CN204335258U - A kind of electronic installation with heat radiation and anti electromagnetic interference structure - Google Patents
A kind of electronic installation with heat radiation and anti electromagnetic interference structure Download PDFInfo
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- CN204335258U CN204335258U CN201420808415.7U CN201420808415U CN204335258U CN 204335258 U CN204335258 U CN 204335258U CN 201420808415 U CN201420808415 U CN 201420808415U CN 204335258 U CN204335258 U CN 204335258U
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Abstract
The utility model provides a kind of electronic installation with heat radiation and anti electromagnetic interference structure, comprising: circuit board; Chip, described chip is installed on circuit board; Fin, described fin is arranged at the subregion of chip surface; Inhale wave plate, described suction wave plate is fixed on chip surface, and described suction wave plate is located on around fin.This electronic installation is by arranging fin and inhaling wave plate on the surface of chip, wherein inhale wave plate and arrange around fin, so both effectively can solve the heat radiation of chip, can shield again the electromagnetic interference of chip, and structure is simple, easily implement, cost is lower.
Description
Technical field
The utility model relates to a kind of electronic installation, particularly relates to a kind of electronic installation with heat radiation and anti electromagnetic interference structure.
Background technology
At present, electronic product (such as panel computer, mobile phone etc.) apply more and more extensively, because the chip in electronic product is main pyrotoxin, so in R & D design process, need to consider to dispel the heat to chip, and any electronic system, all may produce electromagnetic interference (Electromagnetic Interference, EMI), easily communication apparatus or other electronic equipment are impacted, therefore also need to consider to solve EMI problem.Some chip is pyrotoxin and electromagnetic interference source, so just heat radiation and electromagnetic interference must be suppressed to consider in the lump in the design process.Now, relatively simple means adopt thermal conductive silicon rubber cushion to realize the heat conduction and heat radiation between chip and fin or shell, but this can not play the effect suppressing electromagnetic interference, and adopt the material of shielding EMI can not play preferably radiating effect to chip, other suppresses the means (such as installing metallic shield additional) of EMI, and cost is higher.Therefore, how can solve chip cooling with better simply design and can suppress electromagnetic interference again, be the problem needing solution badly.
Utility model content
The utility model is intended to solve one of technical problem in correlation technique at least to a certain extent.For this reason, the utility model proposes and a kind ofly have heat radiation and the electronic installation of anti electromagnetic interference structure, effectively can solve chip cooling again can shield electromagnetic interference, and structure is simple, and cost is lower.
The utility model provides a kind of electronic installation with heat radiation and anti electromagnetic interference structure, comprising: circuit board; Chip, described chip is installed on circuit board; Fin, described fin is arranged at the subregion of chip surface; Inhale wave plate, described suction wave plate is fixed on chip surface, and described suction wave plate is located on around fin.
Further, described fin is arranged at the central area on chip surface.
Further, described suction wave plate to cover on described chip surface completely not by region that fin hides.
Further, described suction wave plate is ferrite.
Further, described fin is graphite.
Further, the thickness of described suction wave plate is 2-5mm.
Further, the thickness of described fin is 2-5mm.
The electronic installation with heat radiation and anti electromagnetic interference structure that the utility model proposes, by arranging fin on the surface of chip and inhaling wave plate, wherein inhale wave plate to arrange around fin, so both effectively can solve the heat radiation of chip, the electromagnetic interference of chip can be shielded again, and structure is simple, easily implement, cost is lower.
Accompanying drawing explanation
Fig. 1 is the electronic device construction schematic diagram with heat radiation and anti electromagnetic interference structure that the utility model embodiment provides;
Fig. 2 is the electronic installation vertical view with heat radiation and anti electromagnetic interference structure that the utility model embodiment provides.
Embodiment
Be described below in detail embodiment of the present utility model, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Be exemplary below by the embodiment be described with reference to the drawings, be intended to for explaining the utility model, and can not be interpreted as restriction of the present utility model.
