CN104023480A - Processing method for shortening PCB plating process - Google Patents
Processing method for shortening PCB plating process Download PDFInfo
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- CN104023480A CN104023480A CN201410263485.3A CN201410263485A CN104023480A CN 104023480 A CN104023480 A CN 104023480A CN 201410263485 A CN201410263485 A CN 201410263485A CN 104023480 A CN104023480 A CN 104023480A
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- copper
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- electroplating process
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Abstract
The invention provides a processing method for shortening a PCB plating process. The method includes the steps of panel plating, panel grinding, film pasting, exposure, developing, etching and film stripping. By means of the special technological process of panel plating, an unexposed copper layer with parts of exposed copper is etched directly through an acidic etching manufacturing process, so that the processes of pattern plating and tin stripping are omitted, the plating process of a PCB is shortened, and cost is further saved for enterprises.
Description
Technical field
The present invention relates to pcb board processing technique field, be specifically related to a kind of processing method of the PCB of shortening electroplating process.
Background technology
Because of the market demand, people are also more and more higher to the requirement of pcb board, part HDI(High Density Interconnect particularly, high density circuit board) require to adopt the processing method that shortens PCB electroplating process to adapt to production dense wire; PCB electroplating process refers to after heavy copper and uses the disposable thickness that is plated to customer requirement of panel plating, adopts acid etching technique to make unexposed copper layer and forms perfect circuit.
At present, the processing method of making outer-layer circuit comprises the following steps: plate is electroplated: make each sandwich circuit conducting and connection; Nog plate: remove greasy dirt and the alligatoring copper surface on copper surface, strengthen the adhesion of dry grinding and copper face; Pad pasting: under pressurization, heating condition, dry film is firmly combined in through in cleaning, alligatoring copper-clad plate; Exposure: dry film photoresist, after UV irradiation, cross-linking polymerization occurs, is subject to illumination part film forming sclerosis and is not developed liquid and affects; Develop: the part without ultraviolet radiation on dry film is dissolved with certain density Na2CO3 solution; Pass through ultraviolet radiation and the part reservation of polymerization reaction take place; Figure electricity: use the principles of chemistry that hole copper and face copper are plated to MI requirement; Move back film: the dry film effect by strong base solution with the light that exposed to the sun, the film on figure is decorporated, the remaining copper coin that has figure; Etching: the unexposed copper layer that has revealed copper part is etched away; Move back tin: by the effect of tin stripper solution, the tin on figure is decorporated, the remaining copper coin that has figure.
This kind of technique, complex manufacturing technology, and cost is relatively high.
Summary of the invention
The processing method that the object of this invention is to provide a kind of PCB of shortening electroplating process, can solve existing complex manufacturing technology, problem that production cost is higher.
In order to realize above object, the invention provides a kind of processing method of the PCB of shortening electroplating process, specifically comprise the following steps that order is carried out:
1), panel plating; Heavy copper on pcb board, by hole copper and face copper, disposable to be plated to the copper setting thick;
2), nog plate; Pollutant on copper foil plate removal of copper surface, increases roughened copper surface degree, controls polishing scratch at 0.5-1.5cm, and the speed of nog plate is 4m/min;
3), pad pasting; In pressurization, under heating condition, dry film is firmly combined in through step 2) on copper foil plate after processing, temperature is controlled at 110 ± 10 ℃, and pad pasting speed is 2.5-3m/min;
4), exposure; Dry film photoresist in step 3), after UV irradiation, cross-linking polymerization is occurred to, and controlling exposure energy is 7 grades, and the pumpdown time is 5 seconds;
5), develop; To on dry film, without the light-struck part of UV, with certain density Na2CO3 solution, dissolve, pass through UV irradiation and the part reservation of polymerization reaction take place, Na2CO3 solution is 10G/L, and temperature is 28 ℃;
6), etching; The unexposed copper layer that has revealed copper part is etched away;
7), move back film; By strong base solution and the dry film effect having exposed, the film on figure is decorporated, the remaining copper coin that has figure.
A kind of processing method that shortens PCB electroplating process provided by the invention, by panel plating technique, by hole copper and face copper, disposable to be plated to the copper setting thick, again by acid etching manufacture craft by the unexposed direct etching of copper layer of having revealed copper part, thereby minimizing figure electricity with move back the large step of tin two, shorten processing process, further saved the production cost of enterprise.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is process chart of the present invention.
Embodiment
A kind of processing method that shortens PCB electroplating process provided by the invention, has solved existing complex manufacturing technology, problem that production cost is higher.
Below in conjunction with the accompanying drawing in the present invention, the technical scheme in the present invention is clearly and completely described, obviously, described is only the present invention's part embodiment, rather than whole embodiment.Embodiment based in the present invention, the every other embodiment that those of ordinary skills obtain under the prerequisite of not making creative work, belongs to the scope of protection of the invention.
