CN103813612B - Metal-clad, printed circuit board, multilayer printed circuit board - Google Patents
Metal-clad, printed circuit board, multilayer printed circuit board Download PDFInfo
- Publication number
- CN103813612B CN103813612B CN201310552196.0A CN201310552196A CN103813612B CN 103813612 B CN103813612 B CN 103813612B CN 201310552196 A CN201310552196 A CN 201310552196A CN 103813612 B CN103813612 B CN 103813612B
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- China
- Prior art keywords
- metal
- clad
- size
- plywood
- circuit board
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Abstract
Present invention offer is a kind of can be reduced warpage and make to be difficult to the metal-clad for producing not good situation in installation procedure.The present invention relates to the metal-clad formed as follows (5), i.e., to base material (1 infiltration resin combination (2) and semi-solid preparation and after forming prepreg (3), to the prepreg (3) on be superimposed metal foil (4) and implement heating pressurization and formed.In the case that the size of plywood (6) after the etching process of the metal foil (4) remove the metal-clad (5) is as benchmark, in the range of the size changing rate that carry out again after the etching process plywood (6) after burin-in process is ± 0.03%.
Description
Technical field
The present invention relates to metal-clad used in the manufacture of printed circuit board etc. and the printing manufactured using it
Circuit board and multilayer printed circuit board.
Background technology
In the past, as metal-clad, it is known to cover gold by flexibility obtained by the fitting metal foil on adhesive foil
Belong to plywood (referring for example to patent document 1).Adhesive foil particularly described in patent document 1 is on Kapton
There is provided the film of the adhesive layer containing TPI, above-mentioned Kapton is to gathering as presoma
Film of the amic acid partly after imidizate carries out film obtained by heating stretch processing.In addition, it is arranged such rear can
Suppress the generation of change in size.
Prior art literature
Patent document
The Japanese Unexamined Patent Publication 2004-338160 publications of patent document 1
Above-mentioned flexible metal-coated lamination does not contain base material internally, but in recent years, for internally containing base material
Rigid metal-clad, also to tackle miniaturization, slimming, therefore it is required that suppress identically with flexible metal-coated lamination
The generation of change in size.Moreover, the rigid metal-clad containing base material internally is referred to as metal-clad below.
Fig. 6 (b) be after the etching process for representing common metal-clad and burin-in process after size changing rate (+
For elongation ,-for shrink) figure.Etching process equivalent to conductive pattern formation process, burin-in process equivalent to for protect lead
Heating process during the resist formation of body pattern.As shown in Fig. 6 (b), in the case of using the size after shaping as benchmark,
Size after etching process is slightly shunk, and the size after burin-in process is significantly shunk in addition.Like this, formation is in general worked as
When significantly being shunk after conductive pattern, the trend that warpage becomes big is just had, once warpage becomes big, is produced in part installation procedure
The possibility of not good situation will raise.Recently, miniaturization, the slimming of substrate are continuous promotes, and installation becomes difficult, so as to want
Seek the change in size suppressed relative to substrate.
The content of the invention
The present invention is to complete in view of the above-mentioned problems, its object is to, there is provided warpage can be reduced and cause installation
It is difficult to the metal-clad and printed circuit board and multilayer printed circuit board for producing not good situation in process.
The metal-clad of the present invention is characterised by, is to infiltrate resin combination and the shape by its semi-solid preparation to base material
Into after prepreg, be superimposed to the prepreg after metal foil and heat the metal-clad that is pressed to form, wherein with except
In the case of going on the basis of the size of the plywood after the etching process of the metal foil of the metal-clad, institute is carried out
In the range of the size changing rate for stating the plywood after carrying out burin-in process after etching process again is ± 0.03%.
It is preferred that in the metal-clad, using carry out the size of the metal-clad before the etching process as
In the case of benchmark, the size increase of the plywood after the etching process is carried out.
It is preferred that in the metal-clad, using carry out the size of the metal-clad before the etching process as
In the case of benchmark, the size changing rate for carrying out the plywood after the etching process is less than 0.1%.
It is preferred that in the metal-clad, the filler containing 50~80 mass % in the resin combination.
It is preferred that in the metal-clad, the thickness of the metal-clad is below 0.2mm.
