CN101664864B - Moderate temperature copper based brazing filler metal and preparation method thereof - Google Patents
Moderate temperature copper based brazing filler metal and preparation method thereof Download PDFInfo
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- CN101664864B CN101664864B CN2009103076355A CN200910307635A CN101664864B CN 101664864 B CN101664864 B CN 101664864B CN 2009103076355 A CN2009103076355 A CN 2009103076355A CN 200910307635 A CN200910307635 A CN 200910307635A CN 101664864 B CN101664864 B CN 101664864B
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Abstract
The invention discloses a moderate temperature copper based brazing filler metal and a preparation method thereof, relating to a brazing filler metal and a preparation method thereof. The invention solves the problems that the existing silver based brazing filler metal has high brazing temperature and high preparation cost and the problem that the existing copper based brazing filler metal is difficult to be processed into soldering wires and can not be used for the brazing of ferrous metals such as steel, stainless steel, and the like. The moderate temperature copper based brazing filler metal mainly comprises Cu, Zn, Mn, Si, Sn, Zr and La. The method comprises the steps: 1. weighing raw materials; 2. preparing Sn-La alloy; 3. smelting the moderate temperature copper based brazing fillermetal; and 4. extruding the smelted cast ingot to obtain the soldering wires of 0.5-3.0mm, thus obtaining the moderate temperature copper based brazing filler metal. The moderate temperature copper based brazing filler metal has low brazing temperature and low preparation cost, and can be used for the brazing of ferrous metals such as steel, stainless steel and the like. The preparation method ofthe moderate temperature copper based brazing filler metal can prepare soldering wires.
Description
Technical field
The present invention relates to a kind of solder and preparation method thereof.
Background technology
Recently, solder is as the very important welding material of a class, in industries such as household electrical appliance, (sending out) motor, electric appliance and electronic, building and ornament materials, military project and manufacturing industry all is essential, vital connection material, and soldering tech has been played the part of the key player in these industries.According to incompletely statistics, only household electrical appliances are made one, and the domestic annual silver solder that needs to consume has 300 tons, and only the construction material machining tool is one, and the domestic annual silver solder that needs to consume has 350 tons.In order to pursue brazing manufacturability and Technological Economy, soldering person usually preferentially selects for use money base to contain the cadmium solder, and the production of the accessory that especially freezes is almost all adopted to contain the cadmium solder.According to relevant department's rough estimates, only 2005, the cadmium that consumes in silver-base solder just reached 250 tons.This be since in the Ag-Cu-Zn ternary alloy three-partalloy, add Cd can significantly reduce alloy liquidus curve, dwindle molten temperature region, improve the flowability and the wetting and spreading of solder, effectively improved brazing manufacturability.In addition, contain cadmium brazing silver alloy when composition proportion is suitable, also have good processing characteristics, easily be processed into a material, sheet material and band, easy to use, thereby in soldering tech and even whole Development of Welding Technology process, played crucial effect.Yet, contain the health that a large amount of uses of cadmium solder not only endanger the welding operator, also the environment of influence periphery contains the production of cadmium solder and uses the pollution to environment to become a global problem.WEEE and two instructions of RoHS of European Union's promulgation, the material that regulation contains cadmium does not allow to use in household appliances, and in enforcement on July 1 in 2006.According to the requirement of 2006 No. 39 order of seven ministries and commissions such as China's Ministry of Information Industry, completely forbid use in industries such as household electrical appliances and contain 6 kinds of harmful substances such as cadmium.The relevant decree of Chinese Government is in enforcement on March 1 in 2007, therefore, must research and development do not contain the alternative solder product of cadmium.At present both at home and abroad main research silver-base solder and these two series of copper base solder replace using at present contains the cadmium solder.But the silver content that does not contain at present in the silver-base solder of cadmium is big, and a large amount of precious metal element Ga and In have been added, the cost of manufacture height, and the brazing temperature of silver-base solder that does not contain cadmium is all more than 1000 ℃, and the brazing temperature height makes that this solder is difficult to obtain to be extensive use of; Though and the copper base solder cost of manufacture that does not contain cadmium is low, but alloying elements such as tin, phosphorus have been added in order to obtain lower brazing temperature, make that the fragility of solder is very big, can't be processed into welding wire, can only make foil-shaped brazing material or make powdered filler metal with rapid solidification method, P elements that adds in the copper base solder and iron very easily generate Fe
3Fragility phases such as P, the mechanical property of the soldered fitting that deteriorated significantly can't be used it in the soldering of ferrous metal such as steel and stainless steel, limited its scope of application.
