CN100408255C - Cadmium-free silver solder containing indium and cerium - Google Patents
Cadmium-free silver solder containing indium and cerium Download PDFInfo
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- CN100408255C CN100408255C CNB2006100396593A CN200610039659A CN100408255C CN 100408255 C CN100408255 C CN 100408255C CN B2006100396593 A CNB2006100396593 A CN B2006100396593A CN 200610039659 A CN200610039659 A CN 200610039659A CN 100408255 C CN100408255 C CN 100408255C
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- cerium
- cadmium
- brass
- indium
- silver
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- 229910052684 Cerium Inorganic materials 0.000 title claims abstract description 54
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 title claims abstract description 54
- 229910052738 indium Inorganic materials 0.000 title claims abstract description 53
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 title claims abstract description 53
- 229910000679 solder Inorganic materials 0.000 title abstract description 20
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 61
- 229910052709 silver Inorganic materials 0.000 claims abstract description 61
- 239000004332 silver Substances 0.000 claims abstract description 61
- 239000010949 copper Substances 0.000 claims abstract description 24
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052725 zinc Inorganic materials 0.000 claims abstract 2
- 239000011701 zinc Substances 0.000 claims abstract 2
- 229910045601 alloy Inorganic materials 0.000 claims description 61
- 239000000956 alloy Substances 0.000 claims description 61
- 238000005219 brazing Methods 0.000 claims description 58
- 239000000203 mixture Substances 0.000 abstract description 22
- 239000000463 material Substances 0.000 abstract description 12
- 239000000126 substance Substances 0.000 abstract description 5
- 229910052793 cadmium Inorganic materials 0.000 abstract description 4
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 abstract description 4
- 238000003723 Smelting Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 25
- 239000002184 metal Substances 0.000 description 25
- 229910001369 Brass Inorganic materials 0.000 description 23
- 239000010951 brass Substances 0.000 description 23
- 229910000975 Carbon steel Inorganic materials 0.000 description 22
- 239000010962 carbon steel Substances 0.000 description 22
- 238000005476 soldering Methods 0.000 description 22
- 230000004907 flux Effects 0.000 description 19
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 18
- 229910000906 Bronze Inorganic materials 0.000 description 17
- 239000010974 bronze Substances 0.000 description 17
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 17
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 241001062472 Stokellia anisodon Species 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- NZWXMOTXTNDNLK-UHFFFAOYSA-N [Cu].[Zn].[Ag] Chemical compound [Cu].[Zn].[Ag] NZWXMOTXTNDNLK-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
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Abstract
The present invention relates to a cadmium-free silver solder containing indium and cerium, which belongs to a welding material. The cadmium-free silver solder has the chemical compositions, in mass percent, 25.0% to 32.0% of copper, 25.0% to 35.0% of zinc, 0.5% to 5.0% of indium, 0.01% to 1.0% of tin, 0.002% to 0.10% of cerium and silver in balancing amount. The chemical compositions are smelted and cast by a conventional intermediate frequency smelting furnace and extruded and drawn to obtain the required solder threads. The solidus temperature is in the range of 660 DEG C to 685 DEG C, and the liquid temperature is in the range of 715 DEG C to 735 DEG C. The cadmium-free silver solder containing indium and cerium does not have the cadmium (Cd) of a harmful element at all, an operator's physical safety is effectively protected, and environmetal pollution is eliminated. The mechanical property indexes of the solder correspond to the mechanical property indexes of BAg45CuZnCd, BAg45CuZn solder.
Description
Technical field
The cadmium-free silver brazing alloy that contains indium and cerium of the present invention belongs to the brazing material of class of metal materials and field of metallurgy.
Background technology
Present silver solder BAg45CuZnCd, the BAg45CuZn that uses, silver content is about 45% solder in its chemical composition.Because silver belongs to precious metal material, price is comparatively expensive, and therefore, research and development have quite or similar performance, brazing material that silver content is lower again, have important economic value and realistic meaning.The cadmium-free silver brazing alloy that contains indium and cerium of this invention is promptly finished under this technical background.
