Foil is circular Copper Foil, and described center solder mask be circle, described in cover oil reservoir be annular.
Compared with prior art, advantage of the present utility model and good effect are: slip-off preventing pad of the present utility model, oil reservoir is covered by what whole Copper Foil is divided into the center solder mask that is positioned at central area and is positioned at outer edge area, and be coated with green oil layer at the described oil reservoir upper surface that covers, on the one hand, in order to meet the function of pad, ensure that the Copper Foil (Ye Ji center solder mask) of exposed part can use as test point welding, the pad Copper Foil diameter not covering oil reservoir region certainly will be greater than by the diameter of pad Copper Foil in the present embodiment, therefore, the fixed-area of large bonding pad and board substrate can be added, when the external force that pad is upwards pulled out, discrete units area stressed, can not be pulled out easily, in addition on the one hand, green oil is covered by the oil reservoir that covers in outer edge area, integrally green oil is covered with the headroom district be positioned at around Copper Foil, form the green oil layer of whole, green oil layer has thrust to Copper Foil, pad can be further increased by the difficulty of pulling out, difficult drop-off more in operation.
After reading the detailed description of the utility model execution mode by reference to the accompanying drawings, other features of the present utility model and advantage will become clearly.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of example structure schematic diagram of the slip-off preventing pad that the utility model proposes;
Fig. 2 is a kind of example structure schematic diagram of the circuit board that the utility model proposes.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Embodiment one, the present embodiment proposes a kind of slip-off preventing pad, as shown in Figure 1, comprise the Copper Foil 11 be mounted on board substrate, described Copper Foil 11 is electrically connected with the circuit trace be arranged on board substrate, what described Copper Foil 11 comprised the center solder mask 110 that is positioned at central area and was positioned at outer edge area covers oil reservoir 111, described in cover oil reservoir 111 upper surface and be coated with green oil layer.The slip-off preventing pad of the present embodiment, oil reservoir 111 is covered by what whole Copper Foil 11 is divided into the center solder mask 110 that is positioned at central area and is positioned at outer edge area, and be coated with green oil layer (angle reason at described oil reservoir 111 upper surface that covers, not shown), on the one hand, in order to meet the function of pad, ensure that the Copper Foil (Ye Ji center solder mask 110) of exposed part can use as test point welding, because in current technology, pad entirety is exposed, the diameter of the center solder mask 110 of minimum guarantee the present embodiment pad is suitable with the diameter of existing pad, the present embodiment pad also comprises in addition and covers oil reservoir 111, therefore, in the present embodiment the diameter of pad Copper Foil 11 be greater than do not cover oil reservoir region in prior art pad Copper Foil diameter (such as, in circuit board, the Copper Foil diameter of existing pad is 1.0mm, the diameter arranging center solder mask 110 that needs of the present embodiment is 1.0mm, and the width covering oil reservoir 111 is not less than 0.5mm, therefore the diameter being equivalent to the present embodiment pad is 1.5mm, be greater than the diameter 1.0mm of existing pad), increase the fixed-area of pad and board substrate, when the external force that pad is upwards pulled out, the stressed of unit are can be reduced, can not be pulled out easily, in addition on the one hand, green oil is covered by the oil reservoir that covers in outer edge area, it integrally can cover green oil with the headroom district be positioned at around Copper Foil, form the green oil layer of whole, green oil layer has thrust to Copper Foil, pad can be further increased by the difficulty of pulling out, difficult drop-off more in operation.
As a preferred embodiment, in the present embodiment, described Copper Foil 11 is formed in one structure, also be, the center solder mask 110 being positioned at central area and the oil reservoir 111 that covers being positioned at outer edge area are one, and both materials are identical, therefore both are electrical connections, can increase pad like this by the difficulty of pulling out.
In order to improve the versatility of the present embodiment pad, it is made more to be applicable to the PCB of various model, described Copper Foil 11 preferably adopts circular Copper Foil as shown in Figure 1, and conveniently pad solder electronic device or welding test wires, described center solder mask 110 also should be circular mutually, therefore, described in cover oil reservoir 111 for annular, be looped around described center solder mask 110 1 weeks.
