CN104267218A - BGA package test socket with pin testing function - Google Patents
BGA package test socket with pin testing function Download PDFInfo
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- CN104267218A CN104267218A CN201410535754.7A CN201410535754A CN104267218A CN 104267218 A CN104267218 A CN 104267218A CN 201410535754 A CN201410535754 A CN 201410535754A CN 104267218 A CN104267218 A CN 104267218A
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Abstract
The invention discloses a BGA package test socket with a pin testing function. The BGA package test socket is characterized by comprising a substrate, a programmable logic device and pin testing points, wherein the programmable logic device and the pin testing points are buried in the substrate. The substrate is an integrated PCB, wires are arranged in the substrate, the wires are connected with pins of the programmable logic device, a slot is formed in the center of the upper surface of the substrate, slot points are arranged in the slot, the slot is used for containing a BGA chip to be detected in an inserted mode, the distance of the slot is uniform with the distance between and the specification of spherical pins of the BGA chip to be detected, the number of rows of the slot points is larger than the number of rows of the spherical pins of the BGA chip to be detected, and the number of lines of the slot points is larger than the number of lines of the spherical pins of the BGA chip to be detected. Substrate pins are arranged on the bottom face of the substrate, and the programmable logic device is connected with the substrate pins and the spherical pins of the BGA chip to be detected. The pin testing points can be led out from the programmable logic device and are evenly distributed on the edge of the upper surface of the substrate.
Description
Technical field
The present invention relates to a kind of test jack, be specially a kind of BGA package test jack possessing pin test function.
Background technology
The pin of chip bga is measured to be needed will consider before pcb board design, and needs each pin carrying out measuring to draw a test point, uses when giving over to pcb board test.If do not draw test point when pcb board designs, so when system testing if there is problem, the equipment such as oscillograph just cannot be used to measure.
The pin-pitch specification of chip bga is limited, be generally several specification such as 1.27mm, 1mm, 0.8mm, 0.65mm, 0.5mm, 0.45mm, 0.4mm, 0.3mm, but under same specification, pin number and the distribution of bga chip have very large difference, the bga chip of a lot of non-standard encapsulation cannot put into the bga socket of standard, need the socket of special special format customized, this greatly adds testing cost and the cycle of small-lot chips.
Traditional board level testing system must reserve the test point of special pin, once determine to change; If need to retain the power of test to all BGA pins, need all pins all to draw test point.
Therefore provide one to can be used in non-standard encapsulation bga chip, and the test jack that identical, signal pins quantity carries out pin test with the different bga chip that distributes that distribute of measure-alike, power pins and ground pin become problem demanding prompt solution in prior art.
Summary of the invention
For the deficiencies in the prior art, the technical matters that quasi-solution of the present invention is determined is, provide a kind of BGA package test jack possessing pin test function, this socket can carry out power of test to the whole pin of chip bga, and is applicable to the bga chip of the off-gauge BGA package form in standard and certain limit.
The present invention solve the technical problem adopted technical scheme, a kind of BGA package test jack possessing pin test function is provided, it is characterized in that this socket comprises substrate, the programmable logic device (PLD) of burying in substrate and pin test point, described substrate is integrated PCB plate, substrate inside is provided with cabling, cabling is connected with the pin of programmable logic device (PLD), the upper face center of substrate is provided with slot, slot point is provided with in slot, described slot is used for inserting bga chip to be measured, the separation of described slot and the spherical pin spacing conformance to specifications of bga chip to be measured, the number of lines and columns of described slot point are greater than line number and the columns of the spherical pin encapsulation of bga chip to be measured respectively, the bottom surface of described substrate is provided with substrate draw-foot, and described programmable logic device (PLD) is connected with the spherical pin of substrate draw-foot and bga chip to be measured, described pin test point is drawn by programmable logic device (PLD), is evenly distributed on the top surface edge of substrate.
