CN203396792U

CN203396792U - Chip-packaging general test seat

Info

Publication number: CN203396792U
Application number: CN201320484176.XU
Authority: CN
Inventors: 杜仲; 安洪亮; 王欣洋
Original assignee: GPIXEL Inc
Current assignee: Changchun Changguang Chenxin Microelectronics Co ltd
Priority date: 2013-08-08
Filing date: 2013-08-08
Publication date: 2014-01-15
Anticipated expiration: 2023-08-08

Abstract

The utility model relates to a chip-packaging general test seat. The test seat includes a load-module matrix comprised of M-row and N-column load modules and M row-load-module-shared handles. The load-module matrix is fixed on a chip test evaluation board and contact matrixes are arranged on the load modules. Each row-load-module-shared handle includes an operation rod part and a rotating rod part, which are mutually connected. The rotating rod part of each row-load-module-shared handle penetrates through a cavity defined by a groove at one side of the bottom face of a top board of row load modules at a corresponding row, the side face of a convex-type plywood and a groove at the upper surface of a bottom plate. When the row-load-module-shared handles are rotated, the convex-type plywoods at corresponding rows can be pushed to move. In the chip-packaging general test seat, standard chip test seat load modules, provided with configurative contacts, are used as a basic unit in testing a burn-in socket. A user can match each pin matrix of a chip through configuring contacts of each load module so that the chip-packaging general test seat is high in universality, high in chip test efficiency and safe and reliable.

Description

Chip package universal test seat

Technical field

The utility model belongs to chip encapsulation technology field, relates to a kind of chip package universal test seat.

Background technology

Chip test base (socket) is that the electric property of chip and function are tested to used chip bearing device.It is mainly used in chip testing evaluation board, plays the function that connects chip and pcb board.Standard chips test bench of the prior art (socket) generally comprises top board, convex clamping plate, base plate and handle; Convex clamping plate are between top board and base plate, and three forms carrier module, configure contact matrix on carrier module; Handle partly consists of interconnective control lever part and bull stick; The cavity that bull stick is partly positioned at the groove of top board bottom surface one side, the groove of the Yi Ge side of convex clamping plate and plate upper surface one side forms; The pin of chip under test is inserted in carrier module Shang contact, by contact matrix, is realized and being electrically connected to chip testing evaluation board.This chip test base can only, for carrying standard chips, be connected it with chip testing evaluation board.If chip package is non-standard encapsulation, normally, according to the package dimension of chip and a chip test base matching of pinout customization, the test bench technological requirement of realization is high by this way, the cycle is long, expense is high.

Summary of the invention

The technical problems to be solved in the utility model is to provide a kind of chip package universal test seat that can meet non-standard packaged chip and many pins of large scale chip bearing.

In order to solve the problems of the technologies described above, chip package universal test seat of the present utility model comprises the carrier module matrix that the capable N row of M carrier module forms, and M row carrier module shares handle, and wherein M, N are natural number; Carrier module matrix is fixed in chip testing evaluation board, and each carrier module configuration contact matrix; Row carrier module shares handle and partly consists of interconnective control lever part and bull stick, each row carrier module shares the bull stick part of handle through the groove of each carrier module top board bottom surface one side of corresponding row, in the cavity that the groove of the Yi Ge side of convex clamping plate and plate upper surface one side forms, the convex clamping plate that the shared handle of rotation row carrier module can promote each carrier module of corresponding row move.

The opposite side upper surface of described carrier module base plate is with two projections, and the space between two projection corresponding surfaces forms gathering sill, and convex clamping plate opposite side is with orienting lug; When the shared handle promotion of rotation row carrier module convex clamping plate move, orienting lug moves along gathering sill.

Described carrier module Shang contact matrix is square matrices.

The bull stick part xsect that described row carrier module shares handle is more than half circle.When the shared handle of each row carrier module of rotation is confined it, bull stick part xsect semicircle plane when initial turns to semicircle plane parallel in convex clamping plate upper and lower surface state perpendicular to convex clamping plate upper and lower surface state, and in this process, bull stick partly promotes convex clamping plate and moves.

Chip pin is inserted in the contact of carrier module matrix, confine all row carrier modules and share handle, make chip pin clamped, all pins of chip are linked in chip testing evaluation board by contact, can utilize chip testing evaluation board to test the electric property of chip and function.The utility model is selected has the standard chips test bench carrier module of configurable contact as the base unit of test socket burnt-in seat.User can be by the contact of each carrier module of configuration, each pin matrix of matching chip, and highly versatile, chip testing efficiency is high, safe and reliable.

Accompanying drawing explanation

Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.

Fig. 1 is that standard chips test bench forms structural drawing.

Fig. 2 is base plate and the handle arrangement mode schematic diagram of chip package universal test seat of the present utility model.

Fig. 3 is chip package universal test seat one-piece construction schematic diagram of the present utility model.

Fig. 4 is chip pin arrangement scheme schematic diagram.

Embodiment

As shown in Figure 1, standard chips test bench is comprised of 4 parts and accessory, comprises top board 1, convex clamping plate 2, base plate 3 and handle 4.Convex clamping plate 2 are between top board 1 and base plate 3, and three forms standard carrier module; Handle consists of interconnective control lever part 42 and bull stick part 41; The cavity that bull stick part 41 is positioned at top board 1 groove 13 of bottom surface one side, the groove of the side 22 of convex clamping plate 2 and base plate 3 upper surface one sides 31 forms.Wherein top board 1, convex clamping plate 2, base plate 3 are standard chips test bench carrier module structure, can guarantee the stability of electrical equipment link.