Summary of the invention
The present invention for solve existing silver-base solder brazing temperature height, cost of manufacture is high and existing copper base solder is difficult to the problem that is processed into welding wire, can not uses in the soldering of ferrous metal such as steel and stainless steel, and provide a kind of in warm copper base solder and preparation method thereof.
Warm copper base solder is mainly made by 50.9～58.94 parts Cu, 10～14 parts Zn, 17～23 parts Mn, 0.7～2 part Si, 5～7 parts Sn, 6～8 parts Zr and 0.02～0.2 part La according to ratio of weight and number among the present invention.
The preparation method of warm copper base solder carries out according to following steps among the present invention: one, take by weighing 50.9～58.94 parts Cu, 10～14 parts Zn, 17～23 parts Mn, 0.7～2 part Si, 5～7 parts Sn, 6～8 parts Zr and 0.02～0.2 part La by ratio of weight and the number of copies; Two, the preparation of Sn-La alloy: according to the weight ratio of La and Sn is that 4～6: 94～96 ratio is made the Sn-La alloy, at first salt-mixture is put in the crucible, be heated to 200～230 ℃ and make the salt-mixture fusing, with 4%～96% the Sn mass concentration that accounts for Sn gross mass that step 1 takes by weighing is that 5%～10% HCl handles and puts into crucible after removing oxide-film, the salt of fusing is with the complete submergence of Sn, temperature in the crucible is risen to 250～270 ℃, after Sn melted fully, in crucible, add the La that step 1 takes by weighing again, temperature in the crucible is risen to 280～320 ℃, pour out the salting liquid on upper strata behind insulated and stirred 25～35min, pour the Sn-La intermediate alloy of lower floor into porcelain boat again and be cooled to room temperature; Wherein, salt-mixture is made up of according to 1: 1 weight ratio LiCl and KCl; Three, in the melting of warm copper base solder: the Cu that step 1 is taken by weighing, Zn and Mn put into the graphite crucible of Medium Frequency Induction Heating Furnace, the temperature of heating furnace rises to 600～800 ℃, add coverture, the temperature of heating furnace rises to 1050～1150 ℃, treat Cu, after Zn and Mn melt fully, remaining Sn behind the preparation Sn-La alloy that Zr that the adding step 1 takes by weighing and step 1 take by weighing, add coverture then, after adding coverture 3～5min the temperature of heating furnace is reduced to 1000～1040 ℃, stir 10～20min, add the Si that step 1 takes by weighing, add coverture, the temperature of heating furnace is reduced to 950～990 ℃, adds step 2 and makes the Sn-La alloy that obtains, and fully stirs until fusing, when looking stove cigarette commentaries on classics milky, stir, drag for slag, when reducing to 900～940 ℃, furnace temp comes out of the stove, pour the tundish degasification into, after funnel is poured temperature into is that 240～310 ℃ the mold that waters obtains ingot, promptly realized the melting of middle temperature copper base solder; Four, with ingot peeling cleaning and cut rising head and be placed on and be preheated to 420～460 ℃ in the stove, be that 9～11cm/s, extrusion ratio are that under 90～150 the condition ingot to be put into the matrix temperature be that 430～460 ℃, the temperature of barrel are that 380～420 ℃ extruder pushes the welding wire that obtains 0.5～3.0mm, warm copper base solder in promptly obtaining at extrusion speed then.
