CN104376938B - Resistance device - Google Patents
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- CN104376938B CN104376938B CN201310351991.3A CN201310351991A CN104376938B CN 104376938 B CN104376938 B CN 104376938B CN 201310351991 A CN201310351991 A CN 201310351991A CN 104376938 B CN104376938 B CN 104376938B
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Abstract
A kind of resistance device, include resistance board, the first metal layer and second metal layer.Resistance board has relative first surface and second surface.The first metal layer is configured on the first surface of resistance board, and the first metal layer includes Part I and Part II, overlapped in the first side of first surface and the second side relative to the first side respectively.Second metal layer is configured on the first metal layer.Second metal layer has the first sensor pad, the second sensor pad, the first electric current pad and the second electric current pad separated each other.First sensor pad and the first electric current pad are located at Part I, and the second sensor pad and the second electric current pad are located at the Part II.
Description
Technical field
The invention relates to a kind of resistance device, in particular to a kind of resistance device applied to current sense.
Background technology
The operation principle of current sensing resistor device (current sensing resistor) be resistance is serially connected with it is negative
In load, and when powering to the load, caused pressure drop on resistance is measured, uses and accurately estimates current strength.Due to electric current sense
The resistance value of device for measuring electric resistance is about milliohm (mOhm) grade, therefore the requirement of relative precision is also compared with general resistance device
The height come (error range is about ± 1% or so).So, it is necessary to preliminary complete in the manufacturing process of current sensing resistor device
Into resistance device carry out resistance measurement to obtain a measuring value, then carry out error op for measuring value and default value, so as to
In the adjustment that appropriate resistance value is carried out to current sensing resistor device.And again to the resistance device amount of progress after the completion of adjustment
Survey, to obtain new measuring value, if new measuring value and the comparison result of default value are the acceptable error range in processing procedure
It is interior, i.e., need not adjust again, if but gap it is excessive, need again to be adjusted resistance device.Dynamic adjustment so repeatedly will
The measuring value of resistance device can be made to level off to default value.
In known techniques, the Kelvin measurement (Kelvin measurement) of 4 points of measurement modes of generally use,
To carry out resistance measurement to current sensing resistor device, the principle of Kelvin measurement will be sketched below.
Fig. 1 is the circuit diagram of Kelvin measurement.Referring to Fig. 1, first by the two of the resistance R of testing resistance device 15
End points tap is four end points 11,12,13,14.Above-mentioned end points 13,14 is connected to source end and the end of fixed current source 16
End, wherein fixed current source 16 can provide fixed current I.On the other hand, respectively with the probe connection end point 11 with high impedance,
12, to measure the voltage difference between two-end-point.Because the input impedance for the probe for being connected to end points 11,12 is relatively higher, herein
Assuming that no electric current passes through end points 11, resistance 15 and end points 12 (i.e. electric current i1=0 and electric current i2=0).In the case, fixed electricity
Stream source 16, end points 14, resistance 15 and end points 13 form primary Ioops.Then measure voltage difference V between end points 11 and end points 12=
V11-V12, through Ohm's law (V=IR), the resistance of testing resistance device 15 can be calculated.
Fig. 2A is the structural representation of traditional current sensing resistor device.Refer to Fig. 2A, current sensing resistor device
100 have resistance board 120 and two electrode slices 110,130.Electrode slice 110,130 is respectively welded in the side of resistance board 120
With opposite side, and electrode slice 110,130 has opening 140,150 respectively.Sensing is defined respectively on electrode slice 110,130
Pad 111,131 and electric current pad 112,132 simultaneously make it as measurement region.In the system of traditional current sensing resistor device 100
During work, electric current I can be applied between electric current pad 112 and electric current pad 132, when fixed current I is turned in current sensing resistor
During device 100, voltage difference (Vdiff=V111-V131) is measured between sensor pad 111 and sensor pad 131.Therefore resistance board 120
Resistance value R1 can pass through R1=Vdiff/I mode obtain.
Fig. 2 B are the resistance device tentatively completed in production line, and the schematic diagram of four end points is measured using measuring instrument.
Four measure end points 161,162,163,164 and are arranged respectively at four regions 171,172,173,174 of electrode slice and square is presented
Shape, as shown in Figure 2 C.163,164 input as fixed current of end points is wherein measured, end points 161,162 is measured and is used as voltage
The output end of measurement.
