CN114449765A - HDI board manufacturing method for manufacturing blind hole instead of laser - Google Patents
HDI board manufacturing method for manufacturing blind hole instead of laser Download PDFInfo
- Publication number
- CN114449765A CN114449765A CN202210053581.XA CN202210053581A CN114449765A CN 114449765 A CN114449765 A CN 114449765A CN 202210053581 A CN202210053581 A CN 202210053581A CN 114449765 A CN114449765 A CN 114449765A
- Authority
- CN
- China
- Prior art keywords
- coating
- copper
- manufacturing
- blind hole
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 67
- 239000011889 copper foil Substances 0.000 claims abstract description 40
- 239000011248 coating agent Substances 0.000 claims abstract description 33
- 238000000576 coating method Methods 0.000 claims abstract description 33
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- 239000010949 copper Substances 0.000 claims abstract description 27
- 238000005520 cutting process Methods 0.000 claims abstract description 15
- 238000005553 drilling Methods 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 14
- 238000001035 drying Methods 0.000 claims abstract description 10
- 230000008569 process Effects 0.000 claims abstract description 8
- 230000007797 corrosion Effects 0.000 claims abstract description 4
- 238000005260 corrosion Methods 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 238000005530 etching Methods 0.000 claims description 31
- 239000010410 layer Substances 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 21
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 15
- 239000003292 glue Substances 0.000 claims description 10
- 238000007689 inspection Methods 0.000 claims description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 238000004064 recycling Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 8
- 238000004806 packaging method and process Methods 0.000 claims description 8
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 7
- 239000003365 glass fiber Substances 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 7
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 6
- 208000013715 atelosteogenesis type I Diseases 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000011161 development Methods 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 6
- 230000008439 repair process Effects 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 6
- 238000012360 testing method Methods 0.000 claims description 6
- 239000000428 dust Substances 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 5
- 238000007254 oxidation reaction Methods 0.000 claims description 5
- 230000008719 thickening Effects 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000011241 protective layer Substances 0.000 claims description 4
- 230000001680 brushing effect Effects 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 239000003814 drug Substances 0.000 claims description 3
- 239000007888 film coating Substances 0.000 claims description 3
- 238000009501 film coating Methods 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000005488 sandblasting Methods 0.000 claims description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 3
- 235000011121 sodium hydroxide Nutrition 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000012459 cleaning agent Substances 0.000 claims description 2
- 239000000084 colloidal system Substances 0.000 claims description 2
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 2
- 238000012545 processing Methods 0.000 abstract description 3
- 239000000126 substance Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000007769 metal material Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000012946 outsourcing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention relates to the technical field of blind buried hole PCB manufacturing, and discloses a manufacturing method of an HDI board for replacing laser to manufacture blind holes, which comprises the following steps: s1: cutting: cutting the core board without the copper clad, and cutting according to the process requirement to obtain the inner core board with the required size; s2: inner layer coating: the surface of the copper foil of the inner core board is roughened and cleaned, and a layer of photosensitive corrosion-resistant coating is uniformly coated in a dust-free environment, wherein the thickness of the coating is 10 mu m; s3: pre-baking: drying the coating, heating the coating from 30 ℃ to 120 ℃ for 8-10s, and baking the coating for 2min at the temperature of 120-135 ℃. The HDI board manufacturing method replacing laser manufacturing blind holes can solve the problems that the existing blind hole manufacturing depends on the hole forming of a laser drilling machine, the equipment is high in price, the cost and delivery period are long due to the fact that an outer bag is long, holes are formed in sequence, when the hole ratio is large, the cost is high, the shape of the formed holes is related to energy, most of the formed holes are conical holes, and delivery period is affected due to the fact that some small and medium-sized enterprises only need to be subjected to outward processing.
Description
Technical Field
The invention relates to the technical field of blind buried hole PCB manufacturing, in particular to a manufacturing method of an HDI board for replacing laser to manufacture blind holes.
