CN103813693A - 散热装置组合 - Google Patents

散热装置组合 Download PDF

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CN103813693A
CN103813693A CN201210452675.0A CN201210452675A CN103813693A CN 103813693 A CN103813693 A CN 103813693A CN 201210452675 A CN201210452675 A CN 201210452675A CN 103813693 A CN103813693 A CN 103813693A
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heat
electronic products
combination
conducting block
radiation module
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路二伟
曾祥鲲
郝程
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN201210452675.0A priority Critical patent/CN103813693A/zh
Priority to TW101142538A priority patent/TW201418955A/zh
Priority to US13/931,526 priority patent/US20140133102A1/en
Publication of CN103813693A publication Critical patent/CN103813693A/zh
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    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
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    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
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    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
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Abstract

一种散热装置组合，包括有消费性电子产品及内接散热模组，所述内接散热模组安装在所述消费性电子产品的内侧，用以对所述消费性电子产品散热，所述散热装置组合还包括有导热块及外接散热模组，所述导热块安装在所述内接散热模组上并延伸至所述消费性电子产品外侧，所述外接散热模组对该导热块散热。

Description

散热装置组合
技术领域
本发明涉及一种散热装置组合，特别是指一种具有外接散热模组的散热装置组合。
背景技术
随着笔记本行业的不断发展，人们对笔记本的性能要求也越来越高。一方面要求高品质的影音，另一方面要求大型要求的高速度。然而，提高这些性能的同时，会产生大量的热量。如果这些热量不能及时排除的话，就会导致笔记本电脑温度升高，影响其正常工作。
现在的笔记本电脑的散热***包括有一风扇、一散热鳍片组及一热管，所述热管紧贴散热元件（如CPU）从而将热量导致所述散热鳍片组，再通过所述风扇将热量吹出所述笔记本电脑，但是这种散热方式，效率很低也渐渐的无法满足高性能能的笔记本电脑。由此，在保证笔记本电脑轻薄的同时，又要提高散热效率的问题随之而来。
发明内容
鉴于以上内容，有必要提供一种高效率的散热装置组合。
一种散热装置组合，包括有消费性电子产品及内接散热模组，所述内接散热模组安装在所述消费性电子产品的内侧，用以对所述消费性电子产品散热，所述散热装置组合还包括有导热块及外接散热模组，所述导热块安装在所述内接散热模组上并延伸至所述消费性电子产品外侧，所述外接散热模组对该导热块散热。
一实施方式中，所述内接散热模组包括有一第一热管，所述导热块固定在所述第一热管上，所述外接散热模组还包括有第二热管，所述第二热管与所述导热块接触，用以传导所述第一热管的热量。
一实施方式中，所述导热块开设有一收容槽，所述第一热管收容在所述收容槽内，并与所述导热块接触。
一实施方式中，所述导热块开设有一卡槽，所述卡槽能够卡在所述消费性电子产品上，以将所述导热块固定在所述消费性电子产品中。
一实施方式中，所述外接散热模组还包括有传热块及散热鳍片组，所述第二热管一端设有所述热传体，另一端插设在所述散热鳍片组中，所述传热块与所述导热块抵触。
一实施方式中，所述外接散热模组还包括有固定架，所述散热鳍片组收容在所述固定架内。
一实施方式中，所述固定架上设有夹持部，所述夹持部夹持所述传热块，并能够拆卸的固定在所述消费性电子产品上。
一实施方式中，所述夹持部开设有一缺口，所述传热块收容在所述缺口中。
一实施方式中，所述夹持部通过两锁固件固定在所述消费性电子产品上。
一实施方式中，所述两锁固件均为弹簧螺丝。
与现有技术相比，上述散热装置组合中，内接散热模组能够给消费性电子产品散热之外，所述外接散热模组再将所述导热块上的热量排出，从而与所述内接散热模组一起对消费性电子产品散热，提高了散热效率。
附图说明
图1是本发明散热装置组合的一较佳实施方式与一消费性电子产品的一立体分解图。
图2是图1中一导热块与一内接散热模组的一立体分解图。
图3是图1中的外接模组的一立体分解图。
图4是图1的一立体组装图，图中未显示消费性电子产品的键盘。
图5是图2的另一立体组装图。
主要元件符号说明
内接散热模组 10
第一风扇 11
第一散热鳍片组 13
第一热管 15
导热块 30
收容槽 31
卡槽 33
外接散热模组 50
第二风扇 51
第二散热鳍片组 53
第二热管 55
固定架 57
本体 571
前板 5711
侧板 5713
夹持部 573
缺口 5731
通孔 5733
连接片 575
锁固件 577
连接器 58
传热块 59
消费性电子产品 70
底盖 71
底板 711
侧墙 713
通风区域 7131
连接孔 7133
卡扣片 7135
锁孔 7137
发热元件 100
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1及图2，在本发明的一较佳实施方式中，一散热装置组合包括有一内接散热模组10、一导热块30、一外接散热模组50及一消费性电子产品70（见图5）。所述内接散热模组10可安装于所述消费性电子产品70中，用以对所述消费性电子产品70散热。所述外接散热模组50可拆卸安装于所述消费性电子产品70的外侧，与所述内接散热模组10一起对所述消费性电子产品70散热。所述消费性电子产品70可以是一笔记本电脑、个人电脑或手持电子产品，图中以笔记本电脑为例。
所述内接散热模组10包括有一第一风扇11、一位于所述第一风扇11一侧的第一散热鳍片组13及一插设在所述第一散热鳍片组13中的第一热管15。所述第一热管15可与若干发热元件100抵触，用以对所述发热元件100散热。
所述导热块30可焊接在所述第一热管15上，并开设有一收容槽31及一卡槽33。所述第一热管15收容在所述收容槽31中，并紧贴所述导热块30以使热量传至所述导热块30。在本实施例中，所述收容槽31大致呈弧形，但并不限于此形状，可根据所述第一热管15的形状改变所述收容槽31的形状，以保证所述导热块30与所述第一热管15紧密接触。所述卡槽33可卡在所述消费性电子产品70内，以固定所述导热块30。
请参照图3，所述外接散热模组50包括有一第二风扇51、一位于所述第二风扇51一侧的第二散热鳍片组53、一第二热管55、一固定架57及一连接器58。所述第二热管55一端插设在所述第二散热鳍片组53中，另一端设有一传热块59。所述传热块59能够将所述导热块30的热量传至所述第二热管55，并同时保护所述第二热管55受损坏。
所述固定架57可与所述消费性电子产品70一起放置在一平面（图未示）上，并包括有一本体571、一夹持部573及一连接所述本体571与所述夹持部573的连接片575。所述本体571大致呈一半封闭的立方体，并包括有一前板5711及一侧板5713。所述前板5711与所述侧板5713大致垂直连接。所述第二风扇51及所述第二散热鳍片组53收容在所述本体571内，从而防止用户在使用所述外接散热模组50时，被所述第二风扇51及所述第二散热鳍片组53烫伤或者刮伤。所述连接片575自所述前板5711的下边缘向外延伸形成，并与所述前板5711大致垂直。
所述夹持部573位于所述连接片575的自由末端，并开设有一缺口5731。所述缺口5731大致呈一“凸”字形，可用以***述传热块59。所述夹持部573在所述缺口5731的相对两侧分别开设有一通孔5733。两锁固件577，如弹簧螺丝，分别***所述通孔5733再锁入所述消费性电子产品70，从而将所述外接散热模组50固定在所述消费性电子产品70上。所述连接器58位于所述侧板5713的一侧，用以连接所述第二风扇51及所述消费性电子产品70，从而使所述消费性电子产品70工作时给所述所述第二风扇51提供工作电压。
请参照图1，所述消费性电子产品70包括有一底盖71及一键盘73。所述底盖71包括有一底板711及一侧墙713。所述侧墙713设有一通风区域7131，并在所述通风区域7131一侧开设有一连接孔7133。所述连接孔7133的下边缘设有一卡扣片7135。所述卡扣片7135可收容在所述导热块30的卡槽33内。所述侧墙713还在所述连接孔7133的相对两侧分别开设有一锁孔7137。
请参照图4及图5，安装时，将所述内接散热模组10安装在所述消费性电子产品70的底板711上，并使所述第一散热鳍片组13对齐所述通风区域7131，所述消费性电子产品70的卡扣片7135卡入所述导热块30的卡槽33，并朝向所述连接孔7133。所述内接散热模组10与所述导热块30由此固定在所述消费性电子产品70内。
所述外接散热模组50放置于所述消费性电子产品70的外侧，并使所述夹持部573抵靠所述消费性电子产品70的侧墙713，且所述传热块59通过所述连接孔7133抵触所述导热块30。所述两锁固件577分别锁入消费性电子产品70的锁孔7137，从而将所述外接散热模组50固定在所述消费性电子产品70的外侧。
使用时，所述发热元件100散热的热量传至所述第一热管15，所述第一热管15经由所述第一散热鳍片组13沿一第一方向至所述通风区域7131，并经由所述导热块30沿一第二方向至所述第二热管55，所述第二散热鳍片组53再将所述第二热管55的热量排出，由此提高了散热效率，从而防止所述消费性电子产品70的热量过高，不能正常工作。