It is preferred that in the metal-clad, the programming rate when heating is pressurizeed is more than 200 DEG C/min.
The printed circuit board of the present invention is characterised by, is to set conductor on the two sides of the metal-clad or one side
Pattern and formed.
The multilayer printed circuit board of the present invention is characterised by, is to use the printed circuit board, sets at least more than 3 layers
The conductive pattern layer and formed.
According to the present invention it is possible to reduce warpage and make to be difficult to produce not good situation in installation procedure.
Brief description of the drawings
Fig. 1 is the figure of one for representing the metal-clad of the present invention, and (a) is the section of two-sided metal-clad
Figure, (b) are the profiles of one side metal-clad, and (c) is the profile of the plywood after the metal foil in all faces is removed,
(d) be the metal-clad for adding internal layer circuit profile, (e) is after the metal foil in all faces is removed, added
The plywood of internal layer circuit.
Fig. 2 is the figure of one of the manufacturing process for representing two-sided metal-clad, and (a), (b) are profiles.
Fig. 3 is the figure of one of the manufacturing process for representing one side metal-clad, and (a), (b) are profiles.
Fig. 4 is to represent to add the figure of one of the manufacturing process of the metal-clad of internal layer circuit, and (a)~(c) is
Profile.
Fig. 5 is the top view of one for representing size changing rate measurement sample.
Fig. 6 (a) be represent the present invention metal-clad etching process after and burin-in process after size changing rate
The curve map of one, (b) be after the etching process for representing common metal-clad and burin-in process after change in size
The curve map of one of rate.
Wherein, 1 base material, 2 resin combinations, 3 prepregs, 4 metal foils, 5 metal-clads, 6 plywoods
Embodiment
Hereinafter, embodiments of the present invention are illustrated.
As shown in Figure 2 to 4, metal-clad 5 of the invention is the two sides that metal foil 4 is superimposed upon to prepreg 3
Or heat pressurization after one side and formed, it is as materials'use used for printed circuit board.In metal-clad 5, pre-preg
Part 3 solidifies, and forms the insulating barrier 30 with electrical insulating property.Fig. 1 (a) represents two-sided metal-clad.Fig. 1 (b) represents one side
Metal-clad.Fig. 1 (c) represents the plywood 6 after the metal foil 4 in all faces of metal-clad 5 is removed.Fig. 1 (d)
Represent metal-clad 5 that there is internal layer circuit 7 in the inside of insulating barrier 30, adding internal layer circuit 7.Fig. 1 (e) is represented
Layer after the metal foil 4 in all faces for the metal-clad 5 for adding internal layer circuit 7 is removed, adding internal layer circuit 7
Lamination 6.
Here, as metal foil 4, such as copper foil, aluminium foil, stainless steel foil etc. can be used.The thickness of metal foil 4 is, for example,
2~70 μm, but it is not limited to this.
In addition, prepreg 3 be by make resin combination 2 to base material 1 infiltrate while, be heated dry solidification and arrive
Semi-cured state (second scalariform state) and formed.
Above-mentioned resin combination 2 preferably comprises heat-curing resin and filler.
Here, as heat-curing resin, such as epoxy resin, phenolic resin, cyanate ester resin, melamine tree can be used
Fat, imide resin etc..Especially as epoxy resin, for example, can use polyfunctional epoxy resin, bisphenol-type epoxy resin,
Phenolic novolac type epoxy resin, biphenyl type epoxy resin etc..
In addition, as filler, such as silica, aluminium hydroxide, magnesium hydroxide, calcium carbonate, talcum, oxygen can be used
Change aluminium etc..
Additionally, it is preferred that contain 50~80 mass % filler relative to the total amount of resin combination 2.Like this, pass through
The content for making filler is more than 50 mass %, it is possible to arrives etching process after further reducing the shaping of metal-clad 5
To the change in size after burin-in process after change in size and etching process afterwards.In addition, if the content of filler is 80 matter
Below % is measured, then can be made to contain filler in resin combination 2 while the rise of viscosity is suppressed.
In addition, resin combination 2 can also contain curing agent and curing accelerator.
Here, as curing agent, such as phenol system curing agent, dicy-curing agent etc. can be used.