Background
At present, the integration level of a PCB (printed circuit board) is higher and higher, the design of blind buried holes is more and more common, the method for manufacturing the blind holes mainly comprises the steps of laser drilling, pattern transfer and etching film removal are carried out by using a mask film before the laser drilling, a copper foil at a hole forming position is removed, and according to the difference of absorption spectrum energy of a metal material (the copper foil) and a non-metal material (glass fiber and resin), the resin glass fiber is broken down by using specific wavelength energy until the resin glass fiber meets an inner copper foil layer. However, the blind hole is manufactured by relying on a laser drilling machine to form holes, the equipment is expensive, the cost and delivery period are long when the blind hole is wrapped, holes are formed in sequence, the cost is high when the hole ratio is large, the hole forming shape is related to energy, most of the blind hole is conical, and some small and medium-sized enterprises only need to be subjected to outward processing, so that the delivery period is influenced.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides the HDI board manufacturing method for replacing laser to manufacture the blind hole, which has the advantages of reducing the cost and greatly improving the efficiency, and solves the problems that the conventional blind hole manufacturing relies on the hole forming of a laser drilling machine, the equipment is expensive, the outsourcing cost and delivery period are long, holes are punched in sequence, the cost is high when the hole ratio is large, the hole forming shape is related to energy, most of the holes are conical holes, and some small and medium-sized enterprises only need to carry out outward processing to influence the delivery period.
(II) technical scheme
In order to achieve the purposes of reducing cost and greatly improving efficiency, the invention provides the following technical scheme: a manufacturing method of an HDI plate for replacing laser to manufacture blind holes comprises the following steps:
s1: cutting: cutting the core board without the copper clad, and cutting according to the process requirement to obtain the inner core board with the required size;
s2: inner layer coating: the surface of the copper foil of the inner core board is roughened and cleaned, and a layer of photosensitive corrosion-resistant coating is uniformly coated in a dust-free environment, wherein the thickness of the coating is 10 mu m;
s3: pre-baking: drying the coating, heating the coating from 30 ℃ to 120 ℃ for 8-10s, and baking the coating for 2min in an environment of 120-135 ℃;
s4: exposure: exposing according to the pattern given by the customer;
s5: developing, etching and stripping: developing the exposed substrate, wherein the unexposed part is dissolved by 1% sodium carbonate, the exposed part is not dissolved, the dissolved part exposes out of the copper foil, the exposed part is removed in a film removing section, and the liquid medicine is mainly a caustic soda film removing liquid;
s6: one-time AOI, which is to perform automatic optical inspection and repair on the etched circuit on the two sides of the substrate;
s7: browning: the checked copper foil circuit is oxidized and roughened by using sulfuric acid, hydrogen peroxide and browning liquid, so that the binding force between the copper foil circuit and a film is increased;
s8: and (3) laminating: bonding the inner core plate and the back adhesive copper foil into a whole under high temperature and high pressure;
s9: coating and prebaking: uniformly coating the photosensitive wet film on the cleaned and roughened copper surface, and then drying at the temperature of 120-135 ℃ for 2-3 min;
s10: exposure and development: exposing the pattern of the blind holes, and developing to expose the copper foil at the blind holes;
s11: etching and removing the film: etching the copper foil exposed out of the blind hole by using a copper chloride etching solution, and removing the film at the exposed position at a film removing section;
s12: loosening and biting the exposed glue area after the blind hole is corroded with copper by using concentrated sulfuric acid, and biting the glue by using 98% industrial sulfuric acid at normal temperature for 15-20 min;
s13: grinding a plate and carrying out sand blasting: the bulked and bitten areas are cleaned by mechanical needle brushing, a blind hole which is the same as a copper etching point in position, has the same size of an orifice and is exposed out of the inner-layer copper foil is formed, the shape of the blind hole and the impurity-free bottom copper foil are ensured, and the blind hole is convenient to be subsequently processed into a conduction blind hole;
s14: drilling a through hole: using a drilling machine, and using a programmed drill belt to drill holes with drill bits with corresponding diameters at a specific rotating speed;
s15: PTH: a layer of thin copper is chemically deposited on the through holes and the blind holes to provide a conducting layer for subsequent electroplating thickening;
s16: outer layer dry film: the outer layer copper foil is pressed with a photosensitive dry film after being coarsened and cleaned, and is exposed and developed to form a surface to be plated with copper and an anti-plating dry film pattern;
s17: and (3) plating copper and tin on the pattern: thickening the developed plate by using a gantry electroplating line to plate copper and electrotinning;
s18: stripping film, etching and stripping tin: stripping the film of the electroplated plate to expose the copper foil, etching the etched section by using a copper chloride etching solution, and stripping tin in the tin stripping section;
s19: secondary AOI: performing automatic optical inspection and repair on circuits on two sides of the substrate which is stripped of films, etched and tin-stripped;
s20: solder mask characters: wet film coating, silk screen printing, drying, contraposition exposure and development, silk screen printing characters, final baking and curing are carried out on the whole board;
s21: surface treatment: cleaning the copper disc and then coating a protective layer;
s22: molding: cutting the large plate to form the shape required by a customer;
s23: cleaning: removing dust and oxidation on the surface;
s24: and (3) testing: open short circuit detection using specific test fixture
S25: and (3) appearance inspection: the substrate appearance was subjected to compliance checking against the customer's original drawing.
