JP2009218317A - Surface-mounted resistor, and its manufacturing method - Google Patents

Surface-mounted resistor, and its manufacturing method Download PDF

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JP2009218317A
JP2009218317A JP2008059076A JP2008059076A JP2009218317A JP 2009218317 A JP2009218317 A JP 2009218317A JP 2008059076 A JP2008059076 A JP 2008059076A JP 2008059076 A JP2008059076 A JP 2008059076A JP 2009218317 A JP2009218317 A JP 2009218317A
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electrode
resistance
electrodes
insulating resin
layer
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Takayuki Yamabe
孝之 山辺
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Koa Corp
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Koa Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface-mounted current-detecting resistor capable of providing an excellent resistance temperature coefficient (T. C. R), by reducing surplus resistance while keeping an excellent heat dissipation property, and to provide its manufacturing method. <P>SOLUTION: This surface mounted current-detecting resistor is provided with: a resistance layer 11 formed of a resistance alloy material; an insulation resin layer 12; a pair of plate body-like undersurface electrodes 13; an undersurface insulation resin material 14 connecting the pair of undersurface electrodes to each other; a pair of upper-surface electrodes 15 fixed to upper surfaces at both ends of the resistance layer; an upper-surface insulation resin material 16 connecting the pair of upper-surface electrodes to each other; and plated layers 18 connecting the upper-surface electrodes to the undersurface electrodes. The undersurface electrode 13 is divided into an inner electrode 13a and an outer electrode 13b along the longitudinal direction of the resistor through the undersurface insulation resin material; recessed parts 17 are formed on side surfaces of the resistance layer and the upper electrodes; and the inner electrodes and the outer electrodes are respectively connected to the upper-surface electrodes by the plated layers divided by the resistance layer and the upper-surface insulation resin material filled in the recessed parts of the side surfaces of the upper-surface electrodes. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、銅ニッケル合金等の抵抗合金材料からなる板体状抵抗体の両端に、銅等の高導電性金属材料からなる板体状の電極を備えた、大電流を高精度で検出することができる面実装形の電流検出用抵抗器に関する。   The present invention has a plate-like electrode made of a highly conductive metal material such as copper at both ends of a plate-like resistor made of a resistance alloy material such as a copper-nickel alloy, and detects a large current with high accuracy. The present invention relates to a surface mount type resistor for current detection.

上記電流検出用抵抗器の一例として、特許文献１に記載された抵抗器が知られている。この抵抗器は、電気的に分離された２つの銅製の支持プレート素子（１０Ａ、１０Ｂ）上に絶縁層（１８）を介して抵抗路としての抵抗合金材料からなる抵抗フィルム（１５）を設け、抵抗フィルム（１５）の両端部を金属層（１６）により支持プレート素子（１０Ａ、１０Ｂ）に接続したものである。支持プレート素子（１０Ａ、１０Ｂ）はプリント回路板の端子に半田付け可能なコンタクト素子として構成されており、それによってプリント回路板への放熱が良好になることが記載されている。   As an example of the current detection resistor, a resistor described in Patent Document 1 is known. This resistor is provided with a resistance film (15) made of a resistance alloy material as a resistance path via an insulating layer (18) on two electrically separated copper support plate elements (10A, 10B), Both ends of the resistance film (15) are connected to the support plate elements (10A, 10B) by the metal layer (16). It is described that the support plate elements (10A, 10B) are configured as contact elements that can be soldered to the terminals of the printed circuit board, thereby improving heat dissipation to the printed circuit board.

しかしながら、上記抵抗器においては、抵抗器への被測定電流の供給および抵抗器両端部に生じる電圧の検出を上記支持プレート素子（１０Ａ、１０Ｂ）にハンダ接続したプリント回路板の端子により行っている。このため、検出される電圧は抵抗フィルム（１５）の両端部を金属層（１６）により支持プレート素子（１０Ａ、１０Ｂ）に接続したものであるので、抵抗温度係数（T.C.R.）が高い金属層（１６）および支持プレート素子（１０Ａ、１０Ｂ）による余剰抵抗の影響を受け、抵抗器全体としての抵抗温度係数（T.C.R.）が悪化するという問題がある。通常の抵抗器では、抵抗値が比較的高いため、これらの余剰抵抗の影響は殆ど生じないが、抵抗値がｍΩオーダの低抵抗値の電流検出用抵抗器においては、余剰抵抗の部分が例えば銅であるとその抵抗温度係数（T.C.R.）は３０００ppm/Ｋ程度であり、上記問題が生じることになる。
特開平７−１９２９０２号公報 However, in the resistor, the current to be measured is supplied to the resistor and the voltage generated at both ends of the resistor is detected by the terminals of the printed circuit board soldered to the support plate elements (10A, 10B). . For this reason, since the detected voltage is obtained by connecting both ends of the resistance film (15) to the support plate elements (10A, 10B) by the metal layer (16), the metal layer having a high resistance temperature coefficient (TCR) ( 16) and the influence of surplus resistance by the support plate elements (10A, 10B), there is a problem that the temperature coefficient of resistance (TCR) of the entire resistor is deteriorated. In ordinary resistors, the resistance value is relatively high, and therefore the influence of these surplus resistances hardly occurs. However, in the current detection resistor having a resistance value of the order of mΩ, the surplus resistance portion is, for example, When copper is used, the temperature coefficient of resistance (TCR) is about 3000 ppm / K, which causes the above problem.
JP-A-7-192902

本発明は上述した事情に基づいてなされたもので、良好な熱放散性を保持しつつ余剰抵抗を低減し、良好な抵抗温度係数（T.C.R.）が得られる面実装形電流検出用抵抗器およびその製造方法を提供することを目的とする。   The present invention has been made based on the above-described circumstances, and reduces the excess resistance while maintaining good heat dissipation, and a surface-mounted current detection resistor capable of obtaining a good resistance temperature coefficient (TCR) and its An object is to provide a manufacturing method.

