CN102601542A

CN102601542A - Brass brazing alloy

Info

Publication number: CN102601542A
Application number: CN2012100874247A
Authority: CN
Inventors: 卫国强
Original assignee: South China University of Technology SCUT
Current assignee: South China University of Technology SCUT
Priority date: 2012-03-28
Filing date: 2012-03-28
Publication date: 2012-07-25
Anticipated expiration: 2032-03-28
Also published as: CN102601542B

Abstract

The invention discloses brass brazing alloy, which comprises Cu, Zn, Sn, Ge, Ag and/or In. The brass brazing alloy consists of components including, by mass percentage, from 58 to 60% of Cu, from 0.5 to 3.0% of Sn, from 1.0 to 6.0% of Ag and/or from 1.0 to 5.0% of In, from 0.05 to 0.3% of Ge and the balance Zn. Compared with an existing brass brazing material, the brass brazing alloy has the advantages that melting temperature is low, the brass brazing alloy can replace a silver brazing material to be used for brazing steel/copper joints, and cost is low due to the fact that Ag content of the brass brazing alloy is low.

Description

A kind of brazing solder alloy

Technical field

The present invention relates to the soldering tech field, specifically be meant a kind of high reliability brazing solder alloy that soldering connects steel that is used for.

Background technology

Current at each industrial circle, the brazing filler metal alloy that the solder brazing of steel is adopted mainly contains silver solder (Ag-Cu-Zn system), brazing solder (Cu-Zn system) etc.Silver solder is able to extensive use owing to have lower fusion temperature, excellent wetting capacity ability and good comprehensive mechanical properties.But along with the excessive use of non-renewable resources, the price of noble metal silver rises steadily, and causes the manufacturing cost of manufacturer constantly to increase.For making the reasonable disposition of non-renewable resources, reduce manufacturing cost, people begin to focus on the feasibility that each industrial circle is used brazing solder again.

For a long time, traditional brazing solder all is to be matrix with Cu, at first forms α-Cu solid solution through adding alloy element Zn, and the interpolation scope of its Zn is generally 38%-42%; Secondly, improve the soldering processes performance and the mechanical property of solder through interpolation trace alloying element Sn, Mn, Ni, Si.In the Cu-Zn alloy, add the fusion temperature that Sn can reduce brazing filler metal alloy, improve wetability; Add Mn, Fe and Ni and can improve the wetability of solder on carbide alloy; Add the evaporation that Si prevents Zn in brazing process.In addition, according to the regulation of American Welding Society (AWS), also have in above brazing filler metal alloy, to add the wetability that trace P (as: RBCuZn-D) improves solder.

Though existing brazing solder is applied at some industrial circle, to use brazing solder to come the soldering steel in some important occasions, also there are many deficiencies in it.Research shows; The Si and the P that in the Cu-Zn alloy, add trace; In brazing process, can form Fe-Si and Fe-P intermetallic compound at steel/solder interface, in addition form micro-crack at the interface and joint existence during with the silver-base solder soldering than big-difference (interface is α-Cu solid solution).Owing to Fe-Si and the intrinsic fragility of Fe-P intermetallic compound and the generation of micro-crack, will reduce the reliability (as: air-tightness, electric conductivity and mechanical property) of soldered fitting military service process.Secondly, existing brazing solder is because fusing point is higher, the soldering class steely/during copper sleeve, copper annealing is serious, causes that excessive grain grows up, and causes intensity index to reduce.

Summary of the invention

The purpose of this invention is to provide a kind of high reliability brazing solder alloy, this solder instead silver solder is used for steel/steel, steel/copper brazing joint of soldering requirement high reliability etc., and solder is with low cost.

The object of the invention realizes through following technical scheme:

A kind of brazing solder alloy is made up of Cu, Zn, Sn, Ge and Ag and/or In.

Said each component is by mass percentage: Cu:58-60%, and Sn:0.5-3.0%, Ag:1.0-6.0% and/or In:1.0-5.0%, Ge:0.05-0.3%, surplus is Zn.

Preferably, said Cu:58-60%, Sn:1.0-2.0%, Ag:2.0-5.0% and/or In:1.0-3.0%, Ge:0.05-0.1%, surplus is Zn.

Preferably, said Cu:60%, Sn:1.5%, Ag:5%, In:1%, Ge:0.05%, Zn: surplus.

Preferably, said Cu:58%, Sn:1.0%, Ag:2%, Ge:0.1%, Zn: surplus.

Preferably, said Cu:58%, Sn:2.0%, Ag:4%, In:3%, Ge:0.1%, Zn: surplus.

Preferably, said Cu:60%, Sn:1.5%, Ag:5%, Ge:0.08%, Zn: surplus.

Preferably, said Cu:59%, Sn:2.0%, Ag:3.0%, Ge:0.06%, Zn: surplus.

Preferably, said Cu:59%, Sn:1.5%, In:3.0%, Ge:0.15%, Zn: surplus.

Above-mentioned brazing filler metal alloy can obtain through conventional brazing filler metal alloy method of smelting, and can be processed into silk material, the band of different size by the solder processing method of routine.

