CN104051099A - Production method of high-power precision alloy SMD (surface mount device) resistor - Google Patents
Production method of high-power precision alloy SMD (surface mount device) resistor Download PDFInfo
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- CN104051099A CN104051099A CN201410296302.8A CN201410296302A CN104051099A CN 104051099 A CN104051099 A CN 104051099A CN 201410296302 A CN201410296302 A CN 201410296302A CN 104051099 A CN104051099 A CN 104051099A
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- resistor
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- strip
- electric resistance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
Abstract
The invention provides a production method of a high-power precision alloy SMD (surface mount device) resistor. The production method comprises the steps: respectively combining two oxygen-free copper strips with two sides of a resistor alloy strip to form an integrated strip-shaped resistor strip, and wrapping a high-heat-conductivity substrate with the integrated strip-shaped resistor strip; etching a basic resistor structure on a wrapping body; precisely adjusting the resistance value of the basic resistance structure; coating, terminal electroplating and printing a resistor body to form a high-power precision alloy SMD resistor. The material with high heat radiation capability and high heat conductivity such as a metal substrate, a high-heat-conductivity ceramic substrate is used as the substrate, so that the actual load capacity of the resistor is greatly increased; the oxygen-free copper strip is partially arranged on the side surface and below the substrate and used as an electrode lead, so that the contact area is increased, and the heat conductivity of the resistor body is also increased on the other hand.
Description
Technical field
The present invention relates to electronic devices and components field, particularly a kind of manufacture method of high-power Precise Alloy Chip-R.
Background technology
Precise Alloy patch resistor is widely used in all kinds of circuit as the critical elements in circuit, is to apply electronic devices and components more widely, is particularly useful for the various circuit that adopt surface-pasted packaging technology to produce.At present, in the making of Precise Alloy patch resistor, power is the key factor of this series products of restriction all the time, need in the circuit of relatively high power at some, existing device is due to the restriction of structure, its caloric value is determined by the material of power and use, no doubt, use the good resistance of heat sink material, its radiating effect is better, performance is also more stable, but its production cost will cause remaining high, expensive, for general resistor mentality of designing, use common heat sink material, its Yi Fashengyin resistance heating and cause overall accumulated heat during for high-power circuit, the unsettled problem of circuit performance, thereby general resistor is difficult to meet this powerful demand.
Summary of the invention
The present invention is directed to the deficiency in above-mentioned background, a kind of actual bearer power that increases resistance is provided, and the resistor of making has Standard resistance range covering compare Guang ﹑ precision Gao ﹑ reliability and Heat stability is good and is convenient to the manufacture method of surface mount performance.
The technical scheme of its realization is as follows:
The manufacture method of high-power Precise Alloy patch resistor, it comprises the steps:
A. utilize welding procedure or process for pressing, two oxygen-free copper bands are combined with the both sides of electric resistance alloy band respectively, form the resistor band of holistic strip, the section of described oxygen-free copper band and electric resistance alloy band is rectangle;
B. resistor band is wrapped on the substrate of high thermal conductivity of segment length's strip to the surface insulation of described substrate;
C. on the inclusion enclave that is enclosed with substrate, etch basic electric resistance structure by the mode of chemical corrosion or laser engraving or polishing;
D. on basic electric resistance structure, resistance value is carried out to accurate adjustment, adjust the mode that uses laser engraving or polishing or chemical corrosion;
E. be die-cut into several resistive elements along the direction of the length perpendicular to inclusion enclave;
F. resistive element is carried out to application, terminal plating and printing, form powerful Precise Alloy patch resistor.
As further describing of the manufacture method to above-mentioned high-power Precise Alloy patch resistor, in step b, described substrate is aluminium base or copper base or high heat-conducting ceramic substrate, and resistor band is attached on substrate by mode bonding, pressing.
As further describing of the manufacture method to above-mentioned high-power Precise Alloy patch resistor, in step b, use insulation, the colloid substance that bonding and heat conduction is good carry out adhesion and solidify resistor band and substrate.
As further describing of the manufacture method to above-mentioned high-power Precise Alloy patch resistor, in step b, the part of electric resistance alloy band is positioned at the top of substrate, and the part of oxygen-free copper band is positioned at side and the below of substrate and makes contact conductor.
As further describing of the manufacture method to above-mentioned high-power Precise Alloy patch resistor, in steps d, the edge on basic electric resistance structure inwardly carries out resistance correction.
The invention has the beneficial effects as follows: utilize material that metal substrate, high heat-conducting ceramic substrate etc. have high heat-sinking capability, high thermal conductivity as substrate, the actual bearer power of resistance is increased greatly; And the part of oxygen-free copper band is located at the side of substrate and below in order to make contact conductor, it has increased contact area, also can increase on the other hand the capacity of heat transmission of resistive element simultaneously.The Precise Alloy patch resistor that the method is made, there is Standard resistance range covering compare Guang ﹑ precision Gao ﹑ inductance value compare little ﹑ frequency response compare Kuan ﹑ reliability and the Hao ﹑ thermoelectric potential of thermal stability Di ﹑ and be convenient to surface-pasted feature, its volume is little simultaneously, also comparatively saves for material.