Warm copper base solder adds active element Zr and trace rare-earth element La in of the present invention, in the solder preparation process, rare earth element adds with the form of intermediate alloy, can effectively prevent its scaling loss in the solder fusion process, make that the microstructure and the composition of solder are even, have certain plasticity.The fusion temperature of warm copper base solder is 780～820 ℃ in of the present invention, and brazing temperature is not higher than 860 ℃; Adopt method of the present invention middle temperature copper base solder can be made the welding wire form, the middle temperature copper base solder that preparation method of the present invention obtains is that diameter is the welding wire of 0.5～3.0mm; Warm copper base solder in of the present invention, precious metal element such as argentiferous not, cost of manufacture is low, and warm copper base solder does not contain any poisonous and hazardous element in of the present invention, and is safe and reliable, is not detrimental to health; Warm copper base solder soldering mechanical property is good in of the present invention, under the room temperature condition of the present invention in the average tensile strength of warm copper base solder reach more than the 350Mpa, mechanical property is good, can be used for the soldering of ferrous metal such as steel and stainless steel.
Description of drawings
Fig. 1 makes the microscopic structure Electronic Speculum figure of the middle temperature copper base solder that obtains for the specific embodiment 14.
The specific embodiment
Technical solution of the present invention is not limited to the following cited specific embodiment, also comprises any combination between each specific embodiment.
The specific embodiment one: warm copper base solder is mainly made by 50.9～58.94 parts Cu, 10～14 parts Zn, 17～23 parts Mn, 0.7～2 part Si, 5～7 parts Sn, 6～8 parts Zr and 0.02～0.2 part La according to ratio of weight and number in the present embodiment.
The fusion temperature of the middle temperature copper base solder of present embodiment is 780～820 ℃, and brazing temperature is not higher than 860 ℃, and brazing temperature is low; The middle temperature copper base solder of present embodiment, precious metal element such as argentiferous does not contain poisonous and harmful elements such as cadmium, and cost of manufacture is low; The middle temperature copper base solder soldering mechanical property of present embodiment is good, and the average tensile strength of the middle temperature copper base solder of present embodiment reaches more than the 350Mpa under the room temperature condition, and mechanical property is good, can be used for the soldering of ferrous metal such as steel and stainless steel.
The specific embodiment two: what present embodiment and the specific embodiment one were different is that middle temperature copper base solder is mainly made by 52～56 parts Cu, 11～13 parts Zn, 18～21 parts Mn, 1～1.8 part Si, 5.2～6.4 parts Sn, 6.5～7.5 parts Zr and 0.06～0.16 part La according to ratio of weight and number.Other are identical with the specific embodiment one.
The specific embodiment three: what present embodiment and the specific embodiment one were different is that middle temperature copper base solder is mainly made by 54 parts Cu, 12 parts Zn, 19.5 parts Mn, 1.4 parts Si, 6 parts Sn, 7 parts Zr and 0.1 part La according to ratio of weight and number.Other are identical with the specific embodiment one.
