CN104376938A - Resistance device - Google Patents
Resistance device Download PDFInfo
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- CN104376938A CN104376938A CN201310351991.3A CN201310351991A CN104376938A CN 104376938 A CN104376938 A CN 104376938A CN 201310351991 A CN201310351991 A CN 201310351991A CN 104376938 A CN104376938 A CN 104376938A
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Abstract
A resistance device comprises a resistance board, a first metal layer, and a second metal layer. The resistance board has a first surface and a second surface, wherein the first surface and the second surface are relatively arranged. The first metal layer is arranged on the first surface of the resistance board and comprises a first part and a second part, wherein the first part is laminated on the first side of the first surface, and the second part is arranged on the second side, which is relative to the first side, of the first surface. The second metal layer is arranged on the first metal layer, and comprises individually-separated a first sensing pad, a second sensing pad, a first current pad, and a second current pad. The first sensing pad and the first current pad are arranged on the first part, and the second sensing pad and the second current pad are arranged on the second part.
Description
Technical field
The invention relates to a kind of resistance device, in particular to a kind of resistance device being applied to current sense.
Background technology
The operation principle of current sensing resistor device (current sensing resistor) is serially connected with in load by resistance, and when powering to the load, measuring the pressure drop that resistance produces, using and accurately estimate current strength.Resistance value due to current sensing resistor device is about milliohm (mOhm) grade, the height (error range is about about ± 1%) that the resistance device that therefore requirement of precision is also more general relatively comes.So in the manufacture process of current sensing resistor device, need to carry out resistance measurement to obtain a measuring value to the resistance device tentatively completed, error op is carried out again, so that carry out the adjustment of suitable resistance value to current sensing resistor device for measuring value and default value.And again resistance device is measured after adjustment completes, to obtain new measuring value, if the comparison result of new measuring value and default value is in the acceptable error range in processing procedure, namely need not adjust again, if but gap is excessive, then need to adjust resistance device again.Dynamic conditioning so repeatedly can make the measuring value of resistance device level off to default value.
In known techniques, usually adopt 4 Kai Erwen measuring mode to measure method (Kelvinmeasurement), resistance measurement is carried out to current sensing resistor device, below will sketch Kai Erwen and measure ratio juris.
Fig. 1 is the circuit diagram that Kai Erwen measures method.Referring to Fig. 1, is first four end points 11,12,13,14 by the two-end-point tap of the resistance R of testing resistance device 15.Above-mentioned end points 13,14 is connected to source end and the end in fixed current source 16, and wherein fixed current source 16 can provide fixed current I.On the other hand, respectively to have the probe connection end point 11,12 of high impedance, to measure the voltage difference between two-end-point.Because the input impedance being connected to the probe of end points 11,12 is relatively higher, there is no electric current by end points 11, resistance 15 and end points 12 (i.e. current i 1=0 and current i 2=0) in this hypothesis.In the case, fixed current source 16, end points 14, resistance 15 and end points 13 form primary Ioops.Then measure the voltage difference V=V11-V12 between end points 11 and end points 12, through Ohm's law (V=IR), just can calculate the resistance of testing resistance device 15.
Fig. 2 A is the structural representation of traditional current sensing resistor device.Refer to Fig. 2 A, current sensing resistor device 100 has resistance board 120 and two electrode slices 110,130.Electrode slice 110,130 is welded in the side of resistance board 120 and relative side respectively, and electrode slice 110,130 has opening 140,150 respectively.Electrode slice 110,130 defines sensor pad 111,131 and electric current pad 112,132 respectively and makes it as measurement region.In the manufacturing process of traditional current sensing resistor device 100, electric current I can be applied between electric current pad 112 and electric current pad 132, when fixed current I conducting is in current sensing resistor device 100, between sensor pad 111 and sensor pad 131, measure voltage difference (Vdiff=V111-V131).Therefore the mode that the resistance value R1 of resistance board 120 can pass through R1=Vdiff/I is obtained.