Brief description of the drawings
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Fig. 1 is resistor tape equipment structure of the present invention;
Fig. 2 is the side schematic view before resistor band and substrate parcel;
Fig. 3 is the structure chart after resistor band and substrate parcel;
Fig. 4 is the schematic rear view of inclusion enclave;
Fig. 5 is the side schematic view of inclusion enclave;
Fig. 6 is the front schematic view of inclusion enclave;
Fig. 7 is the front schematic view of the inclusion enclave of another etching shape;
Fig. 8 is the Facad structure figure of the inclusion enclave that forms after resistance correction;
Fig. 9 carries out the schematic rear view after application and plating to resistive element;
Figure 10 carries out the front schematic view after application and plating to resistive element;
Figure 11 is the front schematic view after resistive element is printed.
Embodiment
As shown in Figures 1 to 3, the manufacture method of high-power Precise Alloy patch resistor of the present invention, it comprises the steps:
A. utilize welding procedure or process for pressing, two oxygen-free copper bands 1 are combined with the both sides of electric resistance alloy band 2 respectively, form the resistor band of holistic strip, the section of described oxygen-free copper band and electric resistance alloy band is rectangle;
B. resistor band is wrapped on the substrate 3 of high thermal conductivity of segment length's strip to the surface insulation of described substrate 3;
C. on the inclusion enclave that is enclosed with substrate 3, etch basic electric resistance structure by the mode of chemical corrosion or laser engraving or polishing, as shown in Fig. 4-7;
D. with reference to Fig. 8, on basic electric resistance structure, resistance value is carried out to accurate adjustment 5, adjustment can be used the mode of laser engraving or polishing or chemical corrosion;
E. be die-cut into several resistive elements along the direction of the length perpendicular to inclusion enclave;
F. use the technique of conventional Chip-R production use, resistive element is carried out to the post-production such as application, terminal plating and printing, form powerful Precise Alloy patch resistor, with reference to Fig. 9-11, the major part of application is the electric resistance alloy band part 7 of resistive element and side and the back side of die-cut metacoxal plate, the major part of electroplating is the surface 8 of the oxygen-free copper band part of resistive element, and carry out on the general surface after resistive element application of printing mark 9.
As further describing of the manufacture method to above-mentioned high-power Precise Alloy patch resistor, in step b, described substrate 3 is aluminium base or copper base or high heat-conducting ceramic substrate, and resistor band is attached on substrate by mode bonding, pressing.It utilizes the good thermal conductivity of the heat-conducting substrate such as aluminium base or copper base or ceramic substrate, the heat that resistive element is sent, can be dispersed on circuit board by heat-conducting substrate with the fastest speed, avoid resistive element body to produce the problem that amount of localized heat concentrates the overall actual power load that makes resistance to decline.
As further describing of the manufacture method to above-mentioned high-power Precise Alloy patch resistor, in step b, use insulation, the colloid substance that bonding and heat conduction is good carry out adhesion and solidify resistor band and substrate, and this colloid substance can adopt.
As further describing of the manufacture method to above-mentioned high-power Precise Alloy patch resistor, in step b, with reference to Fig. 3, the part of electric resistance alloy band is positioned at the top of substrate, the part of oxygen-free copper band is positioned at side and the below of substrate and makes contact conductor, can increase contact area, strengthen the overall capacity of heat transmission of resistive element.
As further describing of the manufacture method to above-mentioned high-power Precise Alloy patch resistor, in steps d, with reference to Fig. 8, the edge on basic electric resistance structure inwardly carries out resistance correction 5.
The above not imposes any restrictions technical scope of the present invention, and all any amendment, equivalent variations and modifications of above embodiment being done according to the technology of the present invention essence, all still belong in the scope of technical solution of the present invention.
Claims (5)
1. the manufacture method of high-power Precise Alloy patch resistor, is characterized in that, comprises the steps:
A. utilize welding procedure or process for pressing, two oxygen-free copper bands are combined with the both sides of electric resistance alloy band respectively, form the resistor band of holistic strip, the section of described oxygen-free copper band and electric resistance alloy band is rectangle;
B. resistor band is wrapped on the substrate of high thermal conductivity of segment length's strip to the surface insulation of described substrate;
C. on the inclusion enclave that is enclosed with substrate, etch basic electric resistance structure by the mode of chemical corrosion or laser engraving or polishing;
D. on basic electric resistance structure, resistance value is carried out to accurate adjustment, adjust the mode that uses laser engraving or polishing or chemical corrosion;
E. be die-cut into several resistive elements along the direction of the length perpendicular to inclusion enclave;
F. resistive element is carried out to application, terminal plating and printing, form powerful Precise Alloy patch resistor.
2. the manufacture method of high-power Precise Alloy patch resistor according to claim 1, is characterized in that: in step b, described substrate is aluminium base or copper base or high heat-conducting ceramic substrate, and resistor band is attached on substrate by mode bonding, pressing.
3. the manufacture method of high-power Precise Alloy patch resistor according to claim 1, is characterized in that: in step b, use insulation, the colloid substance that bonding and heat conduction is good carry out adhesion and solidify resistor band and substrate.
