CN104183354A - Coil part and manufacturing method thereof - Google Patents
Coil part and manufacturing method thereof Download PDFInfo
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- CN104183354A CN104183354A CN201410218626.XA CN201410218626A CN104183354A CN 104183354 A CN104183354 A CN 104183354A CN 201410218626 A CN201410218626 A CN 201410218626A CN 104183354 A CN104183354 A CN 104183354A
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- 239000000463 material Substances 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 19
- 238000000576 coating method Methods 0.000 claims description 19
- 238000007747 plating Methods 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000000992 sputter etching Methods 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims description 3
- 229910001120 nichrome Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 87
- 230000004888 barrier function Effects 0.000 description 57
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- 229910000859 α-Fe Inorganic materials 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 238000003754 machining Methods 0.000 description 5
- 238000003801 milling Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 239000012774 insulation material Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
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- 238000004528 spin coating Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- -1 argon ion Chemical class 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
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- 238000007772 electroless plating Methods 0.000 description 1
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- BGOFCVIGEYGEOF-UJPOAAIJSA-N helicin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC=CC=C1C=O BGOFCVIGEYGEOF-UJPOAAIJSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
The invention provides a coil part which is characterized in that even if a coil pattern is made in a high aspect ratio, there is no shifting or thermal peeling problems, and the performance and the reliability are high. The coil part (1) is provided with coil layers (14a-14d), and each coil layer (14a-14d) is provided with an insulating layer (15a-15d), a framework layer (16a-16d) formed on the insulating layer (15a-15d), and a conductor layer (17a-17d) which is formed on the same plane as the framework layer (16a-16d) and includes a spiral conductor (19-22). Each framework layer (16a-16d) comprises an opening image (18a-18d) including a negative pattern of a coil pattern, and the spiral conductors (19-22) are formed in the opening image (18a-18d). The spiral conductors (19-22) are provided with seed layers (30) for covering the bottom surfaces and the inner side surfaces of the opening images (18a-18d), and clad layers (31) arranged on the surfaces of the seed layers (30).
Description
Technical field
The present invention relates to coil component and manufacture method thereof, particularly relate to coil component and the manufacture method thereof with planar coil configuration.
Background technology
In the coil component of surface installing type, adopting can miniaturization and the planar coil configuration (for example, with reference to patent documentation 1) of slimming.Planar coil configuration is on substrate, to be formed with for example structure of spiral helicine planar coil pattern.Along with the progress of manufacturing technology in recent years, can make the very small-sized and thin space of coil pattern.But, for example at common-mode filter or for power supply, in coil (power inductance), require its D.C. resistance low, if the too low D.C. resistance of the thickness of coil pattern increases, therefore, expectation thickens as far as possible coil pattern and reduces D.C. resistance.
In the past, in the formation of coil pattern, preferably adopted so-called semi-additive process.In semi-additive process, whole at basal surface forms thin Seed Layer in advance, becomes the corrosion-resisting pattern of the negative pattern (negative pattern) of coil pattern thereon.Then, by the face that exposes to Seed Layer, electroplate and make and after its growth forms the coil pattern of specific thickness, remove corrosion-resisting pattern, then remove Seed Layer unnecessary between coil pattern by etching, only residual coil pattern.By the above, complete coil pattern.The situation of lattice coil structure, after forming insulating barrier, repeats above-mentioned operation in coil pattern.
Prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2008-186990 communique
Summary of the invention
Invent technical problem to be solved
Yet, in semi-additive process, by the photoresist of spin-coating method application of liquid, to its exposure and development, form corrosion-resisting pattern, therefore, be difficult to form enough thick corrosion-resisting pattern.Therefore it is difficult, forming for example very thick coil pattern of 100 μ m left and right.
In addition, the bottom surface of coil pattern consists of the Seed Layer forming by sputter etc., high with the adhesion of basal surface, but the side of coil pattern consists of the part forming of growing by plating, contact with formed dielectric resin material after forming this coil pattern, therefore, there is the bad problem of the side of coil pattern and the adhesion of dielectric resin material.In coil pattern, due to stream super-high-current, easily because of heating thermal expansion, but if the side of coil pattern and the adhesion of insulating resin are bad, there is coil pattern thermal expansion and easily peeling off and moisture is invaded the gap of coil pattern and dielectric resin material and the worry of the migration of coil pattern is occurred from insulating resin while shrinking repeatedly.High aspect ratio is more remarkable in the cross section of coil-conductor for such problem.
In addition, in semi-additive process, the corrosion-resisting pattern using when the formation of coil pattern is removed, and dielectric resin material is filled by spin-coating method in the space between coil pattern.But if coil pattern is made to high aspect ratio, above concavo-convex that covers the dielectric resin material of its top becomes strong, in lattice coil structure, there is the machining accuracy problem of step-down significantly of the coil pattern on upper strata.
Therefore, though the object of the present invention is to provide by coil pattern make high aspect ratio also can prevent hot soarfing from or migration and high-performance and high coil component and the manufacture method thereof of reliability.
In addition, even other object of the present invention is to provide the coil pattern of high aspect ratio also can guarantee flatness above and easily coil component and the manufacture method thereof of double line ring layer.