本発明の面実装形抵抗器は、抵抗合金材料からなる抵抗層と、該抵抗層の下面に固定された絶縁樹脂層と、該絶縁樹脂層の下面に固定された、板体状の高導電性金属材料からなる一対の下面電極と、該一対の下面電極を相互に接続する下面絶縁樹脂材と、前記抵抗層の両端部上面に固定された高導電性金属材料からなる一対の上面電極と、該一対の電極を相互に接続する上面絶縁樹脂材と、前記上面電極と下面電極とを接続するメッキ層とを備え、前記下面電極は、抵抗器の長手方向に沿って内側電極と外側電極とに下面絶縁樹脂材を介して分離され、前記抵抗層と上面電極の側面には凹部を備え、該凹部には前記上面絶縁樹脂材が充填され、前記内側電極と外側電極のそれぞれが、前記抵抗層と上面電極の側面の凹部に充填された上面絶縁樹脂材により分離された前記メッキ層により、前記上面電極に接続されていることを特徴とする。   The surface-mounted resistor according to the present invention includes a resistance layer made of a resistance alloy material, an insulating resin layer fixed to the lower surface of the resistance layer, and a plate-like highly conductive material fixed to the lower surface of the insulating resin layer. A pair of lower surface electrodes made of a conductive metal material, a lower surface insulating resin material connecting the pair of lower surface electrodes to each other, and a pair of upper surface electrodes made of a highly conductive metal material fixed to the upper surfaces of both end portions of the resistance layer; An upper surface insulating resin material for connecting the pair of electrodes to each other; and a plating layer for connecting the upper surface electrode and the lower surface electrode. The lower surface electrode includes an inner electrode and an outer electrode along the longitudinal direction of the resistor. The resistance layer and the top electrode are provided with a recess on the side surface, the recess is filled with the top insulation resin material, and each of the inner electrode and the outer electrode is Top surface insulation filled in the recesses on the sides of the resistance layer and top electrode By the plating layers separated by fat material, characterized in that it is connected to the upper electrode.

また、本発明の面実装形抵抗器の製造方法は、高導電性の金属材料からなる箔材と抵抗合金材料からなる箔材とを接合したクラッド材を形成し、前記クラッド材に、抵抗路パターンと、その両端に上面電極パターンと、該上面電極パターンの側面に凹部とを形成し、前記クラッド材を高導電性の金属材料からなる板体に絶縁樹脂層を介して接合し、前記クラッド材の抵抗路パターン部分の前記高導電性の金属材料からなる箔材をエッチングにより除去して前記クラッド材の両端部に上面電極を分離形成し、前記高導電性の金属材料からなる板体をエッチングにより分離して、抵抗器の長手方向に沿って内側電極と外側電極とからなる下面電極を形成し、前記下面電極の内側電極と外側電極との間、一対の内側電極の間、上面電極の間、および上面電極パターンの側面の凹部とに、絶縁性樹脂材を充填し、各電極間を絶縁分離するとともに接続し、前記内側電極と前記外側電極とをそれぞれ前記上面電極に接続するメッキ層を形成することを特徴とする。ここで、前記メッキ層は、上面電極側から延びるメッキ層と下面電極側から延びるメッキ層とが接合して一体のメッキ層として形成される。   The method for manufacturing a surface-mounted resistor according to the present invention includes forming a clad material obtained by joining a foil material made of a highly conductive metal material and a foil material made of a resistance alloy material, and forming a resistance path on the clad material. Forming a pattern, an upper electrode pattern on both ends thereof, and a recess on a side surface of the upper electrode pattern, and bonding the clad material to a plate made of a highly conductive metal material via an insulating resin layer; The foil material made of the highly conductive metal material in the resistance path pattern portion of the material is removed by etching to separate and form upper surface electrodes at both ends of the clad material, and the plate made of the highly conductive metal material is formed. Separated by etching to form a bottom electrode composed of an inner electrode and an outer electrode along the longitudinal direction of the resistor, between the inner electrode and the outer electrode of the lower electrode, between the pair of inner electrodes, and the upper electrode Between, and An insulative resin material is filled in the concave portion on the side surface of the surface electrode pattern, and the electrodes are insulated and connected, and a plating layer is formed to connect the inner electrode and the outer electrode to the upper electrode, respectively. It is characterized by that. Here, the plating layer is formed as an integral plating layer by joining a plating layer extending from the upper electrode side and a plating layer extending from the lower electrode side.

