CN103909362A - Low-silver brazing filler metal containing nickel and indium - Google Patents
Low-silver brazing filler metal containing nickel and indium Download PDFInfo
- Publication number
- CN103909362A CN103909362A CN201410100714.XA CN201410100714A CN103909362A CN 103909362 A CN103909362 A CN 103909362A CN 201410100714 A CN201410100714 A CN 201410100714A CN 103909362 A CN103909362 A CN 103909362A
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- CN
- China
- Prior art keywords
- indium
- silver
- nickel
- filler metal
- brazing filler
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
The invention introduces low-silver brazing filler metal containing nickel and indium and relates to the technical field of welding. The low-silver brazing filler metal is obtained by melting silver, copper, zinc, indium and nickel according to proportion, uniformly stirring and casting, extruding and pulling a cast ingot. The brazing filler metal includes, by weight, 39-41% of silver, 27-31% of zinc, 1.0-4.0% of indium, 0.5-2.0% of nickel and the balance of copper. A small quantity of nickel and indium is added into the silver brazing filler metal, wettability and joint strength of the brazing filler metal can be improved when the nickel enter the brazing filler metal, and processing performance is improved. The indium can more remarkably improve solid and liquid phase lines of the brazing filler metal, fusion range of the brazing filler metal is reduced, and mobility of the brazing filler metal is improved, so that the joint strength can be improved. Content of the silver can be reduced by adding other elements, and production cost is effectively reduced.
Description
Technical field
The present invention relates to welding technology field, relate to specifically a kind of low-silver solder that contains nickel and indium.
Background technology
Silver solder is to be widely used at present soldering mild steel, stainless a kind of hard solder, it has good processing performance, suitable fusing point, the good ability that soaks and fill up gap, but traditional silver solder contains cadmium element, due to the harm of cadmium to health and the pollution to environment, limit in the world the practicality of cadmium element on solder, therefore Solders Research person uses finding the replacer of cadmium in solder, but these solder systems or all have gap with traditional containing cadmium brazing silver alloy in price, in soldering processes performance or processing characteristics.Obtain with tradition and contain the performance that cadmium is identical, conventionally need to improve silver content and carry out, because silver solder contains a large amount of noble silvers, its brazing product, in a large amount of manufactures and the outlet of China, makes the silver-colored resource of China day by day nervous.In order to reduce costs, break the awkward situation of high-quality brazing material from external import, improve the competitiveness of product, need to reach by adding its trace element the processing performance of product.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of low-silver solder that contains nickel and indium of low cost function admirable.
In order to achieve the above object, the technical solution adopted in the present invention is:
A kind of low-silver solder that contains nickel and indium, the raw material of argentiferous, copper, zinc, indium, nickel is smelted by proportioning, after stirring, cast, then ingot casting is passed through to extruding, drawing, obtain needed solder wire material, it is characterized in that: described solder wire material comprises zinc, silver, nickel, phosphide element, wherein silver weight range is 39%～41% by mass percentage, and zinc is 27%～31%, indium 1.0%～4.0%, nickel 0.5%～2.0%, surplus is copper.The present invention drops into silver, copper, zinc, nickel, indium to smelt in sequence, smelts after having got well and stirs, then cast.
More specifically, the mass percent of described indium is that the mass percent of 1.5%-2%, described nickel is 1%.
Beneficial effect of the present invention is:
The present invention mainly by adding a small amount of nickel and indium in silver solder, the copper that nickel enters solder tissue mutually in, can be at the interface continuous crystallisation near mother metal, can improve wetability and the strength of joint of solder, to purifying crystal boundary, improving plasticity, the good effect of having gained in strength, and can improve processing characteristics, be easy to be processed into band.Interpolation indium can more significantly reduce the solid, liquid phase line of solder, also can make solder melting region reduce, and improves solder mobility, and spreading property increases gradually, and indium all forms solid solution with silver, copper, nickel etc., and is difficult for causing the processing characteristics of alloy to worsen.In silver solder, add indium, the intensity that can make joint also raising to a certain extent.The present invention can reduce the content of silver element by adding other elements, effectively reduce production costs.