As shown in Figure 2,3, 4, chip package universal test seat of the present utility model comprises the carrier module matrix that the capable N row of M standard carrier module forms, and M row carrier module shares handle 8.Wherein M, N are natural number, and the size of numerical value does not have strict restriction, determines as required.Carrier module matrix is fixed in chip testing evaluation board (not shown), and each carrier module configuration contact matrix.

Described carrier module consists of top board 1, convex clamping plate 2, base plate 3, and convex clamping plate 2 are between top board 1 and base plate 3.On top board 1, dispose pin hole matrix 11; On convex clamping plate 2, dispose the pin folder hole matrix 23 corresponding to pin hole matrix 11, in each pin folder hole, with pin, press from both sides 24; On base plate 3, dispose the solder joint hole matrix 35 corresponding to pin hole matrix 11, pin Jia24 lower end forms solder joint through the part of solder joint hole matrix 35; The pin folder hole matrix 23 of the pin hole matrix 11 of top board 1, convex clamping plate 2, the common formation of the solder joint hole matrix of base plate 3 35 contact matrix.Top board 1, convex clamping plate 2, base plate 3 are fixed in chip testing evaluation board (not shown) by screw 5, solder joint welding in the pad of chip testing evaluation board and solder joint hole matrix 35.

Row carrier module shares handle 8 and consists of bull stick part 81 and control lever part 82.The xsect in whole or in part of bull stick part 81 is semicircle, cam-shaped, or other can promote the shape that convex clamping plate 2 move when bull stick partly rotates.Each row carrier module shares the bull stick part 81 of handle 8 in the cavity of groove 31 formations of corresponding row carrier module top board 1 groove 13 of bottom surface one side, the Yi Ge side 22 of convex clamping plate and base plate 3 upper surface one sides.The opposite side upper surface of base plate 3 is with two projections 32,33, and the space between projection 32,33 opposite faces forms gathering sill 34, and convex clamping plate 2 opposite sides are with orienting lug 21.When the shared handle 8 promotion convex clamping plate 2 of rotation row carrier module move, the orienting lug 21 of these each convex clamping plate of row carrier module moves along corresponding gathering sill 34, the all pins of chip are clamped by the pin folder 24 in pin folder hole matrix 23 on convex clamping plate 2, thereby chip is fixed on carrier module matrix.

The utility model adopts the PGA(contact pin grid array packages technology of plug-in mounting pin) ceramic package.Described encapsulation should meet 3 requirements.The one, need to arrange chip pin 7 according to matrix-style; The 2nd, more than chip pin 7 is divided into, group pin matrixes 6 and every group of pin matrix 6 physical dimension are identical; The 3rd, respectively to organize pin matrix 6 and need on transverse and longitudinal both direction, align also in a certain distance apart from one another, the test socket burnt-in seat physical dimension of described required distance reference standard encapsulation determines.According to encapsulation requirement, can arrange pin discharge according to chip real needs.

As shown in Figure 4, be that size is larger, the chip that number of pins is more.The utility model can be arranged chip pin with matrix form, each pin matrix 6 is less than standard carrier module contact matrix, each pin matrix 6 transverse and longitudinal number of pins is less than standard carrier module transverse and longitudinal number of contacts, pin interval A in described pin matrix 6 is constant, and meets the contact distance of standard carrier module.In pin matrix 6, pin can be not full up.A plurality of pin matrixes 6 are arranged according to constant interval B and C, and transverse and longitudinal need be greater than the transverse and longitudinal physical dimension of standard carrier module apart from E and F.Concrete chip package pin design can be determined matrix size and size according to actual conditions under prerequisite meeting described requirement.

During the design of chip testing evaluation board (pcb board) discharge carrier module, standard carrier module is designed according to the equidistant discharge of transverse and longitudinal, according to chip pin, design determines transverse and longitudinal distance.According to the length of the line number amount configuration handle of standard carrier module.The control lever part of handle need to be outside chip package, in order to avoid cannot operating grip.

Claims

1. a chip package universal test seat, is characterized in that the carrier module matrix that comprises that the capable N row of M carrier module forms, M the shared handle (8) of row carrier module, and wherein M, N are natural number; Carrier module matrix is fixed in chip testing evaluation board, and each carrier module configuration contact matrix; Row carrier module shares handle (8) and consists of interconnective control lever part (82) and bull stick part (81), each row carrier module shares the bull stick part (81) of handle (8) through the groove (13) of each carrier module top board (1) bottom surface one side of corresponding row, in the cavity that the groove (31) of the Yi Ge side (22) of convex clamping plate (2) and base plate (3) upper surface one side forms, the convex clamping plate (2) that the shared handle (8) of rotation row carrier module can promote each carrier module of corresponding row move.

2. chip package universal test seat according to claim 1, it is characterized in that the opposite side upper surface of described carrier module base plate (3) is with two projections (32,33), space between two projections (32,33) corresponding surface forms gathering sill (34), and convex clamping plate (2) opposite side is with orienting lug (21); When shared handle (8) promotion of rotation row carrier module convex clamping plate move, orienting lug (21) moves (34) along gathering sill.

3. chip package universal test seat according to claim 1, is characterized in that described carrier module Shang contact matrix is square matrices.

4. chip package universal test seat according to claim 1, is characterized in that bull stick part (81) xsect of the shared handle (8) of described row carrier module is more than half circle.