CN104902733A - PCB board shielding cover - Google Patents
PCB board shielding cover Download PDFInfo
- Publication number
- CN104902733A CN104902733A CN201510351831.8A CN201510351831A CN104902733A CN 104902733 A CN104902733 A CN 104902733A CN 201510351831 A CN201510351831 A CN 201510351831A CN 104902733 A CN104902733 A CN 104902733A
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- CN
- China
- Prior art keywords
- radome
- pcb board
- overhead guard
- insulating barrier
- sidewall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Abstract
The invention relates to a PCB board shield cover. The PCB board shield cover comprises a top cover and a side wall perpendicular to the top cover, wherein the top cover is matched with the PCB board in size. Inner surfaces of the top cover and the side wall are respectively provided with an insulating layer. A plurality of heat dissipation holes are arranged in corresponding positions of the top cover and the insulating layer. The insulating glue layer covers the shielding cover, so that the production efficiency and the product quality consistency are improved; in addition, the shielding cover is provided with the heat dissipation holes and gaps, so that the heat dissipation performance of a circuit board is effectively improved.
Description
Technical field
The present invention relates to pcb board technical field, especially relate to a kind of pcb board radome.
Background technology
In today that science and technology is highly developed, the kind of consumption electronic products is also more and more diversified, such as mobile phone, panel computer, the electronic products such as MP3 or MP4 have become the communication or converter tools that people carry with, but it is well-known, these products can produce radio-frequency radiation more or less, the normal work of the electronic circuit of periphery electronic product can be affected, bring harm also can to the health of user, therefore, manufacturers consider to arrange a radome on the PCB plate producing radiation, this radome adopts metal material to be made, reduce the radiation because the electronic circuit on PCB plate produces in the course of the work, and shielding electronic components interference to each other.
And at present, electronic product is more and more towards miniaturized, lightening future development, this just requires to need to fit tightly between radome and pcb board, also there will not be the phenomenons such as short circuit simultaneously.In the prior art, manufacturer is by the sticky layer insulating in region corresponding with electronic circuit on artificial radome on PCB, thus reach insulation and the effect of not short circuit, but, this method wastes time and energy, production efficiency is not high, accurate during artificial stickup, also insulating barrier and radome itself can be made to be polluted and product quality is reduced because of human factor; Simultaneously when electronic product is subject to external impacts or the situations such as twisting occur, certain relative displacement can be produced between PCB plate and insulating barrier, the electronic circuit on PCB plate and insulating barrier can be caused not corresponding, thus cause the short circuit of electronic product, make electronic product be in failure state.
Summary of the invention
The object of the invention is to provide a kind of for the deficiencies in the prior art.
For achieving the above object, the present invention realizes by the following technical solutions:
A kind of pcb board radome, comprises an overhead guard adapted with pcb board size dimension and the sidewall perpendicular to this overhead guard, the inner surface of overhead guard and sidewall is provided with insulating barrier, overhead guard and insulating barrier opposite position are provided with some louvres.
Preferably, sidewall is the frame structure by being integrally formed after the bending of radome overhead guard edge.
Preferably, sidewall is the frame structure that the edge of radome overhead guard is fixedly installed.
Further, frame structure is provided with several gaps perpendicular to overhead guard.
Further, the phase-contact surface of insulating barrier and overhead guard and side wall inner surfaces is high-temperature insulation glue-line.
Beneficial effect of the present invention is:
1, by covering an insulating barrier at the overhead guard of radome and side wall inner surfaces, thus exempting artificial stickup, both improve production efficiency, also there will not be stickup not situation accurately, ensure that the consistency of product quality;
2, owing to showing in radome to be coated with insulating barrier completely, therefore the problem of short circuit can not be produced because electronic product makes electronic circuit and insulating barrier misplace under external force;
3, radome is provided with louvre and gap, effectively can distributes the heat that circuit board produces.
Accompanying drawing explanation
Fig. 1 is the planar structure schematic diagram of the present embodiment radome;
Fig. 2 is the perspective view of the present embodiment radome.
Embodiment
Below in conjunction with accompanying drawing, embodiments of the invention are further described:
As shown in Figure 1, the invention provides a kind of pcb board radome 10, radome 10 comprises an overhead guard 1 adapted with pcb board size dimension, and perpendicular to the sidewall 4 of this overhead guard 1, the inner surface of overhead guard 1 and sidewall 4 is provided with insulating barrier 2.
Wherein, radome 10 is made by metal material, as foreign copper-nickel alloy coiled material, adding man-hour, first insulating barrier 2 is covered on the inner surface of metal material by techniques such as plating, spray, painting or stickups, punching press through connecting punching press or single operation is made into single radome 10, then carries out the process of subsequent technique.
Insulating barrier 2 is high-temperature insulation glue-line with the phase-contact surface of overhead guard 1 and sidewall 4 inner surface, and the inner surface of this insulation glue-line and overhead guard 1 sidewall 4 bonds fastening and can not come off, and ageing resistance is strong.