本発明の面実装形抵抗器によれば、内側電極が外側電極と下面絶縁樹脂材により絶縁分離され、抵抗器側面のメッキ層が上面電極と抵抗層の側面の凹部に充填された上面絶縁樹脂材により絶縁分離されて上面電極に接続されるので、内側電極にて抵抗路両端に生じる被測定電流に対応した電圧を直接検出することができる。これにより、外側電極と抵抗路両端間に生じる余剰抵抗が電圧検出経路に含まれず、正確な被測定電流の電圧検出を行うことができる。
そして、本発明の面実装形抵抗器の製造方法によれば、上面電極と下面電極の内側電極と外側電極とをメッキ層により接続することで、容易に高精度の面実装形電流検出用抵抗器を製造することができる。 According to the surface mount type resistor of the present invention, the upper surface insulating resin in which the inner electrode is insulated and separated by the outer electrode and the lower surface insulating resin material, and the plating layer on the side surface of the resistor is filled in the concave portion on the side surface of the upper surface electrode and the resistance layer. Since it is insulated and separated by the material and connected to the upper surface electrode, it is possible to directly detect the voltage corresponding to the current to be measured generated at both ends of the resistance path by the inner electrode. As a result, surplus resistance generated between the outer electrode and both ends of the resistance path is not included in the voltage detection path, and accurate voltage detection of the current to be measured can be performed.
According to the method for manufacturing a surface-mounted resistor of the present invention, a highly accurate surface-mounted current detecting resistor can be easily connected by connecting the inner electrode and the outer electrode of the upper surface electrode and the lower surface electrode with a plating layer. Can be manufactured.

以下、本発明の面実装形抵抗器およびその製造方法の実施形態について、添付図面を参照して説明する。なお、各図中、同一または相当する部材または要素には、同一の符号を付して説明する。   Embodiments of a surface-mounted resistor and a method for manufacturing the same according to the present invention will be described below with reference to the accompanying drawings. In addition, in each figure, the same code | symbol is attached | subjected and demonstrated to the same or equivalent member or element.

この面実装形抵抗器１０は、図１（ａ）の長手方向の中央部断面図（図１（ｄ）のAA線断面図）および図１（ｂ）の抵抗層面の断面図（図１（ｃ）のBB線断面図）に示すように、銅ニッケル、ニクロム、マンガニン、鉄クロムなどの低抵抗率で且つ抵抗温度係数（T.C.R.）が良好な抵抗合金材料からなる箔状の抵抗層１１の下面に絶縁樹脂層１２が固定され、さらに該絶縁樹脂層１２の下面に板体状の銅等の高導電性金属材料からなる一対の下面電極１３，１３が固定されている。下面電極１３，１３は、中央の下面絶縁樹脂材１４ａを介して分離され、下面電極１３，１３のそれぞれは、抵抗器の長手方向に沿って内側に配置された内側電極１３ａと外側に配置された外側電極１３ｂとに下面絶縁樹脂材１４ｂを介して絶縁分離されている。   This surface-mounted resistor 10 includes a longitudinal sectional view in the longitudinal direction of FIG. 1A (a sectional view taken along the line AA in FIG. 1D) and a sectional view of the resistive layer surface in FIG. As shown in (c) BB cross-sectional view), a foil-like resistance layer 11 made of a resistance alloy material having a low resistivity and a good temperature coefficient of resistance (TCR) such as copper nickel, nichrome, manganin, iron chrome, etc. An insulating resin layer 12 is fixed to the lower surface, and a pair of lower surface electrodes 13 and 13 made of a highly conductive metal material such as plate-like copper are fixed to the lower surface of the insulating resin layer 12. The lower surface electrodes 13 and 13 are separated via a central lower surface insulating resin material 14a, and each of the lower surface electrodes 13 and 13 is disposed on the inner side and the outer side on the inner side along the longitudinal direction of the resistor. The outer electrode 13b is insulated and separated through the lower surface insulating resin material 14b.

箔状の抵抗層１１の両端部上面には銅等の高導電性金属材料からなる一対の上面電極１５，１５が固定され、さらに箔状の抵抗層１１の抵抗路部１１ｂの上面には一対の上面電極１５，１５を相互に絶縁分離しつつ接続する上面絶縁樹脂材１６が配置されている。図１（ｂ）に示すように、抵抗層１１は、両端の電極部１１ａとその間の抵抗路部１１ｂとから構成され、一枚の抵抗板体となっている。両端の電極部１１ａ，１１ａの上面には、上面電極１５，１５が固定され、抵抗路部１１ｂは例えば図示するような所要抵抗値に対応した抵抗路パターンとなっていて、抵抗層１１の抵抗路パターンが存在しない部分には上面絶縁樹脂材１６が充填されている。また、抵抗層１１の両端の電極部１１ａ，１１ａの両側面に凹部１７を備え、上面絶縁樹脂材１６が充填されている。なお、図１（ｃ）の長手方向側面部断面図（図１（ｄ）のCC線断面図）に示すように、上面電極１５，１５にも抵抗層１１と同じ位置に凹部１７を備え、上面絶縁樹脂材１６が充填されている。   A pair of upper surface electrodes 15, 15 made of a highly conductive metal material such as copper is fixed to the upper surface of both end portions of the foil-like resistance layer 11, and a pair of upper surface electrodes 15 b made of a highly conductive metal material such as copper are fixed to the upper surface of the resistance path portion 11 b of the foil-like resistance layer 11. An upper surface insulating resin material 16 that connects the upper surface electrodes 15 and 15 while being insulated and separated from each other is disposed. As shown in FIG. 1B, the resistance layer 11 is composed of an electrode portion 11a at both ends and a resistance path portion 11b between them, and is a single resistor plate. Upper surface electrodes 15 and 15 are fixed to the upper surfaces of the electrode portions 11a and 11a at both ends, and the resistance path portion 11b has a resistance path pattern corresponding to a required resistance value as shown in the figure, for example. The upper surface insulating resin material 16 is filled in a portion where the road pattern does not exist. Further, concave portions 17 are provided on both side surfaces of the electrode portions 11a and 11a at both ends of the resistance layer 11, and the upper surface insulating resin material 16 is filled therewith. As shown in the longitudinal side cross-sectional view in FIG. 1 (c) (CC cross-sectional view in FIG. 1 (d)), the top electrodes 15 and 15 are also provided with a recess 17 at the same position as the resistive layer 11, The upper surface insulating resin material 16 is filled.