Claims (10)

1.一种散热装置组合，包括有消费性电子产品及内接散热模组，所述内接散热模组安装在所述消费性电子产品的内侧，用以对所述消费性电子产品散热，其特征在于：所述散热装置组合还包括有导热块及外接散热模组，所述导热块安装在所述内接散热模组上并延伸至所述消费性电子产品外侧，所述外接散热模组对该导热块散热。
2.如权利要求1所述的散热装置组合，其特征在于：所述内接散热模组包括有一第一热管，所述导热块固定在所述第一热管上，所述外接散热模组还包括有第二热管，所述第二热管与所述导热块接触，用以传导所述第一热管的热量。
3.如权利要求2所述的散热装置组合，其特征在于：所述导热块开设有一收容槽，所述第一热管收容在所述收容槽内，并与所述导热块接触。
4.如权利要求1所述的散热装置组合，其特征在于：所述导热块开设有一卡槽，所述卡槽能够卡在所述消费性电子产品上，以将所述导热块固定在所述消费性电子产品中。
5.如权利要求2所述的散热装置组合，其特征在于：所述外接散热模组还包括有传热块及散热鳍片组，所述第二热管一端设有所述热传体，另一端插设在所述散热鳍片组中，所述传热块与所述导热块抵触。
6.如权利要求5所述的散热装置组合，其特征在于：所述外接散热模组还包括有固定架，所述散热鳍片组收容在所述固定架内。
7.如权利要求6所述的散热装置组合，其特征在于：所述固定架上设有夹持部，所述夹持部夹持所述传热块，并能够拆卸的固定在所述消费性电子产品上。
8.如权利要求7所述的散热装置组合，其特征在于：所述夹持部开设有一缺口，所述传热块收容在所述缺口中。
9.如权利要求7所述的散热装置组合，其特征在于：所述夹持部通过两锁固件固定在所述消费性电子产品上。
10.如权利要求9所述的散热装置组合，其特征在于：所述两锁固件均为弹簧螺丝。
CN201210452675.0A 2012-11-13 2012-11-13 散热装置组合 Pending CN103813693A (zh)

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