In addition, as curing accelerator, such as imidazoles, phenolic compounds, amine, organic phosphine etc. can be used.
In addition, by addition to above-mentioned heat-curing resin, always according to needing to coordinate filler, curing agent, solidification
Accelerator, resin combination 2 can be prepared, in addition by the way that it is diluted with solvent, the clear of resin combination 2 can be prepared
Paint.As solvent, such as MEK, toluene, styrene, methoxypropanol etc. can be used.
As base material 1, such as it can use and be made up of as glass cloth, glassine paper, glass mat etc. inorfil
Material, the material that is made up of as aramid fabric etc. organic fiber.The thickness of base material 1 is, for example, 20~200 μm, but not
It is defined in this.
When manufacturing prepreg 3, resin combination 2 is infiltrated to base material 1 first.Then it is dried to half by being heated
Solid state can be obtained by prepreg 3.Heating-up temperature now is, for example, 100~200 DEG C, and the heat time is, for example, 1~
10 minutes, but it is not limited to this.In addition, for the total amount of prepreg 3 resin combination 2 content (resin
Content) it is preferably 40~75 mass %.
In addition, the metal-clad 5 of the present invention is formed as shown below.
That is, as shown in Fig. 2 (a) (b), the metal-clad 5 as two-sided metal-clad is in above-mentioned preimpregnation
The two sides laminated metal paper tinsel 4 of stain part 3 and formed.In this case, both can be in the two sides laminated metal paper tinsel 4 of 1 prepreg 3
And shape, multi-disc prepreg 3 can also be superimposed, be shaped in its two sides laminated metal paper tinsel 4, but metal-clad 5
Thickness be preferably below 0.2mm (lower limit 0.015mm).The miniaturization of printed circuit board and slim can thus be realized
Change.
In addition, as shown in Fig. 3 (a) (b), the metal-clad 5 as one side metal-clad is above-mentioned pre-
Impregnate a face laminated metal paper tinsel 4 of part 3 and formed.In this case, both can be in a face laminated metal of 1 prepreg 3
Paper tinsel 4 and shape, multi-disc prepreg 3 can also be superimposed, fold metal foil 4 in one surface layer and shape, but metal-clad is folded
The thickness of plate 5 is preferably below 0.2mm (lower limit 0.015mm).The miniaturization of printed circuit board and thin can thus be realized
Type.Furthermore, it is also possible to the metal foil 4 of the one side of two-sided metal-clad is removed comprehensively and forms one side metal-clad and folds
Plate.
In addition, the metal-clad 5 for adding internal layer circuit 7, manufactures the core 8 shown in Fig. 4 (a), so first
Afterwards such as Fig. 4 (b), shown in (c), fold core 8 in a surface layer of above-mentioned prepreg 3, fold metal foil 4 in another surface layer and
Formed.Core 8 for example can set conductive pattern using subraction in the one side of two-sided metal-clad and manufacture, Huo Zhe
The one side without metal foil 4 of one side metal-clad sets conductive pattern using additive process and manufactured.By what is be arranged such
Just turn into internal layer circuit 7 in conductive pattern insertion insulating barrier 30.In addition, in the above cases, it is held on core 8 and metal foil
Prepreg 3 between 4 both can be 1 or multi-disc, but add the metal-clad 5 of internal layer circuit 7
Thickness is preferably below 0.2mm (lower limit 0.015mm).The miniaturization and slimming of printed circuit board can thus be realized.
In addition, above-mentioned each multi-stage vacuum forcing press, double belt press, line pressure roller, true cascading into shape of can for example using
The implementations such as dead level forcing press heating is pressurizeed and carried out.In this case programming rate when heating is pressurizeed is preferably 200 DEG C/min
More than.Folded in this manner it is possible to be readily available the metal-clad with the distinctive change in size shown in Fig. 6 (a) as be described hereinafter
Plate 5.The upper limit of programming rate is 350 DEG C/min, but is not limited to this.Additionally, it is preferred that peak temperature when cascading into shape
For 140~350 DEG C, forming pressure is 0.5~6.0MPa, and curring time is 1~240 minute.
For the metal-clad 5 manufactured as described above, change in size is as follows.Fig. 6 (a) is to represent the present invention
Metal-clad 5 etching process after and burin-in process after size changing rate (+for elongation ,-for shrink) figure.