Then barrel plating processing procedure (barrel plating process) and electricity are carried out to the above-mentioned resistance device tentatively completed
Soldering-tin layer is plated thereon, in order to install resistance device in printed circuit board (PCB) (printed circuit board, abbreviation PCB)
On.
Due to being after completing the resistance value to resistance device and measuring and adjust, soldering-tin layer is just plated on electricity
The problem of hindering on device, therefore resistance device can be caused to produce resistance error.In addition, same series-produced resistance device may
With different resistance values.
The content of the invention
It is an object of the invention to propose a kind of current sensing resistor device, to provide reliable and stable resistance value.
A kind of resistance device, include resistance board, the first metal layer and second metal layer.Resistance board has relative first
Surface and second surface.The first metal layer is configured on the first surface of resistance board.The first metal layer includes Part I and the
Two parts, it is overlapped in the first side of first surface and the second side relative to the first side respectively.Second metal layer is configured at first
On metal level.Second metal layer has the first sensor pad, the second sensor pad, the first electric current pad and the second electric current separated each other
Pad.First sensor pad and the first electric current pad are overlapped overlapped in this second in Part I, the second sensor pad and the second electric current pad
Point.
In one embodiment of this invention, above-mentioned resistance device further includes protective layer, is configured at resistance board, and positioned at the
Between the Part I and Part II of one metal level.
In one embodiment of this invention, the material of above-mentioned protective layer includes epoxy resin.
In one embodiment of this invention, the first electric current pad of above-mentioned second metal layer and position are the first of Part I
The intersection of metal level forms the first cascaded surface, the first metal layer of the second electric current pad of second metal layer and position in Part II
Intersection formed the second cascaded surface, the first cascaded surface is relative to the second cascaded surface.
In one embodiment of this invention, the Part I of above-mentioned the first metal layer has each other respectively with Part II
The 5th relative side and the 6th side, have heptalateral face respectively positioned at the second metal layer of Part I and Part II,
These heptalateral faces are relative with the first cascaded surface and the second cascaded surface respectively, between these the 5th sides and these the 6th sides
With the first spacing, these heptalateral faces have the second spacing, the first spacing with the first cascaded surface and the second cascaded surface respectively
More than the second spacing.
In one embodiment of this invention, above-mentioned resistance device further includes soldering-tin layer, second metal layer system and outside
Circuit board is electrically connected with, and soldering-tin layer is configured on the top surface towards circuit board of second metal layer.
In one embodiment of this invention, above-mentioned resistance board have first side relative to each other and second side and
3rd side relative to each other and the 4th side, first side, second side, the 3rd side and the 4th side are adjacent to respectively
Between first surface and second surface, first side, second side, the 3rd side and the 4th side have first to open respectively
Mouth, the second opening, the 3rd opening and the 4th opening.
In one embodiment of this invention, the width of the first above-mentioned opening is equal to the width of the second opening, the 3rd opening
Width be equal to the 4th opening width.
In one embodiment of this invention, above-mentioned first opening is between the first sensor pad and the first electric current pad, the
Between the second sensor pad and the second electric current pad, the 3rd is open between the first electric current pad and the second electric current pad two openings,
4th opening is between the first sensor pad and the second sensor pad.
In one embodiment of this invention, above-mentioned resistance board has more slit, is adjacent to the 3rd opening and the 4th opening
At least one, slit to semifixed resistor plate resistance value.
In one embodiment of this invention, above-mentioned resistance device further includes auxiliary layer, is configured at the second table of resistance board
On face, auxiliary layer includes overlapped at least one first block part in the first side of resistance board and overlapped in the second side of resistance board
At least one second block part, wherein the first block part separates each other with the second block part.
In one embodiment of this invention, the quantity of above-mentioned at least one first block part and at least one second block part is respectively
Two, these first block parts correspond respectively to the first sensor pad and the first electric current pad, and these second block parts correspond respectively to second
Sensor pad and the second electric current pad.
In one embodiment of this invention, between the first block part and the second block part of above-mentioned auxiliary layer protected seam every
From.
In one embodiment of this invention, the block part of these above-mentioned first is located at resistance board respectively with these second block parts
At corner, and the protective layer being configured between these first block parts and these second block parts is substantially in cross.