The specific embodiment four: the preparation method of warm copper base solder carries out according to following steps in the present embodiment: one, take by weighing 50.9～58.94 parts Cu, 10～14 parts Zn, 17～23 parts Mn, 0.7～2 part Si, 5～7 parts Sn, 6～8 parts Zr and 0.02～0.2 part La by ratio of weight and the number of copies; Two, the preparation of Sn-La alloy: according to the weight ratio of La and Sn is that 4～6: 94～96 ratio is made the Sn-La alloy, at first salt-mixture is put in the crucible, be heated to 200～230 ℃ and make the salt-mixture fusing, with 4%～96% the Sn mass concentration that accounts for Sn gross mass that step 1 takes by weighing is that 5%～10% HCl handles and puts into crucible after removing oxide-film, the salt of fusing is with the complete submergence of Sn, temperature in the crucible is risen to 250～270 ℃, after Sn melted fully, in crucible, add the La that step 1 takes by weighing again, temperature in the crucible is risen to 280～320 ℃, pour out the salting liquid on upper strata behind insulated and stirred 25～35min, pour the Sn-La intermediate alloy of lower floor into porcelain boat again and be cooled to room temperature; Wherein, salt-mixture is made up of according to 1: 1 weight ratio LiCl and KCl; Three, in the melting of warm copper base solder: the Cu that step 1 is taken by weighing, Zn and Mn put into the graphite crucible of Medium Frequency Induction Heating Furnace, the temperature of heating furnace rises to 600～800 ℃, add coverture, the temperature of heating furnace rises to 1050～1150 ℃, treat Cu, after Zn and Mn melt fully, remaining Sn behind the preparation Sn-La alloy that Zr that the adding step 1 takes by weighing and step 1 take by weighing, add coverture then, after adding coverture 3～5min the temperature of heating furnace is reduced to 1000～1040 ℃, stir 10～20min, add the Si that step 1 takes by weighing, add coverture, the temperature of heating furnace is reduced to 950～990 ℃, adds step 2 and makes the Sn-La alloy that obtains, and fully stirs until fusing, when looking stove cigarette commentaries on classics milky, stir, drag for slag, when reducing to 900～940 ℃, furnace temp comes out of the stove, pour the tundish degasification into, after funnel is poured temperature into is that 240～310 ℃ the mold that waters obtains ingot, promptly realized the melting of middle temperature copper base solder; Four, with ingot peeling cleaning and cut rising head and be placed on and be preheated to 420～460 ℃ in the stove, be that 9～11cm/s, extrusion ratio are that under 90～150 the condition ingot to be put into the matrix temperature be that 430～460 ℃, the temperature of barrel are that 380～420 ℃ extruder pushes the welding wire that obtains 0.5～3.0mm, warm copper base solder in promptly obtaining at extrusion speed then.
Coverture in the present embodiment step 3 is the charcoal through destructive distillation.
The brazing temperature that present embodiment is made the middle temperature copper base solder that obtains is not higher than 860 ℃, and brazing temperature is low; Present embodiment is made the middle temperature copper base solder obtain, and precious metal element such as argentiferous does not contain poisonous and harmful elements such as cadmium, and cost of manufacture is low; The middle temperature copper base solder soldering mechanical property that the present embodiment making obtains is good, the average tensile strength of the middle temperature copper base solder that the present embodiment making obtains under the room temperature condition reaches more than the 350Mpa, mechanical property is good, can be used for the soldering of ferrous metal such as steel and stainless steel.
The specific embodiment five: what present embodiment and the specific embodiment four were different is to take by weighing 52～56 parts Cu, 11～13 parts Zn, 18～21 parts Mn, 1～1.8 part Si, 5.2～6.4 parts Sn, 6.5～7.5 parts Zr and 0.06～0.16 part La according to ratio of weight and number in the step 1 to make.Other steps and parameter are identical with the specific embodiment four.
The specific embodiment six: what present embodiment and the specific embodiment four were different is to take by weighing 54 parts Cu, 12 parts Zn, 19.5 parts Mn, 1.4 parts Si, 6 parts Sn, 7 parts Zr and 0.1 part La according to ratio of weight and number in the step 1 to make.Other steps and parameter are identical with the specific embodiment four.
The specific embodiment seven: present embodiment and the specific embodiment four, five or six are different is to be that 5: 95 ratio is made the Sn-La alloy according to the weight ratio of La and Sn in the step 2.Other steps and parameter are identical with the specific embodiment four, five or six.
The specific embodiment eight: present embodiment and the specific embodiment one to seven are different is in the step 2 salt-mixture to be put into 220 ℃ crucible to melt.Other steps and parameter are identical with the specific embodiment one to seven.
The specific embodiment nine: present embodiment and the specific embodiment one to seven are different be in the step 2 for the first time crucible heat up, the temperature of crucible is risen to 260 ℃.Other steps and parameter are identical with the specific embodiment one to seven.
The specific embodiment ten: present embodiment and the specific embodiment one to seven are different be in the step 2 for the second time crucible heat up, the temperature of crucible is risen to 280 ℃, insulated and stirred 30min.Other steps and parameter are identical with the specific embodiment one to seven.