As shown in Fig. 6 (a), size in the metal-clad 5 after with shaping, be etched before cover metal
In the case of on the basis of the size of plywood 5, the size of the plywood 6 after being etched easily increases.Thus can be with
Remove the strain of the inside of plywood 6.Due to formation process of the above-mentioned etching process equivalent to conductive pattern, therefore, it is intended that
The strain of the inside of plywood 6 can also be removed when forming conductive pattern.Size changing rate now for example can be according to JIS
C6481 is calculated.First, determine the interval between arbitrary 2 points of the surface of the metal-clad 5 before etching process and by its
It is set to L0.Then by using the etching solution using copper chloride etc. as principal component by the metal in all faces of metal-clad 5
After paper tinsel 4 is removed and is etched, the interval between above-mentioned 2 points is determined again, is set to L1.In this manner it is possible to utilize
Following formula (1) calculates the size changing rate S after etching process1。
S1=(L1-L0)×100/L0(%) ... (1)
When utilizing above-mentioned formula (1), when specifically calculating the size changing rate of the plywood 6 after etching process, for this
The metal-clad 5 of invention, above-mentioned size changing rate are well over 0% and are less than 0.1%.Like this, it is possible to use
Minimal change in size removes the strain of the inside of plywood 6.
In addition, as shown in Fig. 6 (a), on the basis of the size of the plywood 6 after etching process in the case of, etching
The size for carrying out the plywood 6 after burin-in process after processing again there is no change.Size changing rate now for example also may be used
To be calculated according to JIS C 6481.Carried out by the way that the plywood 6 after etching process to be heated to 30 minutes at 150 DEG C at aging
After reason, the interval between above-mentioned 2 points is determined again, is set to L2.In this manner it is possible to calculate burin-in process using following formula (2)
Size changing rate S afterwards2。
S2=(L2-L1)×100/L1(%) ... (2)
When utilizing above-mentioned formula (2), when specifically calculating the size changing rate of the plywood 6 after burin-in process, for this
The metal-clad 5 of invention, above-mentioned size changing rate be ± 0.03% in the range of.Like this, it is of the invention to cover gold
Category plywood 5 carries out burin-in process after etching process, and size also there is no change.The burin-in process equivalent to
Heating process when the resist formation of conductive pattern is protected, and can reduce warpage after such a heating process terminates, can
To be difficult in the installation procedure of part thereafter to produce not good situation.
In addition, the printed circuit board of the present invention is to set conductor figure on the two sides of above-mentioned metal-clad 5 or one side
Case and formed.The formation of conductive pattern such as can using subraction, additive process carry out.
In addition, the multilayer printed circuit board of the present invention is use above-mentioned printed circuit board, at least more than 3 layers of setting is led
The layer of body pattern and formed.As a rule the layer of conductive pattern is less than 2 layers in printed circuit board, but can be with as follows
The multilayer printed circuit board that the layer of ground manufacture conductive pattern is more than 3 layers.
That is, although diagram is omitted, but the multilayer printed circuit board of the present invention can be the two of above-mentioned printed circuit board
Partly not removing for the metal foil 4 is set conductor by face or one side folder across the above-mentioned laminated metal paper tinsel 4 of prepreg 3
The layer of pattern is formed.In this case, it is preferred that use above-mentioned prepreg 3, but other prepregs can also be used
3.In addition, as metal foil 4, material same as described above can be used.Cascading into shape and molding condition is with manufacturing above-mentioned cover
The situation of metal level lamination 5 is identical.The formation of conductive pattern is carried out identically when can be with manufacture printed circuit board.That is, having
Subraction can be utilized to form the layer of conductive pattern in the case of having metal foil 4, can profit in the case of no metal foil 4
The layer of conductive pattern is formed with additive process.Alternatively, it is also possible to be folded in the metal-clad for adding internal layer circuit 7 shown in Fig. 1 (d)
The two sides of plate 5 forms the layer of conductive pattern using subraction, manufactures multilayer printed circuit board.Moreover, in multilayer printed circuit board
In, the number of plies of conductive pattern is not particularly limited.
[embodiment]
Hereinafter, the present invention is specifically described using embodiment.