Fig. 2 B be the resistance device that tentatively completes at production line, use measuring instrument to measure the schematic diagram of four end points.Four measure end points 161,162,163,164 and are configured in four regions 171,172,173,174 of electrode slice respectively and present rectangle, as shown in Figure 2 C.Wherein measure the input of end points 163,164 as fixed current, measure the output that end points 161,162 measures as voltage.
Then barrel plating processing procedure (barrel plating process) is carried out to the above-mentioned resistance device tentatively completed and plated solder layer thereon, so that install resistance device on printed circuit board (PCB) (printed circuitboard is called for short PCB).
Due to be complete carry out measuring to the resistance value of resistance device with adjust after, just soldering-tin layer is plated on resistance device, therefore can makes the problem of resistance device generation resistance error.In addition, same series-produced resistance device may have different resistance values.
Summary of the invention
The object of the invention is to propose a kind of current sensing resistor device, in order to provide reliable and stable resistance value.
A kind of resistance device, comprises resistance board, the first metal layer and the second metal level.Resistance board has relative first surface and second surface.The first metal layer is configured on the first surface of resistance board.The first metal layer comprises Part I and Part II, respectively overlapped the first side in first surface and the second side relative to the first side.Second metal level is configured on the first metal layer.Second metal level has the first sensor pad separated from one another, the second sensor pad, the first electric current pad and the second electric current pad.First sensor pad and the first electric current pad overlapped in Part I, the second sensor pad and the second electric current pad overlapped in this Part II.
In one embodiment of this invention, above-mentioned resistance device more comprises protective layer, is configured at resistance board, and between the Part I and Part II of the first metal layer.
In one embodiment of this invention, the material of above-mentioned protective layer comprises epoxy resin.
In one embodiment of this invention, first electric current pad of the second above-mentioned metal level and position form the first cascaded surface in the intersection of the first metal layer of Part I, second electric current pad of the second metal level and position form second-order tread in the intersection of the first metal layer of Part II, and the first cascaded surface is relative to second-order tread.
In one embodiment of this invention, the Part I of above-mentioned the first metal layer and Part II have the 5th side respect to one another and the 6th side respectively, the second metal level being positioned at Part I and Part II has heptalateral face respectively, these heptalateral faces are relative with the first cascaded surface and second-order tread respectively, between these the 5th sides and these the 6th sides, there is the first spacing, these heptalateral faces have the second spacing with the first cascaded surface and second-order tread respectively, and the first spacing is greater than the second spacing.
In one embodiment of this invention, above-mentioned resistance device more comprises soldering-tin layer, and the second metal series of strata are electrically connected with outside circuit board, and soldering-tin layer be configured at the second metal level towards on the end face of circuit board.
In one embodiment of this invention, above-mentioned resistance board has the first side respect to one another and the second side and the 3rd side respect to one another and the 4th side, first side, the second side, the 3rd side and the 4th side are adjacent between first surface and second surface respectively, and the first side, the second side, the 3rd side and the 4th side have the first opening, the second opening, the 3rd opening and the 4th opening respectively.
In one embodiment of this invention, the width of the first above-mentioned opening equals the width of the second opening, and the width of the 3rd opening equals the width of the 4th opening.
In one embodiment of this invention, the first above-mentioned opening is between the first sensor pad and the first electric current pad, second opening is between the second sensor pad and the second electric current pad, 3rd opening is between the first electric current pad and the second electric current pad, and the 4th opening is between the first sensor pad and the second sensor pad.
In one embodiment of this invention, above-mentioned resistance board has more slit, be adjacent to the 3rd opening and the 4th opening at least one of them, slit is in order to the resistance value of semifixed resistor plate.
In one embodiment of this invention, above-mentioned resistance device more comprises auxiliary layer, be configured on the second surface of resistance board, auxiliary layer comprises at least one first piece of part of overlapped the first side in resistance board and at least one second piece of part of overlapped the second side in resistance board, wherein first piece of part and second piece of part separated from one another.