従って、図１（ｂ）（ｃ）に示すように、抵抗層１１の電極部１１ａと上面電極１５とには、抵抗器側面に上面絶縁樹脂材が充填された凹部１７を備え、これらの側面のみにおいてメッキ層１８ａと１８ｂとが図１（ｅ）に示すように絶縁分離されている。これに対して、下面電極の内側電極１３ａと外側電極１３ｂとの間は、抵抗器の幅方向の全幅に下面絶縁樹脂材１４ｂが充填され、完全に絶縁分離されている。   Accordingly, as shown in FIGS. 1B and 1C, the electrode portion 11a and the upper surface electrode 15 of the resistance layer 11 are provided with the concave portion 17 filled with the upper surface insulating resin material on the resistor side surface, and these side surfaces are provided. As shown in FIG. 1E, the plating layers 18a and 18b are insulated and separated. On the other hand, between the inner electrode 13a and the outer electrode 13b of the lower surface electrode, the lower surface insulating resin material 14b is filled in the entire width in the width direction of the resistor and is completely insulated and separated.

図１（ｄ）（ｅ）（ｆ）に示すように、この抵抗器１０においては、下面電極１３、抵抗層の電極部１１ａおよび上面電極１５のすべての露出表面がメッキ層１８により被覆されている。メッキ層１８は、Ｃｕ，Ｎｉ，Ｓｎの３層のメッキ層からなる。ここで、メッキ層１８ａと１８ｂとが下面絶縁樹脂材１４ｂおよび凹部１７に充填された絶縁樹脂材１６により絶縁分離され、下面電極１３の内側電極１３ａが側面のメッキ層１８ａにより上面電極１５に接続され、下面電極１３の外側電極１３ｂが側面および端面のメッキ層１８ｂにより上面電極１５に接続される。   As shown in FIGS. 1D, 1E, and 1F, in this resistor 10, all exposed surfaces of the lower surface electrode 13, the resistance layer electrode portion 11a, and the upper surface electrode 15 are covered with the plating layer 18. Yes. The plating layer 18 is composed of three plating layers of Cu, Ni, and Sn. Here, the plating layers 18a and 18b are insulated and separated by the lower surface insulating resin material 14b and the insulating resin material 16 filled in the recess 17, and the inner electrode 13a of the lower surface electrode 13 is connected to the upper surface electrode 15 by the side plating layer 18a. Then, the outer electrode 13b of the lower electrode 13 is connected to the upper electrode 15 by the plating layer 18b on the side surface and the end surface.

実装時には、図２（ａ）に示すように、プリント基板等の実装基板上に、配線パッドである電流端子パッド２１と電圧端子パッド２２とを準備し、電流端子パッド２１に面実装形抵抗器１０の外側電極１３ｂを接続し、電圧端子パッド２２に内側電極１３ａを接続する。なお、電流端子パッド２１には、被測定電流の供給源に接続する配線端子２１ａを備え、電圧端子パッド２２には、検出電圧の測定装置に接続する配線端子２２ａを備える。従って、図２（ｂ）に示すように、面実装形抵抗器１０が実装基板２０に実装される。   At the time of mounting, as shown in FIG. 2A, a current terminal pad 21 and a voltage terminal pad 22 which are wiring pads are prepared on a mounting board such as a printed board, and a surface mount type resistor is provided on the current terminal pad 21. 10 outer electrodes 13 b are connected, and the inner electrode 13 a is connected to the voltage terminal pad 22. The current terminal pad 21 includes a wiring terminal 21a connected to the supply source of the current to be measured, and the voltage terminal pad 22 includes a wiring terminal 22a connected to the detection voltage measuring device. Therefore, as shown in FIG. 2B, the surface mount type resistor 10 is mounted on the mounting substrate 20.

実装状態では、一方の電流端子パッド２１から被測定電流が抵抗器１０の外側電極１３ｂに流入し、端面および側面のメッキ層１８ａと上面電極１５を通り抵抗層１１の一方に流入する。抵抗層１１の他方から流出する被測定電流は、上面電極１５と端面および側面のメッキ層１８ａと外側電極１３ｂを通り、他方の電流端子パッド２１に流出する。この電流経路において、抵抗層１１の抵抗路部１１ｂの抵抗値と電流の積に対応した電圧が抵抗路部１１ｂの両端部に発生し、この電圧を検出電圧として上面電極１５とメッキ層１８ｂと内側電極１３ａとを通して、電圧端子パッド２２の配線端子２２ｂから検出することができる。   In the mounted state, the current to be measured flows from one current terminal pad 21 into the outer electrode 13 b of the resistor 10, and flows into one of the resistance layers 11 through the plating layer 18 a and the upper surface electrode 15 on the end surface and side surface. The current to be measured flowing out from the other side of the resistance layer 11 passes through the upper surface electrode 15, the end surface and the side plating layer 18 a, and the outer electrode 13 b, and then flows out to the other current terminal pad 21. In this current path, a voltage corresponding to the product of the resistance value of the resistance path portion 11b of the resistance layer 11 and the current is generated at both ends of the resistance path portion 11b, and this voltage is used as a detection voltage to detect the top electrode 15 and the plating layer 18b. It can be detected from the wiring terminal 22b of the voltage terminal pad 22 through the inner electrode 13a.