(embodiment 1)
As heat-curing resin, Dainippon Ink Chemicals's system " HP9500 " and " N540 " have been used.
In addition, as filler, as silica, Co., Ltd.'s ADMATECHS systems " YC100C-MLE " have been used
And " S0-25R ".
In addition, as curing agent, as phenol curing agent, Dainippon Ink Chemicals's system " TD2090 " has been used.
In addition, as curing accelerator, as imidazoles, Shikoku Chem's system " 2E4MZ " has been used.
In addition, as base material 1, as glass cloth, Nitto Boseki Co. Ltd's system " 1037Cloth " (29 μ of thickness have been used
m)。
Hereafter, by by above-mentioned heat-curing resin (" HP9500 "：46.51 mass parts, " N540 "：19.94 mass
Part), filler (" YC100C-MLE "：50 mass parts, " S0-25R "：250 mass parts), curing agent (" TD2090 "：33.55 matter
Measure part), curing accelerator (" 2E4MZ "：0.05 mass parts) coordinate, then diluted with solvent (MEK), and prepare resin group
The varnish of compound 2.
Then, by make above-mentioned varnish to base material 1 infiltrate while by its at 150 DEG C with 3 minutes in drying oven
Heat drying produces prepreg 3 to semi-cured state.The resin combination 2 for the total amount of the prepreg 3
Content (resin content) be 59 mass %.
Then, by the way that above-mentioned prepreg 3 is superimposed into 2, on its two sides as the laminated copper foil of metal foil 4 (three wells gold
Category mining industry Co. Ltd. system " 3EC-VLP ", 18 μm of 500mm × 500mm × thickness) and shape, and manufactured as metal-clad 5
Go out the two-sided metal-clad (thick 0.096mm) as shown in Fig. 1 (a).It is above-mentioned it is cascading into shape be to use multi-stage vacuum pressure
Machine is implemented heating pressurization and carried out.Programming rate during heating pressurization is 250 DEG C/min, and peak temperature is 250 DEG C, shaping pressure
Power is 3.9MPa (40kgf/cm2), curring time is 5 minutes.
Then, above-mentioned metal-clad 5 is cut out with 50mm square, as size changing rate measurement sample
Use, determine the interval between arbitrary 2 points in orthogonal 2 direction (X-direction and Y-direction) on the surface of the sample, will
They are set to L0And L (X)0(Y) (reference picture 5).
Then, by using the etching solution using copper chloride etc. as principal component by the gold in all faces of metal-clad 5
Category paper tinsel 4 is removed after being etched, and determines the interval between 2 points on 2 above-mentioned directions again, they are set to
L1And L (X)1(Y).Hereafter, the size changing rate S after etching process is calculated using above-mentioned formula (1)1And S (X)1(Y).Tied
Fruit represents as follows.
S1(X)=+ 0.03%
S1(Y)=+ 0.03%
Then, by the way that the plywood 6 after etching process to be heated to 30 minutes at 150 DEG C and after carrying out burin-in process, again
The interval between 2 points on 2 above-mentioned directions is determined, they are set to L2And L (X)2(Y).Hereafter, above-mentioned formula is utilized
(2) the size changing rate S after burin-in process is calculated2And S (X)2(Y).Its result is represented as follows.
S2(X)=+ 0.01%
S2(Y)=+ 0.01%
Hereafter, above-mentioned plywood 6 is made into convex surface to be placed on platform with uncharged state upward, according to JIS C
6481 determine the maximum amount of warpage of plywood 6 using settled process.As a result, maximum amount of warpage is 1.1mm.
(embodiment 2)
As heat-curing resin, Nippon Kayaku K. K's system " EPPN502H " has been used.
In addition, as filler, used as silica, Co., Ltd.'s ADMATECHS systems " YC100C-MLE ",
" S0-25R " and " S0-C6 ".
In addition, as curing agent, as phenol curing agent, bright and chemical conversion Co. Ltd. system " MEH7600 " has been used.
In addition, as curing accelerator, as imidazoles, Shikoku Chem's system " 2E4MZ " has been used.