As shown in Figure 2, the overhead guard 1 of radome 10 and insulating barrier 2 opposite position are provided with some louvres 3, can distribute because the electronic circuit on pcb board is because work and the heat of generation.The formation of this louvre 3 is cover insulating barrier 2 on metal material inner surface after, then carries out punching in the lump and form.Louvre 3 and energy complete matching on radome overhead guard 1, can not cause corrosion because of the hand perspiration of human factor or other pollutions to material, paste and affect flatness, affect product quality.In addition, the diameter of this louvre 3 is not more than 1/15 of the radio frequency wavelength that electronic circuit on pcb board is launched.
Sidewall 4 is the frame structures by being integrally formed after the bending of radome overhead guard 1 edge, also can be the frame structure be fixedly installed at the edge of radome overhead guard 1, frame structure just can be fastened on the edge of pcb board, by PCB plate and on electronic circuit be contained in radome 10.
Frame structure is provided with the gap 41 perpendicular to overhead guard, this gap 41 can be one, but all arranging a gap at the frame structure peripheral intervals certain distance of sidewall 4 is optimal selection, therefore gap 41 is several, so just can increase the radiating effect of radome 10 further.In addition, the width in gap 41 is not more than 1/15 of the radio frequency wavelength that electronic circuit on pcb board is launched, thus shield effectiveness can not be affected because of gap 41.
It is emphasized that above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, some simple deduction or replace can also be made, all should be considered as belonging to protection scope of the present invention.
Claims (5)
1. a pcb board radome, comprise an overhead guard adapted with pcb board size dimension and the sidewall perpendicular to this overhead guard, it is characterized in that, described overhead guard and the inner surface of sidewall are provided with insulating barrier, described overhead guard and insulating barrier opposite position are provided with some louvres.
2. the radome of a kind of PCB plate according to claim 1, is characterized in that: described sidewall is the frame structure by being integrally formed after the bending of radome overhead guard edge.
3. the radome of a kind of pcb board according to claim 1, is characterized in that: described sidewall is the frame structure be fixedly installed at the edge of radome overhead guard.
4. the radome of a kind of pcb board according to Claims 2 or 3, is characterized in that: described frame structure is provided with several gaps perpendicular to overhead guard.
5. the radome of a kind of pcb board according to claim 4, is characterized in that: the phase-contact surface of described insulating barrier and overhead guard and side wall inner surfaces is high-temperature insulation glue-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510351831.8A CN104902733A (en) | 2015-06-24 | 2015-06-24 | PCB board shielding cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510351831.8A CN104902733A (en) | 2015-06-24 | 2015-06-24 | PCB board shielding cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104902733A true CN104902733A (en) | 2015-09-09 |
Family
ID=54035032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510351831.8A Pending CN104902733A (en) | 2015-06-24 | 2015-06-24 | PCB board shielding cover |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104902733A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113514755A (en) * | 2021-06-11 | 2021-10-19 | 天津津航计算技术研究所 | Automatic detection device and method for electrical performance of PCB (printed circuit board) enclosure frame |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013191797A (en) * | 2012-03-15 | 2013-09-26 | Kyocera Document Solutions Inc | Shield case, shield case unit, and image formation device |
| CN203399475U (en) * | 2013-08-08 | 2014-01-15 | 刘建中 | Shielding cover of PCB |
| CN104363743A (en) * | 2014-11-27 | 2015-02-18 | 成都龙腾中远信息技术有限公司 | Electromagnetic wave radiation shield cover for printed circuit board |
| CN204362486U (en) * | 2014-12-23 | 2015-05-27 | 乐视致新电子科技（天津）有限公司 | A kind of EMI radiation radome of integral fin |
-
2015
- 2015-06-24 CN CN201510351831.8A patent/CN104902733A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013191797A (en) * | 2012-03-15 | 2013-09-26 | Kyocera Document Solutions Inc | Shield case, shield case unit, and image formation device |
| CN203399475U (en) * | 2013-08-08 | 2014-01-15 | 刘建中 | Shielding cover of PCB |
| CN104363743A (en) * | 2014-11-27 | 2015-02-18 | 成都龙腾中远信息技术有限公司 | Electromagnetic wave radiation shield cover for printed circuit board |
| CN204362486U (en) * | 2014-12-23 | 2015-05-27 | 乐视致新电子科技（天津）有限公司 | A kind of EMI radiation radome of integral fin |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113514755A (en) * | 2021-06-11 | 2021-10-19 | 天津津航计算技术研究所 | Automatic detection device and method for electrical performance of PCB (printed circuit board) enclosure frame |
| CN113514755B (en) * | 2021-06-11 | 2023-06-27 | 天津津航计算技术研究所 | Automatic detection device and method for electrical properties of PCB (printed circuit board) surrounding frame |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150909 |
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| WD01 | Invention patent application deemed withdrawn after publication |