In one embodiment of this invention, above-mentioned at least one first piece of part and the quantity of at least one second piece of part are respectively two, these first piece of part corresponds respectively to the first sensor pad and the first electric current pad, and these second piece of part corresponds respectively to the second sensor pad and the second electric current pad.
In one embodiment of this invention, between first piece of part of above-mentioned auxiliary layer and second piece of part, protected seam is isolated.
In one embodiment of this invention, these above-mentioned first piece of part and these second piece of part lay respectively at the corner place of resistance board, and the protective layer be configured between these first piece of part and these second piece of part is roughly in cross.
In one embodiment of this invention, above-mentioned resistance device more comprises support plate, is configured on the second surface of resistance board.
Accompanying drawing explanation
Fig. 1 illustrates the circuit diagram into Kai Erwen measurement method.
Fig. 2 A illustrates the structural representation into traditional current sensing resistor device.
Fig. 2 B illustrates resistance device for tentatively completing at production line, uses measuring instrument to measure the schematic diagram of four end points.
It is four distribution schematic diagrams measuring on end points resistance board that Fig. 2 C illustrates.
Fig. 3 A illustrates the perspective view for the resistance device described in one embodiment of the invention.
Fig. 3 B illustrates the perspective view for the resistance device omission protective layer shown in Fig. 3 A.
Fig. 4 A illustrates the perspective view for the resistance device described in another embodiment of the present invention.
Fig. 4 B illustrates the generalized section into the AA line segment along Fig. 4 A.
Fig. 5 illustrates the schematic top plan view for the resistance device shown in Fig. 4 A.
Fig. 6 A illustrates the perspective view for the resistance device described in another embodiment of the present invention.
Fig. 6 B illustrates the perspective view for the resistance device omission protective layer shown in Fig. 6 A.
Fig. 6 C illustrates the schematic top plan view for the resistance device shown in Fig. 6 B.
Fig. 7 illustrates the perspective view for the resistance device described in another embodiment of the present invention.
Fig. 8 illustrates the generalized section into the BB line segment along Fig. 7.
Fig. 9 illustrates the elevational schematic view for the resistance device shown in Fig. 7.
Figure 10 illustrates the perspective view for the resistance device described in another embodiment of the present invention.
Figure 11 illustrates the generalized section for the resistance device described in another embodiment of the present invention.
Figure 12 illustrates the scheme of installation into resistance device of the present invention and circuit board.
Figure 13 illustrates the scheme of installation into resistance device of the present invention and circuit board.
Wherein, description of reference numerals is as follows:
11,12,13,14: end points
15: resistance device
16: fixed current source
R: resistance
I1, i2: electric current
100: current sensing resistor device
120: resistance board
110,130: electrode slice
140,150: opening
111,131: sensor pad
112,132: electric current pad
2,2a, 2b, 2c, 2d, 2e: resistance device
20: resistance board
21: the first metal layer
22, the 22a: the second metal level
23: protective layer
24: soldering-tin layer
25: auxiliary layer
26: slit
27: support plate
200: current path
201: first surface
202: second surface
203: end face
204: the first sides
205: the second sides
206: the three sides
207: the four sides
208: the first cascaded surfaces
209: second-order tread
211: Part I
212: Part II
213: the five sides
214: the six sides
215: the heptalateral faces
221, the 221a: the first sensor pad
222, the 222a: the second sensor pad
223, the 223a: the first electric current pad
224, the 224a: the second electric current pad
251,252,253,254: block part
300: circuit board
310: scolding tin pad
2001: the first openings
2002: the second openings
2003: the three openings
2004: the four openings
W1, W2: spacing
Embodiment
Below, more detailed description will be done by the following example to the present invention.But it is noted that, the following description about preferred embodiment of the present invention, only as the object described with illustrate, be not used to limit the present invention.