従って、本発明の面実装形抵抗器１０においては、被測定電流は電流端子パッド２１、外側電極１３ｂ、メッキ層１８ａ、上面電極１５から抵抗層１１に流れ、この部分の抵抗が余剰抵抗となるが、メッキ層１８ｂと内側電極１３ｂとから構成される電圧検出経路には被測定電流は流れない。このため、内側電極１３ａとメッキ層１８ｂと上面電極１５とからなる抵抗路部１１ｂの両端に配置された電圧検出経路からは、被測定電流と抵抗路部１１ｂの抵抗値との積に対応した電圧のみが検出され、余剰抵抗に対応した電圧が含まれず、正確な被測定電流の電圧検出を行うことができる。   Therefore, in the surface-mounted resistor 10 of the present invention, the current to be measured flows from the current terminal pad 21, the outer electrode 13b, the plating layer 18a, and the upper surface electrode 15 to the resistance layer 11, and the resistance of this portion becomes an excess resistance. However, no current to be measured flows through the voltage detection path constituted by the plating layer 18b and the inner electrode 13b. For this reason, from the voltage detection path arranged at both ends of the resistance path portion 11b composed of the inner electrode 13a, the plating layer 18b, and the upper surface electrode 15, it corresponds to the product of the current to be measured and the resistance value of the resistance path portion 11b. Only the voltage is detected, the voltage corresponding to the surplus resistance is not included, and accurate voltage detection of the current to be measured can be performed.

一例として、長さ６．３ｍｍ×幅３．２ｍｍのサイズの面実装形抵抗器について、シミュレーションを行った結果について説明する。メッキ層のＣｕ厚さを０．０５ｍｍとし、その抵抗温度係数（T.C.R.）を３０００ppm/Kとし、その他を無視してシミュレーションを行った。その結果、従来の構造では、２５℃抵抗値８．６０ｍΩで抵抗温度係数（T.C.R.）３９ppm/Kであるのに対し、本発明の構造では、２５℃抵抗値８．５２ｍΩで抵抗温度係数（T.C.R.）１１ppm/Kという結果が得られ、本発明の構造の有効性を確認できた。なお、面実装形抵抗器のサイズがさらに小さくなるにつれ、その効果はメッキ層の影響が大きくなるため、より顕著になると考えられる。   As an example, a simulation result of a surface-mount resistor having a size of 6.3 mm long × 3.2 mm wide will be described. The simulation was performed by setting the Cu thickness of the plating layer to 0.05 mm, the resistance temperature coefficient (T.C.R.) to 3000 ppm / K, and ignoring others. As a result, the conventional structure has a resistance temperature coefficient (TCR) of 39 ppm / K at a resistance value of 8.60 mΩ at 25 ° C., whereas the resistance temperature coefficient (TCR) at a resistance value of 25 ° C. of 8.52 mΩ in the structure of the present invention. ) A result of 11 ppm / K was obtained, confirming the effectiveness of the structure of the present invention. Note that as the size of the surface-mounted resistor is further reduced, the effect is considered to be more prominent because the influence of the plating layer is increased.

次に、本発明の面実装形抵抗器の製造方法の一例について説明する。まず、図３（ａ）に示すように、２０〜１００μｍの厚さのＣｕ箔材１５ｍと、４０〜１００μｍの厚さのＮｉ−Ｃｒ系合金箔材１１ｍとを圧接し、クラッド材３０を形成する。なお、図の左欄は製品１個分の断面図であり、中欄は製品１個分の平面図であり、右欄は多数個取りシートの平面図である。   Next, an example of a method for manufacturing the surface-mounted resistor according to the present invention will be described. First, as shown in FIG. 3A, a Cu foil material 15 m having a thickness of 20 to 100 μm and a Ni—Cr alloy foil material 11 m having a thickness of 40 to 100 μm are pressed to form a clad material 30. To do. In the figure, the left column is a sectional view of one product, the middle column is a plan view of one product, and the right column is a plan view of a multi-sheet.

次に、図３（ｂ）に示すように、クラッド材３０に両面フォトエッチングにより、抵抗路パターン１１ｂと、その両端に上面電極パターン１１ａと、該上面電極パターンの側面に凹部１７等を形成する。なお、右欄のシートにて点線で囲んだ１区画が中欄の製品１個分に相当する。次に、図３（ｃ）に示すように、厚さ２００μｍ程度のＣｕベース材１３ｍをエポキシ系接着剤１２ｍを用いて、パターン形成したクラッド材３０に貼り合わせる。これにより、クラッド材３０およびＣｕベース材１３ｍを固定した絶縁樹脂層１２ｍが形成される。なお、絶縁樹脂層１２ｍは４０〜１００μｍ程度の厚さに形成する。   Next, as shown in FIG. 3B, the resistance path pattern 11b, the upper surface electrode pattern 11a at both ends thereof, and the recesses 17 and the like are formed on the side surfaces of the upper surface electrode pattern by double-sided photoetching on the clad material 30. . One section surrounded by a dotted line in the sheet on the right column corresponds to one product in the middle column. Next, as shown in FIG. 3C, a Cu base material 13m having a thickness of about 200 μm is bonded to the patterned clad material 30 using an epoxy adhesive 12m. Thereby, the insulating resin layer 12m to which the clad material 30 and the Cu base material 13m are fixed is formed. The insulating resin layer 12m is formed to a thickness of about 40 to 100 μm.