Summary of the invention
The task of this invention provide a kind of can the welding position in brazing process and after the soldering do not have fully poisonous element cadmium, brazing property is good, to have with traditional silver content be 45% the suitable combination property of solder (BAg45CuZnCd, BAg45CuZn), silver content is lower than the brazing material of 45% (being about about 40%) again.
This invention has mainly solved following two key technical problems: 1) develop no cadmium, combination property and traditional silver content be 45% silver solder quite or similar, the silver solder of alternative BAg45CuZnCd, BAg45CuZn, by optimizing the chemical composition of " cadmium-free silver brazing alloy that contains indium and cerium ", obtained mother metal wetability, good, the brazed seam mechanical property (σ of spreadability
b, τ) good cadmium-free silver brazing alloy; 2) in cadmium-free silver brazing alloy, add an amount of indium (In) and trace tin (Sn) to reduce the fusing point of principal component alloy (Ag-Cu-Zn alloy), improve the wetability of cadmium-free silver brazing alloy on red copper, brass, carbon steel, stainless steel and nickel-base alloy simultaneously, add the crystal grain of rare-earth element cerium (Ce) simultaneously, improve the plasticity and the comprehensive mechanical property of cadmium-free silver brazing alloy with the neoteric cadmium-free silver brazing alloy of refinement.
The technical scheme that addresses the above problem is, 1), use commercially available silver, cathode copper, zinc ingot metal, tin slab, indium metal, metallic cerium, proportioning on demand adopts that conventional intermediate frequency smelting furnace is smelted, casting, by extruding, drawing, promptly obtain needed solder wire material then; 2), according to producing needs, tin slab, indium metal, metallic cerium can be smelted into alloy respectively in advance, add then in silver-copper-zinc alloy smelt, casting, by extruding, drawing, promptly obtain needed solder wire material again.
The cadmium-free silver brazing alloy that contains indium and cerium of the present invention, its chemical composition by the mass percent proportioning is: 25.0%～32.0% copper (Cu), 25.0%～35.0% zinc (Zn), 0.5%～5.0% indium (In), 0.01%～1.0% tin (Sn), 0.002%～0.10% cerium (Ce), all the other are silver (Ag).Solidus temperature at 660 ℃～685 ℃ scopes, liquidus temperature 715 ℃～735 ℃ scopes; Cooperate FB102 (QJ102) brazing flux, brazing material is following combination: when red copper-brass, brass-carbon steel, stainless steel-nickel-base alloy, the brazed seam mechanical property is respectively: σ
b=175～335MPa, τ=170～335MPa.
Adopt conventional intermediate frequency smelting furnace to smelt, cast, by extruding, drawing, promptly obtain needed solder wire material then; The neoteric cadmium-free silver brazing alloy that contains gallium and cerium is that 45% solder is an object of reference with silver content, cooperate FB102 (QJ102) brazing flux, during combinations of materials such as soldering red copper-brass, brass-carbon steel, stainless steel-nickel-base alloy, wetability, spreadability to mother metal are suitable with it, the suitable with it (σ of brazed seam mechanical property
b=175～335MPa scope, τ=170～335MPa scope).The neoteric cadmium-free silver brazing alloy that contains indium and cerium does not have the harmful element cadmium fully, has protected operator's health safety effectively, has eliminated the pollution to environment.The brazed seam mechanical performance index of solder and BAg45CuZnCd, BAg45CuZn solder are suitable, and neoteric solder is just applied at the refrigeration part production industry as the substitute of BAg45CuZnCd, BAg45CuZn solder.
The specific embodiment
According to the quality recipe ratio of " cadmium-free silver brazing alloy that contains indium and cerium " of the present invention, narration the specific embodiment of the present invention.
The specific embodiment one:
Press the mass percent proportioning, its composition is: 30.0% bronze medal (Cu), and 27.9% zinc (Zn), 1.0% tin (Sn), 1.2% indium (In), 0.02% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver brazing alloy that contains indium and cerium " solidus temperature that the mentioned component proportioning obtains about 675 ℃, liquidus temperature (considered experimental error) about 735 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=200 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=300 ± 25MPa, τ=300 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment two:
Press the mass percent proportioning, its composition is: 25.0% bronze medal (Cu), and 32.0% zinc (Zn), 1.0% tin (Sn), 4.0% indium (In), 0.10% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver brazing alloy that contains indium and cerium " solidus temperature that the mentioned component proportioning obtains about 660 ℃, liquidus temperature (considered experimental error) about 715 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass red copper-brass (σ
b=200 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=300 ± 25MPa, τ=300 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment three:
Press the mass percent proportioning, its composition is: 32.0% bronze medal (Cu), and 29.0% zinc (Zn), 0.05% tin (Sn), 0.5% indium (In), 0.002% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver brazing alloy that contains indium and cerium " solidus temperature that the mentioned component proportioning obtains about 685 ℃, liquidus temperature (considered experimental error) about 735 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=200 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=300 ± 25MPa, τ=300 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment four:
Press the mass percent proportioning, its composition is: 30.0% bronze medal (Cu), and 27.0% zinc (Zn), 0.02% tin (Sn), 2.0% indium (In), 0.005% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver brazing alloy that contains indium and cerium " solidus temperature that the mentioned component proportioning obtains about 680 ℃, liquidus temperature (considered experimental error) about 720 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=200 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=300 ± 25MPa, τ=300 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment five:
Press the mass percent proportioning, its composition is: 30.0% bronze medal (Cu), and 29.5% zinc (Zn), 0.02% tin (Sn), 2.0% indium (In), 0.02% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver brazing alloy that contains indium and cerium " solidus temperature that the mentioned component proportioning obtains about 675 ℃, liquidus temperature (considered experimental error) about 715 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=200 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=300 ± 25MPa, τ=300 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment six:
Press the mass percent proportioning, its composition is: 31.0% bronze medal (Cu), and 27.0% zinc (Zn), 0.08% tin (Sn), 1.8% indium (In), 0.025% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver brazing alloy that contains indium and cerium " solidus temperature that the mentioned component proportioning obtains about 675 ℃, liquidus temperature (considered experimental error) about 725 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=200 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=300 ± 25MPa, τ=300 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment seven:
Press the mass percent proportioning, its composition is: 32.0% bronze medal (Cu), and 27.0% zinc (Zn), 0.5% tin (Sn), 1.5% indium (In), 0.035% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver brazing alloy that contains indium and cerium " solidus temperature that the mentioned component proportioning obtains about 685 ℃, liquidus temperature (considered experimental error) about 730 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=200 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=300 ± 25MPa, τ=300 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment eight:
Press the mass percent proportioning, its composition is: 25.0% bronze medal (Cu), and 35.0% zinc (Zn), 0.5% tin (Sn), 1.5% indium (In), 0.035% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver brazing alloy that contains indium and cerium " solidus temperature that the mentioned component proportioning obtains about 680 ℃, liquidus temperature (considered experimental error) about 730 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=200 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=300 ± 25MPa, τ=300 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment nine:
Press the mass percent proportioning, its composition is: 27.0% bronze medal (Cu), and 29.0% zinc (Zn), 0.7% tin (Sn), 4.5% indium (In), 0.025% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver brazing alloy that contains indium and cerium " solidus temperature that the mentioned component proportioning obtains about 665 ℃, liquidus temperature (considered experimental error) about 715 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=200 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=300 ± 25MPa, τ=300 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment ten:
Press the mass percent proportioning, its composition is: 26.5% bronze medal (Cu), and 28.5% zinc (Zn), 0.01% tin (Sn), 5.0% indium (In), 0.065% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver brazing alloy that contains indium and cerium " solidus temperature that the mentioned component proportioning obtains about 665 ℃, liquidus temperature (considered experimental error) about 720 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=200 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=300 ± 25MPa, τ=300 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment 11:
Press the mass percent proportioning, its composition is: 28.0% bronze medal (Cu), and 29.0% zinc (Zn), 0.05% tin (Sn), 3.8% indium (In), 0.002% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver brazing alloy that contains indium and cerium " solidus temperature that the mentioned component proportioning obtains about 680 ℃, liquidus temperature (considered experimental error) about 725 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=200 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=300 ± 25MPa, τ=300 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment 12:
Press the mass percent proportioning, its composition is: 26.0% bronze medal (Cu), and 30.0% zinc (Zn), 0.05% tin (Sn), 4.2% indium (In), 0.035% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver brazing alloy that contains indium and cerium " solidus temperature that the mentioned component proportioning obtains about 670 ℃, liquidus temperature (considered experimental error) about 720 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=200 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=300 ± 25MPa, τ=300 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment 13:
Press the mass percent proportioning, its composition is: 26.5% bronze medal (Cu), and 32.5% zinc (Zn), 0.08% tin (Sn), 1.0% indium (In), 0.035% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver brazing alloy that contains indium and cerium " solidus temperature that the mentioned component proportioning obtains about 685 ℃, liquidus temperature (considered experimental error) about 730 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=200 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=300 ± 25MPa, τ=300 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment 14:
Press the mass percent proportioning, its composition is: 29.5% bronze medal (Cu), and 29.8% zinc (Zn), 0.02% tin (Sn), 0.8% indium (In), 0.035% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver brazing alloy that contains indium and cerium " solidus temperature that the mentioned component proportioning obtains about 685 ℃, liquidus temperature (considered experimental error) about 735 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=200 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=300 ± 25MPa, τ=300 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment 15:
Press the mass percent proportioning, its composition is: 29.6% bronze medal (Cu), and 29.5% zinc (Zn), 0.01% tin (Sn), 1.2% indium (In), 0.002% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver brazing alloy that contains indium and cerium " solidus temperature that the mentioned component proportioning obtains about 680 ℃, liquidus temperature (considered experimental error) about 735 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=200 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=300 ± 25MPa, τ=300 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment 16:
Press the mass percent proportioning, its composition is: 27.0% bronze medal (Cu), and 29.0% zinc (Zn), 0.9% tin (Sn), 3.2% indium (In), 0.10% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver brazing alloy that contains indium and cerium " solidus temperature that the mentioned component proportioning obtains about 680 ℃, liquidus temperature (considered experimental error) about 725 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=200 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=300 ± 25MPa, τ=300 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment 17:
Press the mass percent proportioning, its composition is: 28.0% bronze medal (Cu), and 29.0% zinc (Zn), 0.02% tin (Sn), 2.8% indium (In), 0.005% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver brazing alloy that contains indium and cerium " solidus temperature that the mentioned component proportioning obtains about 685 ℃, liquidus temperature (considered experimental error) about 725 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=200 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=300 ± 25MPa, τ=300 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
Another technical characterstic of the present invention is, because " cadmium-free silver brazing alloy that contains indium and cerium " of the present invention is to soldering mother metal red copper, brass, carbon steel, stainless steel, nickel-base alloy all has good wettability respectively, therefore any cadmium-free silver brazing alloy that contain indium and cerium of the above-mentioned specific embodiment one to the specific embodiment 17, in soldering red copper-red copper, red copper-brass, brass-carbon steel, brass-stainless steel, carbon steel-stainless steel, carbon steel-nickel-base alloy, stainless steel-nickel-base alloy, red copper-nickel-base alloy, during different combined material (mother metal) such as brass-nickel-base alloy, combined material (mother metal) to institute's soldering all has good wetability, and soldered fitting has good comprehensive mechanical properties.
Claims (1)
1. a cadmium-free silver brazing alloy that contains indium and cerium is characterized in that, by the mass percent proportioning is: 25.0%～32.0% copper, 25.0%～35.0% zinc, 0.5%～5.0% indium, 0.01%～1.0% tin, 0.002%～0.10% cerium, all the other are silver.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100396593A CN100408255C (en) | 2006-04-19 | 2006-04-19 | Cadmium-free silver solder containing indium and cerium |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100396593A CN100408255C (en) | 2006-04-19 | 2006-04-19 | Cadmium-free silver solder containing indium and cerium |
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| Publication Number | Publication Date |
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| CN1836823A CN1836823A (en) | 2006-09-27 |
| CN100408255C true CN100408255C (en) | 2008-08-06 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100420538C (en) * | 2006-11-26 | 2008-09-24 | 常熟市华银焊料有限公司 | Cadmium-free silver based solder containing gallium, indium and cerium |
| CN100408256C (en) * | 2006-11-26 | 2008-08-06 | 常熟市华银焊料有限公司 | Cadmium-free silver solder containing gallium, indium and cerium |
| CN103418933A (en) * | 2013-07-18 | 2013-12-04 | 浙江信和科技股份有限公司 | Silver solder for connecting brass and stainless steel |
| CN103909363A (en) * | 2014-04-01 | 2014-07-09 | 金华市三环焊接材料有限公司 | Cadmium-free low-silver solder containing tin, manganese and indium |
| CN104439753A (en) * | 2014-11-13 | 2015-03-25 | 杭州华光焊接新材料股份有限公司 | Multi-element silver soldering material containing indium and tin and preparation method of multi-element silver soldering material |
| CN107662063A (en) * | 2016-07-29 | 2018-02-06 | 金华市三环焊接材料有限公司 | A kind of formula of high-strength environment-friendly section silver solder |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4052531A (en) * | 1975-08-14 | 1977-10-04 | Eutectic Corporation | Indium-containing silver-copper-zinc brazing alloy |
| GB1532879A (en) * | 1976-09-24 | 1978-11-22 | Sheffield Smelting Co Ltd | Brazing alloys |
| US5341981A (en) * | 1992-09-02 | 1994-08-30 | Degussa Aktiengesellschaft | Use of a cadmium-free silver alloy as brazing solder (III) |
| JP2001087889A (en) * | 1999-08-24 | 2001-04-03 | Degussa Huels Ag | Cadmium-free hard birazing filler alloy |
| US6299835B1 (en) * | 1993-07-12 | 2001-10-09 | Degussa Ag | Cadmium-free silver alloy as low-melting brazing filler material |
-
2006
- 2006-04-19 CN CNB2006100396593A patent/CN100408255C/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4052531A (en) * | 1975-08-14 | 1977-10-04 | Eutectic Corporation | Indium-containing silver-copper-zinc brazing alloy |
| GB1532879A (en) * | 1976-09-24 | 1978-11-22 | Sheffield Smelting Co Ltd | Brazing alloys |
| US5341981A (en) * | 1992-09-02 | 1994-08-30 | Degussa Aktiengesellschaft | Use of a cadmium-free silver alloy as brazing solder (III) |
| US6299835B1 (en) * | 1993-07-12 | 2001-10-09 | Degussa Ag | Cadmium-free silver alloy as low-melting brazing filler material |
| JP2001087889A (en) * | 1999-08-24 | 2001-04-03 | Degussa Huels Ag | Cadmium-free hard birazing filler alloy |
Non-Patent Citations (2)
| Title |
|---|
| 元素锡、铟在银基钎料中的作用及其机理. 薛松柏等.焊接，第11期. 1998 |
| 元素锡、铟在银基钎料中的作用及其机理. 薛松柏等.焊接，第11期. 1998 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1836823A (en) | 2006-09-27 |
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