Preferably, in S4, the pattern is exposed by film or laser imaging.
Preferably, in S8, a glue body without glass fiber is disposed between the inner core board and the back adhesive copper foil.
Preferably, in S10, the positive pattern of blind holes is exposed.
Preferably, in S21, the protective layer includes tin or nickel-gold.
Preferably, in S23, the surface dust and oxidation are removed by using high-pressure water or a cleaning agent.
Preferably, in S25, the acceptable substrates are sent to a packaging line for packaging, and the unacceptable substrates are sent back to a scrap recycling line for recycling, and the cause of the recycling is analyzed.
Preferably, in S25, the acceptable substrates are sent to a packaging line for packaging, and the unacceptable substrates are sent back to a scrap recycling line for recycling, and the cause of the recycling is analyzed.
(III) advantageous effects
Compared with the prior art, the invention provides the HDI board manufacturing method for replacing laser to manufacture the blind hole, and the HDI board manufacturing method has the following beneficial effects:
1. compared with the conventional laser drilling of the blind hole, the HDI board manufacturing method for manufacturing the blind hole by replacing the laser has the advantages that the hole forming by the chemical glue etching mode is convenient and quick, a program is not needed to be designed, a target point is not needed to be found, the size of a light beam is not needed to be adjusted, the energy is high or low, the HDI board can be manufactured by small-batch sample plates without equipment, and compared with the matching of special horizontal equipment, the HDI board manufacturing method is small in investment, large in capacity, good in consistency and more economical.
2. The HDI board manufacturing method for manufacturing the blind holes instead of the laser does not depend on a laser drilling machine, uses simple chemical raw materials, is accurate in hole forming position and regular in shape, and is capable of forming holes in a large number of holes at one time without any sequence, so that the cost is reduced, and the efficiency is greatly improved.
Drawings
FIG. 1 is a schematic flow chart of a manufacturing method of an HDI board for replacing laser to manufacture blind holes, which is provided by the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a method for manufacturing an HDI board replacing a laser blind hole includes the following steps:
s1: cutting: cutting the core board without the copper clad, and cutting according to the process requirement to obtain the inner core board with the required size;
s2: inner layer coating: the surface of the copper foil of the inner core board is roughened and cleaned, and a layer of photosensitive corrosion-resistant coating is uniformly coated in a dust-free environment, wherein the thickness of the coating is 10 mu m;
s3: pre-baking: drying the coating, heating the coating from 30 ℃ to 120 ℃ for 10s, and baking the coating for 2min at the temperature of 120 ℃;
s4: exposure: exposing by using film imaging according to a pattern given by a client;
s5: developing, etching and stripping: developing the exposed substrate, wherein the unexposed part is dissolved by 1% sodium carbonate, the exposed part is not dissolved, the dissolved part exposes out of the copper foil, the copper chloride etching solution is used for etching the etching section, the exposed part is removed in the film removing section, and the liquid medicine is mainly used as a caustic soda film removing solution;
s6: one-time AOI, which is to perform automatic optical inspection and repair on the etched circuit on the two sides of the substrate;
s7: browning: the checked copper foil circuit is oxidized and roughened by using sulfuric acid, hydrogen peroxide and browning liquid, so that the binding force between the copper foil circuit and a film is increased;
s8: and (3) laminating: bonding the inner core plate and the back-glued copper foil into a whole under high temperature and high pressure, wherein a colloid without glass fiber is arranged between the inner core plate and the back-glued copper foil, and the conventional PP prepreg contains glass fiber and can not achieve the process purpose;
s9: coating and prebaking: uniformly coating the photosensitive wet film on the cleaned and coarsened copper surface, and then drying for 2min at 1205 ℃;
s10: exposure and development: exposing the pattern of the blind hole positive film, and developing to expose the copper foil at the blind hole;
s11: etching and removing the film: etching the copper foil exposed out of the blind hole by using a copper chloride etching solution, and removing the film at the exposed position at a film removing section;