In one embodiment of this invention, above-mentioned resistance device further includes support plate, is configured on the second surface of resistance board.
Brief description of the drawings
Fig. 1 is schematically shown as the circuit diagram of Kelvin measurement.
Fig. 2A is schematically shown as the structural representation of traditional current sensing resistor device.
Fig. 2 B are schematically shown as the resistance device tentatively completed in production line, and the signal of four end points is measured using measuring instrument
Figure.
Fig. 2 C are schematically shown as four distribution schematic diagrams measured on end points resistance board.
Fig. 3 A are schematically shown as the dimensional structure diagram of the resistance device described in one embodiment of the invention.
The resistance device that Fig. 3 B are schematically shown as shown in Fig. 3 A omits the dimensional structure diagram of protective layer.
Fig. 4 A are schematically shown as the dimensional structure diagram of the resistance device described in another embodiment of the present invention.
Fig. 4 B are schematically shown as the diagrammatic cross-section along Fig. 4 A AA line segments.
Fig. 5 is schematically shown as the schematic top plan view of the resistance device shown in Fig. 4 A.
Fig. 6 A are schematically shown as the dimensional structure diagram of the resistance device described in another embodiment of the present invention.
The resistance device that Fig. 6 B are schematically shown as shown in Fig. 6 A omits the dimensional structure diagram of protective layer.
Fig. 6 C are schematically shown as the schematic top plan view of the resistance device shown in Fig. 6 B.
Fig. 7 is schematically shown as the dimensional structure diagram of the resistance device described in another embodiment of the present invention.
Fig. 8 is schematically shown as the diagrammatic cross-section along Fig. 7 BB line segments.
Fig. 9 is schematically shown as the elevational schematic view of the resistance device shown in Fig. 7.
Figure 10 is schematically shown as the dimensional structure diagram of the resistance device described in another embodiment of the present invention.
Figure 11 is schematically shown as the diagrammatic cross-section of the resistance device described in another embodiment of the present invention.
Figure 12 is schematically shown as the resistance device of the present invention and the scheme of installation of circuit board.
Figure 13 is schematically shown as the resistance device of the present invention and the scheme of installation of circuit board.
Wherein, description of reference numerals is as follows：
11、12、13、14：End points
15：Resistance device
16：Fixed current source
R：Resistance
i1、i2：Electric current
100：Current sensing resistor device
120：Resistance board
110、130：Electrode slice
140、150：Opening
111、131：Sensor pad
112、132：Electric current pad
2、2a、2b、2c、2d、2e：Resistance device
20：Resistance board
21：The first metal layer
22、22a：Second metal layer
23：Protective layer
24：Soldering-tin layer
25：Auxiliary layer
26：Slit
27：Support plate
200：Current path
201：First surface
202：Second surface
203：Top surface
204：First side
205：Second side
206：3rd side
207：4th side
208：First cascaded surface
209：Second cascaded surface
211：Part I
212：Part II
213：5th side
214：6th side
215：Heptalateral face
221、221a：First sensor pad
222、222a：Second sensor pad
223、223a：First electric current pad
224、224a：Second electric current pad
251、252、253、254：Block part
300：Circuit board
310：Scolding tin pad
2001：First opening
2002：Second opening
2003：3rd opening
2004：4th opening
W1、W2：Spacing
Embodiment
Hereinafter, more detailed description will be done to the present invention by the following example.It is but it is noted that following on this
The description of the preferred embodiment of invention, only as description and the purpose of explanation, it is not used to the limitation present invention.