Please refer to the perspective view that Fig. 3 A and Fig. 3 B, Fig. 3 A is the resistance device described in one embodiment of the invention.Fig. 3 B is the perspective view of the resistance device omission protective layer shown in Fig. 3 A.As shown in Figure 3A, the resistance device 2 described in the present embodiment comprises resistance board 20, the first metal layer 21, second metal level 22 and protective layer 23.Resistance board 20 has relative first surface 201 and second surface 202.The first metal layer 21 is configured on the first surface 201 of resistance board 20.As shown in Figure 3 B, the first metal layer 21 comprises Part I 211 and Part II 212.Specifically; this Part I 211 and Part II 212 lay respectively at the first side of first surface 201 and the second side of relative first side; current path 200 is made to conduct (in figure 3b between the Part I 211 and Part II 212 of the first metal layer 21 through resistance board 20; give expression to the Part I 211 of the first metal layer 21 and the structure of Part II 212 in order to clearer, therefore the protective layer 23 of Fig. 3 A is omitted).Second metal level 22 is configured on the first metal layer 21.Second metal level 22 has the first sensor pad 221, second sensor pad 222, first electric current pad 223 and the second electric current pad 224 separated from one another.Specifically, the first sensor pad 221 and the first electric current pad 223 overlapped in the Part I 211 of the first metal layer 21, and the second sensor pad 222 and the second electric current pad 224 overlapped in the Part II 212 of the first metal layer 21.Protective layer 23 is configured at resistance board 20 and between the Part I 211 and Part II 212 of the first metal layer 21.The material of protective layer 23 is such as epoxy resin, but the present invention is not as limit, and the material with the good characteristic that is electrically insulated all can be used to as protective layer 23.
It is worth mentioning that, the resistance board 20 described in the present embodiment can by the resistive material of tool, and the alloy of such as manganese-copper, nickel-copper or nickel-phosphorus or mixture, make resistance board.In addition, the first metal layer 21 described in the present embodiment is such as electroplate collocation micro image etching procedure and be formed on resistance board 20.And the second metal level 22, be such as electroplate collocation micro image etching procedure to be formed on the first metal layer 21, but the present invention is not as limit.The material of the first metal layer 21 is such as copper, and the material of the second metal level 22 is such as copper, nickel/tin or tin.
Please refer to Fig. 4 A to Fig. 5, Fig. 4 A is the perspective view of the resistance device described in another embodiment of the present invention.Fig. 4 B is the generalized section of the AA line segment along Fig. 4 A.Fig. 5 is the schematic top plan view of the resistance device shown in Fig. 4 A.Resistance device 2a described in the present embodiment and the resistance device shown in Fig. 3 A 2 similar, difference is, the resistance device 2a described in the present embodiment can more comprise soldering-tin layer 24.This soldering-tin layer 24 is configured on the second metal level 22, and specifically, soldering-tin layer 24 is configured on the end face 203 of the first sensor pad 221, second sensor pad 222, first electric current pad 223 and the second electric current pad 224.When the resistance device 2a described in the present embodiment assembles with outside circuit board (not showing in Fig. 3 and Fig. 4), the first sensor pad 221, second sensor pad 222, first electric current pad 223 of the second metal level 22 and the end face 203 of the second electric current pad 224 are understood towards circuit board and complete electric connection with circuit board.Carry out the detailed description of assembling about the resistance device 2a described in the present embodiment and outside circuit board, can be described in follow-up embodiment.
Specifically when the material of the second metal level 22 of the resistance device 2 shown in Fig. 3 A is tin, effect that the second metal level 22 produces can be similar to the soldering-tin layer 24 shown in Fig. 4 A.