次に、抵抗層１１の抵抗路部１１ｂの上部のＣｕ箔材をエッチングにより除去することで、抵抗路部１１ｂを露出させるとともに、上面電極１５，１５を分離して形成する。このとき、抵抗路部１１ｂの厚さを研磨で調整することで、抵抗値のトリミングを行うようにしてもよい。   Next, by removing the Cu foil material on the resistance path portion 11b of the resistance layer 11 by etching, the resistance path portion 11b is exposed and the upper surface electrodes 15 and 15 are formed separately. At this time, the resistance value may be trimmed by adjusting the thickness of the resistance path portion 11b by polishing.

次に、図４（ａ）に示すように、裏面側のＣｕベース材１３ｍにエッチング処理を絶縁樹脂層１２に到達するように施し、下面電極１３の内側電極１３ａと外側電極１３ｂとを絶縁分離して形成する。そして、図４（ｂ）に示すように、スクリーン印刷により下面絶縁樹脂材ペーストをエッチング処理を施した空間に充填し、加温硬化することで、内側電極間に下面絶縁樹脂材１４ａを形成し、内側電極と外側電極との間に下面絶縁樹脂材１４ｂを形成する。   Next, as shown in FIG. 4 (a), the Cu base material 13m on the back surface side is etched so as to reach the insulating resin layer 12, and the inner electrode 13a and the outer electrode 13b of the lower surface electrode 13 are insulated and separated. To form. Then, as shown in FIG. 4B, the bottom insulating resin material paste 14a is formed between the inner electrodes by filling the etching-treated space with the bottom insulating resin material paste by screen printing and heating and curing. The lower surface insulating resin material 14b is formed between the inner electrode and the outer electrode.

次に、図４（ｃ）に示すように、表面側にスクリーン印刷により、上面絶縁樹脂材ペーストを抵抗路１１ｂを完全に被覆し、且つ凹部１７を埋め込むように充填し、加温硬化することで、それぞれに上面絶縁樹脂材１６を形成する。そして、図４（ｄ）に示すように、切断線Ｓにより分割または切断することで、個々の製品に対応した面実装形抵抗器が得られる。なお、マーキング等は個々の製品に分割後、または多数個取りシートの段階で行うようにしても良い。   Next, as shown in FIG. 4 (c), the upper surface insulating resin material paste is completely covered with the resistance path 11b and embedded in the recesses 17 by screen printing on the surface side, and is heated and cured. Then, the upper surface insulating resin material 16 is formed on each. And as shown in FIG.4 (d), the surface mount type resistor corresponding to each product is obtained by dividing | segmenting or cut | disconnecting by the cutting line S. FIG. Note that the marking or the like may be performed after being divided into individual products or at the stage of multi-sheets.

次に、図５を参照してメッキ層の形成について説明する。メッキ層１８は、Ｃｕ，Ｎｉ，Ｓｎの３層のメッキ層として、電解メッキにより形成する。ここで、Ｃｕメッキ層を絶縁樹脂層１２の厚さの半分以上とすると、上面電極側から延びるメッキ層と下面電極側から延びるメッキ層とが接合して一体のメッキ層１８として形成される。   Next, formation of the plating layer will be described with reference to FIG. The plating layer 18 is formed by electrolytic plating as a plating layer of three layers of Cu, Ni, and Sn. Here, if the Cu plating layer is at least half the thickness of the insulating resin layer 12, the plating layer extending from the upper surface electrode side and the plating layer extending from the lower surface electrode side are joined to form an integrated plating layer 18.

すなわち、図５（ａ）に示す段階が、図４（ｄ）で、多数個取りシートを切断・分割して、個々の製品にした段階である。この段階で、メッキ処理を少し行うと、絶縁物である絶縁樹脂層１２の表面にはメッキは付かないが、抵抗合金からなる抵抗層１１，Ｃｕからなる下面電極１３および上面電極１５にはメッキは付着する（図５（ｂ）参照）。さらに、メッキ厚が厚くなると、徐々に絶縁樹脂層の露出面積が減る（図５（ｃ）参照）。そして、Ｃｕメッキ層の厚さが絶縁樹脂層１２の厚さの半分以上となると、上面電極１５側から延びるメッキ層と下面電極１３側から延びるメッキ層とが接合して、一体のメッキ層１８として形成される（図５（ｄ）参照）。このメッキ層形成により、本発明の面実装形抵抗器が完成する。   That is, the stage shown in FIG. 5A is the stage where the multi-sheet is cut and divided into individual products in FIG. 4D. At this stage, if the plating process is performed a little, the surface of the insulating resin layer 12 that is an insulator is not plated, but the resistance layer 11 made of a resistance alloy, the lower electrode 13 made of Cu, and the upper electrode 15 are plated. Adheres (see FIG. 5B). Furthermore, as the plating thickness increases, the exposed area of the insulating resin layer gradually decreases (see FIG. 5C). Then, when the thickness of the Cu plating layer becomes more than half of the thickness of the insulating resin layer 12, the plating layer extending from the upper surface electrode 15 side and the plating layer extending from the lower surface electrode 13 side are joined, and the integrated plating layer 18 is joined. (See FIG. 5D). By this plating layer formation, the surface mount type resistor of the present invention is completed.