As depicted in figs. 1 and 2, the utility model provides a kind of electronic installation 100 with heat radiation and anti electromagnetic interference structure, comprising: circuit board 10; Chip 20, described chip 20 is installed on circuit board 10; Fin 30, described fin 30 is arranged at the subregion on chip 20 surface; Inhale wave plate 40, described suction wave plate 40 is fixed on chip 20 surface, and described suction wave plate 40 is located on around fin 30.
Electronic installation in the utility model embodiment, refers to the electronic product with electronic circuit, generally comprises panel computer, mobile phone etc., but be not limited to mentioned kind.Described electronic installation has circuit board, circuit board is provided with various chips, wherein some chip is pyrotoxin and electromagnetic interference source, these chips outwardly distribute heat, simultaneously also outside emitting electromagnetic wave, other electronic devices and components on electromagnetic wave and circuit board interact and produce electromagnetic interference.
The utility model, by arranging fin 30 on the surface of chip 20 and inhaling wave plate 40, is wherein inhaled wave plate 40 and is arranged around fin 30, so both effectively can solve the heat radiation of chip 20, the electromagnetic interference of chip 20 can be shielded again, and structure is simple, easily implement, cost is lower.
Preferably, described fin 30 is arranged on the central area on chip 20 surface, inhales wave plate 40 and arranges around fin 30, form a closed annulus, be contained in wherein by fin 30.Fin 30 and the ratio of inhaling shared by each comfortable chip 20 surface of wave plate 40 can adjust according to the degree of the caloric value of chip 20 and electromagnetic interference, increase the width inhaling wave plate annulus and can obtain preferably shield electromagnetic interference effect.
Further preferably, described suction wave plate 40 covers described chip 20 completely on the surface not by region that fin 30 hides, namely, after chip 20 surface arranges fin 30, cover the exposed region on chip 20 surface with suction wave plate 40 completely, thus reach best anti-electromagnetic interference effect.
Described suction wave plate 40 for electromagnetic wave absorption be main, reflection, the high-tech functional composite material that scattering and transmission are all very little, such as ferrite, its principle mainly adds electromagnetic consumable material in macromolecule medium, when electromagnetic wave enters absorbing material inside, promote the intramolecular ion of composition material, transition between electron motion or electron energy level, produce conductance loss, high-frequency dielectric loss and magnetic hysteresis loss etc., electromagnetic energy is made to be transformed into heat energy, do not changing in the design basis of PCB, shielding, electromagnetic wave absorption disturbs, solve various interference behavior or electromagnetic noise, thus solve EMI problem.
In the utility model embodiment, the thickness of described suction wave plate 40 is 2-5mm, according to the difference of chip 20 electromagnetic interference degree, the thickness inhaling wave plate 40 can adjust according to actual conditions, if the structure of electronic installation is without too large restriction, the thickness inhaling wave plate 40 can be increased, thus reach the effect of better electromagnetism interference.
Described fin 30, for having the material of thermal conductivity, as graphite, can absorb the heat that chip 20 produces fast, play good radiating effect.The thickness of fin 30 is 2-5mm, and the thickness of same fin 30 can adjust according to the caloric value of chip 20.
The one side of described fin 30 and suction wave plate 40 is provided with adhesive-layer (not shown), and fin 30 and suction wave plate 40 are fixed on described chip 20 surface by adhesive-layer.Can fit tightly at chip 20 on the surface to ensure described fin 30 and inhaling wave plate 40, the one side of fin 30 and suction wave plate 40 is all provided with adhesive linkage, fin 30 and suction wave plate 40 are pasted onto chip 20 on the surface by described adhesive linkage, particularly, described adhesive linkage is glue, such as gjb446 adhesive.
In sum, the electronic installation of heat radiation that what the utility model embodiment provided have and anti electromagnetic interference structure, by arranging fin on the surface of chip and inhaling wave plate, wherein inhale wave plate to arrange around fin, so both effectively can solve the heat radiation of chip, the electromagnetic interference of chip can be shielded again, and structure be simple, easy enforcement, cost is lower.