In conjunction with Fig. 1, a kind of processing method that shortens PCB electroplating process:
Embodiment 1:
A: panel plating: heavy copper on pcb board is by use long-time low-density operating type with plating line after heavy copper, thick by hole copper and the disposable copper that is plated to customer requirement of face copper; B: nog plate: greasy dirt and alligatoring copper surface on copper foil plate removal of copper surface, strengthen the adhesion of dry grinding with copper face; Control polishing scratch at 0.5-1.5cm, nog plate speed is controlled at 4m/min, and substrate process pre-treatment rear surface is oxide-free, oil trace etc., but as long in the residence time, surface meeting and airborne oxygen generation oxidation reaction, the plate that pre-treatment is good should be handled within a short period of time; C: pad pasting: under pressurization, heating condition, dry film is firmly combined in through on cleaning, alligatoring copper coated foil plate, control temperature: 110 ± 10 ℃, speed: 2.5-3m/min, the control of preheat temperature, time and ventilation is very strict, excess Temperature or overlong time, easily cause the difficult decrease resolution that develops, demoulding difficulty; D: exposure: the dry film photoresist in C, after UV irradiation, cross-linking polymerization is occurred to, be subject to illumination part film forming sclerosis and be not developed liquid and affect, control exposure energy: 7 grades, 5 seconds pumpdown times, this step is specially, and is exposed part: the region of film printing opacity is under UV-irradiation, and light trigger absorbs luminous energy and resolves into free radical, free radical causes photo polymerization monomer again and carries out polymerization crosslinking reaction, forms the build macromolecular structure that is insoluble to weak solution; E: develop: the part without ultraviolet radiation on dry film is dissolved at the Na2CO3 of 10G/L solution by concentration; Pass through ultraviolet radiation and the part reservation of polymerization reaction take place; Temperature is 28 ℃, for guaranteeing development quality, must control solution level, temperature and developing time in suitable opereating specification; Temperature too high (more than 35 ℃) or developing time oversize (surpassing more than 90 seconds), can cause epithelium quality, hardness and chemical resistance to reduce; F: etching: the unexposed copper layer that has revealed copper part is etched away; Before production, carry out first plate and confirm, in production process, carry out autonomous inspection; G: move back film: the dry film effect by strong base solution with the light that exposed to the sun, the film on figure is decorporated, the remaining copper coin that has figure.
By said method and existing method, making outer-layer circuit negative film, to test in every respect contrast as follows:
One, shorten PCB electroplating process and replace normal PCB electroplating process production cost contrast:
1, PCB electroplates normal processing procedure production cost calculating
2, shorten the cost calculation of PCB electroplating process
3, cost contrast
Two, production cycle contrast:
1, with 150PNL, calculate and adopt the normal processing procedure of plating PCB to produce each operation production cycle;
1), adopt the outer processing procedure production procedure of normal PCB:
Upper operation-----nog plate (pad pasting-----contraposition exposure------develop------check)------------------etching------is moved back the lower operation of tin------to Tu electricity to move back film
2), adopt the normal PCB electroplating process production time:
Nog plate (4H)+figure electricity (3H)+etching (2H)=9H
2, with 150PNL, calculate and adopt shortening PCB electroplating process to produce each operation production cycle;
1), upper operation------nog plate (pad pasting-----contraposition exposure-----develop------check)------etching------is moved back the lower operation of film-----
2), adopt and shorten the PCB electroplating process production time:
Nog plate (4H)+etching (2H)=6H
3, production efficiency contrast:
Take 150PNL as unit, use shortening PCB electroplating process production efficiency can improve about 3H.
Three, produce quality estimating:
1, adopt shortening PCB electroplating process to produce: test plate (panel) PR02871 model, 50 blocks of plates, after exposure etching, quality is normal, crosses AOI test normally, yield 100%
2, adopt normal PCB electroplating process to produce: test plate (panel) PR02871 model, 50 blocks of plates are found the clean and line of the etching topic of making detailed inquiries after exposure etching, and bad point rate reaches 60.8%
In summary, shorten PCB electroplating process processing method, by its working condition on probation and quality result, meet the requirements completely, wireless thin and etching is the quality abnormal such as only not; Adopting shortening PCB electroplating process to produce replaces normal PCB electroplating process production cost to save 0.85 yuan/FT2; Cost 52%, as with February output calculate, monthly can save approximately 8500 yuan; Adopt shortening PCB electroplating process to produce and replace normal PCB electroplating process production to take 150PNL as unit, can reduce approximately 3 hours production cycles.Through adopting different schemes to verify, wherein adopt shortening PCB electroplating process production quality all can reach requirement.Therefore, adopt to shorten that PCB electroplating process technology generations has been saved 0.85 yuan/FT2 for normal PCB electroplating process production cost and the production cycle is shorter.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (5)
1. a processing method that shortens PCB electroplating process, is characterized in that, comprises the following steps that order is carried out:
1), panel plating; Heavy copper on pcb board, by hole copper and face copper, disposable to be plated to the copper setting thick;
2), nog plate; Pollutant on copper foil plate removal of copper surface, increases roughened copper surface degree;
3), pad pasting; In pressurization, under heating condition, dry film is firmly combined in through step 2) on copper foil plate after processing;
4), exposure; After UV irradiation, be there is to cross-linking polymerization in the dry film photoresist in step 3);
5), develop; To on dry film, without the light-struck part of UV, with certain density Na2CO3 solution, dissolve, pass through UV irradiation and the part reservation of polymerization reaction take place;
6), etching; The unexposed copper layer that has revealed copper part is etched away;
7), move back film; By strong base solution and the dry film effect having exposed, the film on figure is decorporated, the remaining copper coin that has figure.