Continue referring to Fig. 4 A to Fig. 5, the resistance board 20 of the resistance device 2a described in the present embodiment has the first side 204 respect to one another and the second side 205 and the 3rd side 206 respect to one another and the 4th side 207.First side 205, side 204, second, the 3rd side 206 and the 4th side 207 are adjacent between first surface 201 and second surface 202 respectively, and have the first opening 2001, second opening 2002, the 3rd opening 2003 and the 4th opening 2004 respectively in the first side 205, side 204, second, the 3rd side 206 and the 4th side 207.First opening 2001 is between the first sensor pad 221 and the first electric current pad 223.Second opening 2002 is between the second sensor pad 222 and the second electric current pad 224.3rd opening 2003 is between the first electric current pad 223 and the second electric current pad 224.4th opening 2004 is between the first sensor pad 221 and the second sensor pad 222.In the present embodiment, the width of the first opening 2001 is such as the width equaling the second opening 2002, the width of the 3rd opening 2003 is such as the width equaling the 4th opening 2004, and the width of the first opening 2001 or the second opening 2002 is less than the width of the 3rd opening 2003 or the 4th opening 2004, but the present invention is not as limit, the width of opening can change to some extent according to the demand of actual conditions, such as: the width of the 3rd opening 2003 and the width of the 4th opening 2004 unequal each other, and the degree of depth of the degree of depth of the 3rd opening 2003 and the 4th opening 2004 also can be different from each other, by A/F and the degree of depth different come adjusting resistance temperature coefficient (TCR) and resistance value.In addition, the first opening 2001 described in the present embodiment is such as arrange relative to the second opening 2002, but the present invention is not as limit, and in other embodiments, the first opening 2001 and the second opening 2002 miss one another and arrange.
Hold above-mentioned, by arranging the first opening 2001, second opening 2002, the 3rd opening 2003 and the 4th opening 2004 on resistance board 20, when the method that measures with Kai Erwen carries out resistance value measurement, effectively reduce error in measurement, suitable resistance board finishing is carried out in collocation, really to obtain the current sensing resistor device with precise resistance value.
Please refer to Fig. 6 A to Fig. 6 C, Fig. 6 A is the perspective view of the resistance device described in another embodiment of the present invention.Fig. 6 B is the perspective view of the resistance device omission protective layer shown in Fig. 6 A.Fig. 6 C is the schematic top plan view of Fig. 6 B.As shown in Fig. 6 A to Fig. 6 C, resistance device 2b described in the present embodiment and the resistance device 2a shown in Fig. 4 A to Fig. 5 is similar, difference is, the first sensor pad 221a of the second metal level 22a of the resistance device 2b described in the present embodiment and the first electric current pad 223a and position form the first cascaded surface 208 in the intersection of the first metal layer 21 of Part I 211.And the second sensor pad 222a of the second metal level 22a and the second electric current pad 224a forms second-order tread 209 with the intersection of the first metal layer 21 being positioned at Part II 212.First cascaded surface 208 and second-order tread 209 are each other facing (in order to the structure of the resistance device 2b described in clearer expression the present embodiment, eliminating this component of protective layer 23 in fig. 6b).As shown in Figure 6 C, Part I 211 and the Part II 212 of the first metal layer 21 described in the present embodiment have the 5th side 213 respect to one another and the 6th side 214 respectively, be positioned at Part I 211 and have heptalateral face 215 respectively with the second metal level 22a of Part II 212, these heptalateral faces 215 are relative with the first cascaded surface 208 and second-order tread 209 respectively.It is worth mentioning that to have spacing W1 between these the 5th side 213 and the 6th sides 214, these heptalateral faces 215 have spacing W2 respectively and between the first cascaded surface 208 and second-order tread 209, and spacing W1 is greater than spacing W2.In other words, above-mentioned spacing W1 represents the Part I 211 of the first metal layer 21 and the width of Part II 212.Spacing W2 representative is positioned at the width of the second metal level 22a of Part I 211 and Part II 212, and that is, the width of the first metal layer 21 is greater than the width of the second metal level 22a.
The structural advantages of the resistance device 2b described in the present embodiment is to guarantee that the second metal level 22a and soldering-tin layer 24 are (namely when reflow operation; be used as the electrode with circuit board contacts) height inevitable higher than protective layer 23; with prevent follow-up carry out reflow operation time, the second metal level 22a and soldering-tin layer 24 cannot develop circuit board (PCB) and cause setting up a monument, the problem such as missing solder.
