CN103924269B - 一种非染料系整平剂的应用 - Google Patents
一种非染料系整平剂的应用 Download PDFInfo
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- CN103924269B CN103924269B CN201310731859.5A CN201310731859A CN103924269B CN 103924269 B CN103924269 B CN 103924269B CN 201310731859 A CN201310731859 A CN 201310731859A CN 103924269 B CN103924269 B CN 103924269B
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- leveling agent
- copper
- molecule
- heteroaralkyl
- plating
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- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 46
- 239000000975 dye Substances 0.000 title claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 238000009713 electroplating Methods 0.000 claims abstract description 15
- 125000003710 aryl alkyl group Chemical group 0.000 claims abstract description 8
- 125000004475 heteroaralkyl group Chemical group 0.000 claims abstract description 8
- 238000005516 engineering process Methods 0.000 claims abstract description 7
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 4
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 4
- 125000005017 substituted alkenyl group Chemical group 0.000 claims abstract description 4
- 125000000547 substituted alkyl group Chemical group 0.000 claims abstract description 4
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 4
- 125000002769 thiazolinyl group Chemical group 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 abstract description 20
- 238000000034 method Methods 0.000 abstract description 10
- 239000002253 acid Substances 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
- 230000007547 defect Effects 0.000 abstract description 4
- 238000011161 development Methods 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000012512 characterization method Methods 0.000 abstract description 2
- 125000000524 functional group Chemical group 0.000 abstract description 2
- 230000010534 mechanism of action Effects 0.000 abstract description 2
- 231100000252 nontoxic Toxicity 0.000 abstract description 2
- 230000003000 nontoxic effect Effects 0.000 abstract description 2
- 239000000654 additive Substances 0.000 description 18
- 230000000996 additive effect Effects 0.000 description 18
- 238000002474 experimental method Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 239000000460 chlorine Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 238000005282 brightening Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000012452 mother liquor Substances 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- -1 polyoxyethylene Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241000370738 Chlorion Species 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910000806 Latten Inorganic materials 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000013441 quality evaluation Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
Claims (2)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310731859.5A CN103924269B (zh) | 2013-12-26 | 2013-12-26 | 一种非染料系整平剂的应用 |
PCT/CN2014/076807 WO2015096347A1 (en) | 2013-12-26 | 2014-05-05 | Leveling composition and method for electrodeposition of metals in microelectronics |
CN201480000564.3A CN105026385B (zh) | 2013-12-26 | 2014-05-05 | 一种应用于微电子的整平剂组合物及其用于金属电沉积的方法 |
US13/261,924 US9551081B2 (en) | 2013-12-26 | 2014-05-05 | Leveling composition and method for electrodeposition of metals in microelectronics |
US15/388,927 US9920023B2 (en) | 2013-12-26 | 2016-12-22 | Leveling composition and method for electrodeposition of metals in microelectronics |
Applications Claiming Priority (1)
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CN201310731859.5A CN103924269B (zh) | 2013-12-26 | 2013-12-26 | 一种非染料系整平剂的应用 |
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CN103924269A CN103924269A (zh) | 2014-07-16 |
CN103924269B true CN103924269B (zh) | 2016-04-13 |
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CN201310731859.5A Active CN103924269B (zh) | 2013-12-26 | 2013-12-26 | 一种非染料系整平剂的应用 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102095497B1 (ko) * | 2016-11-23 | 2020-04-01 | 쑤저우 신하오 머티리얼즈 엘엘씨 | 높은 우선 배향을 갖는 구리 결정 입자 및 그의 제조 방법 |
KR102201349B1 (ko) * | 2016-11-23 | 2021-01-12 | 쑤저우 신하오 머티리얼즈 엘엘씨 | 우선 성장 배향을 갖는 전기도금 구리층의 제조 방법 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015096347A1 (en) * | 2013-12-26 | 2015-07-02 | Suzhou Shinhao Materials Llc | Leveling composition and method for electrodeposition of metals in microelectronics |
KR101893338B1 (ko) * | 2014-12-30 | 2018-08-30 | 쑤저우 신하오 머티리얼즈 엘엘씨 | 레벨러, 레벨링 조성물 및 마이크로전자공학에서 금속의 전착 방법 |
CN108396344B (zh) * | 2018-03-19 | 2021-02-12 | 苏州昕皓新材料科技有限公司 | 具有扭曲带状无序缠绕微观结构的电解铜箔及其制备方法 |
CN109112580A (zh) | 2018-09-18 | 2019-01-01 | 苏州昕皓新材料科技有限公司 | 一种具有热力学各向异性的金属材料及其制备方法 |
Citations (4)
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---|---|---|---|---|
CN101634041A (zh) * | 2008-07-21 | 2010-01-27 | 中国科学院宁波材料技术与工程研究所 | 一种含盲孔锌合金工件表面电镀锌的方法及其溶液 |
CN101935836A (zh) * | 2010-08-03 | 2011-01-05 | 山东金宝电子股份有限公司 | 高档fr-4覆铜板用红化铜箔的表面处理工艺 |
CN102047438A (zh) * | 2008-05-30 | 2011-05-04 | 阿托特希德国有限公司 | 用于11(ib)族-13(iiia)族-16(via)族元素的金属、二元、三元、四元或五元合金沉积的电镀添加剂 |
CN102418129A (zh) * | 2011-11-18 | 2012-04-18 | 山东金宝电子股份有限公司 | 一种高Tg、无卤素板用铜箔的表面处理工艺 |
Family Cites Families (1)
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JP3670185B2 (ja) * | 2000-01-28 | 2005-07-13 | 三井金属鉱業株式会社 | プリント配線板用表面処理銅箔の製造方法 |
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- 2013-12-26 CN CN201310731859.5A patent/CN103924269B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102047438A (zh) * | 2008-05-30 | 2011-05-04 | 阿托特希德国有限公司 | 用于11(ib)族-13(iiia)族-16(via)族元素的金属、二元、三元、四元或五元合金沉积的电镀添加剂 |
CN101634041A (zh) * | 2008-07-21 | 2010-01-27 | 中国科学院宁波材料技术与工程研究所 | 一种含盲孔锌合金工件表面电镀锌的方法及其溶液 |
CN101935836A (zh) * | 2010-08-03 | 2011-01-05 | 山东金宝电子股份有限公司 | 高档fr-4覆铜板用红化铜箔的表面处理工艺 |
CN102418129A (zh) * | 2011-11-18 | 2012-04-18 | 山东金宝电子股份有限公司 | 一种高Tg、无卤素板用铜箔的表面处理工艺 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102095497B1 (ko) * | 2016-11-23 | 2020-04-01 | 쑤저우 신하오 머티리얼즈 엘엘씨 | 높은 우선 배향을 갖는 구리 결정 입자 및 그의 제조 방법 |
KR102201349B1 (ko) * | 2016-11-23 | 2021-01-12 | 쑤저우 신하오 머티리얼즈 엘엘씨 | 우선 성장 배향을 갖는 전기도금 구리층의 제조 방법 |
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CN103924269A (zh) | 2014-07-16 |
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Address after: 215000 East Side of Chang'an Road, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province (Science and Technology Pioneering Park) Patentee after: Meiyouke (Suzhou) Semiconductor Materials Co.,Ltd. Country or region after: China Address before: 215000 East Side of Chang'an Road, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province (Science and Technology Pioneering Park) Patentee before: SUZHOU SHINHAO MATERIALS LLC Country or region before: China |
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