The stereochemical structure that Fig. 3 A and Fig. 3 B, Fig. 3 A is the resistance device described in one embodiment of the invention is refer to illustrate
Figure.Fig. 3 B are the dimensional structure diagram of the resistance device omission protective layer shown in Fig. 3 A.As shown in Figure 3A, described in the present embodiment
Resistance device 2 include resistance board 20, the first metal layer 21, second metal layer 22 and protective layer 23.Resistance board 20 has phase
To first surface 201 and second surface 202.The first metal layer 21 is configured on the first surface 201 of resistance board 20.Such as Fig. 3 B
Shown, the first metal layer 21 includes Part I 211 and Part II 212.Specifically, this Part I 211 and second
Divide 212 respectively positioned at the second side of the first side of first surface 201 and relative first side so that current path 200 is through resistance board
20 and between the Part I 211 and Part II 212 of the first metal layer 21 conduction (in figure 3b, for clearer table
Reach the Part I 211 of the first metal layer 21 and the structure of Part II 212, therefore Fig. 3 A protective layer 23 is omitted).The
Two metal levels 22 are configured on the first metal layer 21.Second metal layer 22 has the first sensor pad 221, second sense separated each other
Survey pad 222, the first electric current pad 223 and the second electric current pad 224.Specifically, the first sensor pad 221 and the first electric current pad 223
The overlapped Part I 211 in the first metal layer 21, and the second sensor pad 222 and the second electric current pad 224 are overlapped in the first metal
The Part II 212 of layer 21.Protective layer 23 is configured at resistance board 20 and positioned at the Part I 211 and second of the first metal layer 21
Between part 212.The material of protective layer 23 is, for example, epoxy resin, but the present invention is not limited, and has well electrical absolutely
The material of edge characteristic all can be used to as protective layer 23.
It is noted that resistance board 20 described in the present embodiment can by having a resistive material, such as manganese-copper,
The alloy or mixture of nickel-copper or nickel-phosphor, resistance board is made.In addition, the first metal layer 21 described in the present embodiment is, for example,
It is formed at plating collocation micro image etching procedure on resistance board 20.And second metal layer 22, e.g. with plating collocation lithographic
Etch process is formed on the first metal layer 21, but the present invention is not limited.The material of the first metal layer 21 is, for example, copper, the
The material of two metal levels 22 is, for example, copper, nickel/tin or tin.
Fig. 4 A to Fig. 5 are refer to, Fig. 4 A are the stereochemical structure signal of the resistance device described in another embodiment of the present invention
Figure.Fig. 4 B are the diagrammatic cross-section along Fig. 4 A AA line segments.Fig. 5 is the schematic top plan view of the resistance device shown in Fig. 4 A.This reality
The resistance device 2a applied described in example is similar with the resistance device 2 shown in Fig. 3 A, and difference is, the resistance dress described in the present embodiment
Soldering-tin layer 24 can be further included by putting 2a.This soldering-tin layer 24 is configured in second metal layer 22, and specifically, soldering-tin layer 24 is configured at
One sensor pad 221, the second sensor pad 222, the first electric current pad 223 and the second electric current pad 224 top surface 203 on.When this implementation
When resistance device 2a and outside circuit board (not shown in Fig. 3 and Fig. 4) described in example are assembled, second metal layer 22
The first sensor pad 221, the second sensor pad 222, the first electric current pad 223 and the second electric current pad 224 top surface 203 can be towards electricity
Road plate simultaneously is completed to be electrically connected with circuit board.Assembled on the resistance device 2a described in the present embodiment and the circuit board of outside
Detailed description, can be illustrated in follow-up embodiment.
Specifically, when the material of the second metal layer 22 of the resistance device 2 shown in Fig. 3 A is tin, the second gold medal
Belonging to effect caused by layer 22 can be similar to the soldering-tin layer 24 shown in Fig. 4 A.
Fig. 4 A to Fig. 5 are continued referring to, the resistance board 20 of the resistance device 2a described in the present embodiment has toward each other
First side 204 and second side 205 and the 3rd side 206 and the 4th side 207 relative to each other.First side 204,
Two side faces 205, the 3rd side 206 and the 4th side 207 are adjacent between first surface 201 and second surface 202 respectively, and
And there is the first opening 2001, the respectively in first side 204, second side 205, the 3rd side 206 and the 4th side 207
The opening 2003 of two opening the 2002, the 3rd and the 4th opening 2004.First opening 2001 is positioned at the first sensor pad 221 and the first electricity
Between stream pad 223.Second opening 2002 is between the second sensor pad 222 and the second electric current pad 224.3rd opening 2003 is located at
Between first electric current pad 223 and the second electric current pad 224.4th opening 2004 is located at the first sensor pad 221 and the second sensor pad 222
Between.In the present embodiment, the width of the first opening 2001 is, for example, equal to the width of the second opening 2002, the 3rd opening 2003
Width be, for example, be equal to the 4th opening 2004 width, and first opening 2001 or second opening 2002 width be less than the 3rd
The width of the opening 2004 of opening 2003 or the 4th, but the present invention is not limited, and the width of opening can be according to the need of actual conditions
Ask and change, such as：The width of 3rd opening 2003 and the width of the 4th opening 2004 are unequal each other, and the 3rd opening
The depth of 2003 depth and the 4th opening 2004 also can be different from each other, and resistance is adjusted by the difference of A/F and depth
Temperature coefficient (TCR) and resistance value.In addition, the first opening 2001 described in the present embodiment is, for example, relative to the second opening 2002
Set, but the present invention is not limited, and in other embodiments, the first opening 2001 misses one another with the second opening 2002 and set
Put.