In the utility model, unless otherwise clearly defined and limited, term " installation ", " being connected ", " connection ", etc. term should be interpreted broadly, such as, can be fixedly connected with, also can be removably connect, or integral; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements, unless otherwise clear and definite restriction.For the ordinary skill in the art, the concrete meaning of above-mentioned term in the utility model can be understood as the case may be.
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present utility model or example.In this manual, to the schematic representation of above-mentioned term not must for be identical embodiment or example.And the specific features of description, structure, material or feature can combine in one or more embodiment in office or example in an appropriate manner.In addition, when not conflicting, the feature of the different embodiment described in this specification or example and different embodiment or example can carry out combining and combining by those skilled in the art.
Although illustrate and described embodiment of the present utility model above, be understandable that, above-described embodiment is exemplary, can not be interpreted as restriction of the present utility model, those of ordinary skill in the art can change above-described embodiment, revises, replace and modification in scope of the present utility model.
Claims (7)
1. there is an electronic installation for heat radiation and anti electromagnetic interference structure, it is characterized in that, comprising:
Circuit board;
Chip, described chip is installed on circuit board;
Fin, described fin is arranged at the subregion of chip surface;
Inhale wave plate, described suction wave plate is fixed on chip surface, and described suction wave plate is located on around fin.
2. have the electronic installation of heat radiation and anti electromagnetic interference structure as claimed in claim 1, it is characterized in that, described fin is arranged at the central area on chip surface.
3. have heat radiation and the electronic installation of anti electromagnetic interference structure as claimed in claim 2, it is characterized in that, described suction wave plate to cover on described chip surface completely not by region that fin hides.
4. have the electronic installation of heat radiation and anti electromagnetic interference structure as claimed in claim 1, it is characterized in that, described suction wave plate is ferrite.
5. have the electronic installation of heat radiation and anti electromagnetic interference structure as claimed in claim 1, it is characterized in that, described fin is graphite.
6. have the electronic installation of heat radiation and anti electromagnetic interference structure as claimed in claim 4, it is characterized in that, the thickness of described suction wave plate is 2-5mm.
7. have the electronic installation of heat radiation and anti electromagnetic interference structure as claimed in claim 5, it is characterized in that, the thickness of described fin is 2-5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420808415.7U CN204335258U (en) | 2014-12-19 | 2014-12-19 | A kind of electronic installation with heat radiation and anti electromagnetic interference structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420808415.7U CN204335258U (en) | 2014-12-19 | 2014-12-19 | A kind of electronic installation with heat radiation and anti electromagnetic interference structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204335258U true CN204335258U (en) | 2015-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420808415.7U Active CN204335258U (en) | 2014-12-19 | 2014-12-19 | A kind of electronic installation with heat radiation and anti electromagnetic interference structure |
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| CN (1) | CN204335258U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110267382A (en) * | 2019-06-26 | 2019-09-20 | 深圳市鑫汇科股份有限公司 | Inhale wave apparatus and electromagnetic heating apparatus |
| WO2020090499A1 (en) * | 2018-10-31 | 2020-05-07 | 北川工業株式会社 | Heat conduction sheet |
| WO2022059701A1 (en) * | 2020-09-17 | 2022-03-24 | 北川工業株式会社 | Heat conducting sheet |
-
2014
- 2014-12-19 CN CN201420808415.7U patent/CN204335258U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020090499A1 (en) * | 2018-10-31 | 2020-05-07 | 北川工業株式会社 | Heat conduction sheet |
| CN110267382A (en) * | 2019-06-26 | 2019-09-20 | 深圳市鑫汇科股份有限公司 | Inhale wave apparatus and electromagnetic heating apparatus |
| WO2022059701A1 (en) * | 2020-09-17 | 2022-03-24 | 北川工業株式会社 | Heat conducting sheet |
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