The means of technical solution problem
In order to address the above problem, coil component of the present invention at least has a coil layer, described coil layer possesses: there is the casing play of patterns of openings and be formed on described casing play same level on the conductor layer that comprises coil pattern, the negative pattern that described patterns of openings comprises described coil pattern, described coil pattern is formed on the inside of described patterns of openings, and described coil pattern has the Seed Layer of at least inner side surface that covers described patterns of openings and the surperficial coating that is arranged on described Seed Layer.
According to the present invention, the Seed Layer of coil pattern is contacted with the inner side surface of casing play, therefore, can improve the bonding force with casing play.Therefore, though can provide by coil pattern make high aspect ratio also can prevent migration or hot soarfing from and high-performance and the high coil component of reliability.
In the present invention, preferably, described Seed Layer comprises the material different from described coating.In this case, particularly preferably, described Seed Layer has the adhesive linkage consisting of Cr, Ti, Ta, Pd, Ni or NiCr and is overlapped in described adhesive linkage and two-layer structure that the plating basalis by forming with described coating same material that arranges sequentially forms with this.According to the coil pattern with such Seed Layer, can improve the cementability with casing play, can realize the coil component that high-performance and reliability are high.
Preferably, the aspect ratio in the cross section of described coil pattern is more than 1.In addition, preferably, the height that the height of described Seed Layer that covers the described inner side surface of described patterns of openings is described casing play over half.If the aspect ratio of coil pattern is more than 1, can realize coil small-sized and that D.C. resistance is low, the hot soarfing that its reverse side easily produces coil pattern from or migration.Yet, according to above-mentioned structure, can solve such problem, if the height that the height of Seed Layer is casing play is over half, the effect of can be improved the effectively side of the coil pattern in the present invention and the cementability of casing play.
Preferably, described casing play consists of resin sheet.If coil pattern is made to high aspect ratio, can reduce D.C. resistance, realize high performance coil component, still, the hot soarfing that coil pattern easily occurs from or migration.In addition, above concavo-convex of helical pattern becomes strong, is difficult to guarantee layer by layer the flatness of basal surface thereon in the situation of folded coil pattern.But, in the situation that being used resin sheet, casing play can easily solve such problem, can easily manufacture the coil component of multi-ply construction.
Preferably, the flat shape of described patterns of openings comprises helical pattern, and described coil pattern comprises helical conductor.In the situation that coil pattern is the helical conductor of high aspect ratio, easily occur hot soarfing from or migration problem.In addition, above concavo-convex of helical pattern becomes strong, is difficult to guarantee layer by layer the flatness of basal surface thereon in the situation of folded coil pattern.But, according to the present invention, can solve such problem, can realize the coil component that reliability is high.
Preferably, the described inner side surface of described patterns of openings has the reverse tapered shapes that tilts towards the mode of upper opening narrowed width from the below of the stacked direction of described casing play.According to this structure, can use ion milling method for example easily to manufacture that the Seed Layer of coil pattern and the inner side surface of casing play contact and the coil component of the structure that arranges.
Preferably, coil component of the present invention has the lit-par-lit structure of a plurality of described coils.In the situation that coil pattern is high aspect ratio, above concavo-convex of helical pattern becomes strong, is difficult to guarantee layer by layer the flatness of basal surface thereon in the situation of folded coil pattern.But, according to the present invention, can solve such problem, can realize the coil component that reliability is high.
In addition, the manufacture method of coil component of the present invention, it is characterized in that, possess form casing play operation and with described casing play same level on form the operation of the conductor layer that comprises coil pattern, the operation that forms described casing play comprises the operation of pasting resin sheet, and the operation that forms the patterns of openings of the negative pattern that comprises described coil pattern at described resin sheet, the operation that forms described conductor layer comprises: in whole the operation that forms Seed Layer that is formed with the described resin sheet of described patterns of openings, optionally remove and be formed on the Seed Layer above of described resin sheet and make this Seed Layer remain in the operation of at least inner side surface of described patterns of openings, and by electroplating the operation that forms coating and form the described conductor layer being formed by described Seed Layer and described coating in the inside of described opening in described Seed Layer.
According to the present invention, owing to using resin sheet as intercoil insulation material (permanent material), therefore, can form effectively the coil pattern of high aspect ratio, and can improve the adhesion of coil pattern and casing play.In addition, by using resin sheet, the flatness above of coil pattern can be improved, the machining accuracy of the coil pattern that is deposited in its upper strata can be improved.Therefore, can improve the reliability of the coil component of multi-ply construction.
Preferably, in optionally removing the operation that is formed on the Seed Layer above described resin sheet, make this Seed Layer remain in described inner side surface and the bottom surface of described patterns of openings.Accordingly, can in the inside of patterns of openings, form coil layer effectively.
In the present invention, preferably, the aspect ratio in the cross section of described coil pattern is more than 1.In addition, preferably, the operation of optionally removing the Seed Layer above that is formed on described resin sheet is undertaken by implementing ion milling under the state tilting with respect to the exit direction of ion with described casing play above.Thus, can easily manufacture the coil component of the multi-ply construction of the coil pattern with high aspect ratio.
