CN104078548A - 一种全角度发光led白光光源及其制造方法 - Google Patents
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Abstract
本发明公开了一种全角度发光LED白光光源,包括:透明支架;蓝光LED芯片,该LED芯片为一片以上,并通过混合有荧光粉的固晶胶设置在所述透明支架上;金属焊线,用于将所述LED芯片串联或是并联在一起;电极,用于将所述LED芯片与电源相连;其中,所述LED芯片通过荧光胶封装在所述透明支架上。此外,本发明还公开了一种全角度发光LED白光光源的制造方法。本发明采用本发明制作的白光LED光源,即通过混合有荧光粉的固晶胶将蓝光LED芯片粘接在透明支架上,且通过荧光胶进行封装,这样,就克服了普通LED封装光源发光角度局限于180°之内的问题,实现了白光LED光源的全方位均匀发光。
Description
技术领域
本发明涉及到一种白光LED光源及其制造方法,用于通用照明灯具,商用照明灯具,如球泡灯等,属半导体照明领域。
背景技术
LED作为一种新型固体照明光源,具有体积小、寿命长、可靠性好、节能、环保等特点,已广泛应用于照明、背光及大屏幕显示方面,当前LED白光光源最主要的实现方式是蓝光LED芯片加荧光粉,如黄粉、红粉、绿粉等,部分蓝光被荧光粉吸收,激发而发出相应的黄光,红光和绿光。蓝光,黄光,红光和绿光的混合,就产生了人视觉上的白光。
目前封装的白光LED光源,无论是点光源如Top-LED,还是面光源如多晶集成光源,即COB,都采用不透明的、导热性能好的材料做支架基板,如铜、铝、氧化铝陶瓷等,以期把LED蓝光芯片在点亮时产生的热能迅速从支架基板上导出,从而有效降低芯片的工作温度,使芯片的结温运行在标定的工作温度范围内,提高芯片的寿命。正是由于这种支架基板的运用,导致了LED在180°范围内出光,其光强分布成朗伯尔120°形状。
目前封装LED白光光源存在的缺点:
1)单面发光,即发光角度小于180°,如用于球泡灯的应用,在360°的空间内有暗区。
2)若采用二次光学设计使光线发散,扩大灯具发光角的过程中会降低光源的出光效率,不利于节能。
发明内容
针对现有技术存在的问题,本发明的目的在于提供一种全角度发光LED白光光源及其制作方法,实现了白光LED光源的全方位均匀发光。
本发明的一种全角度发光LED白光光源包括:
透明支架;
蓝光LED芯片,该LED芯片为一片以上,并通过混合有荧光粉的固晶胶设置在所述透明支架上;
金属焊线,用于将所述LED芯片串联或是并联在一起;
电极,用于将所述LED芯片与电源相连;
其中,所述LED芯片通过荧光胶封装在所述透明支架上。
优选地,所述金属焊线或电极通过绝缘层设置在透明支架上。
优选地,所述固晶胶为透明树脂材料或硅胶,固晶胶厚度为4~20μm。
优选地,所述LED芯片为背面无反光膜层的透明的LED芯片。
优选地,所述荧光胶由荧光粉和封装胶混合而成,其中荧光粉和封装胶的混合比例为1:0.05~0.5,荧光胶的厚度为0.1~2.0mm。
优选地,所述封装胶为硅胶或环氧树脂。
优选地,所述荧光粉为LED用红色、橙色、黄色及绿色荧光粉中的一种或几种的混合物。
本发明的一种全角度发光LED白光光源的制造方法,包括如下步骤:
1)称取固晶胶和荧光粉,将二者混合均匀,用其将LED蓝光芯片固定于透明支架上,放入烘箱中烘烤固化,取出、冷却待用;
2)将步骤1)所得的材料中的LED蓝光芯片通过金属线的焊接串联或并联后接入绝缘层上面的支架电极;
3)称取荧光粉和封装胶,将二者混合均匀得到荧光胶,均匀涂覆于固有芯片的支架,放入烘箱中加热使其固化,取出,冷却;
4)将步骤3)所得的模组接入电路,即得全角度白光LED光源。
本发明制作的LED白光光源优点:
1、采用本发明制作的白光LED光源,即通过混合有荧光粉的固晶胶将蓝光LED芯片粘接在透明支架上,且通过荧光胶进行封装,这样,就克服了普通LED封装光源发光角度局限于180°之内的问题,实现了白光LED光源的全方位均匀发光;
2、无360°二次光学设计,提高了光的利用率。
附图说明
图1为本发明的白光LED光源的结构示意图;
图2为荧光粉固晶胶局部示意图。
具体实施方式