s12: loosening and biting the exposed glue area after copper is corroded at the blind hole by using concentrated sulfuric acid, and biting the glue by using 98% industrial sulfuric acid at normal temperature for 15 min;
s13: grinding a plate and carrying out sand blasting: the bulked and bitten areas are cleaned by mechanical needle brushing, a blind hole which is the same as a copper etching point in position, has the same size of an orifice and is exposed out of the inner-layer copper foil is formed, the shape of the blind hole and the impurity-free bottom copper foil are ensured, and the blind hole is convenient to be subsequently processed into a conduction blind hole;
s14: drilling a through hole: using a drilling machine, and using a programmed drill belt to drill holes with drill bits with corresponding diameters at a specific rotating speed;
s15: PTH: a layer of thin copper is chemically deposited on the through holes and the blind holes to provide a conducting layer for subsequent electroplating thickening;
s16: outer layer dry film: the outer layer copper foil is pressed with a photosensitive dry film after being coarsened and cleaned, and is exposed and developed to form a surface to be plated with copper and an anti-plating dry film pattern;
s17: and (3) copper and tin plating of the pattern: thickening the developed plate by using a gantry electroplating line to plate copper and electrotinning;
s18: stripping film, etching and stripping tin: stripping the film of the electroplated plate to expose the copper foil, etching the etched section by using a copper chloride etching solution, and stripping tin in the tin stripping section;
s19: secondary AOI: performing automatic optical inspection and repair on circuits on two sides of the substrate which is stripped of films, etched and tin-stripped;
s20: solder mask characters: wet film coating, silk screen printing, drying, contraposition exposure and development, silk screen printing characters, final baking and curing are carried out on the whole board;
s21: surface treatment: cleaning a copper disc, and then coating a tin layer for protection;
s22: molding: cutting the large plate to form the shape required by a customer;
s23: cleaning: removing dust and oxidation on the surface by using high-pressure water;
s24: and (3) testing: open short circuit detection using specific test fixture
S25: and (3) appearance inspection: and performing compliance inspection on the appearance of the substrate by using AVI or visual mode in comparison with the original drawing of a customer, conveying the qualified substrate into a packaging production line for packaging, conveying the unqualified substrate back to a waste recovery line for recovery, and analyzing the generation reason of the unqualified substrate.
In summary, the HDI board manufacturing method for manufacturing the blind hole instead of the laser has the advantages that the hole forming in the chemical glue etching mode is convenient and fast compared with the hole forming of a conventional laser drilling blind hole, a program is not needed to be designed, a positioning point is not needed to be found, the size of a light beam is not needed to be adjusted, the energy is high or low, equipment is not needed, small-batch sample board manufacturing can be carried out, and the HDI board manufacturing method is small in investment, large in capacity, good in consistency and more economical compared with the matching of special horizontal equipment; the method has the advantages of no dependence on a laser drilling machine, use of simple chemical raw materials, accurate hole forming position, regular shape, one-step hole forming of numerous holes without sequence, cost reduction and great efficiency improvement.
It is to be noted that the term "comprises," "comprising," or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A HDI board manufacturing method for replacing laser to manufacture blind holes is characterized by comprising the following steps:
s1: cutting: cutting the core board without the copper clad, and cutting according to the process requirement to obtain the inner core board with the required size;
s2: inner layer coating: the surface of the copper foil of the inner core plate is roughened and cleaned, and a layer of photosensitive corrosion-resistant coating is uniformly coated in a dust-free environment, wherein the thickness of the coating is 10 mu m;
s3: pre-baking: drying the coating, heating the coating from 30 ℃ to 120 ℃ for 8-10s, and baking the coating for 2min in an environment of 120-135 ℃;
s4: exposure: exposing according to the pattern given by the customer;