In addition, as base material 1, as glass cloth, Nitto Boseki Co. Ltd's system " 1037Cloth " (29 μ of thickness have been used
m)。
Hereafter, by by above-mentioned heat-curing resin (" EPPN502H "：62.83 mass parts), filler (" YC100C-
MLE”：50 mass parts, " S0-25R "：100 mass parts, " S0-C6 "：50 mass parts), curing agent (" MEH7600 "：37.17 mass
Part), curing accelerator (" 2E4MZ "：0.05 mass parts) coordinate, then diluted with solvent (MEK), and prepare resin combination
The varnish of thing 2.
Then, in addition to using above-mentioned varnish, (the resin content of prepreg 3 is manufactured same as Example 1ly：59
Quality %), manufacture metal-clad 5 using the prepreg 3.
Then, the size changing rate S after etching process is calculated same as Example 1ly1And S (X)1(Y).By its result table
Show as follows.
S1(X)=+ 0.02%
S1(Y)=+ 0.02%
Then, the size changing rate S after burin-in process is calculated same as Example 1ly2And S (X)2(Y).By its result table
Show as follows.
S2(X)=+ 0.03%
S2(Y)=+ 0.03%
Hereafter, the maximum amount of warpage of plywood 6 is determined same as Example 1ly.As a result, maximum amount of warpage is
1.3mm。
(embodiment 3)
As base material 1, as glass cloth, Nitto Boseki Co. Ltd's system " 1036 Cloth " (thick 28 μm) has been used.
The varnish of resin combination 2 is prepared same as Example 1ly.
Then, in addition to using above-mentioned varnish and base material 1, (the resin of prepreg 3 is manufactured same as Example 1ly
Content：51 mass %), produce metal-clad 5 using the prepreg 3.
Then, the size changing rate S after etching process is calculated same as Example 1ly1And S (X)1(Y).By its result table
Show as follows.
S1(X)=+ 0.03%
S1(Y)=+ 0.03%
Then, the size changing rate S after burin-in process is calculated same as Example 1ly2And S (X)2(Y).By its result table
Show as follows.
S2(X)=+ 0.02%
S2(Y)=+ 0.01%
Hereafter, the maximum amount of warpage of plywood 6 is determined same as Example 1ly.As a result, maximum amount of warpage is
0.9mm。
(embodiment 4)
By being used as the laminated copper foil (Mitsui Metal Co., Ltd. of metal foil 4 on the two sides of 1 of prepreg 3 same as Example 1
18 μm of mining industry Co. Ltd. system " 3EC-VLP ", 500mm × 500mm × thickness) and shape, and produced as metal-clad 5
Two-sided metal-clad (thick 0.066mm).It is above-mentioned it is cascading into shape be implement heating pressurization using multi-stage vacuum forcing press and
Carry out.Programming rate during heating pressurization is 250 DEG C/min, and peak temperature is 250 DEG C, forming pressure 3.9MPa
(40kgf/cm2), curring time is 5 minutes.
Then, the one side in above-mentioned two-sided metal-clad sets conductive pattern using subraction and produces core
8。
Then, core 8 is folded by the surface layer of 1 in prepreg 3 same as described above, folded in another surface layer
Metal foil 4 simultaneously shapes, and produces the metal-clad 5 (thick 0.120mm) for adding internal layer circuit 7.Metal is covered with two-sided
The manufacture of plywood carries out above-mentioned cascading into shape in the same manner.
Then, the size changing rate S after etching process is calculated same as Example 1ly1And S (X)1(Y).By its result table
Show as follows.
S1(X)=+ 0.02%
S1(Y)=+ 0.02%
Then, the size changing rate S after burin-in process is calculated same as Example 1ly2And S (X)2(Y).By its result table
Show as follows.
S2(X)=+ 0.03%
S2(Y)=+ 0.03%
Hereafter, the maximum amount of warpage of plywood 6 is determined same as Example 1ly.As a result, maximum amount of warpage is
3.1mm。
(comparative example 1)
By the way that prepreg 3 same as Example 1 is superimposed into 2, in its two sides laminated copper foil (Mitsui Metal Co., Ltd.'s mining industry strain
18 μm of formula commercial firm system " 3EC-VLP ", 500mm × 500mm × thickness) it is used as metal foil 4 and shapes, and it is used as metal-clad 5
Produce two-sided metal-clad (thick 0.096mm).It is above-mentioned it is cascading into shape be to implement heating using multi-stage vacuum forcing press
Pressurize and carry out.Programming rate during heating pressurization is 3 DEG C/min, and peak temperature is 220 DEG C, forming pressure 3.9MPa
(40kgf/cm2), curring time is 80 minutes.