The specific embodiment
A kind of low-silver solder that contains nickel and indium of the present invention, solder wire material comprises zinc, silver, copper, silver, nickel element, and wherein mass range silver is 39%～41% by mass percentage, and zinc is 27%～31%, indium 1.0%～4.0%, nickel 0.5%～2.0%.When this solder is produced as follows, formula according to the rules, adopt cathode copper, zinc ingot metal, silver, indium metal, metallic nickel to prepare burden, adopt conventional intermediate frequency smelting furnace to carry out melting, after melting, cast, then ingot casting is passed through to extruding, drawing, obtain needed solder wire material, must be wherein to drop in sequence silver, copper, zinc, nickel, indium to smelt, smelting be cast after stirring after having got well again.
Embodiment 1:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 39%, and zinc 27%, indium 1%, nickel 0.5%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 400MPa, 699 ℃ of left and right of fusion temperature, 778 ℃ of left and right of brazing temperature.
Embodiment 2:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 39%, and zinc 31%, indium 4%, nickel 0.5%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 400MPa, 635 ℃ of left and right of fusion temperature, 705 ℃ of left and right of brazing temperature.
Embodiment 3:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 39%, and zinc 30%, indium 1.5%, nickel 1%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 400MPa, 687 ℃ of left and right of fusion temperature, 773 ℃ of left and right of brazing temperature.
Embodiment 4:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 39%, and zinc 30%, indium 1.7%, nickel 1%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 400MPa, 683 ℃ of left and right of fusion temperature, 767 ℃ of left and right of brazing temperature.
Embodiment 5:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 40%, and zinc 28%, indium 1.5%, nickel 1%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 400MPa, 691 ℃ of left and right of fusion temperature, 781 ℃ of left and right of brazing temperature.
Embodiment 6:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 40%, and zinc 29%, indium 1.7%, nickel 1.5%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 400MPa, 679 ℃ of left and right of fusion temperature, 773 ℃ of left and right of brazing temperature.
Embodiment 7:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 40%, and zinc 31%, indium 1.7%, nickel 1%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 400MPa, 672 ℃ of left and right of fusion temperature, 765 ℃ of left and right of brazing temperature.
Embodiment 8:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 40%, and zinc, 28%, indium 2%, nickel 2%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 400MPa, 664 ℃ of left and right of fusion temperature, 753 ℃ of left and right of brazing temperature.
Embodiment 9:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 40%, and zinc 27%, indium 1%, nickel 0.5%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 400MPa, 715 ℃ of left and right of fusion temperature, 820 ℃ of left and right of brazing temperature.
Embodiment 10:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 40%, and zinc 31%, indium 4%, nickel 2%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 400MPa, 646 ℃ of left and right of fusion temperature, 721 ℃ of left and right of brazing temperature.
Embodiment 11:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 41%, and zinc 29%, indium 1.7%, nickel 2%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 400MPa, 679 ℃ of left and right of fusion temperature, 760 ℃ of left and right of brazing temperature.
Embodiment 12:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 41%, and zinc 29%, indium 2%, nickel 1%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 400MPa, 671 ℃ of left and right of fusion temperature, 754 ℃ of left and right of brazing temperature.
Embodiment 13:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 41%, and zinc 31%, indium 3%, nickel 1.5%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 400MPa, 653 ℃ of left and right of fusion temperature, 734 ℃ of left and right of brazing temperature.
Embodiment 14:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 41%, and zinc 31%, indium 4%, nickel 0.5%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 400MPa, 635 ℃ of left and right of fusion temperature, 718 ℃ of left and right of brazing temperature.
Embodiment 15:
Press brazing filler metal alloy ingredient composition, the percentage by weight of alloying component consists of: silver 41%, and zinc 30%, indium 1.5%, nickel 1%, surplus is copper.The solder of system is processed as to the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, with conventional method soldering copper alloy mother metal, its wetability on mother metal is good, unrestrained good fluidity, and tensile strength reaches 400MPa, 680 ℃ of left and right of fusion temperature, 761 ℃ of left and right of brazing temperature.