Specifically be, the width of the second metal level 22a of the resistance device 2b shown in Fig. 6 A to Fig. 6 C is approximately 1/2nd of the width of second metal level 22 of the resistance device 2a shown in Fig. 4 A, the width of the first metal layer 21 of the resistance device 2b shown in Fig. 6 A to Fig. 6 C is then roughly identical with the width of the first metal layer 21 of the resistance device 2a shown in Fig. 4 A, that is, in the present embodiment, the width of the second metal level 22a is reduced, and the width of the first metal layer 21 remains unchanged, and then the resistance device 2b structure with cascaded surface completed as shown in 6A to Fig. 6 C.Above-mentioned the first metal layer 21 and the width size relation of the second metal level 22a are only an embodiment wherein of the present invention, and the present invention is not as limit.In other embodiments, also can increase the width of the first metal layer 21, and the width of the second metal level 22a remains unchanged, be similar to the resistance device 2b structure with cascaded surface shown in 6A to Fig. 6 C.
Please refer to Fig. 7, Fig. 8 and Fig. 9, Fig. 7 is the perspective view of the resistance device described in another embodiment of the present invention.Fig. 8 is the generalized section of the BB line segment along Fig. 7.Fig. 9 is the elevational schematic view of the resistance device shown in Fig. 7.As shown in Figure 7 to 9, the resistance device 2c described in the present embodiment and the resistance device 2a shown in Fig. 4 A to Fig. 5 is similar, and difference is, the resistance device 2c described in the present embodiment more comprises the auxiliary layer 25 be configured on the second surface 202 of resistance board 20.This auxiliary layer 25 comprises the block part 251,253 of overlapped the first side in resistance board 20 and the block part 252,254 of overlapped the second side in resistance board 20.These block parts 251,252,253,254 separated from one another, flow through in these block parts 251,252,253,254 to prevent electric current.Specifically, these block parts 251,252,253,254 correspond respectively to the first sensor pad 221, second sensor pad 222, first electric current pad 223 and the second electric current pad 224 of the second metal level 22, that is, these block parts 251,252,253,254 lay respectively at the corner place of the second surface 202 of resistance board 20.In addition; these block parts 251,252,253,254 have protective layer 23 each other equally; that is; the first surface 201 of the resistance device 2c described in the present embodiment and second surface 202 all has protective layer 23; in other embodiments, these block parts 251,252,253,254 of auxiliary layer 25 also can be coated on wherein by protected seam 23 completely.Because these block parts 251,252,253,254 lay respectively at the corner place of the second surface 202 of resistance board 20, therefore, the protective layer 23 be configured on the second surface 202 of resistance board 20 is roughly cross.
Hold above-mentioned, auxiliary layer 25 is configured by the second surface 202 of resistance board 20, namely at the corner place configuration block part 251,252,253,254 of the second surface 202 of resistance board 20, effectively can improve the efficiency of heat radiation, the overall structure of resistance device is also had to the effect of support simultaneously, therefore, the material of auxiliary layer 25 should select intensity to have the material of enough supportives and the good material of heat conduction, such as copper metal layer.Specifically in the present embodiment, the quantity of the block part of auxiliary layer 25 is four, be only an embodiment wherein of the present invention, the present invention not as limit, the demand of the visual actual conditions of quantity of block part and increasing and decreasing to some extent.
Specifically the first metal layer 21, second metal level 22 of the resistance device 2c described in the present embodiment can be identical with the material of auxiliary layer 25, also can be different materials.