Compared with prior art, the present invention has online programming ability, the spherical pin of specifying arbitrarily of bga chip to be measured can be led to pin test point, tested spherical pin can be changed, by the test using a small amount of pin test point can realize the spherical pin to all bga chips to be measured by programming simultaneously.The present invention also has good adaptability, identical in pin-pitch, when the row, column number of the spherical pin of bga chip to be measured is no more than the row, column number of slot point of slot in the present invention, can realize the test of the bga chip to different number of pins type.
Accompanying drawing explanation
Fig. 1 is the vertical section structural representation that the present invention possesses a kind of embodiment of BGA package test jack of pin test function;
Fig. 2 is the plan structure schematic diagram that the present invention possesses a kind of embodiment of BGA package test jack of pin test function;
In figure, 1, substrate, 2, programmable logic device (PLD), 3, pin test point, 4, substrate draw-foot, 5, bga chip to be measured.
Embodiment
Describe the present invention further below in conjunction with embodiment and accompanying drawing thereof, specific embodiment is only to further explanation of the present invention, does not limit protection scope of the present invention with this.
The BGA package test jack that the present invention possesses pin test function (is called for short socket, see Fig. 1-2) comprise substrate 1, the programmable logic device (PLD) 2 of burying in substrate and pin test point 3, described substrate 1 is the pcb board of high integration, substrate 1 inside is provided with cabling, cabling is connected with the pin of programmable logic device (PLD) 2, the upper face center of substrate 1 is provided with slot, slot point is provided with in slot, described slot is used for inserting bga chip 5 to be measured, state the separation of slot and the spherical pin spacing conformance to specifications of bga chip to be measured, the number of lines and columns of described slot point are greater than line number and the columns of the spherical pin encapsulation of bga chip to be measured respectively, the bottom surface of described substrate 1 is provided with substrate draw-foot 4, and the spherical pin of described programmable logic device (PLD) 2 and substrate draw-foot 4 and bga chip to be measured 5 is carried out logic and is connected, described pin test point 3 is drawn by programmable logic device (PLD) 2, is evenly distributed on the top surface edge of substrate 1.
The using method of socket of the present invention is: when needs carry out functional test to bga chip to be measured, bga chip 5 to be measured is inserted in the slot of substrate 1, and adopt physical connection mode to be connected to test macro this socket, according to system, in advance programmable logic device (PLD) 2 is programmed, bga chip 5 to be measured is connected in default output pin test point 3 by logic;
When needing certain the spherical pin signal measuring bga chip 5 to be measured, need to programme to programmable logic device (PLD) 2, the spherical pin of bga chip to be measured is connected in the reserved pin test point 3 of BGA test jack by programmable logic device (PLD) 2, just can measures the state of this point;
When needing the type changing bga chip 5 to be measured, only needing again to programme to programmable logic device (PLD) 2, setting up the spherical pin of new bga chip to be measured 5 and the corresponding annexation of pin test point 3.
The quantity of pin test point 3 of the present invention is relevant with the quantity of requirement of system design and bga chip to be measured, and maximum can the support of the quantity of pin test point 3 is tested the pin of all bga chips.
The software flow that the present invention realizes is: 1) be all GPIO pin being connected to the pin assignment programmable logic device (PLD) 2 of the bga chip to be measured 5 of substrate draw-foot 4; 2) for needing the pin assignment programmable logic device pin of the bga chip to be measured 5 being connected to pin test point 3; 3) in the internal logic of programmable logic device, by 1), 2) logical relation set up in two steps connects; 4) if need to change the Pin locations that bga chip 5 to be measured leads to pin test point 3, then the 2nd is returned) step resets; 5) the software programming of having write is entered in the program storage area of programmable logic device (PLD).
The present invention possesses the BGA package test jack of pin test function, there is online programming ability, the spherical pin of specifying arbitrarily of bga chip 5 to be measured can be led to pin test point 3, possess the power of test of use a small amount of pin test point 3 to the spherical pin of all bga chips 5 to be measured, and the spherical pin of tested bga chip 5 can be changed by programming, and then the test of the spherical pin to all bga chips 5 to be measured can be realized easily.The present invention has good adaptability, identical in pin-pitch, when the line number of bga chip 5 spherical pin to be measured and columns are no more than line number and the columns of slot point in slot in the present invention respectively, the test of the bga chip to different number of pins type can be realized.