s5: developing, etching and stripping: developing the exposed substrate, wherein the unexposed part is dissolved by 1% sodium carbonate, the exposed part is not dissolved, the dissolved part exposes out of the copper foil, the exposed part is removed in a film removing section, and the liquid medicine is mainly a caustic soda film removing liquid;
s6: one-time AOI, which is to perform automatic optical inspection and repair on the etched circuit on the two sides of the substrate;
s7: browning: the checked copper foil circuit is oxidized and roughened by using sulfuric acid, hydrogen peroxide and browning liquid, so that the binding force between the copper foil circuit and a film is increased;
s8: and (3) laminating: bonding the inner core plate and the back adhesive copper foil into a whole under high temperature and high pressure;
s9: coating and prebaking: uniformly coating the photosensitive wet film on the cleaned and roughened copper surface, and then drying at the temperature of 120-135 ℃ for 2-3 min;
s10: exposure and development: exposing the pattern of the blind holes, and developing to expose the copper foil at the blind holes;
s11: etching and removing the film: etching the copper foil exposed out of the blind hole by using a copper chloride etching solution, and removing the film at the exposed position at a film removing section;
s12: etching glue: loosening and biting the exposed glue area after the blind hole is corroded with copper by using concentrated sulfuric acid, and biting the glue by using 98% industrial sulfuric acid at normal temperature for 15-20 min;
s13: grinding a plate and carrying out sand blasting: the bulked and bitten areas are cleaned by mechanical needle brushing, a blind hole which is the same as a copper etching point in position, has the same size of an orifice and is exposed out of the inner-layer copper foil is formed, the shape of the blind hole and the impurity-free bottom copper foil are ensured, and the blind hole is convenient to be subsequently processed into a conduction blind hole;
s14: drilling a through hole: using a drilling machine, and using a programmed drill belt to drill holes with drill bits with corresponding diameters at a specific rotating speed;
s15: PTH: a layer of thin copper is chemically deposited on the through holes and the blind holes to provide a conducting layer for subsequent electroplating thickening;
s16: outer layer dry film: the outer layer copper foil is pressed with a photosensitive dry film after being coarsened and cleaned, and is exposed and developed to form a surface to be plated with copper and an anti-plating dry film pattern;
s17: and (3) copper and tin plating of the pattern: carrying out thickened copper-plated electrotinning on the developed board by using a gantry plating line;
s18: stripping film, etching and stripping tin: stripping the film of the electroplated plate to expose the copper foil, etching the etched section by using a copper chloride etching solution, and stripping tin in the tin stripping section;
s19: secondary AOI: performing automatic optical inspection and repair on circuits on two sides of the substrate which is stripped of films, etched and tin-stripped;
s20: solder mask characters: wet film coating, silk screen printing, drying, contraposition exposure and development, silk screen printing characters, final baking and curing are carried out on the whole board;
s21: surface treatment: cleaning the copper disc and then coating a protective layer;
s22: molding: cutting the large plate to form the shape required by a customer;
s23: cleaning: removing dust and oxidation on the surface;
s24: and (3) testing: open short circuit detection using specific test fixture
S25: and (3) appearance inspection: the substrate appearance was subjected to compliance checking against the customer's original drawing.
2. The manufacturing method of the HDI board replacing the laser manufactured blind hole in claim 1 is characterized in that: in S4, the pattern is exposed using film or laser imaging.
3. The manufacturing method of the HDI board replacing the laser manufactured blind hole in claim 1 is characterized in that: and in the S8, a colloid without glass fiber is arranged between the inner-layer core board and the back adhesive copper foil.
4. The manufacturing method of the HDI board replacing the laser manufactured blind hole in claim 1 is characterized in that: in S10, the pattern positive of the blind via is exposed.
5. The manufacturing method of the HDI board replacing the laser manufactured blind hole in claim 1 is characterized in that: in S21, the protective layer includes tin or nickel-gold.
6. The manufacturing method of the HDI board replacing the laser manufactured blind hole in claim 1 is characterized in that: in S23, the surface dust and oxidation are removed by using high-pressure water or a cleaning agent.