Please refer to Figure 10, it is the perspective view of the resistance device described in another embodiment of the present invention.Resistance device 2d described in the present embodiment and the resistance device 2a shown in Fig. 4 A to Fig. 5 is similar, and difference is, the resistance board 20 of the resistance device 2d described in the present embodiment has more slit 26.In the present embodiment, slit 26 is such as adjacent to each other with the 3rd opening 2003, but the present invention is not as limit, and in other embodiments, slit 26 is such as adjacent to each other with the 4th opening 2004.It is worth mentioning that, the slit 26 described in the present embodiment mainly cuts out slit 26 by the mode of laser cutting on resistance board 20.Because the resistance value of resistance board 20 can change along with the length of slit 26 or quantity, therefore the size of slit 26 or the number system of quantity decide according to the resistance value that will reach.Duplicate measurements can be made to reduce to minimum with the number of times of adjustment impedance through the position of opening and the selection of size.By making the mode of simple modifications to the structure of resistance board 20 to the selected of opening and slit 26, semifixed resistor value will be made to become comparatively easy.
Please refer to Figure 11, it is the generalized section of the resistance device described in another embodiment of the present invention.The resistance device 2c shown in resistance device 2e and Fig. 7 to Fig. 9 described in the present embodiment is similar, and difference is, the resistance device 2e described in the present embodiment more comprises the support plate 27 be configured between resistance board 20 and auxiliary layer 25.Specifically, support plate 27 is configured at the second surface 202 of resistance board 20, and the major function of support plate 27 is to support resistance board 20, and the material of support plate 27 is such as pottery, but the present invention is not as limit.
Please refer to Figure 12 and Figure 13, it is the scheme of installation of resistance device of the present invention and circuit board.In Figure 12 and Figure 13, be described for the resistance device 2a shown in Fig. 4 A to Fig. 5.As shown in figure 12, when resistance device 2a of the present invention is utilized back welding process and is installed on a circuit board 300 by reality, the soldering-tin layer 24 of the first electric current pad 223 and the second electric current pad 224 that are configured at the second metal level 22 can be electrically connected with the scolding tin pad 310 of circuit board 300, because the protective layer 23 between the first electric current pad 223 and the second electric current pad 224 is epoxy resin, it has anti-welding function, therefore when carrying out back welding process, the solder of melting is not easily attached on the surface of protective layer 23, and can be inclined to and stay put, can effectively prevent the solder of molten condition from producing flowing, and the be connected to each other phenomenon of caused short circuit of the first electric current pad 223 and the second electric current pad 224 is occurred.In like manner; as shown in figure 13; from the opposite side of resistance device 2a of the present invention; the solder of melting is not easily attached on the surface of protective layer 23; and can be inclined to and stay put between the second sensor pad 222 and circuit board 300; and second between electric current pad 224 and circuit board 300, effectively can prevent the solder of molten condition from producing flowing, and cause the phenomenon of short circuit between the second sensor pad 222 and the second electric current pad 224 to occur.
To sum up institute is old, and the electrode that the resistance device described in the embodiment of the present invention and the external circuit board carry out being electrically connected adopts double-deck structure, the structure of the first metal layer namely described in the various embodiments described above and the second metal level.Due to the design that the first sensor pad of the second metal level, the second sensor pad, the first electric current pad and the second electric current pad are separated from one another; add the protective layer (being namely covered in the protective layer on resistance board) between the first sensor pad, the second sensor pad, the first electric current pad and the second electric current pad with insulation effect to intercept, and then effectively reduce the situation that when being electrically connected with circuit board, (as carrying out back welding process) position offsets.In addition, under such structural design, further can avoid the conducting of the first sensor pad, the second sensor pad, the first electric current pad and the second electric current pad, and then reduce resistance value error in measurement.
Although the present invention with preferred embodiment openly as above; so itself and be not used to limit the present invention; any those skilled in the art; not departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore protection scope of the present invention is when being as the criterion depending on accompanying those as defined in claim.
Claims (15)
1. a resistance device, comprises:
One resistance board, has a relative first surface and a second surface;
One the first metal layer, is configured on this first surface of this resistance board, and this first metal layer comprises a Part I and a Part II, and overlapped one first side in this first surface and is relative to the second side of this first side respectively; And
One second metal level, be configured on this first metal layer, this second metal level has one first sensor pad separated from one another, one second sensor pad, one first electric current pad and one second electric current pad, this first sensor pad and this first electric current pad are positioned at this Part I, and this second sensor pad and this second electric current pad are positioned at this Part II.