Hold it is above-mentioned, by resistance board 20 set first opening 2001, second opening the 2002, the 3rd opening 2003 and
4th opening 2004, when carrying out resistance value measurement with Kelvin measurement, error in measurement is effectively reduced, collocation carries out appropriate
Resistance board finishing, with it is certain obtain with precise resistance value current sensing resistor device.
Fig. 6 A to Fig. 6 C are refer to, Fig. 6 A are the stereochemical structure signal of the resistance device described in another embodiment of the present invention
Figure.Fig. 6 B are the dimensional structure diagram of the resistance device omission protective layer shown in Fig. 6 A.Fig. 6 C are Fig. 6 B schematic top plan view.
As shown in Fig. 6 A to Fig. 6 C, the resistance device 2b described in the present embodiment is similar with the resistance device 2a shown in Fig. 4 A to Fig. 5, different
Put and be, the second metal layer 22a of the resistance device 2b described in the present embodiment the first sensor pad 221a and the first electric current pad
223a forms the first cascaded surface 208 with position in the intersection of the first metal layer 21 of Part I 211.And second metal layer 22a
The second sensor pad 222a and the second electric current pad 224a and the first metal layer 21 positioned at Part II 212 intersection form the
Two cascaded surfaces 209.First cascaded surface 208 and the second cascaded surface 209 are facing each other (in order to become apparent from expressing described in the present embodiment
Resistance device 2b structure, eliminate protective layer 23 this component in fig. 6b).As shown in Figure 6 C, described in the present embodiment
The Part I 211 of the first metal layer 21 has the 5th side 213 and the 6th side relative to each other respectively with Part II 212
214, the second metal layer 22a positioned at Part I 211 and Part II 212 has heptalateral face 215, these heptalaterals respectively
Face 215 is relative with the first cascaded surface 208 and the second cascaded surface 209 respectively.It is noted that these the 5th sides 213 with
There is spacing W1 between 6th side 214, these heptalateral faces 215 respectively with the first cascaded surface 208 and the second cascaded surface 209
Between there is spacing W2, and spacing W1 is more than spacing W2.In other words, above-mentioned spacing W1 represents first of the first metal layer 21
Divide 211 width with Part II 212.Spacing W2 represents the second metal layer with Part II 212 positioned at Part I 211
22a width, that is to say, that the width of the first metal layer 21 is more than second metal layer 22a width.
The structural advantages of resistance device 2b described in the present embodiment are to may insure second metal layer 22a and soldering-tin layer 24
The height certainty of (namely when reflow operation, being used as the electrode with circuit board contacts) is higher than protective layer 23, to prevent
When only subsequently carrying out reflow operation, second metal layer 22a and soldering-tin layer 24 can not develop circuit board (PCB) and cause to set up a monument, be empty
The problems such as weldering.
Specifically, the second metal layer 22a of the resistance device 2b shown in Fig. 6 A to Fig. 6 C width is about
The half of the width of the second metal layer 22 of resistance device 2a shown in Fig. 4 A, and the resistance device shown in Fig. 6 A to Fig. 6 C
The width of 2b the first metal layer 21 is then substantially identical with the width of the first metal layer 21 of the resistance device 2a shown in Fig. 4 A,
That is in the present embodiment, second metal layer 22a width is reduced, and the width of the first metal layer 21 maintains not
Become, and then complete the resistance device 2b structures with cascaded surface as shown in 6A to Fig. 6 C.Above-mentioned the first metal layer 21 and
Two metal level 22a width size relation is only the embodiment therein of the present invention, and the present invention is not limited thereto.
In other embodiments, it can also increase the width of the first metal layer 21, and second metal layer 22a width remains unchanged, and has come
Into similar to the resistance device 2b structures with cascaded surface shown in 6A to Fig. 6 C.