4. the manufacture method of high-power Precise Alloy patch resistor according to claim 1, is characterized in that: in step b, the part of electric resistance alloy band is positioned at the top of substrate, and the part of oxygen-free copper band is positioned at side and the below of substrate and makes contact conductor.
5. the manufacture method of high-power Precise Alloy patch resistor according to claim 1, is characterized in that: in steps d, the edge on basic electric resistance structure inwardly carries out resistance correction.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410296302.8A CN104051099A (en) | 2014-06-27 | 2014-06-27 | Production method of high-power precision alloy SMD (surface mount device) resistor |
| PCT/CN2014/088532 WO2015196634A1 (en) | 2014-06-27 | 2014-10-14 | Manufacturing method for high-power precious alloy chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410296302.8A CN104051099A (en) | 2014-06-27 | 2014-06-27 | Production method of high-power precision alloy SMD (surface mount device) resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104051099A true CN104051099A (en) | 2014-09-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410296302.8A Pending CN104051099A (en) | 2014-06-27 | 2014-06-27 | Production method of high-power precision alloy SMD (surface mount device) resistor |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104051099A (en) |
| WO (1) | WO2015196634A1 (en) |
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| CN108158070A (en) * | 2016-12-07 | 2018-06-15 | 江山显进机电科技服务有限公司 | If the indirect temp.-regulating type temperature-adjusting clothes of metal segments indicator light liquid contact heat-exchanging |
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| CN106694476A (en) * | 2016-12-19 | 2017-05-24 | 江山菲普斯照明有限公司 | Lamp tube opening cleaning mechanism |
| CN106945798A (en) * | 2016-12-19 | 2017-07-14 | 杭州跟策科技有限公司 | If can wave resistance Crashworthy plate can seawave power generation paper bag cargo ship |
| CN106944382A (en) * | 2016-12-19 | 2017-07-14 | 杭州跟策科技有限公司 | Day-light lamp end surfaces cleaning device |
| CN112191563A (en) * | 2016-12-19 | 2021-01-08 | 杭州跟策科技有限公司 | End surface cleaning device for fluorescent lamp tube |
| CN106945797A (en) * | 2016-12-19 | 2017-07-14 | 杭州跟策科技有限公司 | Can seawave power generation be detachably connected wave resistance Crashworthy plate paper bag cargo ship |
| CN106945790A (en) * | 2016-12-19 | 2017-07-14 | 杭州跟策科技有限公司 | It is detachably connected the paper bag cargo ship of wave resistance Crashworthy plate |
| CN106944382B (en) * | 2016-12-19 | 2020-09-15 | 台州市耶丽亚科技有限公司 | End surface cleaning device for fluorescent lamp tube |
| CN106585903A (en) * | 2016-12-19 | 2017-04-26 | 浙江省海洋水产研究所 | Fishing boat for freezing same cabin through vibration energy refrigeration |
| CN106809349A (en) * | 2016-12-19 | 2017-06-09 | 浙江省海洋水产研究所 | The fishing boat of vibrational energy refrigeration refrigeration |
| CN106800075A (en) * | 2016-12-19 | 2017-06-06 | 浙江省海洋水产研究所 | The fishing boat of vibrational energy refrigeration cold |
| CN106945789A (en) * | 2016-12-19 | 2017-07-14 | 杭州跟策科技有限公司 | If the paper bag cargo ship of paper bag storage rack |
| CN109578868A (en) * | 2016-12-27 | 2019-04-05 | 浙江雷士灯具有限公司 | The two-sided light-source structure of LED spotlight |
| CN109539025A (en) * | 2016-12-27 | 2019-03-29 | 浙江雷士灯具有限公司 | Can double-side LED spotlight |
| CN109578867A (en) * | 2016-12-27 | 2019-04-05 | 浙江雷士灯具有限公司 | The LED spotlight of double-side |
| CN109539025B (en) * | 2016-12-27 | 2021-03-23 | 浙江雷士灯具有限公司 | LED spotlight capable of emitting light from two sides |
| CN106741672A (en) * | 2016-12-28 | 2017-05-31 | 浙江海洋大学 | Placement is connected with the ship of the large jellyfish for following the trail of jellyfish vertical movement mechanism |
| CN106828852A (en) * | 2016-12-28 | 2017-06-13 | 浙江海洋大学 | Purse seine is casted net ship |
| CN106828794A (en) * | 2016-12-28 | 2017-06-13 | 浙江海洋大学 | Observe the ship of large jellyfish |
| CN107061119A (en) * | 2016-12-28 | 2017-08-18 | 浙江海洋大学 | Can the purse seine of seawave power generation cast net ship |
| CN109192412A (en) * | 2018-08-02 | 2019-01-11 | 南京萨特科技发展有限公司 | A kind of resistor and its manufacturing method with radiator |
| WO2022205641A1 (en) * | 2021-03-29 | 2022-10-06 | 南京萨特科技发展有限公司 | Method for preparing high-power resistor and resistor prepared by said method |
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|---|---|
| WO2015196634A1 (en) | 2015-12-30 |
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