2. a kind of processing method that shortens PCB electroplating process according to claim 1, is characterized in that step 2) in, control polishing scratch at 0.5-1.5cm, the speed of nog plate is 4m/min.
3. a kind of processing method that shortens PCB electroplating process according to claim 1, is characterized in that, in step 3), temperature is controlled at 110 ± 10 ℃, and pad pasting speed is 2.5-3m/min.
4. a kind of processing method that shortens PCB electroplating process according to claim 1, is characterized in that, in step 4), controlling exposure energy is 7 grades, and the pumpdown time is 5 seconds.
5. a kind of processing method that shortens PCB electroplating process according to claim 1, is characterized in that, in step 5), Na2CO3 solution is 10G/L, and temperature is 28 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410263485.3A CN104023480A (en) | 2014-06-13 | 2014-06-13 | Processing method for shortening PCB plating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410263485.3A CN104023480A (en) | 2014-06-13 | 2014-06-13 | Processing method for shortening PCB plating process |
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| CN104023480A true CN104023480A (en) | 2014-09-03 |
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| CN201410263485.3A Pending CN104023480A (en) | 2014-06-13 | 2014-06-13 | Processing method for shortening PCB plating process |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104597300A (en) * | 2014-12-15 | 2015-05-06 | 黄山市中显微电子有限公司 | Manufacturing method of electric test board for electric performance test |
| CN114340186A (en) * | 2022-01-06 | 2022-04-12 | 安捷利电子科技（苏州）有限公司 | FPC and preparation method thereof |
| CN114641141A (en) * | 2020-12-16 | 2022-06-17 | 深南电路股份有限公司 | Manufacturing method of circuit board, circuit board and electronic device |
| CN115505929A (en) * | 2022-10-08 | 2022-12-23 | 东莞市钜升金属科技有限公司 | Production process of metal etching thin material |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01268093A (en) * | 1988-04-19 | 1989-10-25 | Ube Ind Ltd | Manufacture of wiring substrate having plated through hole |
| JPH02251195A (en) * | 1989-03-24 | 1990-10-08 | Nec Corp | Manufacture of printed wiring board |
| CN103260361A (en) * | 2013-05-14 | 2013-08-21 | 金悦通电子（翁源）有限公司 | Method with simple process for processing HDI outer layer line negative film being |
-
2014
- 2014-06-13 CN CN201410263485.3A patent/CN104023480A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01268093A (en) * | 1988-04-19 | 1989-10-25 | Ube Ind Ltd | Manufacture of wiring substrate having plated through hole |
| JPH02251195A (en) * | 1989-03-24 | 1990-10-08 | Nec Corp | Manufacture of printed wiring board |
| CN103260361A (en) * | 2013-05-14 | 2013-08-21 | 金悦通电子（翁源）有限公司 | Method with simple process for processing HDI outer layer line negative film being |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104597300A (en) * | 2014-12-15 | 2015-05-06 | 黄山市中显微电子有限公司 | Manufacturing method of electric test board for electric performance test |
| CN104597300B (en) * | 2014-12-15 | 2018-11-09 | 黄山市中显微电子有限公司 | A kind of production method of electrical measurement plate for electric performance test |
| CN114641141A (en) * | 2020-12-16 | 2022-06-17 | 深南电路股份有限公司 | Manufacturing method of circuit board, circuit board and electronic device |
| CN114340186A (en) * | 2022-01-06 | 2022-04-12 | 安捷利电子科技（苏州）有限公司 | FPC and preparation method thereof |
| CN115505929A (en) * | 2022-10-08 | 2022-12-23 | 东莞市钜升金属科技有限公司 | Production process of metal etching thin material |
| CN115505929B (en) * | 2022-10-08 | 2023-12-19 | 东莞市钜升金属科技有限公司 | Production process of metal etching thin material |
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Application publication date: 20140903 |