The specific embodiment 11: what present embodiment and the specific embodiment one to seven were different is with Cu in the step 3, Zn and Mn put into the graphite crucible of Medium Frequency Induction Heating Furnace, the temperature of heating furnace rises to 700 ℃, add coverture, the temperature of heating furnace rises to 1100 ℃, treat Cu, after Zn and Mn melt fully, add Zr and Sn, add coverture then, after adding coverture 3～5min the temperature of heating furnace is reduced to 1020 ℃, stir 15min, add Si, add coverture, the temperature of heating furnace is reduced to 940 ℃, adds the Sn-La alloy, fully stirs until fusing, when looking stove cigarette commentaries on classics milky, stir, drag for slag, when reducing to 920 ℃, furnace temp comes out of the stove, pour the tundish degasification into, after funnel is poured temperature into is that 280 ℃ the mold that waters obtains ingot, promptly realized the melting of middle temperature copper base solder.Other steps and parameter are identical with the specific embodiment one to seven.
The specific embodiment 12: present embodiment and the specific embodiment one to seven are different is with ingot peeling cleaning and cut rising head and be placed on and be preheated to 430～450 ℃ in the stove in the step 4.Other steps and parameter are identical with the specific embodiment one to seven.
The specific embodiment 13: present embodiment and the specific embodiment one to seven are different is to be that 10cm/s, extrusion ratio are that under 110 the condition ingot to be put into the matrix temperature be that 440 ℃, the temperature of barrel are that 400 ℃ extruder pushes the welding wire that obtains 1.6mm at extrusion speed then in the step 4.Other steps and parameter are identical with the specific embodiment one to seven.
The specific embodiment 14: the preparation method of warm copper base solder carries out according to following steps in the present embodiment: one, take by weighing 54 parts Cu, 12 parts Zn, 19.5 parts Mn, 1.4 parts Si, 6 parts Sn, 7 parts Zr and 0.1 part La by ratio of weight and the number of copies; Two, the preparation of Sn-La alloy: according to the weight ratio of La and Sn is that 5: 95 ratio is made the Sn-La alloy, at first salt-mixture is put in the crucible, be heated to 210 ℃ and make the salt-mixture fusing, with 32% the Sn mass concentration that accounts for Sn gross mass that step 1 takes by weighing is that 6% HCl handles and puts into crucible after removing oxide-film, the salt of fusing is with the complete submergence of Sn, temperature in the crucible is risen to 260 ℃, after Sn melted fully, in crucible, add the La that step 1 takes by weighing again, temperature in the crucible is risen to 300 ℃, pour out the salting liquid on upper strata behind the insulated and stirred 30min, again the Sn-La intermediate alloy of lower floor is poured into porcelain boat and be cooled to room temperature and promptly obtain the Sn-La alloy; Wherein, salt-mixture is made up of according to 1: 1 weight ratio LiCl and KCl; Three, in the melting of warm copper base solder: the Cu that step 1 is taken by weighing, Zn and Mn put into the graphite crucible of Medium Frequency Induction Heating Furnace, the temperature of heating furnace rises to 700 ℃, add coverture, the temperature of heating furnace rises to 1100 ℃, treat Cu, after Zn and Mn melt fully, remaining Sn behind the preparation Sn-La alloy that Zr that the adding step 1 takes by weighing and step 1 take by weighing, add coverture then, after adding coverture 4min the temperature of heating furnace is reduced to 1020 ℃, stir 15min, add the Si that step 1 takes by weighing, add coverture, the temperature of heating furnace is reduced to 970 ℃, adds step 2 and makes the Sn-La alloy that obtains, and fully stirs until fusing, when looking stove cigarette commentaries on classics milky, stir, drag for slag, when reducing to 920 ℃, furnace temp comes out of the stove, pour the tundish degasification into, after funnel is poured temperature into is that 240～310 ℃ the mold that waters obtains ingot, promptly realized the melting of middle temperature copper base solder; Four, with ingot peeling cleaning and cut rising head and be placed on and be preheated to 440 ℃ in the stove, be that 10cm/s, extrusion ratio are that under 120 the condition ingot to be put into the matrix temperature be that 440 ℃, the temperature of barrel are that 400 ℃ extruder pushes the welding wire that obtains 1.8mm, warm copper base solder in promptly obtaining at extrusion speed then.
Coverture in the present embodiment step 3 is the charcoal through destructive distillation.
The brazing temperature that present embodiment is made the middle temperature copper base solder that obtains is 820 ℃, and brazing temperature is low; Present embodiment is made the middle temperature copper base solder obtain, and precious metal element such as argentiferous does not contain poisonous and harmful elements such as cadmium, and cost of manufacture is low; The middle temperature copper base solder soldering mechanical property that the present embodiment making obtains is good, the average tensile strength of the middle temperature copper base solder that the present embodiment making obtains under the room temperature condition reaches more than the 350Mpa, mechanical property is good, can be used for the soldering of ferrous metal such as steel and stainless steel.
The microscopic structure Electronic Speculum figure that present embodiment is made the middle temperature copper base solder obtain as shown in Figure 1, to make the microstructure of the middle temperature copper base solder that obtains even for present embodiment as can be seen from Figure 1, it is good that present embodiment is made the middle temperature copper base solder quality that obtains.
Claims (8)
1. warm copper base solder in a kind, warm copper base solder is made by 50.9～58.94 parts Cu, 10～14 parts Zn, 17～23 parts Mn, 0.7～2 part Si, 5～7 parts Sn, 6～8 parts Zr and 0.02～0.2 part La according to ratio of weight and number in it is characterized in that.
2. according to claim 1 a kind of in warm copper base solder, warm copper base solder is made by 52～56 parts Cu, 11～13 parts Zn, 18～21 parts Mn, 1～1.8 part Si, 5.2～6.4 parts Sn, 6.5～7.5 parts Zr and 0.06～0.16 part La according to ratio of weight and number in it is characterized in that.
3. according to claim 1 a kind of in warm copper base solder, warm copper base solder is made by 54 parts Cu, 12 parts Zn, 19.5 parts Mn, 1.4 parts Si, 6 parts Sn, 7 parts Zr and 0.1 part La according to ratio of weight and number in it is characterized in that.
4. the preparation method of warm copper base solder in a kind, the preparation method of warm copper base solder carries out according to following steps in it is characterized in that: one, take by weighing 50.9～58.94 parts Cu, 10～14 parts Zn, 17～23 parts Mn, 0.7～2 part Si, 5～7 parts Sn, 6～8 parts Zr and 0.02～0.2 part La by ratio of weight and the number of copies; Two, the preparation of Sn-La alloy: according to the weight ratio of La and Sn is that 4～6: 94～96 ratio is made the Sn-La alloy, at first salt-mixture is put in the crucible, be heated to 200～230 ℃ and make the salt-mixture fusing, with 4%～96% the Sn mass concentration that accounts for Sn gross mass that step 1 takes by weighing is that 5%～10% HCl handles and puts into crucible after removing oxide-film, the salt-mixture of fusing is with the complete submergence of Sn, temperature in the crucible is risen to 250～270 ℃, after Sn melted fully, in crucible, add the La that step 1 takes by weighing again, temperature in the crucible is risen to 280～320 ℃, pour out the salting liquid on upper strata behind insulated and stirred 25～35min, again the Sn-La intermediate alloy of lower floor is poured into porcelain boat and be cooled to room temperature and promptly obtain the Sn-La alloy; Wherein, salt-mixture is made up of according to 1: 1 weight ratio LiCl and KCl; Three, in the melting of warm copper base solder: the Cu that step 1 is taken by weighing, Zn and Mn put into the graphite crucible of Medium Frequency Induction Heating Furnace, the temperature of heating furnace rises to 600～800 ℃, add coverture, the temperature of heating furnace rises to 1050～1150 ℃, treat Cu, after Zn and Mn melt fully, remaining Sn behind the preparation Sn-La alloy that Zr that the adding step 1 takes by weighing and step 1 take by weighing, add coverture then, after adding coverture 3～5min the temperature of heating furnace is reduced to 1000～1040 ℃, stir 10～20min, add the Si that step 1 takes by weighing, add coverture, the temperature of heating furnace is reduced to 950～990 ℃, adds step 2 and makes the Sn-La alloy that obtains, and fully stirs until fusing, when looking stove cigarette commentaries on classics milky, stir, drag for slag, when reducing to 900～940 ℃, furnace temp comes out of the stove, pour the tundish degasification into, after funnel is poured temperature into is that 240～310 ℃ the mold that waters obtains ingot, promptly realized the melting of middle temperature copper base solder; Four, with ingot peeling cleaning and cut rising head and be placed on and be preheated to 420～460 ℃ in the stove, be that 9～11cm/s, extrusion ratio are that under 90～150 the condition ingot to be put into the matrix temperature be that 430～460 ℃, barrel temperature are that 380～420 ℃ extruder pushes the welding wire that obtains 0.5～3.0mm, warm copper base solder in promptly obtaining at extrusion speed then.
5. according to claim 4 a kind of in the preparation method of warm copper base solder, it is characterized in that taking by weighing 52～56 parts Cu, 11～13 parts Zn, 18～21 parts Mn, 1～1.8 part Si, 5.2～6.4 parts Sn, 6.5～7.5 parts Zr and 0.06～0.16 part La according to ratio of weight and number in the step 1.
6. according to claim 4 a kind of in the preparation method of warm copper base solder, it is characterized in that taking by weighing 54 parts Cu, 12 parts Zn, 19.5 parts Mn, 1.4 parts Si, 6 parts Sn, 7 parts Zr and 0.1 part La according to ratio of weight and number in the step 1.
According to claim 4,5 or 6 described a kind of in the preparation method of warm copper base solder, it is characterized in that in the step 2 that weight ratio according to La and Sn is that 5: 95 ratio is made the Sn-La alloy.
8. according to claim 7 a kind of in the preparation method of warm copper base solder, it is characterized in that in the step 4 ingot peeling cleaning and cut rising head being placed on and being preheated to 430～450 ℃ in the stove.
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| CN102626837B (en) * | 2012-05-09 | 2014-06-04 | 哈尔滨工业大学 | Moderate temperature copper-based solder and preparation method thereof |
| CN102862003A (en) * | 2012-10-08 | 2013-01-09 | 佛山市泓实机械制造有限公司 | Silver-free copper based solder and preparation method thereof |
| CN102896438B (en) * | 2012-10-22 | 2014-10-08 | 王志祥 | Copper-zinc solder and preparation method thereof |
| EP2832488A1 (en) * | 2013-07-31 | 2015-02-04 | Umicore AG & Co. KG | Brazing alloys |
| CN104646848B (en) * | 2013-11-25 | 2017-05-24 | 上海工程技术大学 | Brazing filler metal for brazing of stainless steel and preparation method thereof |
| CN109465568A (en) * | 2018-12-29 | 2019-03-15 | 郑州机械研究所有限公司 | A kind of diamond grinding tool soldering copper based active solder |
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| JP3097818B2 (en) * | 1995-02-27 | 2000-10-10 | ブラザー工業株式会社 | Font data memory device |
| JP2005297051A (en) * | 2004-04-15 | 2005-10-27 | Sanyo Special Steel Co Ltd | Copper alloy powder for build up excellent in cladding performance and wear resistance, and valve seat using the same |
| CN1759974A (en) * | 2005-10-25 | 2006-04-19 | 哈尔滨工业大学 | Mesothermal copper based solder without cadmium, and preparation method |
| CN101003109A (en) * | 2006-12-29 | 2007-07-25 | 哈尔滨工业大学 | Active mesothermal copper base solder, and preparation method |
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| CN101664864A (en) | 2010-03-10 |
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