従って、上記面実装形抵抗器の製造工程によれば、上面電極と下面電極とを接続するメッキ層を絶縁樹脂層の厚さの半分以上にすることで、容易に絶縁樹脂層をまたぐメッキ層を形成することができ、工程を簡素化しつつ、低い抵抗温度係数（T.C.R.）が得られる面実装形抵抗器を提供することができる。   Therefore, according to the manufacturing process of the above surface mount type resistor, the plating layer that easily crosses the insulating resin layer by making the plating layer connecting the upper surface electrode and the lower surface electrode more than half the thickness of the insulating resin layer. Thus, it is possible to provide a surface mount type resistor that can obtain a low temperature coefficient of resistance (TCR) while simplifying the process.

これまで本発明の一実施形態について説明したが、本発明は上述の実施形態に限定されず、その技術的思想の範囲内において種々異なる形態にて実施されてよいことは言うまでもない。   Although one embodiment of the present invention has been described so far, it is needless to say that the present invention is not limited to the above-described embodiment, and may be implemented in various forms within the scope of the technical idea.

（ａ）は本発明の一実施形態の面実装形抵抗器を示すその長手方向の中央部断面図（図１（ｄ）のAA線断面図）であり、（ｂ）は抵抗層面の断面図（図１（ｃ）のBB線断面図）であり、（ｃ）は面実装形抵抗器の長手方向側面部断面図（図１（ｄ）のCC線断面図）であり、（ｄ）は面実装形抵抗器の上面図であり、（ｅ）は面実装形抵抗器の側面図であり、（ｆ）は面実装形抵抗器の下面図である。(A) is the center part sectional drawing (AA sectional view of FIG.1 (d)) which shows the surface mounted resistor of one Embodiment of this invention in the longitudinal direction, (b) is sectional drawing of a resistance layer surface FIG. 1C is a cross-sectional view taken along the line BB in FIG. 1C, FIG. 1C is a cross-sectional view taken along the side surface in the longitudinal direction of the surface-mounted resistor, and FIG. It is a top view of a surface-mounted resistor, (e) is a side view of the surface-mounted resistor, and (f) is a bottom view of the surface-mounted resistor. その実装状態を示す図であり、（ａ）は電流端子パッドと電圧端子パッドを示す平面図であり、（ｂ）は実装状態の面実装形抵抗器の側面図である。It is a figure which shows the mounting state, (a) is a top view which shows a current terminal pad and a voltage terminal pad, (b) is a side view of the surface mounted resistor of a mounting state. 本発明の面実装形抵抗器の製造方法を示す図であり、図の左欄は製品１個分の断面図であり、中欄は製品１個分の平面図であり、右欄は多数個取りシートの平面図である。It is a figure which shows the manufacturing method of the surface mount-type resistor of this invention, The left column of a figure is sectional drawing for one product, A middle column is a top view for one product, A right column is many pieces It is a top view of a taking sheet. 同じく、本発明の面実装形抵抗器の製造方法を示す図であり、図の左欄は製品１個分の断面図であり、中欄は製品１個分の平面図であり、右欄は多数個取りシートの平面図である。Similarly, it is a figure which shows the manufacturing method of the surface mount-type resistor of this invention, The left column of a figure is sectional drawing for one product, A middle column is a top view for one product, A right column is a figure. It is a top view of a multi-sheet. そのメッキの段階の説明図である。It is explanatory drawing of the step of the plating.

符号の説明Explanation of symbols

１０ 面実装形抵抗器
１１ 抵抗層
１２ 絶縁樹脂層
１３ 下面電極
１３ａ 内側電極
１３ｂ 外側電極
１４ａ，１４ｂ 下面絶縁樹脂層
１５ 上面電極
１６ 上面絶縁樹脂層
１７ 凹部
１８，１８ａ，１８ｂ メッキ層
２０ 実装基板
２１ 電流供給端子
２２ 電圧検出端子 DESCRIPTION OF SYMBOLS 10 Surface mount type resistor 11 Resistance layer 12 Insulating resin layer 13 Lower surface electrode 13a Inner electrode 13b Outer electrode 14a, 14b Lower surface insulating resin layer 15 Upper surface electrode 16 Upper surface insulating resin layer 17 Recess 18, 18a, 18b Plating layer 20 Mounting substrate 21 Current supply terminal 22 Voltage detection terminal

Claims (7)