Fig. 7, Fig. 8 and Fig. 9 are refer to, Fig. 7 is that the stereochemical structure of the resistance device described in another embodiment of the present invention is shown
It is intended to.Fig. 8 is the diagrammatic cross-section along Fig. 7 BB line segments.Fig. 9 is the elevational schematic view of the resistance device shown in Fig. 7.Such as Fig. 7
Shown in Fig. 9, the resistance device 2c described in the present embodiment is similar with the resistance device 2a shown in Fig. 4 A to Fig. 5, and difference is,
Resistance device 2c described in the present embodiment further includes the auxiliary layer 25 being configured on the second surface 202 of resistance board 20.This auxiliary
Layer 25 includes the overlapped block part 251,253 in the first side of resistance board 20 and the overlapped block part in the second side of resistance board 20
252、254.These block parts 251,252,253,254 separate each other, to prevent electric current from flowing through these block parts 251,252,253,254
In.Specifically, these block parts 251,252,253,254 correspond respectively to the first sensor pad 221, second of second metal layer 22
Sensor pad 222, the first electric current pad 223 and the second electric current pad 224, that is to say, that these block parts 251,252,253,254 are distinguished
At the corner of the second surface 202 of resistance board 20.Have in addition, these block parts 251,252,253,254 are same each other
Matcoveredn 23, that is to say, that the first surface 201 of the resistance device 2c described in the present embodiment on second surface 202 with all having
Matcoveredn 23, in other embodiments, these block parts 251,252,253,254 of auxiliary layer 25 can also protected seam 23
It is coated on completely wherein.Because these block parts 251,252,253,254 are located at the corner of the second surface 202 of resistance board 20 respectively
Place, therefore, the protective layer 23 on the second surface 202 of resistance board 20 is configured at substantially in cross.
Hold it is above-mentioned, by configuring auxiliary layer 25, that is, the in resistance board 20 on the second surface 202 of resistance board 20
Block part 251,252,253,254 is configured at the corner on two surfaces 202, the efficiency of radiating can be effectively improved, simultaneously for electricity
Hindering the overall structure of device also has the effect of support, and therefore, the material of auxiliary layer 25 preferably selects intensity to have enough supportives
Material and the good material of heat conduction, such as copper metal layer.Specifically, in the present embodiment, the block of auxiliary layer 25
The quantity of part is four, is only the embodiment therein of the present invention, and the present invention is not limited thereto, and the quantity of block part is visually real
The demand of border situation and increased and decreased.
Specifically, the first metal layer 21 of the resistance device 2c described in the present embodiment, second metal layer 22 with
The material of auxiliary layer 25 can be identical or different materials.
Figure 10 is refer to, it is the dimensional structure diagram of the resistance device described in another embodiment of the present invention.This reality
The resistance device 2d applied described in example is similar with the resistance device 2a shown in Fig. 4 A to Fig. 5, and difference is, described in the present embodiment
Resistance device 2d resistance board 20 has more slit 26.In the present embodiment, slit 26 is, for example, to be open 2003 each other with the 3rd
It is adjacent, but the present invention is not limited thereto, and in other embodiments, slit 26 is, for example, adjacent each other with the 4th opening 2004
Connect.It is noted that the mode that the slit 26 described in the present embodiment is mainly cut by laser is cut out on resistance board 20
Slit 26.Because the resistance value of resistance board 20 can change with the length or quantity of slit 26, thus the size of slit 26 or
The number system of quantity determines according to the impedance value to be reached.The selection of position and size through opening may be such that weight
Repetition measurement amount minimize with adjusting the number of impedance.Make letter by opening with the selected of slit 26 and to the structure of resistance board 20
The mode singly corrected, semifixed resistor value will be caused to become to be relatively easy to.
Figure 11 is refer to, it is the diagrammatic cross-section of the resistance device described in another embodiment of the present invention.The present embodiment
Described resistance device 2e is similar with the resistance device 2c shown in Fig. 7 to Fig. 9, and difference is, the resistance described in the present embodiment
Device 2e further includes the support plate 27 being configured between resistance board 20 and auxiliary layer 25.Specifically, support plate 27 is configured at resistance board
20 second surface 202, the major function of support plate 27 is to support resistance board 20, and the material of support plate 27 is, for example, ceramics, but
The present invention is not limited.
