CN104044218B - Multi-line cutting device - Google Patents
Multi-line cutting device Download PDFInfo
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- CN104044218B CN104044218B CN201410299402.6A CN201410299402A CN104044218B CN 104044218 B CN104044218 B CN 104044218B CN 201410299402 A CN201410299402 A CN 201410299402A CN 104044218 B CN104044218 B CN 104044218B
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Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410299402.6A CN104044218B (en) | 2014-06-27 | 2014-06-27 | Multi-line cutting device |
Applications Claiming Priority (1)
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CN201410299402.6A CN104044218B (en) | 2014-06-27 | 2014-06-27 | Multi-line cutting device |
Publications (2)
Publication Number | Publication Date |
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CN104044218A CN104044218A (en) | 2014-09-17 |
CN104044218B true CN104044218B (en) | 2017-01-25 |
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CN201410299402.6A Active CN104044218B (en) | 2014-06-27 | 2014-06-27 | Multi-line cutting device |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108770491B (en) * | 2018-08-09 | 2024-06-25 | 吉林大学 | Stalk crop header linear cutting device |
CN111976044A (en) * | 2020-08-26 | 2020-11-24 | 长沙岱勒新材料科技股份有限公司 | Dislocation steering mechanism, multi-wire cutting device and multi-wire cutting system |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1717001A1 (en) * | 2005-04-25 | 2006-11-02 | Nippei Toyama Corporation | Method for manufacturing semiconductor wafers, method for their slicing and wire saw used for the same |
CN101602232A (en) * | 2009-07-15 | 2009-12-16 | 北京京联发数控科技有限公司 | Wire butting machine tool |
CN101973084A (en) * | 2010-11-22 | 2011-02-16 | 湘潭大学 | Automatic winding device with swinging mechanism for multi-wire cutting machine, |
CN102615728A (en) * | 2012-03-30 | 2012-08-01 | 湖南红太阳光电科技有限公司 | Cutting wire tension control device of crystalline silicon square cutting machine |
CN102626955A (en) * | 2012-02-14 | 2012-08-08 | 上海五同机械制造有限公司 | Double-guide roll linear silicon wafer cutting system |
CN103192462A (en) * | 2013-04-16 | 2013-07-10 | 天津英利新能源有限公司 | Multi-line silicon wafer cutting method |
CN103552163A (en) * | 2013-10-17 | 2014-02-05 | 湖南红太阳光电科技有限公司 | Handling method adopted after cutting wire breakage of multi-wire sawing machine |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202412492U (en) * | 2011-12-31 | 2012-09-05 | 英利能源(中国)有限公司 | Cutting device for silicon blocks |
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2014
- 2014-06-27 CN CN201410299402.6A patent/CN104044218B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1717001A1 (en) * | 2005-04-25 | 2006-11-02 | Nippei Toyama Corporation | Method for manufacturing semiconductor wafers, method for their slicing and wire saw used for the same |
CN101602232A (en) * | 2009-07-15 | 2009-12-16 | 北京京联发数控科技有限公司 | Wire butting machine tool |
CN101973084A (en) * | 2010-11-22 | 2011-02-16 | 湘潭大学 | Automatic winding device with swinging mechanism for multi-wire cutting machine, |
CN102626955A (en) * | 2012-02-14 | 2012-08-08 | 上海五同机械制造有限公司 | Double-guide roll linear silicon wafer cutting system |
CN102615728A (en) * | 2012-03-30 | 2012-08-01 | 湖南红太阳光电科技有限公司 | Cutting wire tension control device of crystalline silicon square cutting machine |
CN103192462A (en) * | 2013-04-16 | 2013-07-10 | 天津英利新能源有限公司 | Multi-line silicon wafer cutting method |
CN103552163A (en) * | 2013-10-17 | 2014-02-05 | 湖南红太阳光电科技有限公司 | Handling method adopted after cutting wire breakage of multi-wire sawing machine |
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CN104044218A (en) | 2014-09-17 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20161121 Address after: 225300 Jiangsu Province, Taizhou City Hailing Xingtai Road No. 268 Applicant after: TAIZHOU LEYE PHOTOVOLTAIC TECHNOLOGY CO., LTD. Address before: 710100 Changan District, Shaanxi Province, aerospace Road, No. 388, No. Applicant before: Xi'an Longji-Silicon Co., LTD. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: 225314 Jiangsu Province, Taizhou City Hailing Xingtai Road No. 268 Patentee after: Taizhou long base music Photovoltaic Technology Co., Ltd. Address before: 225300 Jiangsu Province, Taizhou City Hailing Xingtai Road No. 268 Patentee before: TAIZHOU LEYE PHOTOVOLTAIC TECHNOLOGY CO., LTD. |
|
CP03 | Change of name, title or address | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171212 Address after: 678000 Longyang District of Baoshan city in Yunnan province Xin Jie Xiang Changling Gang silicon Industrial Park Patentee after: Baoshan longI silicon materials Co. Ltd. Address before: 225314 Jiangsu Province, Taizhou City Hailing Xingtai Road No. 268 Patentee before: Taizhou long base music Photovoltaic Technology Co., Ltd. |
|
TR01 | Transfer of patent right |