The present invention does not address part and is all applicable to prior art.
Claims (1)
1. one kind possesses the BGA package test jack of pin test function, it is characterized in that this socket comprises substrate, the programmable logic device (PLD) of burying in substrate and pin test point, described substrate is integrated PCB plate, substrate inside is provided with cabling, cabling is connected with the pin of programmable logic device (PLD), the upper face center of substrate is provided with slot, slot point is provided with in slot, described slot is used for inserting bga chip to be measured, the separation of described slot and the spherical pin spacing conformance to specifications of bga chip to be measured, the number of lines and columns of described slot point are greater than line number and the columns of the spherical pin encapsulation of bga chip to be measured respectively, the bottom surface of described substrate is provided with substrate draw-foot, and described programmable logic device (PLD) is connected with the spherical pin of substrate draw-foot and bga chip to be measured, described pin test point is drawn by programmable logic device (PLD), is evenly distributed on the top surface edge of substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410535754.7A CN104267218B (en) | 2014-10-11 | 2014-10-11 | A kind of BGA package test jack for possessing pin test function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410535754.7A CN104267218B (en) | 2014-10-11 | 2014-10-11 | A kind of BGA package test jack for possessing pin test function |
Publications (2)
| Publication Number | Publication Date |
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| CN104267218A true CN104267218A (en) | 2015-01-07 |
| CN104267218B CN104267218B (en) | 2017-09-15 |
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| CN201410535754.7A Active CN104267218B (en) | 2014-10-11 | 2014-10-11 | A kind of BGA package test jack for possessing pin test function |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105067846A (en) * | 2015-08-10 | 2015-11-18 | 深圳市共进电子股份有限公司 | BGA package chip test clamp |
| CN105353175A (en) * | 2015-11-22 | 2016-02-24 | 苏州光韵达光电科技有限公司 | BGA packaging test socket |
| CN106771405A (en) * | 2017-01-06 | 2017-05-31 | 中国船舶重工集团公司第七0九研究所 | A kind of spherical grid array integrated circuit interface adapter |
| CN107976618A (en) * | 2016-03-08 | 2018-05-01 | 赵令臣 | A kind of method of work of BGA package test jack |
| US20180307654A1 (en) * | 2017-04-13 | 2018-10-25 | Battelle Memorial Institute | System and method for generating test vectors |
| CN109116061A (en) * | 2018-09-10 | 2019-01-01 | 上海泽丰半导体科技有限公司 | A kind of socket based on chip testing |
| US11933815B2 (en) | 2020-08-14 | 2024-03-19 | Changxin Memory Technologies, Inc. | Test fixture |
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| CN1635388A (en) * | 2003-12-26 | 2005-07-06 | 技嘉科技股份有限公司 | Ball grid array substrate detecting device and constructive method thereof |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105067846A (en) * | 2015-08-10 | 2015-11-18 | 深圳市共进电子股份有限公司 | BGA package chip test clamp |
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| CN107976618A (en) * | 2016-03-08 | 2018-05-01 | 赵令臣 | A kind of method of work of BGA package test jack |
| CN107976618B (en) * | 2016-03-08 | 2020-02-07 | 宁波利特舜电气有限公司 | Working method of BGA packaging test socket |
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| CN109116061A (en) * | 2018-09-10 | 2019-01-01 | 上海泽丰半导体科技有限公司 | A kind of socket based on chip testing |
| US11933815B2 (en) | 2020-08-14 | 2024-03-19 | Changxin Memory Technologies, Inc. | Test fixture |
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| CN104267218B (en) | 2017-09-15 |
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Effective date of registration: 20180404 Address after: 300308 Tianjin District of Dongli City Airport Economic Zone bonded Road No. 357 Patentee after: TIANJIN JINHANG INSTITUTE OF COMPUTING TECHNOLOGY Address before: 300308 Tianjin District of Dongli City Airport Economic Zone bonded Road No. 357 Patentee before: NO.8357 Research Institute of the Third Academy of China Aerospace Science & Industry Corp. |