Figure 12 and Figure 13 is refer to, it is the resistance device of the present invention and the scheme of installation of circuit board.In Figure 12 and
In Figure 13, illustrated by taking Fig. 4 A to the resistance device 2a shown in Fig. 5 as an example.As shown in figure 12, when actually will be of the present invention
Resistance device 2a when being installed on using back welding process on a circuit board 300, be configured at the first electric current of second metal layer 22
The soldering-tin layer 24 of the electric current pad 224 of pad 223 and second can and the scolding tin pad 310 of circuit board 300 be electrically connected with, due to positioned at the
Protective layer 23 between one electric current pad 223 and the second electric current pad 224 is epoxy resin, and it has anti-welding function, therefore when progress
During back welding process, the solder of melting is not easy to be attached on the surface of protective layer 23, and can be inclined to and stay put, and can effectively prevent from melting
The solder for melting state produces flowing, and makes the first electric current pad 223 and the second electric current pad 224 phenomenon short-circuit caused by being connected to each other
Occur.Similarly, as shown in figure 13, from the point of view of resistance device 2a of the present invention opposite side, the solder of melting is not easy to adhere to
Onto the surface of protective layer 23, and it can be inclined to and stay put between the second sensor pad 222 and circuit board 300, and the second electric current
It between pad 224 and circuit board 300, can effectively prevent the solder of molten condition from producing flowing, and cause the second sensor pad 222 and the
Short-circuit phenomenon occurs between two electric current pads 224.
To sum up institute is old, and the resistance device described in the embodiment of the present invention uses with the electrode that the external circuit board is electrically connected with
Double-deck structure, that is, the first metal layer and the structure of second metal layer described in the various embodiments described above.Due to the second metal
The design that the first sensor pad, the second sensor pad, the first electric current pad and the second electric current pad of layer separate each other, along with the first sense
The protective layer between survey pad, the second sensor pad, the first electric current pad and the second electric current pad with insulation effect (is namely covered in
Protective layer on resistance board) obstructed, and then effectively reduce when being electrically connected with circuit board (as carried out back welding process)
The situation of position skew.In addition, under such structure design, the first sensor pad, the second sensing can be further avoided
The conducting of pad, the first electric current pad and the second electric current pad, and then reduce resistance value error in measurement.
Although the present invention is disclosed as above with preferred embodiment, so it is not limited to the present invention, any this area skill
Art personnel, without departing from the spirit and scope of the invention, when a little change and retouching, therefore the protection model of the present invention can be made
Enclose to work as and be defined depending on appended claims institute defender.
Claims (15)
1. a kind of resistance device, comprising：
One resistance board, there is relative a first surface and a second surface；
One the first metal layer, it is configured on the first surface of the resistance board, the first metal layer includes a Part I and one
Part II, respectively it is overlapped in one first side of the first surface with one relative to first side the second side；And
One second metal layer, it is configured on the first metal layer, and is only located at side of the first surface away from the second surface,
The second metal layer has one first sensor pad separated each other, one second sensor pad, one first electric current pad and one second electricity
Stream pad, first sensor pad are located at the Part I with first electric current pad, and second sensor pad is located at second electric current pad
The Part II.
2. resistance device as claimed in claim 1, further including a protective layer, the resistance board is configured at, and be located at first gold medal
Between the Part I and the Part II for belonging to layer.
3. the material of resistance device as claimed in claim 2, the wherein protective layer includes an epoxy resin.
4. the first electric current pad position of resistance device as claimed in claim 1, the wherein second metal layer is in the Part I
The first metal layer on and formed with the first metal layer it is one stepped, in first electric current pad have one be erected in this first
First cascaded surface of metal level, the second electric current pad position of the second metal layer on the first metal layer of the Part II and
It is stepped with second metal layer formation one, there is second ladder for being erected in the first metal layer in second electric current pad
Face, and first cascaded surface faces second cascaded surface.