如图1、2所示,本发明的实现方式:把透明芯片4用混合了荧光粉的透明固晶胶3黏结在透明支架1上,芯片之间及芯片和电极2之间通过金属焊线6连接,透明芯片4上面覆盖混有荧光粉的封装胶5。
本发明所选封装支架材料为透明材料,包括但不局限于透明氧化铝陶瓷,氮化铝陶瓷,氧化硅,玻璃或树脂,形状可为圆形,方形或其他几何形状。
本发明所选透明芯片4为透明蓝光LED芯片,为一颗或多颗,用金属焊线6采用串联或并联的方式将透明芯片4连接;并与透明支架1上的电极相连。
本发明所选固晶胶3为透明树脂或硅胶材料,透光性能好,在其中混合荧光粉,优选固晶胶与荧光粉的混合比例为1:(0.05~0.5),固晶胶厚度为2~15μm。
本发明所选封装胶为透光性、稳定性好的透明硅胶或环氧树脂,并和荧光粉混合而成。
本发明所选荧光粉为能够被蓝光LED激发的红粉、橙粉、黄粉和绿粉中一种或几种的混合物,优选颗粒为3~8μm;
此外,本发明的白光LED光源的制作方法,步骤如下:1、称取透明固晶胶和荧光粉,将二者混合均匀,用其将透明蓝光LED芯片固定于透明支架1上,放入烘箱中烘烤固化;2、将步骤1所得材料中的透明蓝光LED芯片通过金属焊线6焊接,串联或并联后接入支架绝缘层上面的电极2;3、称取荧光粉和封装胶,将二者混合,均匀涂覆于固有透明芯片的支架,放入烘箱中加热使其固化;4、将步骤3所得的模组接入电路,即得全角度LED白光光源。
本发明制作的白光LED光源优点:1、采用本发明制作的白光LED光源,即通过混合有荧光粉的固晶胶将蓝光LED芯片粘接在透明支架上,且通过荧光胶进行封装,这样,就克服了普通LED封装光源发光角度局限于180°之内的问题,实现了白光LED光源的全方位均匀发光;2、无360°二次光学设计,提高了光的利用率。
Claims (8)
1.一种全角度发光LED白光光源,其特征在于,包括:
透明支架;
蓝光LED芯片,该LED芯片为一片以上,并通过混合有荧光粉的固晶胶设置在所述透明支架上;
金属焊线,用于将所述LED芯片串联或是并联在一起;
电极,用于将所述LED芯片与电源相连;
其中,所述LED芯片通过荧光胶封装在所述透明支架上。
2.如权利要求1所述的光源,其特征在于,所述金属焊线或电极通过绝缘层设置在透明支架上。
3.如权利要求1所述的光源,其特征在于,所述固晶胶为透明树脂材料或硅胶,固晶胶厚度为4~20μm。
4.如权利要求1所述的光源,其特征在于,所述LED芯片为背面无反光膜层的透明的LED芯片。
5.如权利要求1所述的光源,其特征在于,所述荧光胶由荧光粉和封装胶混合而成,其中荧光粉和封装胶的混合比例为1:0.05~0.5,荧光胶的厚度为0.1~2.0mm。
6.如权利要求4所述的光源,其特征在于,所述封装胶为硅胶或环氧树脂。
7.所述如权利要求1至6任一所述的光源,其特征在于,荧光粉为LED用红色、橙色、黄色及绿色荧光粉中的一种或几种的混合物。
8.一种全角度发光LED白光光源的制造方法,其特征在于,包括如下步骤:
1)称取固晶胶和荧光粉,将二者混合均匀,用其将LED蓝光芯片固定于透明支架上,放入烘箱中烘烤固化,取出、冷却待用;
2)将步骤1)所得的材料中的LED蓝光芯片通过金属线的焊接串联或并联后接入绝缘层上面的支架电极;
3)称取荧光粉和封装胶,将二者混合均匀得到荧光胶,均匀涂覆于固有芯片的支架,放入烘箱中加热使其固化,取出,冷却;
4)将步骤3)所得的模组接入电路,即得全角度白光LED光源。
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Cited By (7)
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CN104681548A (zh) * | 2015-03-03 | 2015-06-03 | 杭州士兰明芯科技有限公司 | 一种led发光结构及其制作方法 |
CN106257666A (zh) * | 2015-06-19 | 2016-12-28 | 嘉兴山蒲照明电器有限公司 | Led球泡灯 |
CN106287339A (zh) * | 2015-06-10 | 2017-01-04 | 嘉兴山蒲照明电器有限公司 | Led球泡灯 |
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