The effect of invention
According to the present invention, though can provide by coil pattern make high aspect ratio also can prevent migration or hot soarfing from and high-performance and high coil component and the manufacture method thereof of reliability.In addition, according to the present invention, even can provide the coil pattern of high aspect ratio also can guarantee flatness above and easily coil component and the manufacture method thereof of double line ring layer.
Accompanying drawing explanation
Fig. 1 means the general perspective view of exterior structure of the coil component 1 of the 1st execution mode of the present invention.
Fig. 2 is the roughly exploded perspective view that represents in detail the layer structure of coil component 1.
Fig. 3 is the general lateral sectional view of functional layer 11.
Fig. 4 is the rough cross-sectional view of manufacture method that schematically illustrates the coil component 1 of the 1st execution mode of the present invention.
Fig. 5 is for the schematic diagram as the inclination milling method of an operation of the manufacturing process of coil component 1 is described.
Fig. 6 is the sectional view of manufacture method that schematically shows the coil component 1 of the 2nd execution mode of the present invention.
Fig. 7 is layer roughly exploded perspective view of constructing that represents in detail the coil component 2 of the 2nd execution mode of the present invention.
Fig. 8 is layer roughly exploded perspective view of constructing that represents in detail the coil component 3 of the 3rd execution mode of the present invention.
The explanation of symbol
1 coil component
Above 1a coil component
The bottom surface of 1b coil component
The side of 1c, 1d, 1e, 1f coil component
10 substrates
11 functional layers
12a, 12b, 12c, 12d pad electrode
13 cover layers
14a coil layer
14b coil layer
14c coil layer
14d coil layer
15a insulating barrier
15b insulating barrier
15c insulating barrier
15d insulating barrier
15e insulating barrier
16a casing play
16b casing play
16c casing play
16d casing play
17a conductor layer
17b conductor layer
17c conductor layer
17d conductor layer
18a～18d patterns of openings
19 helical conductors
20 helical conductors
21 helical conductors
22 helical conductors
23 conductor introductions
24 conductor introductions
25 conductor introductions
26 conductor introductions
27 via conductors
28 via conductors
29a internal terminal electrode
29b internal terminal electrode
29c internal terminal electrode
29d internal terminal electrode
30 Seed Layer
31 coating
32 via conductors
33 magnetic cores
Above Sa casing play
The bottom surface of Sb patterns of openings
The inner side surface of Sc patterns of openings.
Embodiment
Below, with reference to accompanying drawing, limit describes the preferred embodiment of the present invention in detail.
Fig. 1 means the stereogram of exterior structure of the coil component 1 of the 1st execution mode of the present invention.
As shown in Figure 1, the coil component 1 of present embodiment is the common-mode filter with 4 terminal constructions, possess substrate 10, be arranged at substrate 10 functional layer 11 above, be arranged at the 1st～4th pad electrode 12a～12d above of functional layer 11 and be arranged at functional layer 11 except the formation position of pad electrode 12a～12d above cover layer 13.
As shown in the figure, coil component 1 is roughly rectangular-shaped surface installing type tab member, has 1a, bottom surface 1b above, two side 1c, 1ds and with Y-direction parallel two side 1e, 1fs parallel with directions X.Have, the coil component of Fig. 1 is supine state to be installed, to be reversed up and down, and pad electrode 12a～12d is used down during installation again.
Substrate 10 plays the effect of the mechanical strength of guaranteeing coil component 1.As the material of substrate 10, such as using the magnetic ceramic materials such as ferrite sintered body, also can use the nonmagnetic ceramic materials such as aluminium oxide or non magnetic ferrite.In the situation that using magnetic ceramics material, can make substrate 10 bring into play function as the closed magnetic circuit of coil part.Although be not particularly limited, when patch size is 0.65 * 0.50 * 0.30 (mm), the thickness of substrate 10 can be 0.2mm left and right.
Functional layer 11 is to comprise the layer that is arranged at the coil part between substrate 10 and cover layer 13.Although detailed content is narrated in the back, functional layer 11 has the multi-ply construction that alternately laminated insulating barrier 11 and conductor layer form.So, the coil component 1 of present embodiment is so-called film-type, with have wound core of magnetic around the winding type of structure of wire have any different.
The 1st～4th pad electrode 12a～12d is the external terminal electrode of coil part.1a above and a side 1c that the 1st and the 2nd pad electrode 12a, 12b are formed in coil component 1 have the L word electrode that exposes face, and what the 3rd and the 4th pad electrode 12c, 12d were formed in coil component 1 has with the side 1d of 1a opposition side above the L word electrode that exposes face.
Cover layer 13 is the layers that form the installed surface of coil component 1, mechanicalness and electrical resistance ground defencive function layer 13 together with substrate 10.Wherein, the mechanical strength of cover layer 13 is less than substrate 10, brings into play auxiliary effect aspect intensity.In addition, the effect of the 1st～4th pad electrode 12a～12d is mechanically supported in cover layer 13 performances.As cover layer 13, can use the epoxy resin (complex ferrite) that contains ferrite powder, also can use the not epoxy resin of contain ferrite powder.In the situation that using complex ferrite, can make cover layer 13 as the closed magnetic circuit performance function of coil component 1.
Fig. 2 is the exploded perspective view that represents in detail the layer structure of coil component 1.
As shown in Figure 2, functional layer 11 possesses: the insulating barrier 15a～15e stacking gradually towards cover layer 13 from substrate 10, casing play 16a～the 16d forming respectively on insulating barrier 15a～15e, comprise the conductor layer 17a that is formed on the 1st helical conductor 19 on insulating barrier 15a together with casing play 16a, comprise the conductor layer 17b that is formed on the 2nd helical conductor 20 on insulating barrier 15b together with casing play 16b, comprise the conductor layer 17c that is formed on the 3rd helical conductor 21 on insulating barrier 15c together with casing play 16c, and comprise the conductor layer 17d that is formed on the 4th helical conductor 22 on insulating barrier 15d together with casing play 16d.
Insulating barrier 15a～15e plays and will be arranged at insulation between the conductive pattern of different conductor layers and guarantee to form the effect of flatness of the basal surface of conductive pattern.Particularly, the effect that insulating barrier 15a plays the surperficial concavo-convex of absorptive substrate 10 and improves the machining accuracy of conductive pattern.As the material of insulating barrier 15a～15e, preferably use the photoresist of on electrical insulating property excellence and handling ease, be not particularly limited, can use polyimide resin or epoxy resin.The thickness of insulating barrier is preferably 5～10 μ m.
Casing play 16a～16d is the insulating resin layer with the patterns of openings (negative pattern) identical shaped with being formed on conductive pattern on same level.Casing play 16a～16d plays the effect of the side of supportive conductors pattern, therefore, in the mode in the gap between landfill conductive pattern, arranges.As the material of casing play 16a～16d, preferably use the photoresist sheet (sheet) of on electrical insulating property excellence and handling ease, be not particularly limited, can use polyimide resin or epoxy resin.The thickness of casing play 16a～16d can be for example 100 μ m.
On insulating barrier 15a, be provided with the 1st helical conductor 19 and the 1st conductor introduction 23 and internal terminal electrode 29a～29d, on insulating barrier 15b, be provided with the 2nd helical conductor 20 and the 2nd conductor introduction 24 and internal terminal electrode 29a～29d.On insulating barrier 15c, be provided with the 3rd helical conductor 21 and the 3rd conductor introduction 25 and internal terminal electrode 29a～29d, on insulating barrier 15d, be provided with the 4th helical conductor 22 and the 4th conductor introduction 26 and internal terminal electrode 29a～29d.Internal terminal electrode 29a～29d connects the through hole electrode that the mode of insulating barrier 15b～15e arranges.
The outer circumference end of the 1st helical conductor 19 is connected in the 1st internal terminal electrode 29a via the 1st conductor introduction 23, and the outer circumference end of the 2nd helical conductor 20 is connected in the 3rd internal terminal electrode 29c via the 2nd conductor introduction 24.In addition, the interior Zhou Duan of the 1st and the 2nd helical conductor 19,20 interconnects via connecting the 1st via conductors 27 of insulating barrier 15b each other.Therefore, the 1st and the 2nd helical conductor 19,20 forms the single inductance coil that the series circuit by 2 coils forms.
The outer circumference end of the 3rd helical conductor 21 is connected in the 2nd internal terminal electrode 29b via the 3rd conductor introduction 25, and the outer circumference end of the 4th helical conductor 22 is connected in the 4th internal terminal electrode 29d via the 4th conductor introduction 26.In addition, the interior Zhou Duan of the 3rd and the 4th helical conductor 21,22 interconnects via connecting the 2nd via conductors 28 of insulating barrier 15d each other.Therefore, the 3rd and the 4th helical conductor 21,22 forms the single inductance coil that the series circuit by 2 coils forms.
The 1st～4th helical conductor 19～22 has identical in fact flat shape, and in vertical view, is arranged on same position and overlaps.The 1st helical conductor 19 turns clockwise from the inside Zhou Duan of its outer circumference end, the 2nd helical conductor 20 turns clockwise from Zhou Duanxiang outer circumference end in it on the contrary, therefore, when from internal terminal electrode 29a to inner terminal electrode 29c current flowing, by identical in the orientation of the 1st magnetic flux that mobile electric current produces in the 2nd helical conductor 19,20 respectively.Similarly, when from internal terminal electrode 29b to inner terminal electrode 29d streaming current, orientation by the magnetic flux that mobile electric current produces in the 3rd and the 4th helical conductor 21,22 is respectively mutually the same, all identical with the orientation of the magnetic flux of the 2nd helical conductor 19,20 with the above-mentioned the 1st in addition.Therefore, 19～22 of the 1st～4th helical conductors, produce strong magnetic coupling.
The profile of the 1st～4th helical conductor 19～22 is round spiral.The decay of round spiral conductor in high frequency is few, therefore can be preferably as high frequency electric sense use.Have, helical conductor can, for just round, can, for oval, can be also also ellipse again.In addition, can be also essentially rectangular.Have, the position relationship of the above-below direction of the 1st～4th helical conductor 19～22 is not particularly limited again, for example, the 1st and the 2nd helical conductor 19,20 can be configured in than the 3rd and the 4th helical conductor 21,22 position on upper strata more.
On insulating barrier 15d, be respectively arranged with the 1st～4th pad electrode 12a～12d.The 1st～4th pad electrode 12a～12d is connected to internal terminal electrode 29a～29d.Have, " pad electrode " refers to from by the Metal Ball such as Cu, Au being carried out to hot pressing with flip chip bonding, to fetch the electrode of formation different in this manual, is by the formed thick film electrode plating of plating again.Although be not particularly limited, preferably use Cu as the material of pad electrode.The thickness of pad electrode can be with the thickness of cover layer 13 equal or more than, be 0.08～0.1mm left and right.
Fig. 3 is the side cross-sectional views along the functional layer 11 of the Y0-Y0 line of Fig. 2.
As shown in Figure 3, functional layer 11 has the multi-ply construction that the 1st～4th coil layer 14a～14d is formed with this sequential cascade, the 1st coil layer 14a consists of insulating barrier 15a, casing play 16a and conductor layer 17a, the 2nd coil layer 14b consists of insulating barrier 15b, casing play 16b and conductor layer 17b, the 3rd coil layer 14c consists of insulating barrier 15c, casing play 16c and conductor layer 17c, and the 4th coil layer 14d consists of insulating barrier 15d, casing play 16d and conductor layer 17d.
On the 1st～4th insulating barrier 15a～15d, casing play 16a～16d is set respectively, at casing play 16a～16d, is formed with respectively patterns of openings 18a～18d.Patterns of openings 18a～18d is the negative pattern of the 1st～4th helical conductor 19～21 conductive patterns such as grade, is formed with the conductive pattern of conductor layer 17a～17d in the inside of patterns of openings 18a～18d.
The interior Zhou Duan of the 2nd helical conductor 20 is connected in the interior Zhou Duan of the 1st helical conductor 19 via connecting the via conductors 27 of insulating barrier 15b, the interior Zhou Duan of the 4th helical conductor 22 is connected in the interior Zhou Duan of the 3rd helical conductor 21 via connecting the via conductors 28 of the 4th insulating barrier 15d.The internal terminal electrode 29a of conductor layer 17b～17d～29d connects the insulating barrier 15b～15d that forms its basal surface and the internal terminal electrode 29a～29d that is connected in lower floor, and pad electrode 12a～12d connects the 5th insulating barrier 15e and is connected to corresponding internal terminal electrode 29a～29d in addition.
In order to reduce D.C. resistance, the 1st～4th helical conductor 19～22 is preferably thick as much as possible, and the aspect ratio in its cross section is preferably more than 1.Particularly, the thickness that can make helical conductor is 100 μ m, and width is 20 μ m.In order to form accurately the helical conductor that aspect ratio is high, need the side of the helical conductor of supports upright securely, in present embodiment, the side of helical conductor 19～22 is supported by casing play 16a～16d.
The conductive pattern of each conductor layer 17a～17d that comprises helical conductor 19～22 has the lit-par-lit structure of Seed Layer 30 and coating 31, and Seed Layer 30 not only covers the bottom surface of patterns of openings 18a～18d, also covers inner side surface.Seed Layer 30 is owing to being the fine and close conductor layer connecting airtight in its basal surface, therefore high with the adhesion of basal surface, the hot soarfing that is difficult to produce conductive pattern from or migration.
Described in bright as noted earlier, in the coil component 1 of present embodiment, the conductive pattern that comprises helical conductor 19～22 consists of Seed Layer 30 and coating 31, Seed Layer 30 covers bottom surface and the inner side surface of patterns of openings, therefore, can easily form the helical conductor 19～22 that aspect ratio is high.In addition, can realize do not exist the migration of conductive pattern or hot soarfing from problem and high-performance and the high coil component of reliability.
Then, the manufacture method with regard to coil component describes.
Fig. 4 is for the rough cross-sectional view of the manufacture method of coil component 1 is described.Have again, in Fig. 4, for the convenience illustrating, only show 1 coil component, but in actual manufacture, adopt and on a large assembly substrate, form the volume production operation of a plurality of coil components simultaneously.
In the manufacture of coil component 1, first, prepared substrate 10 (Fig. 4 (a)) forms functional layer 11 (Fig. 4 (b)～(i)) on substrate 10.Functional layer 11 is formed by so-called thin-film technique.Thin-film technique refers to, by being repeated below operation: photosensitive resin coating, by its exposure and development and after forming insulating barrier, and forms conductive pattern, thereby be alternately formed with the method for the multilayer film of insulating barrier and conductor layer on the surface of insulating barrier.The functional layer 11 of present embodiment is the layer that the 1st～5th insulating barrier 15a～15e and the 1st～4th conductor layer 17a～17d are laminated with this sequence alternate.In addition, in present embodiment, with the 1st～4th conductor layer 17a～17d same level on be formed with respectively the 1st～4th casing play 16a～16d as intercoil insulation material (permanent material).
In the formation operation of functional layer 11, first whole on substrate 10 forms insulating barrier 15a (Fig. 4 (b)).Insulating barrier 15a can utilize spin-coating method photosensitive resin coating exposure to form.
Then, on insulating barrier 15a, form casing play 16a (Fig. 4 (c)).Casing play 16a preferably forms by pasting photoresist sheet.Thus, the casing play of adequate thickness can be formed, and the flatness above it can be improved.
Then, by casing play 16a exposure and development are formed to patterns of openings 18a (Fig. 4 (d)).This patterns of openings 18a is formed in the negative pattern of the conductive pattern that comprises helical conductor 19, conductor introduction 23, internal terminal electrode 29a～29d on insulating barrier 15a.
Then, whole of the casing play 16a after patterning forms Seed Layer 30 (Fig. 4 (e)).Seed Layer 30 can be formed by sputter or electroless plating.Seed Layer 30 is preferably sequentially carries out with this two membranes (Cu/Cr film) that film forming forms by the adhesive linkage consisting of Cr and the plating basalis consisting of Cu.In this case, the thickness of Cr film and Cu film can be 10nm respectively
and 100nm
also can substitute Cr with Ti, Ta, Pd, Ni, NiCr etc.By this operation, Seed Layer 30 is Sa but also form at the bottom surface of patterns of openings 18a Sb or inner side surface Sc on casing play 16a not only.
Then, optionally remove the Seed Layer 30 of Sa above that is only formed on casing play 16a, make the Sa above of casing play 16a expose (Fig. 4 (f)).This operation for example can be by only carrying out chemical grinding and carry out being formed with the Sa above of the casing play 16a of Seed Layer 30, or also can be undertaken by inclination milling method.As shown in Figure 5, inclination milling method is the method that tilts to carry out milling with respect to the exit direction out of plumb by the argon ion shown in dotted arrow by being polished face.Now, preferably to be polished amount of grinding uniform mode in face of face, make to be polished face rotation.According to inclination milling method, although only cover the upper end of Seed Layer 30 of the inner side surface Sc of patterns of openings 18a, be removed, can be in major part and the Sb relict sublayer, bottom surface 30 of inner side surface Sc.Particularly in the high conductive pattern of aspect ratio, its effect is remarkable.
Although perfect condition is that to cover the height of Seed Layer 30 of inner side surface Sc of patterns of openings 18a identical with the height of casing play 16a, needing only is height over half of casing play 16a.As long as the height of Seed Layer 30 is height over half of casing play 16a, the effect of can be improved the effectively side of helical conductor 19 and the cementability of casing play 16a.
Then, by copper, electroplate the coating 31 that formation consists of Cu in Seed Layer 30, form thus by the Seed Layer 30 of the inside of patterns of openings 18a and the conductor layer 17a (Fig. 4 (g)) that coating 31 forms.The conductive pattern of conductor layer 17a preferably comprises the 1st helical conductor the 19, the 1st conductor introduction 23 and the 1st～4th internal terminal electrode.The thickness of conductor layer 17a is preferably about 100 μ m.In addition, the live width of the 1st helical conductor is for example 10 about μ m, and its aspect ratio is very high, but the side of the 1st helical conductor supported by casing play, therefore can form effectively the helical conductor that aspect ratio is high.
Then, on the basal surface being formed by casing play 16a and conductor layer 17a, form insulating barrier 15b, and form the through hole (Fig. 4 (h)) that connects insulating barrier 15b.The insulating barrier 15b with through hole can be by utilizing spin-coating method photosensitive resin coating and its exposure and development being formed.
Thereafter, by repeating series of processes from the formation that is formed into insulating barrier of casing play (Fig. 4 (c)～(h)), thereby form successively casing play 16b, conductor layer 17b, insulating barrier 15c, casing play 16c, conductor layer 17c, insulating barrier 15d, casing play 16d, conductor layer 17d and insulating barrier 15e (Fig. 4 (i)).Thus, complete functional layer 11.
Then, on functional layer 11, form pad electrode 12a～12d and cover layer 13.Pad electrode 12a～12d can be formed by semi-additive process.In addition, cover layer 13 can and make it solidify to form by potting resin lotion.Thereafter, the operation via regulations such as scribing, cylinder grinding, barrel platings completes coil component 1.
As described above, according to the manufacture method of the coil component 1 of present embodiment, use resin sheet as the material using when making the growth of coil pattern plating, thereby can form effectively the coil pattern of high aspect ratio.In addition, after forming conductive pattern by plating, also casing play is directly used same as before as intercoil insulation material (permanent material), thereby can form Seed Layer at bottom surface and the inner side surface of patterns of openings, can improve the adhesion of coil pattern and casing play.In addition, by use resin sheet, can improve the flatness above of the coil pattern of high aspect ratio, can improve the machining accuracy of the coil pattern that is deposited in its upper strata.Therefore, can improve the reliability of the coil component of multi-ply construction.
Fig. 6 means the rough cross-sectional view of manufacture method of the coil component 1 of the 2nd execution mode of the present invention.
As shown in Figure 6, the manufacture method of the coil component 1 of present embodiment is characterised in that, the light when utilizing exposure the roundabout and mode that makes the inner side surface of patterns of openings 18a (and 18b～18d) become back taper forms.As shown in Fig. 6 (a), the light from light source 40 that has passed through photomask 41 is radiated on casing play 16a a little round.By this casing play 16a is developed, as shown in Fig. 6 (b), at casing play 16a, be formed with the patterns of openings 18a of the medial surface with the reverse tapered shapes to tilt towards the mode of upper opening narrowed width below its stacked direction.Have, the direction from the below of stacked direction towards top refers to the positive direction of stacked direction again, be in the direction vertical with casing play from substrate 10 away from direction.
As Fig. 6 (c) as shown in, in whole formation Seed Layer 30 being formed with the casing play 16a of patterns of openings 18a, for another example Fig. 6 (d) shown in, remove the Seed Layer 30 above that be formed on casing play 16a thereafter.Now, by casing play 16a above with incident direction by the argon ion shown in arrow perpendicularly towards and implement ion milling.Because the inner side surface of patterns of openings 18a has the reverse tapered shapes to tilt towards the mode of upper end open narrowed width from lower end, so the inner side surface of patterns of openings 18a forms the impact with respect to the incident direction of argon ion.Therefore, the Seed Layer 30 that is formed on the inner side surface of patterns of openings 18a is not removed, and be only formed on casing play 16a above and the Seed Layer 30 of the bottom surface of patterns of openings 18a be removed.
Even if Seed Layer 30 is not formed on the bottom surface of patterns of openings 18a and is only formed in the situation of inner side surface like this, the conductive pattern that is formed on the inside of patterns of openings 18a also connects airtight with the inner side surface of patterns of openings 18a via Seed Layer 30, thus can suppress hot soarfing from etc.Be more than the explanation of coil layer 14a, but be also same for coil layer 14b～14d.
Fig. 7 is layer roughly exploded perspective view of constructing that represents in detail the coil component 2 of the 2nd execution mode of the present invention.
As shown in Figure 7, the coil component 2 of present embodiment is the power supply coil with two-terminal structure, possesses the 1st and the 2nd pad electrode 12a, 12c.The basic structure of insulating barrier 15a～15e, casing play 16a～16d, conductor layer 17a～17d is identical with the 1st execution mode, but is with the 1st execution mode difference, and the 1st～4th helical conductor 19～22 is connected in series and forms single inductance coil.
The outer circumference end of the 1st helical conductor 19 is connected in the 1st internal terminal electrode 29a via the 1st conductor introduction 23, and the outer circumference end of the 4th helical conductor 22 is connected in the 2nd internal terminal electrode 29c via the 4th conductor introduction 26.The interior Zhou Duan of the 1st and the 2nd helical conductor 19,20 interconnects via connecting the 1st via conductors 27 of insulating barrier 15b each other.The interior Zhou Duan of the 3rd and the 4th helical conductor 21,22 interconnects via connecting the 2nd via conductors 28 of insulating barrier 15d each other.In addition, the outer circumference end of the 2nd and the 3rd helical conductor 20,21 interconnects via connecting the 3rd via conductors 32 of insulating barrier 15c each other.Therefore, the 1st, the 2nd, the 3rd and the 4th helical conductor 19,20,21,22 forms the single inductance coil that the series circuit by 4 coils forms.The 1st internal electron motor 29a is connected in the 1st pad electrode 12a, and the 2nd internal terminal electrode 29c is connected in the 2nd pad electrode 12c.
The 1st～4th helical conductor 19～22 is arranged on same position and overlaps in vertical view.The 1st helical conductor 19 turns clockwise from the inside Zhou Duan of its outer circumference end, the 2nd helical conductor 20 turns clockwise from Zhou Duanxiang outer circumference end in it on the contrary, the 3rd helical conductor 21 turns clockwise from the inside Zhou Duan of its outer circumference end, and the 4th helical conductor 22 turns clockwise towards outer circumference end from Zhou Duan in it on the contrary.Therefore,, when from internal terminal electrode 29a to inner terminal electrode 29c current flowing, the orientation of the magnetic flux being produced by the electric current that flows to respectively the 1st～4th helical conductor 19～22 is identical.Therefore, 19～22 of the 1st～4th helical conductors, produce strong magnetic coupling.
In present embodiment, also on the 1st～4th insulating barrier 15a～15d, be provided with casing play 16a～16d, at casing play 16a～16d, be formed with respectively patterns of openings 18a～18d.Moreover the conductive pattern of each conductor layer 17a～17d that comprises helical conductor 19～22 has the lit-par-lit structure of Seed Layer 30 and coating 31, Seed Layer 30 not only covers the bottom surface of patterns of openings 18a～18d but also covers inner side surface (with reference to Fig. 3).Because Seed Layer 30 is the fine and close conductor layers that connect airtight in its basal surface, therefore high with the adhesion of basal surface, the hot soarfing that is difficult to produce conductive pattern from or migration.Therefore, can easily form the helical conductor 19～22 that aspect ratio is high.In addition, can realize do not exist the migration of conductive pattern or hot soarfing from problem and high-performance and the high coil component of reliability.
The coil component 2 of present embodiment can be manufactured by the manufacture method shown in Fig. 4～Fig. 6.That is, in the manufacture of coil component 2, use resin sheet as the material using when making the growth of coil pattern plating, thereby can form effectively the coil pattern of high aspect ratio.In addition, after forming conductive pattern by plating, also casing play is directly used same as before as intercoil insulation material (permanent material), therefore, can form Seed Layer at bottom surface and the inner side surface of patterns of openings, can improve the adhesion of coil pattern and casing play.In addition, by use resin sheet, can improve the flatness above of the coil pattern of high aspect ratio, can improve the machining accuracy of the coil pattern that is deposited in its upper strata.Therefore, can improve the reliability of the coil component of multi-ply construction.
Fig. 8 is layer sectional view of constructing that represents in detail the coil component 3 of the 3rd execution mode of the present invention.
As shown in Figure 8, the coil component 3 of present embodiment is characterised in that to possess the magnetic core 33 of the hollow bulb of the inner side that connects the 1st～4th helical conductor 19～22.Magnetic core 33 arranges to connect the mode of casing play 16a～16d and insulating barrier 15b～15e.In the situation that be provided with such magnetic core 33, can improve the inductance of the 1st～4th helical conductor 19～22, more high performance coil component can be provided.
Above, with regard to the preferred embodiment of the present invention, be illustrated, but the present invention does not now limit due to above-mentioned execution mode, can carry out various changes in the scope that does not exceed aim of the present invention, self-evident, these are also contained in scope of the present invention.
For example, enumerating in the above-described embodiment helical conductor is example as coil pattern, but such as also using other the coil pattern such as meander pattern (meander pattern).In addition, above-mentioned coil component 1 is the lattice coil structure with 4 layer line ring layers, but the sum of coil layer is not particularly limited, can for 5 layers can, for below 3 layers, can be also also monolayer constructions will above.Wherein, the present invention can bring into play favourable effect in lattice coil structure.
In addition, in above-mentioned execution mode, on insulating barrier 15a, form casing play 16a, but also can omit insulating barrier 15a, and casing play 16a and conductor layer 17a are directly formed to them on substrate 10.
Claims (13)
1. a coil component, is characterized in that:
The coil component with at least one coil layer,
Described coil layer possesses: there is the casing play of patterns of openings and be formed on described casing play same level on the conductor layer that comprises coil pattern,
The negative pattern that described patterns of openings comprises described coil pattern,
Described coil pattern is formed on the inside of described patterns of openings,
Described coil pattern has: cover the Seed Layer of at least inner side surface of described patterns of openings and the surperficial coating that is arranged on described Seed Layer.
2. coil component as claimed in claim 1, is characterized in that:
Described Seed Layer comprises the material different from described coating.
3. coil component as claimed in claim 1, is characterized in that:
Described Seed Layer has the adhesive linkage consisting of Cr, Ti, Ta, Pd, Ni or NiCr and is overlapped in described adhesive linkage and two-layer structure that the plating basalis by forming with described coating same material that arranges sequentially forms with this.
4. coil component as claimed in claim 1, is characterized in that:
The aspect ratio in the cross section of described coil pattern is more than 1.
5. coil component as claimed in claim 1, is characterized in that:
The height that the height of described Seed Layer that covers the described inner side surface of described patterns of openings is described casing play over half.
6. coil component as claimed in claim 1, is characterized in that:
Described casing play consists of resin sheet.
7. coil component as claimed in claim 1, is characterized in that:
The flat shape of described patterns of openings comprises helical pattern,
Described coil pattern comprises helical conductor.
8. coil component as claimed in claim 1, is characterized in that:
The described inner side surface of described patterns of openings has the reverse tapered shapes that tilts towards the mode of upper opening narrowed width with the below of the stacked direction from described casing play.
9. the coil component as described in any one in claim 1～8, is characterized in that:
The lit-par-lit structure with a plurality of described coil layer.
10. a manufacture method for coil component, is characterized in that,
Possess: form casing play operation and with described casing play same level on form the operation of the conductor layer that comprises coil pattern,
The operation that forms described casing play comprises: paste the operation of resin sheet and the operation that forms the patterns of openings of the negative pattern that comprises described coil pattern at described resin sheet,
The operation that forms described conductor layer comprises: whole of described resin sheet that is formed with described patterns of openings form the operation of Seed Layer, optionally remove be formed on the Seed Layer described resin sheet above and make this Seed Layer remain in described patterns of openings at least inner side surface operation and by electroplating the operation of the described conductor layer that forms coating and formed by described Seed Layer and described coating in the formation of the inside of described opening in described Seed Layer.
The manufacture method of 11. coil components as claimed in claim 10, is characterized in that:
In optionally removing the operation that is formed on the Seed Layer above described resin sheet, make this Seed Layer remain in described inner side surface and the bottom surface of described patterns of openings.
The manufacture method of 12. coil components as claimed in claim 10, is characterized in that:
The aspect ratio in the cross section of described coil pattern is more than 1.
The manufacture method of 13. coil components as described in any one in claim 10～12, is characterized in that:
The operation of optionally removing the Seed Layer above that is formed on described resin sheet is by being undertaken implementing ion milling under the state tilting with respect to the exit direction of ion of described casing play above.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-108053 | 2013-05-22 | ||
| JP2013108053A JP5831498B2 (en) | 2013-05-22 | 2013-05-22 | Coil component and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104183354A true CN104183354A (en) | 2014-12-03 |
Family
ID=51964330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410218626.XA Pending CN104183354A (en) | 2013-05-22 | 2014-05-22 | Coil part and manufacturing method thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5831498B2 (en) |
| KR (1) | KR20140137306A (en) |
| CN (1) | CN104183354A (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2014229739A (en) | 2014-12-08 |
| KR20140137306A (en) | 2014-12-02 |
| JP5831498B2 (en) | 2015-12-09 |
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Application publication date: 20141203 |