5. the Part I of resistance device as claimed in claim 4, the wherein the first metal layer is distinguished with the Part II
All there is one the 5th side and one the 6th side, the 6th side of the Part I and the Part II is medial surface, each other
Face-to-face, the 5th side of the Part I and the Part II is lateral surface, away from each other, positioned at the Part I with being somebody's turn to do
The second metal layer on Part II has a heptalateral face respectively, those heptalateral faces be positioned at the Part I and this
The lateral surface of the second metal layer on two parts, away from each other, the 5th side of the Part I and the 6th side it
Between and the 5th side of the Part II and the 6th side between respectively there is one first spacing, position is on the Part I
The second metal layer the heptalateral face and first cascaded surface between and second metal on the Part II of position
Respectively there is one second spacing between the heptalateral face of layer and second cascaded surface, first spacing is more than second spacing.
6. resistance device as claimed in claim 1, a soldering-tin layer is further included, the second metal layer and outside circuit board electricity
Property connection, and the soldering-tin layer is configured at the one of the second metal layer towards on the top surface of the circuit board.
7. resistance device as claimed in claim 1, the wherein resistance board have a first side and one second relative to each other
Side and one the 3rd side relative to each other and one the 4th side, the first side, the second side, the 3rd side and
4th side is adjacent between the first surface and the second surface respectively, the first side, the second side, the 3rd side
Face and the 4th side have one first opening, one second opening, one the 3rd opening and one the 4th opening respectively.
8. resistance device as claimed in claim 7, width of wherein first opening is equal to the width of second opening, and this
The width of three openings is equal to the width of the 4th opening.
9. resistance device as claimed in claim 7, wherein first opening is positioned at first sensor pad and first electric current pad
Between, for second opening between second sensor pad and second electric current pad, the 3rd opening is located at first electric current pad
Between second electric current pad, the 4th opening is between first sensor pad and second sensor pad.
10. resistance device as claimed in claim 7, the wherein resistance board have more a slit, be adjacent to the 3rd opening with
4th opening at least one, the slit is finely tuning the resistance value of the resistance board.
11. resistance device as claimed in claim 1, further including an auxiliary layer, it is configured on the second surface of the resistance board,
The auxiliary layer include overlapped at least one first block part in first side of the resistance board and it is overlapped in the resistance board this
At least one second block part of two sides, wherein first block part separate each other with second block part.
12. resistance device as claimed in claim 11, wherein at least one first block part and the number of at least one second block part
Amount is respectively two, and those first block parts correspond respectively to first sensor pad and first electric current pad, those second block parts point
Dui Yingyu not second sensor pad and second electric current pad.
13. quilt between first block part and second block part of resistance device as claimed in claim 11, the wherein auxiliary layer
One protective layer is isolated.
14. resistance device as claimed in claim 13, wherein those first block parts are located at the electricity respectively with those second block parts
At the corner of baffle-wall, and the protective layer being configured between those first block parts and those second block parts is substantially in cross.
15. resistance device as claimed in claim 1, further including a support plate, it is configured on the second surface of the resistance board.
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| CN201310351991.3A CN104376938B (en) | 2013-08-13 | 2013-08-13 | Resistance device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310351991.3A CN104376938B (en) | 2013-08-13 | 2013-08-13 | Resistance device |
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| CN104376938A CN104376938A (en) | 2015-02-25 |
| CN104376938B true CN104376938B (en) | 2018-03-13 |
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| US11415601B2 (en) * | 2018-12-21 | 2022-08-16 | Cyntec Co., Ltd. | Resistor having low temperature coefficient of resistance |
| CN109975614B (en) * | 2019-02-18 | 2021-02-23 | 南京隆特集成电路科技有限公司 | Four-wire current sensing resistor and measuring method thereof |
| CN110660551B (en) * | 2019-09-20 | 2021-03-02 | 丽智电子（南通）有限公司 | Method for manufacturing alloy plate metal resistor for electronic product |
| CN110676006A (en) * | 2019-10-24 | 2020-01-10 | 南京萨特科技发展有限公司 | Alloy resistor |
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| US6636143B1 (en) * | 1997-07-03 | 2003-10-21 | Matsushita Electric Industrial Co., Ltd. | Resistor and method of manufacturing the same |
| JPH11329802A (en) * | 1998-05-12 | 1999-11-30 | Murata Mfg Co Ltd | Chip resistor and manufacture thereof |
| JP2000138102A (en) * | 1998-11-04 | 2000-05-16 | Matsushita Electric Ind Co Ltd | Resistor and its manufacture |
| JP2001351801A (en) * | 2000-06-05 | 2001-12-21 | Rohm Co Ltd | Chip resistor |
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