抵抗合金材料からなる抵抗層と、
該抵抗層の下面に固定された絶縁樹脂層と、
該絶縁樹脂層の下面に固定された、板体状の高導電性金属材料からなる一対の下面電極と、該一対の下面電極を相互に接続する下面絶縁樹脂材と、
前記抵抗層の両端部上面に固定された高導電性金属材料からなる一対の上面電極と、該一対の電極を相互に接続する上面絶縁樹脂材と、
前記上面電極と下面電極とを接続するメッキ層とを備え、
前記下面電極は、抵抗器の長手方向に沿って内側電極と外側電極とに下面絶縁樹脂材を介して分離され、
前記抵抗層と上面電極の側面には凹部を備え、該凹部には前記上面絶縁樹脂材が充填され、
前記内側電極と外側電極のそれぞれが、前記抵抗層と上面電極の側面の凹部に充填された上面絶縁樹脂材により分離された前記メッキ層により、前記上面電極に接続されていることを特徴とする面実装形抵抗器。 A resistance layer made of a resistance alloy material;
An insulating resin layer fixed to the lower surface of the resistance layer;
A pair of lower surface electrodes made of a plate-like highly conductive metal material fixed to the lower surface of the insulating resin layer, and a lower surface insulating resin material for connecting the pair of lower surface electrodes to each other;
A pair of upper surface electrodes made of a highly conductive metal material fixed to the upper surfaces of both end portions of the resistance layer; and an upper surface insulating resin material for connecting the pair of electrodes to each other;
A plating layer connecting the upper surface electrode and the lower surface electrode;
The lower surface electrode is separated through the lower surface insulating resin material into the inner electrode and the outer electrode along the longitudinal direction of the resistor,
A side surface of the resistance layer and the upper surface electrode is provided with a recess, and the recess is filled with the upper surface insulating resin material,
Each of the inner electrode and the outer electrode is connected to the upper surface electrode by the plating layer separated by the upper surface insulating resin material filled in the concave portion on the side surface of the resistance layer and the upper surface electrode. Surface mount type resistors. 前記高導電性金属材料は銅であることを特徴とする請求項１記載の面実装形抵抗器。   2. The surface mount resistor according to claim 1, wherein the highly conductive metal material is copper. 前記抵抗合金材料は銅・ニッケル合金、ニッケル・クロム合金、銅・マンガン合金、鉄・クロム合金であることを特徴とする請求項１記載の面実装形抵抗器。 2. The surface-mount resistor according to claim 1, wherein the resistance alloy material is a copper / nickel alloy , a nickel / chromium alloy, a copper / manganese alloy, or an iron / chromium alloy. 高導電性の金属材料からなる箔材と抵抗合金材料からなる箔材とを接合したクラッド材を形成し、
前記クラッド材に、抵抗路パターンと、その両端に上面電極パターンと、該上面電極パターンの側面に凹部とを形成し、
前記クラッド材を高導電性の金属材料からなる板体に絶縁樹脂層を介して接合し、
前記クラッド材の抵抗路パターン部分の前記高導電性の金属材料からなる箔材をエッチングにより除去して前記クラッド材の両端部に上面電極を分離形成し、
前記高導電性の金属材料からなる板体をエッチングにより分離して、抵抗器の長手方向に沿って内側電極と外側電極とからなる下面電極を形成し、
前記下面電極の内側電極と外側電極との間、一対の内側電極の間、一対の上面電極の間、および上面電極パターンの側面の凹部とに、絶縁性樹脂材を充填し、各電極間を絶縁分離するとともに接続し、
前記内側電極と前記外側電極とをそれぞれ前記上面電極に接続するメッキ層を形成することを特徴とする面実装形抵抗器の製造方法。 A clad material is formed by joining a foil material made of a highly conductive metal material and a foil material made of a resistance alloy material,
Forming a resistance path pattern on the clad material, an upper electrode pattern on both ends thereof, and a recess on a side surface of the upper electrode pattern;
The clad material is bonded to a plate made of a highly conductive metal material via an insulating resin layer,
The foil material made of the highly conductive metal material in the resistance path pattern portion of the cladding material is removed by etching to form upper surface electrodes separately at both ends of the cladding material,
The plate body made of the highly conductive metal material is separated by etching to form a bottom electrode made of an inner electrode and an outer electrode along the longitudinal direction of the resistor,
An insulating resin material is filled between the inner electrode and the outer electrode of the lower surface electrode, between the pair of inner electrodes, between the pair of upper surface electrodes, and the concave portion on the side surface of the upper surface electrode pattern. Insulate and connect,
A method of manufacturing a surface-mounted resistor, comprising forming a plating layer that connects the inner electrode and the outer electrode to the upper surface electrode, respectively. 前記メッキ層は、上面電極側から延びるメッキ層と下面電極側から延びるメッキ層とが接合して一体のメッキ層として形成されることを特徴とする請求項４記載の面実装形抵抗器の製造方法。   5. The surface-mount resistor according to claim 4, wherein the plating layer is formed as an integral plating layer by joining a plating layer extending from the upper surface electrode side and a plating layer extending from the lower surface electrode side. Method. 前記高導電性金属材料は銅であることを特徴とする請求項４記載の面実装形抵抗器の製造方法。   5. The method of manufacturing a surface-mounted resistor according to claim 4, wherein the highly conductive metal material is copper. 前記抵抗合金材料は銅・ニッケル合金、ニッケル・クロム合金、銅・マンガン合金、鉄・クロム合金であることを特徴とする請求項４記載の面実装形抵抗器の製造方法。   5. The method of manufacturing a surface-mounted resistor according to claim 4, wherein the resistance alloy material is a copper / nickel alloy, a nickel / chromium alloy, a copper / manganese alloy, or an iron / chromium alloy.
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US10083781B2 (en) 2015-10-30 2018-09-25 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
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Cited By (10)

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Publication number Priority date Publication date Assignee Title
JP2014187092A (en) * 2013-03-22 2014-10-02 Rohm Co Ltd Chip resistor and chip resistor manufacturing method
US10083781B2 (en) 2015-10-30 2018-09-25 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
US10418157B2 (en) 2015-10-30 2019-09-17 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
WO2018216455A1 (en) * 2017-05-23 2018-11-29 パナソニックＩｐマネジメント株式会社 Metal plate resistor and method for manufacturing same
CN110520942A (en) * 2017-05-23 2019-11-29 松下知识产权经营株式会社 Metal plate resistance device and its manufacturing method
US20200075200A1 (en) * 2017-05-23 2020-03-05 Panasonic Intellectual Property Management Co., Ltd. Metal plate resistor and method for manufacturing same
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US10438729B2 (en) 2017-11-10 2019-10-08 Vishay Dale Electronics, Llc Resistor with upper surface heat dissipation
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