Embodiment two, based on a kind of slip-off preventing pad in embodiment one, the present embodiment proposes a kind of circuit board, as shown in Figure 2, the pad comprising board substrate 13, circuit trace 14 and be electrically connected with described circuit trace 14, described pad comprises the Copper Foil 11 be mounted on described board substrate, and what described Copper Foil 11 comprised the center solder mask 110 that is positioned at central area and was positioned at outer edge area covers oil reservoir 111, described in cover oil reservoir 111 upper surface and be coated with green oil layer.As shown in Figure 2, pad is one block of independently Copper Foil 11 in board substrate 13, the surrounding of this Copper Foil 11 is headroom district 15, for Copper Foil 11 is isolated with other copper sheet regions on circuit board, headroom district 15 upper surface is coated with green oil layer equally, therefore, the green oil layer of the green oil layer and headroom district 15 upper surface of preferably covering oil reservoir 111 upper surface is structure as a whole, form the green oil layer of whole, green oil layer has thrust to Copper Foil 11, pad can be further increased by the difficulty of pulling out, in operation difficult drop-off more.
As a preferred embodiment, in the present embodiment, in order to prevent center solder mask 110 just in case come off from circuit board, whole circuit board is unlikely to scrap, and described circuit trace 14 is electrically connected with the described oil reservoir 111 that covers.When pad be subject to external force be unplugged time, generally that exposed copper foil portion divides (Ye Ji center solder mask 110) to be unplugged, covering oil reservoir 111 is still attached on board substrate 13, due to circuit trace 14 with cover oil reservoir 111 and be electrically connected, therefore, this pad also does not directly come off completely, by scraping the green oil covering oil reservoir 111 surface off, the Copper Foil exposed replaces the effect of former center solder mask 110, can continue to use as test point, and then whole circuit board is unlikely to scrap, can also continue to use.
Preferably in the present embodiment, described Copper Foil 11 is formed in one structure, is also, the center solder mask 110 being positioned at central area and the oil reservoir 111 that covers being positioned at outer edge area are one, and both materials are identical, therefore both are electrical connections, can increase pad like this by the difficulty of pulling out.
As a same reason, in order to improve the versatility of circuit board, its solder joint is made to go for the welding of polytype electronic device or test pin, in the present embodiment, described Copper Foil 11 is circular Copper Foil, described center solder mask 110 is circular, and therefore covering oil reservoir 111 part described in remainder is annular.
Certainly; above-mentioned explanation is not to restriction of the present utility model; the utility model is also not limited in above-mentioned citing, the change that those skilled in the art make in essential scope of the present utility model, remodeling, interpolation or replacement, also should belong to protection range of the present utility model.
Claims (7)
1. a slip-off preventing pad, comprise the Copper Foil be mounted on board substrate, described Copper Foil is electrically connected with the circuit trace on described board substrate, it is characterized in that, what described Copper Foil comprised the center solder mask that is positioned at central area and was positioned at outer edge area covers oil reservoir, described in cover oil reservoir upper surface and be coated with green oil layer.
2. slip-off preventing pad according to claim 1, is characterized in that, described Copper Foil is formed in one structure.
3. slip-off preventing pad according to claim 1 and 2, is characterized in that, described Copper Foil is circular Copper Foil, and described center solder mask is circular, described in cover oil reservoir be annular.
4. a circuit board, the pad comprising board substrate, circuit trace and be electrically connected with described circuit trace, described pad comprises the Copper Foil be mounted on described board substrate, it is characterized in that, what described Copper Foil comprised the center solder mask that is positioned at central area and was positioned at outer edge area covers oil reservoir, described in cover oil reservoir upper surface and be coated with green oil layer.
5. circuit board according to claim 4, is characterized in that, described circuit trace and the described oil reservoir that covers are electrically connected.
6. circuit board according to claim 5, is characterized in that, described Copper Foil is formed in one structure.
7. the circuit board according to any one of claim 4-6, is characterized in that, described Copper Foil is circular Copper Foil, and described center solder mask is circular, described in cover oil reservoir be annular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420742266.9U CN204206604U (en) | 2014-12-02 | 2014-12-02 | A kind of slip-off preventing pad and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420742266.9U CN204206604U (en) | 2014-12-02 | 2014-12-02 | A kind of slip-off preventing pad and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204206604U true CN204206604U (en) | 2015-03-11 |
Family
ID=52664509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420742266.9U Active CN204206604U (en) | 2014-12-02 | 2014-12-02 | A kind of slip-off preventing pad and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204206604U (en) |
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2014
- 2014-12-02 CN CN201420742266.9U patent/CN204206604U/en active Active
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |