CN103906412A - 散热装置 - Google Patents
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- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
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- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/06—Fastening; Joining by welding
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- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Abstract
一种散热装置,包括热导管及与发热元件相抵接以将发热元件产生的热量传导至热导管的传导件,其特征在于:该传导件直接焊覆于热导管表面以改善热导管之平整度从而实现热管直覆设计以进一步降低厚度。
Description
技术领域
本发明涉及一种散热装置,特别涉及一种热管式散热装置。
背景技术
如图1所示,传统散热装置400通常包括抵接于发热元件500的散热基板410及固定于散热基板410上的热导管420。散热基板410上还开设有若干通孔430。固定件(未示出)例如螺丝穿过通孔430以将散热基板410及热导管420锁固至发热元件500。在超薄电子装置的应用中,发热元件500例如CPU芯片距离电子装置壳体(未示出)的距离通常小于3mm,要满足有限的空间需求,则需降低散热装置400的厚度。散热装置400的厚度主要由散热基板410及热导管420的厚度所决定。然而,热导管420的厚度直接决定散热性能,因此降低热导管420的厚度会影响整体散热性能。所以改善方向只能为降低散热基板410的厚度,但当散热基板410的厚度降为0.35mm以下时,由于强度问题往往难以满足固定件将其固定至发热元件500所需之结合力,传统散热装置400很难进一步降低厚度。而若摒除散热基板410,直接采用热管直覆设计时,受热管表面平整度制程限制,热阻过大,难以有效导热,大大降低了传热效率。若采用其他技术处理管壁平整度(如打磨,切削),会引起管壁变薄,影响可靠性。
发明内容
有鉴于此,有必要提供一种散热装置,能够避免传统散热基板因受结合力需求的限制而无法进一步降低厚度,抑或直接摒除发热元件与热管之间的散热基板,在热管厚度不增加或增加极少的情况下改善热管表面平整度,使得热管直覆设计得以实施。
该散热装置,包括热导管及与发热元件相抵接以将发热元件产生的热量传导至热导管的传导件。传导件直接焊覆于热导管表面以改善热导管之平整度从而实现热管直覆设计以进一步降低厚度。
上述散热装置通过焊覆于热导管表面的传导件抵接发热元件以将发热元件产生的热量传导至热导管,进而避免:
1.散热装置的厚度因传统散热基板考虑到结合力需求的限制而无法降低的情况出现。
2.热管表面平整度制约而无法采用热管直覆设计来降低高度。
附图说明
图1为传统散热装置的剖视图。
图2和图3为本发明一较佳实施方式的散热装置的示意图。
图4为图2所示散热装置安装至发热元件后的剖视图。
图5和图6为本发明另一较佳实施方式的散热装置的示意图。
图7为图5所示散热装置安装至发热元件后的剖视图。
主要元件符号说明
散热装置 | 100、300 |
发热元件 | 200 |
散热模组 | 110 |
热导管 | 120 |
传导件 | 140 |
基板 | 201 |
固定板 | 160、360 |
风扇 | 180 |
散热片 | 112 |
填充材料 | 114 |
凹部 | 116 |
第一端部 | 122 |
第二端部 | 124 |
基部 | 162 |
固定臂 | 164 |
固定孔 | 166 |
开口 | 364 |
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图2和图3,其为本发明实施方式提供的散热装置100的示意图。散热装置100用于为发热元件200(如图4所示)例如CPU芯片进行散热。散热装置100包括散热模组110、插设于散热模组110的热导管120、设置于热导管120上且抵接发热元件200的传导件140以及用于将传导件140及热导管120锁固至发热元件200的固定板160。此外,散热装置100还包括设置于散热模组110一侧的风扇180,用于加速散热模组110的热量散失。
散热模组110包括若干散热片112及用于填补间隙的填充材料114。散热片112由热传导性能较好的金属材料制成。填充材料114通常为泡棉或类似材料制成。散热片112之间均平行且间隔设置。散热片112内部有一用于收容热导管120的凹部116。
热导管120大致呈L形,用于将发热元件200产生的热量传导至散热模组110。热导管120包括靠近发热元件200的第一端部122及与第一端部122相对的第二端部124。第二端部124安装于凹部116中。第二端部124可通过焊接等方式固定至凹部116。在本实施例中,热导管120的第二端部124直接焊接至凹部116。
传导件140用于将发热元件200产生的热量传导至热导管120,以允许发热元件200产生的热量进一步通过热导管120传导至散热模组110。传导件140由焊锡或者与焊锡相同材质之导热金属材料直接焊覆于热导管120上。传导件140的形状大致与发热元件200的形状相配,且能完成覆盖发热元件200。传导件140在本实施例中为焊覆于热导管120靠近第一端部122的表面的焊锡。为能够与发热元件200表面紧密贴合,在焊锡焊接至热导管120后,焊锡的表面需经磨床加工等处理以保证平整度。在保证平整度的情况下,焊锡的厚度可达到0.04mm甚至更薄。在其它实施例中,传导件140亦可选用厚度较薄、平面性较好之非金属材质直接焊接于热导管上,且其厚度可小于0.3mm。
固定板160大致呈X形,其厚度大致为0.3mm。固定板160包括大致呈矩形的基部162及分别自基部162的四角向外一体延伸而出的四个固定臂164。基部162在本实施例中通过焊接固定于热导管120背向传导件140的一面。每一个固定臂164远离基部162的一端均开设有固定孔166。固定孔166用于收容固定件(未示出)例如螺钉,以将固定板160固定至发热元件200的基座(未视出)。
如图4所示,模组组装时,将热导管120插设于散热模组110以及将散热模组110及风扇180固定至承载发热元件200的基板201,组装于设备时,将固定于热导管120上的传导件140直接贴附于发热元件200。然后,通过固定件(例如螺丝)将固定板160锁固至发热元件200的基座。
组装后,散热装置100通过设置于热导管120上的传导件140直接抵接发热元件200,并通过固定板160将热导管120及传导件140锁固至发热元件200,以将发热元件200产生的热量经热导管120传导至散热模组110。如此,散热装置100通过直接焊覆于热导管表面的传导件140取代传统散热基板,使传导件140不受结合需求的限制,从而能够避免散热装置100的厚度因传统散热基板受结合力需求的限制而无法降低的情况出现。此外,由于传导件140直接覆盖于热导管120上,因此传导件140的存在又加强了热导管120与传导件140的接触面处的强度。此次实施中固定板160位置只为示意,在其它方式中也可焊接于热导管120两侧而非上侧(即热导管120背向传导件140的一面),故固定板160厚度亦不会影响散热装置100的整体厚度。
图5和图6为本发明另一实施方式的散热装置300的示意图。散热装置300与散热装置100的不同在处在于,散热装置300的固定板360的结构与设置方式与散热装置100的固定板160不同。请一并参考图7,固定板360固定于热导管120设置有传导件140的一侧,且固定板360的基部开设开口364。开口364与传导件140相对应,且开口364的尺寸大致与发热元件200的尺寸相当,用于在散热装置300锁固至发热元件200后收容发热元件200于其中并允许发热元件200与传导件140相抵接。由于发热元件200收容于开口364且直接抵接传导件140,因此固定板360不会占用发热元件200正上方的空间。如此,散热装置300进一步避免了因固定板160的厚度导致散热装置100在发热元件200正上方向的厚度增加,从而相对散热装置100来说其厚度能够进一步降低。
本技术领域的普通技术人员应当认识到,以上的实施方式仅是用来说明本发明,而并非用作为对本发明的限定,只要在本发明的实质精神范围之内,对以上实施例所作的适当改变和变化都落在本发明要求保护的范围之内。
Claims (9)
1.一种散热装置,包括热导管及与发热元件相抵接以将发热元件产生的热量传导至热导管的传导件,其特征在于:该传导件直接焊覆于热导管表面以改善热导管之平整度从而实现热管直覆设计以进一步降低厚度。
2.如权利要求1所述的散热装置,其特征在于:所述传导件为焊覆于热导管表面的焊锡或具有与焊锡类似之导热金属材料,且其厚度可达到0.04mm甚至更薄。
3.如权利要求1所述的散热装置,其特征在于:所述传导件亦可选用厚度较薄、平面性较好之非金属材质直接焊接于热导管上,且其厚度小于0.3mm。
4.如权利要求1所述的散热装置,其特征在于:所述散热装置还包括固定于热导管的固定板,用于将热导管及传导件锁固至发热元件。
5.如权利要求4所述的散热装置,其特征在于:所述固定板固定于热导管背向传导件的一面或热导管的两侧。
6.如权利要求4所述的散热装置,其特征在于:所述固定板固定于热导管设置有传导件的一面。
7.如权利要求6所述的散热装置,其特征在于:固定板开设有与传导件相对且用于收容发热元件的开口。
8.如权利要求1所述的散热装置,其特征在于:所述散热装置还包括散热模组,该散热模组固定于热导管一端,包括若干散热片。
9.如权利要求8所述的散热装置,其特征在于:所述散热片设有凹部,该凹部用于收容热导管。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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CN201210587872.3A CN103906412A (zh) | 2012-12-29 | 2012-12-29 | 散热装置 |
TW102100846A TW201427583A (zh) | 2012-12-29 | 2013-01-10 | 散熱裝置 |
US13/960,859 US20140182818A1 (en) | 2012-12-29 | 2013-08-07 | Heat sink |
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CN201210587872.3A CN103906412A (zh) | 2012-12-29 | 2012-12-29 | 散热装置 |
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JP2016004839A (ja) * | 2014-06-13 | 2016-01-12 | 日本電産株式会社 | ヒートモジュール |
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USD825498S1 (en) * | 2017-07-17 | 2018-08-14 | Oculus Vr, Llc | Heat sink assembly |
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KR100766109B1 (ko) * | 2004-10-20 | 2007-10-11 | 엘지전자 주식회사 | 방열장치 |
US20060260787A1 (en) * | 2005-05-23 | 2006-11-23 | Chaun-Choung Technology Corp. | Flattened contact cooling module |
CN100531535C (zh) * | 2005-08-05 | 2009-08-19 | 富准精密工业(深圳)有限公司 | 散热模组 |
US7766074B2 (en) * | 2006-05-12 | 2010-08-03 | Cpumate Inc. | Heat-dissipating device having air-guiding structure |
JP4719084B2 (ja) * | 2006-05-30 | 2011-07-06 | 株式会社東芝 | 電子機器 |
US7600558B2 (en) * | 2006-08-22 | 2009-10-13 | Shyh-Ming Chen | Cooler |
TW200826824A (en) * | 2006-12-08 | 2008-06-16 | Inventec Corp | Heat dissipation module |
CN101674717B (zh) * | 2008-09-11 | 2012-05-16 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN101909417A (zh) * | 2009-06-04 | 2010-12-08 | 富准精密工业(深圳)有限公司 | 散热装置及其制造方法 |
-
2012
- 2012-12-29 CN CN201210587872.3A patent/CN103906412A/zh active Pending
-
2013
- 2013-01-10 TW TW102100846A patent/TW201427583A/zh unknown
- 2013-08-07 US US13/960,859 patent/US20140182818A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
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TW201427583A (zh) | 2014-07-01 |
US20140182818A1 (en) | 2014-07-03 |
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