7. The manufacturing method of the HDI board replacing the laser manufactured blind hole in claim 1 is characterized in that: in S25, the acceptable substrates are sent to a packaging line for packaging, and the unacceptable substrates are sent back to a scrap recycling line for recycling, and the cause of the recycling is analyzed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210053581.XA CN114449765A (en) | 2022-01-18 | 2022-01-18 | HDI board manufacturing method for manufacturing blind hole instead of laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210053581.XA CN114449765A (en) | 2022-01-18 | 2022-01-18 | HDI board manufacturing method for manufacturing blind hole instead of laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114449765A true CN114449765A (en) | 2022-05-06 |
Family
ID=81367030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210053581.XA Pending CN114449765A (en) | 2022-01-18 | 2022-01-18 | HDI board manufacturing method for manufacturing blind hole instead of laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114449765A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115066110A (en) * | 2022-08-19 | 2022-09-16 | 广东科翔电子科技股份有限公司 | Micro-LED PCB ultra-Micro huge blind hole manufacturing method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3319317A (en) * | 1963-12-23 | 1967-05-16 | Ibm | Method of making a multilayered laminated circuit board |
| JPS63164292A (en) * | 1986-10-27 | 1988-07-07 | ヒューズ・エアクラフト・カンパニー | Method of selectively forming small holes in polyimide/kevlar substrate |
| US5352325A (en) * | 1993-04-30 | 1994-10-04 | Eastern Co., Ltd. | Method of forming through holes in printed wiring board substrates |
| JPH08186372A (en) * | 1994-12-29 | 1996-07-16 | Cmk Corp | Manufacture of multilayer printed wiring board |
| US6119335A (en) * | 1997-12-02 | 2000-09-19 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing multi-layer printed circuit board |
| CN103188887A (en) * | 2012-01-03 | 2013-07-03 | 三星泰科威株式会社 | Method of forming via hole in circuit board |
| CN112601371A (en) * | 2020-12-22 | 2021-04-02 | 江西志博信科技股份有限公司 | HDI manufacturing process |
-
2022
- 2022-01-18 CN CN202210053581.XA patent/CN114449765A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3319317A (en) * | 1963-12-23 | 1967-05-16 | Ibm | Method of making a multilayered laminated circuit board |
| JPS63164292A (en) * | 1986-10-27 | 1988-07-07 | ヒューズ・エアクラフト・カンパニー | Method of selectively forming small holes in polyimide/kevlar substrate |
| US5352325A (en) * | 1993-04-30 | 1994-10-04 | Eastern Co., Ltd. | Method of forming through holes in printed wiring board substrates |
| JPH08186372A (en) * | 1994-12-29 | 1996-07-16 | Cmk Corp | Manufacture of multilayer printed wiring board |
| US6119335A (en) * | 1997-12-02 | 2000-09-19 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing multi-layer printed circuit board |
| CN103188887A (en) * | 2012-01-03 | 2013-07-03 | 三星泰科威株式会社 | Method of forming via hole in circuit board |
| CN112601371A (en) * | 2020-12-22 | 2021-04-02 | 江西志博信科技股份有限公司 | HDI manufacturing process |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115066110A (en) * | 2022-08-19 | 2022-09-16 | 广东科翔电子科技股份有限公司 | Micro-LED PCB ultra-Micro huge blind hole manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101951727B (en) | Method for producing electroplated board edge of circuit board | |
| CN108718485B (en) | Semi-additive technology for manufacturing fine-wire thick-copper double-sided FPC | |
| CN109348637B (en) | Film alignment method for preventing incomplete etching of negative plate circuit | |
| CN111629523A (en) | Preparation method of multilayer electric hole process packaging substrate and substrate | |
| CN105163502A (en) | Low line width and line space etching control method of thick copper plate | |
| CN114615814B (en) | Manufacturing process of circuit pattern of outer-layer flexible rigid-flex circuit board | |
| CN114449765A (en) | HDI board manufacturing method for manufacturing blind hole instead of laser | |
| CN104883820A (en) | Manufacturing method for external layer line of asymmetric backboard with warped structure | |
| CN106658966B (en) | Method for etching inner layer of thin film resistor | |
| CN111031683B (en) | Design and use method of pattern electroplating accompanying plate in PCB production process | |
| CN104023480A (en) | Processing method for shortening PCB plating process | |
| CN108712819B (en) | Printed circuit board scrapping method | |
| JPH09288358A (en) | Formation of conductor circuit | |
| CN113973440A (en) | Circuit board insulating layer treatment process | |
| CN112492776B (en) | Method for selective plating of inner blind holes of ultrathin plate | |
| CN112672525B (en) | Treatment method for incomplete etching in PCB negative film process | |
| CN114206012A (en) | Manufacturing process of main board | |
| CN113225921A (en) | Method for manufacturing PCB blind hole | |
| CN102686031B (en) | Pre-windowing process of high-density interconnected PCB (printed circuit board) with buried blind hole | |
| CN113115520A (en) | Manufacturing method of high-order HDI (high Density interconnection) grading golden finger printing plate | |
| CN105282989A (en) | Manufacturing method of windowed rigid-flex PCB | |
| CN111405768A (en) | Method for manufacturing multilayer printed circuit board | |
| CN111385982A (en) | Method for improving laminated structure of multilayer PCB | |
| KR102345769B1 (en) | Method for testing break point and working film for the same | |
| CN115767924A (en) | Method for manufacturing circuit board by laser etching |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220506 |
|
| RJ01 | Rejection of invention patent application after publication |