2. resistance device as claimed in claim 1, more comprises a protective layer, is configured at this resistance board, and between this Part I and this Part II of this first metal layer.
3. resistance device as claimed in claim 2, wherein the material of this protective layer comprises an epoxy resin.
4. resistance device as claimed in claim 1, wherein this first electric current pad of this second metal level and position form one first cascaded surface in the intersection of this first metal layer of this Part I, this the second electric current pad of this second metal level and position form a second-order tread in the intersection of this first metal layer of this Part II, and this first cascaded surface is relative to this second-order tread.
5. resistance device as claimed in claim 4, wherein this Part I of this first metal layer and this Part II have respect to one another 1 the 5th side and one the 6th side respectively, this second metal level being positioned at this Part I and this Part II has a heptalateral face respectively, those heptalateral faces are relative with this first cascaded surface and this second-order tread respectively, between those the 5th sides and those the 6th sides, there is one first spacing, those heptalateral faces have one second spacing with this first cascaded surface and this second-order tread respectively, this first spacing is greater than this second spacing.
6. resistance device as claimed in claim 1, more comprises a soldering-tin layer, and this second metal level is electrically connected with an outside circuit board, and this soldering-tin layer is configured at one of this second metal level towards on the end face of this circuit board.
7. resistance device as claimed in claim 1, wherein this resistance board has one first side respect to one another and one second side and respect to one another 1 the 3rd side and one the 4th side, this first side, this second side, the 3rd side and the 4th side are adjacent between this first surface and this second surface respectively, and this first side, this second side, the 3rd side and the 4th side have one first opening, one second opening, one the 3rd opening and one the 4th opening respectively.
8. resistance device as claimed in claim 7, wherein the width of this first opening equals the width of this second opening, and the width of the 3rd opening equals the width of the 4th opening.
9. resistance device as claimed in claim 7, wherein this first opening is between this first sensor pad and this first electric current pad, this second opening is between this second sensor pad and this second electric current pad, 3rd opening is between this first electric current pad and this second electric current pad, and the 4th opening is between this first sensor pad and this second sensor pad.
10. resistance device as claimed in claim 7, wherein this resistance board has more a slit, be adjacent to the 3rd opening and the 4th opening at least one of them, this slit is in order to finely tune the resistance value of this resistance board.
11. resistance devices as claimed in claim 1, more comprise an auxiliary layer, be configured on this second surface of this resistance board, this auxiliary layer comprises at least one first piece of part of overlapped this first side in this resistance board and at least one second piece of part of overlapped this second side in this resistance board, wherein this first piece of part and this second piece of part separated from one another.
12. resistance devices as claimed in claim 11, wherein the quantity of this at least one first piece of part and this at least one second piece of part is respectively two, those first piece of part corresponds respectively to this first sensor pad and this first electric current pad, and those second piece of part corresponds respectively to this second sensor pad and this second electric current pad.
13. resistance devices as claimed in claim 11, are wherein isolated by a protective layer between this first piece of part of this auxiliary layer and this second piece of part.
14. resistance devices as claimed in claim 13, wherein those first piece of part and those second piece of part lay respectively at the corner place of this resistance board, and this protective layer be configured between those first piece of part and those second piece of part is roughly in cross.
15. resistance devices as claimed in claim 1, more comprise a support plate, are configured on this second surface of this resistance board.
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| CN201310351991.3A CN104376938B (en) | 2013-08-13 | 2013-08-13 | Resistance device |
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| CN109975614A (en) * | 2019-02-18 | 2019-07-05 | 南京隆特集成电路科技有限公司 | A kind of four-wire type current sensing resistor and its measurement method |
| CN110660551A (en) * | 2019-09-20 | 2020-01-07 | 丽智电子（南通）有限公司 | Method for manufacturing alloy plate metal resistor for electronic product |
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