Then, the size changing rate S after etching process is calculated same as Example 1ly1And S (X)1(Y).By its result table
Show as follows.
S1(X)=+ 0.01%
S1(Y)=+ 0.01%
Then, the size changing rate S after burin-in process is calculated same as Example 1ly2And S (X)2(Y).By its result table
Show as follows.
S2(X)=- 0.05%
S2(Y)=- 0.05%
Hereafter, the maximum amount of warpage of plywood 6 is determined same as Example 1ly.As a result, maximum amount of warpage is
2.5mm。
(comparative example 2)
As heat-curing resin, Dainippon Ink Chemicals's system " HP9500 " and " N540 " have been used.
In addition, as filler, as silica, Co., Ltd.'s ADMATECHS systems " S0-25R " have been used.
In addition, as curing agent, as phenol curing agent, Dainippon Ink Chemicals's system " TD2090 " has been used.
In addition, as curing accelerator, as imidazoles, Shikoku Chem's system " 2E4MZ " has been used.
In addition, as base material 1, as glass cloth, Nitto Boseki Co. Ltd's system " 1036Cloth " (28 μ of thickness have been used
m)。
Hereafter, by by above-mentioned heat-curing resin (" HP9500 "：46.51 mass parts, " N540 "：19.94 mass
Part), filler (" S0-25R "：300 mass parts), curing agent (" TD2090 "：33.55 mass parts), curing accelerator
(“2E4MZ”：0.05 mass parts) coordinate, then diluted with solvent (MEK), and prepare the varnish of resin combination 2.
Then, in addition to using above-mentioned varnish and base material 1, (the resin of prepreg 3 is manufactured identically with comparative example 1
Content：72 mass %), produce metal-clad 5 using the prepreg 3.
Then, the size changing rate S after etching process is calculated same as Example 1ly1And S (X)1(Y).By its result table
Show as follows.
S1(X)=- 0.02%
S1(Y)=- 0.02%
Then, the size changing rate S after burin-in process is calculated same as Example 1ly2And S (X)2(Y).By its result table
Show as follows.
S2(X)=- 0.06%
S2(Y)=- 0.06%
Hereafter, the maximum amount of warpage of plywood 6 is determined same as Example 1ly.As a result, maximum amount of warpage is
3.7mm。
Claims (6)
1. a kind of metal-clad, it is characterised in that be to form pre-preg to base material infiltration resin combination and semi-solid preparation
After part, metal foil and the metal-clad for heating pressurization and being formed are superimposed to the prepreg,
The base material is fibrillation glass cloth,
The resin combination contains heat-curing resin and filler,
Filler containing 50~80 mass % in the resin combination,
Wherein make remove the size of the plywood after the etching process of the metal foil of the metal-clad
On the basis of in the case of, the stacking after being heated 30 minutes at 150 DEG C again after carrying out the etching process and carrying out burin-in process
In the range of the size changing rate of plate is ± 0.03%,
In the case of carrying out the size of the metal-clad before the etching process as benchmark, to carry out at the etching
The size increase of plywood after reason,
In the case of carrying out the size of the metal-clad before the etching process as benchmark, to carry out at the aging
The size increase of plywood after reason.
2. metal-clad according to claim 1, it is characterised in that
In the case of carrying out the size of the metal-clad before the etching process as benchmark, to carry out at the etching
The size changing rate of plywood after reason is less than 0.1%.
3. metal-clad according to claim 1 or 2, it is characterised in that
The thickness of the metal-clad is below 0.2mm.
4. metal-clad according to claim 1 or 2, it is characterised in that
Programming rate during the heating pressurization is more than 200 DEG C/min.
A kind of 5. printed circuit board, it is characterised in that
It is that conductive pattern is set on the two sides of the metal-clad any one of Claims 1-4 or one side and formed
's.