Brazing filler metal alloy of the present invention compared with prior art has following advantage:

1) when the soldering steel, steel/solder interface can not form intermetallic compound, and the interface can obtain the α identical with silver solder-Cu solid solution Interface Microstructure, thereby improves the reliability of soldered fitting.

2) and existing brazing solder relatively because fusion temperature is lower, the instead silver solder is used for the soldering of steel/copper sleeve.

3) brazing solder of the present invention is lower owing to containing the Ag amount, so cost is lower.

The principle that the effect of each component and content limit among the present invention is (content is all by percentage to the quality) as follows:

Cu and Zn: be organized as α-Cu solid solution for guaranteeing brazing filler metal alloy; Solder has good processing properties, and according to the Cu-Zn binary phase diagraml, the ratio of Cu and Zn should be limited to Cu: Zn at 58-60%: in the 42%-40% scope.

Sn: in the Cu-Zn alloy, add Sn, can reduce the fusion temperature of brazing filler metal alloy, increase wetability.But the solid solubility of Sn in Cu and Zn is very little, and the Sn meeting and the Cu that therefore add form intermetallic compound, and solder is become fragile, and are preferably 1.0-2.0%.

Ag and In: the fusion temperature that can reduce brazing filler metal alloy; Improve wetability, improve the mechanical property of solder simultaneously.Consider from material cost and soldered fitting combination property, be preferably Ag:2.0-5.0% and/or In:1.0-3.0%.

Ge: bigger solid solubility is arranged, but Ge is active element (activity is lower than Si) in Cu, can prevents that the evaporation of Zn and Fe from can not form intermetallic compound, consider that simultaneously brazing solder brazing temperature of the present invention decreases, therefore be preferably 0.05-0.1%.

The specific embodiment

Embodiment 1

A kind of brazing solder alloy, its alloy formula are Cu:60%, Sn:1.5%, Ag:5%, In:1.0%, Ge:0.05%, Zn: surplus.

The preparation process of above-mentioned brazing solder alloy is following:

1) amounts to 5000 grams by each material of above formulated;

2) putting into induction furnace to Cu is heated to more than 1100 ℃ and makes its fusing;

3) add Zn and fully stirring, reduce deposite metal temperature to 920 ℃ simultaneously rapidly;

4) waiting to melt metal evenly adds Ag and fully stirs in the back;

5) add Sn, In and Ge and stir casting then;

6) extruding of solder processing method, the wire drawing by routine makes this brazing filler metal alloy.

Embodiment 2

Present embodiment and embodiment 1 difference are to adopt following prescription:

Cu:58%, Sn:1.0%, Ag:2%, Ge:0.1%, Zn: surplus.

Embodiment 3

Cu:58%, Sn:2.0%, Ag:4%, In:3%, Ge:0.1%, Zn: surplus.

Embodiment 4

Cu:60%, Sn:1.5%, Ag:5%, Ge:0.08%, Zn: surplus.

Embodiment 5

Cu:59%, Sn:2.0%, Ag:3.0%, Ge:0.06%, Zn: surplus.

Embodiment 6

Cu:59%, Sn:1.5%, In:3.0%, Ge:0.15%, Zn: surplus.

Conventional gas brazing is adopted in the preparation of soldering sample, and the mother metal trade mark is Q195, and brazing flux is a trimethylborate type gas flux.The solder fusing point adopts dsc measurement, and programming rate is 10 ℃/min; The loaded load of microhardness is 100gf, and the load time is 15s; Soldering sample interface pattern adopts sem observation.Testing result is seen table 1.

Table 1 embodiment and comparative example testing result are relatively

Claims

1. a brazing solder alloy is characterized in that, is made up of Cu, Zn, Sn, Ge and Ag and/or In.

2. alloy according to claim 1 is characterized in that, said each component by mass percentage: Cu:58-60%, Sn:0.5-3.0%, Ag:1.0-6.0% and/or In:1.0-5.0%, Ge:0.05-0.3%, surplus is Zn.

3. alloy according to claim 2 is characterized in that, said Cu:58-60%, and Sn:1.0-2.0%, Ag:2.0-5.0% and/or In:1.0-3.0%, Ge:0.05-0.1%, surplus is Zn.

4. alloy according to claim 3 is characterized in that, said Cu:60%, Sn:1.5%, Ag:5%, In:1%, Ge:0.05%, Zn: surplus.

5. alloy according to claim 3 is characterized in that, said Cu:58%, Sn:1.0%, Ag:2%, Ge:0.1%, Zn: surplus.

6. alloy according to claim 3 is characterized in that, said Cu:58%, Sn:2.0%, Ag:4%, In:3%, Ge:0.1%, Zn: surplus.

7. alloy according to claim 3 is characterized in that, said Cu:60%, Sn:1.5%, Ag:5%, Ge:0.08%, Zn: surplus.

8. alloy according to claim 3 is characterized in that, said Cu:59%, Sn:2.0%, Ag:3.0%, Ge:0.06%, Zn: surplus.

9. alloy according to claim 3 is characterized in that, said Cu:59%, Sn:1.5%, In:3.0%, Ge:0.15%, Zn: surplus.