CN103980711B - Directional metal wire-filled anti-EMI silica gel liner and preparation method thereof - Google Patents
Directional metal wire-filled anti-EMI silica gel liner and preparation method thereof Download PDFInfo
- Publication number
- CN103980711B CN103980711B CN201410162804.1A CN201410162804A CN103980711B CN 103980711 B CN103980711 B CN 103980711B CN 201410162804 A CN201410162804 A CN 201410162804A CN 103980711 B CN103980711 B CN 103980711B
- Authority
- CN
- China
- Prior art keywords
- silk
- tinsel
- silica gel
- orientation
- emi filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 57
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 41
- 239000002184 metal Substances 0.000 title claims abstract description 41
- 239000000741 silica gel Substances 0.000 title claims abstract description 34
- 229910002027 silica gel Inorganic materials 0.000 title claims abstract description 34
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000008119 colloidal silica Substances 0.000 claims abstract description 21
- 239000003292 glue Substances 0.000 claims description 28
- 229910000792 Monel Inorganic materials 0.000 claims description 27
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 26
- 239000004411 aluminium Substances 0.000 claims description 25
- 229910052782 aluminium Inorganic materials 0.000 claims description 25
- 238000007789 sealing Methods 0.000 claims description 19
- 239000004744 fabric Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 18
- 230000008569 process Effects 0.000 claims description 17
- 238000000465 moulding Methods 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 15
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 10
- 229910000077 silane Inorganic materials 0.000 claims description 10
- 239000012528 membrane Substances 0.000 claims description 9
- 238000002203 pretreatment Methods 0.000 claims description 9
- 239000000565 sealant Substances 0.000 claims description 9
- 238000004804 winding Methods 0.000 claims description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 239000007822 coupling agent Substances 0.000 claims description 4
- 239000007769 metal material Substances 0.000 abstract description 2
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004531 microgranule Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 | |
Tensile strength >=1.8MPa | 2.0 | 2.2 | 1.9 | 2.1 | 2.3 | 2.0 |
Percentage elongation >=200% | 220 | 240 | 210 | 230 | 250 | 220 |
Hardness A35 ± 5 | 35 | 32 | 38 | 36 | 34 | 39 |
Tearing strength >=8Kg/cm | 11 | 12 | 10 | 12 | 13 | 10 |
Silk 140 ± 15/cm of density2 | 140 | 125 | 155 | 140 | 125 | 155 |
Shield effectiveness (14KHZ~1GHZ) >=60dB | 70 | 65 | 80 | 60 | 70 | 80 |
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410162804.1A CN103980711B (en) | 2014-04-22 | 2014-04-22 | Directional metal wire-filled anti-EMI silica gel liner and preparation method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410162804.1A CN103980711B (en) | 2014-04-22 | 2014-04-22 | Directional metal wire-filled anti-EMI silica gel liner and preparation method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103980711A CN103980711A (en) | 2014-08-13 |
CN103980711B true CN103980711B (en) | 2017-02-15 |
Family
ID=51272891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410162804.1A Active CN103980711B (en) | 2014-04-22 | 2014-04-22 | Directional metal wire-filled anti-EMI silica gel liner and preparation method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103980711B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106976188A (en) * | 2016-01-18 | 2017-07-25 | 深圳市海德讯科技有限公司 | Thermal transfer conducting resinl pads forming method in a kind of high-accuracy mould |
CN110894359B (en) * | 2019-12-05 | 2022-02-18 | 中国电子科技集团公司第三十三研究所 | Sponge type directional conductive rubber and preparation method thereof |
CN112908528B (en) * | 2020-12-10 | 2023-02-10 | 睿惢思工业科技(苏州)有限公司 | Conductive foam and manufacturing process thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3518267B2 (en) * | 1997-08-07 | 2004-04-12 | 住友電装株式会社 | EMI suppression cable |
CN103571215A (en) * | 2012-07-18 | 2014-02-12 | 天瑞企业股份有限公司 | High thermal conductivity and EMI sheltering high polymer composite material |
CN103602072A (en) * | 2013-11-29 | 2014-02-26 | 国家电网公司 | Conductive silicone rubber with electromagnetic shielding performance and manufacturing method |
-
2014
- 2014-04-22 CN CN201410162804.1A patent/CN103980711B/en active Active
Also Published As
Publication number | Publication date |
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CN103980711A (en) | 2014-08-13 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190730 Address after: 100039 B08, 11th Floor, 88 Yongding Road, Haidian District, Beijing Patentee after: Beijing Taipaist Technology Development Co.,Ltd. Address before: 030400 No. 1, No. 9 North Lane, Liu Village Commercial Street, Xugou Town, Qingxu County, Taiyuan City, Shanxi Province Patentee before: TAIYUAN TEMPEST ELECTRONICS CO.,LTD. |
|
TR01 | Transfer of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: The invention relates to an EMI resistant silica gel pad filled with directional metal wire and a preparation method thereof Effective date of registration: 20210721 Granted publication date: 20170215 Pledgee: Zhongguancun Beijing technology financing Company limited by guarantee Pledgor: Beijing Taipaist Technology Development Co.,Ltd. Registration number: Y2021990000637 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20221109 Granted publication date: 20170215 Pledgee: Zhongguancun Beijing technology financing Company limited by guarantee Pledgor: Beijing Taipaist Technology Development Co.,Ltd. Registration number: Y2021990000637 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Anti EMI silicone liner filled with oriented metal wire and its preparation method Effective date of registration: 20221121 Granted publication date: 20170215 Pledgee: Zhongguancun Beijing technology financing Company limited by guarantee Pledgor: Beijing Taipaist Technology Development Co.,Ltd. Registration number: Y2022990000821 |