A kind of 6. multilayer printed circuit board, it is characterised in that
It is the printed circuit board described in usage right requirement 5, at least layer of more than 3 layers of the conductive pattern is set and formed
's.
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| JP2012-248686 | 2012-11-12 | ||
| JP2012248686 | 2012-11-12 |
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| CN201310552196.0A Active CN103813612B (en) | 2012-11-12 | 2013-11-08 | Metal-clad, printed circuit board, multilayer printed circuit board |
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| Country | Link |
|---|---|
| JP (2) | JP6226232B2 (en) |
| KR (1) | KR101794874B1 (en) |
| CN (1) | CN103813612B (en) |
| TW (1) | TWI544842B (en) |
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| JP5954675B2 (en) * | 2014-09-26 | 2016-07-20 | パナソニックＩｐマネジメント株式会社 | Method for producing double-sided metal-clad laminate, method for producing printed wiring board, method for producing multilayer laminate, and method for producing multilayer printed wiring board |
| JP5991500B1 (en) * | 2016-03-18 | 2016-09-14 | パナソニックＩｐマネジメント株式会社 | Metal-clad laminate, printed wiring board, method for producing metal-clad laminate, and method for producing printed wiring board |
| JP6796791B2 (en) * | 2016-08-01 | 2020-12-09 | パナソニックＩｐマネジメント株式会社 | Manufacturing method of metal-clad laminate, printed wiring board, metal-clad laminate and manufacturing method of printed wiring board |
| US11040517B2 (en) * | 2016-11-09 | 2021-06-22 | Showa Denko Materials Co., Ltd. | Printed wiring board and semiconductor package |
| CN106856646A (en) * | 2016-11-13 | 2017-06-16 | 惠州市大亚湾科翔科技电路板有限公司 | A kind of flexibility covers metal lamination |
| JP6960595B2 (en) * | 2017-01-13 | 2021-11-05 | パナソニックＩｐマネジメント株式会社 | Printed wiring board with built-in thick conductor and its manufacturing method |
| TWI775905B (en) * | 2017-07-25 | 2022-09-01 | 日商松下知識產權經營股份有限公司 | Manufacturing method of multi-layered printed wiring board |
| DE112021000930T5 (en) * | 2020-04-03 | 2022-11-24 | Panasonic Intellectual Property Management Co., Ltd. | HEAT CURING RESIN SHEET AND PRINTED WIRING BOARD |
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| CN1791310A (en) * | 2001-05-24 | 2006-06-21 | 住友电木株式会社 | Method for manufacturing a laminated board |
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| JPS62259825A (en) * | 1986-05-07 | 1987-11-12 | Matsushita Electric Works Ltd | Manufacture of metal foil clad laminated sheet |
| JPH0655449B2 (en) * | 1986-12-15 | 1994-07-27 | 松下電工株式会社 | Glass-based epoxy resin laminate processing method |
| JPH0752788B2 (en) * | 1988-12-28 | 1995-06-05 | 松下電器産業株式会社 | Method of forming printed wiring board |
| JP2954335B2 (en) * | 1990-11-30 | 1999-09-27 | 住友ベークライト株式会社 | Manufacturing method of laminated board |
| JPH05327150A (en) * | 1992-05-18 | 1993-12-10 | Sumitomo Bakelite Co Ltd | Laminated plate for printed circuit |
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| JPH10235780A (en) * | 1997-02-27 | 1998-09-08 | Matsushita Electric Works Ltd | Substrate for tape carrier package |
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| JP2005158974A (en) * | 2003-11-25 | 2005-06-16 | Matsushita Electric Works Ltd | Method for manufacturing multi-layer printed wiring board and sheet material for manufacturing the same |
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| CN1791310A (en) * | 2001-05-24 | 2006-06-21 | 住友电木株式会社 | Method for manufacturing a laminated board |
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|---|---|
| JP6226232B2 (en) | 2017-11-08 |
| CN103813612A (en) | 2014-05-21 |
| TW201440585A (en) | 2014-10-16 |
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| JP2014111361A (en) | 2014-06-19 |
| JP6624573B2 (en) | 2019-12-25 |
| TWI544842B (en) | 2016-08-01 |
| JP2018001764A (en) | 2018-01-11 |
| KR101794874B1 (en) | 2017-11-07 |
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