Obtained by above-described embodiment, by solder is added nickel, phosphide element and optimizes its partition ratio, the processing performance such as tensile strength, brazing temperature of solder is better, the special mass percent that is 1.5%-2%, nickel when indium mass percent is 1%, the processing performance such as tensile strength, the brazing temperature better performances of solder.The present invention adds a small amount of nickel and indium in silver solder, the copper that nickel enters solder tissue mutually in, can be at the interface continuous crystallisation near mother metal, can improve wetability and the strength of joint of solder, to purifying crystal boundary, improving plasticity, the good effect of having gained in strength, and can improve processing characteristics, be easy to be processed into band, but can improve the liquidus temperature of solder.Interpolation indium can more significantly reduce the solid, liquid phase line of solder, also can make solder melting region reduce, and improves solder mobility, and indium all forms solid solution with silver, copper, nickel etc., and is difficult for causing the processing characteristics of alloy to worsen.In silver solder, add indium, the intensity that can make joint also raising to a certain extent.The present invention can reduce the content of silver element by adding other elements, effectively reduce production costs.
Claims (2)
1. a low-silver solder that contains nickel and indium, the raw material of argentiferous, copper, zinc, indium, nickel is smelted by proportioning, after stirring, cast, then ingot casting is passed through to extruding, drawing, obtain needed solder wire material, it is characterized in that: described solder wire material comprises zinc, silver, copper, nickel, phosphide element, wherein silver weight range is 39%～41% by mass percentage, and zinc is 27%～31%, indium 1.0%～4.0%, nickel is 0.5%～2.0%, and surplus is copper.
2. a kind of low-silver solder that contains nickel and indium according to claim 1, is characterized in that: described indium mass percent is that 1.5%-2%, described nickel mass percent are 1%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410100714.XA CN103909362A (en) | 2014-03-17 | 2014-03-17 | Low-silver brazing filler metal containing nickel and indium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410100714.XA CN103909362A (en) | 2014-03-17 | 2014-03-17 | Low-silver brazing filler metal containing nickel and indium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103909362A true CN103909362A (en) | 2014-07-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410100714.XA Pending CN103909362A (en) | 2014-03-17 | 2014-03-17 | Low-silver brazing filler metal containing nickel and indium |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110695567A (en) * | 2019-10-21 | 2020-01-17 | 北京航空航天大学 | Silver-based brazing filler metal with low melting point and high plasticity |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001121288A (en) * | 1999-10-27 | 2001-05-08 | Tanaka Kikinzoku Kogyo Kk | Silver brazing filler metal for joining cemented carbide |
| CN1962160A (en) * | 2006-11-26 | 2007-05-16 | 常熟市华银焊料有限公司 | Cadmium-free silver solder containing gallium, indium and cerium |
| CN101524793A (en) * | 2009-04-20 | 2009-09-09 | 金华市三环焊接材料有限公司 | Cadmium-free silver filler containing lithium and niobium and production method thereof |
| CN103111770A (en) * | 2012-12-19 | 2013-05-22 | 杭州华光焊接新材料股份有限公司 | Polybasic silver solder |
| CN103418933A (en) * | 2013-07-18 | 2013-12-04 | 浙江信和科技股份有限公司 | Silver solder for connecting brass and stainless steel |
-
2014
- 2014-03-17 CN CN201410100714.XA patent/CN103909362A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001121288A (en) * | 1999-10-27 | 2001-05-08 | Tanaka Kikinzoku Kogyo Kk | Silver brazing filler metal for joining cemented carbide |
| CN1962160A (en) * | 2006-11-26 | 2007-05-16 | 常熟市华银焊料有限公司 | Cadmium-free silver solder containing gallium, indium and cerium |
| CN101524793A (en) * | 2009-04-20 | 2009-09-09 | 金华市三环焊接材料有限公司 | Cadmium-free silver filler containing lithium and niobium and production method thereof |
| CN103111770A (en) * | 2012-12-19 | 2013-05-22 | 杭州华光焊接新材料股份有限公司 | Polybasic silver solder |
| CN103418933A (en) * | 2013-07-18 | 2013-12-04 | 浙江信和科技股份有限公司 | Silver solder for connecting brass and stainless steel |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110695567A (en) * | 2019-10-21 | 2020-01-17 | 北京航空航天大学 | Silver-based brazing filler metal with low melting point and high plasticity |
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Application publication date: 20140709 |