JPH05327150A

JPH05327150A - Laminated plate for printed circuit

Info

Publication number: JPH05327150A
Application number: JP12496392A
Authority: JP
Inventors: Kazuya Obara; 和也小原; Takahiro Nakada; 高弘中田
Original assignee: Sumitomo Bakelite Co Ltd
Current assignee: Sumitomo Bakelite Co Ltd
Priority date: 1992-05-18
Filing date: 1992-05-18
Publication date: 1993-12-10

Abstract

PURPOSE:To enable the dimensional shrinkage coefficient and warpage to be notably reduced by a method wherein two each or more glass fiber sheets of a surface layer as well as a prepreg containing inorganic filler are to be used. CONSTITUTION:A surface layer is composed of a glass sheet 2' impregnated with a thermosetting resin while an intermediate layer is composed of a non- glass fiber sheet prepreg 3 impregnated with another resin containing an inorganic filler in 10-200wt% of the thermosetting resin. Within the title laminated layer, two each or more glass fiber sheets 2 impregnated with the thermosetting resin of respective surface layers are used and at least one sheet 2 is specified to contain the inorganic filler in 10-200wt% of the resin of the surface layer. Through these procedures, the dimensional stability and warpage during the processing steps can be improved up to the equal level to that of the laminated plate of the base material of the glass fiber sheets by using said two or more glass fiber sheets on respective surfaces.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は寸法安定性、反り、加工
性に優れ、特に電気機器、電子機器、通信機器等に使用
される印刷回路用積層板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated board for a printed circuit, which is excellent in dimensional stability, warpage and workability and is particularly used in electric equipment, electronic equipment, communication equipment and the like.

【０００２】[0002]

【従来の技術】民生用電子機器の小型化、高機能化が進
み、それに用いられる印刷回路用積層板として、ガラス
不織布を中間層基材とし、ガラス織布を表面層基材と
し、これら基材にエポキシ樹脂を含浸させ加熱加圧した
積層板（以下、コンポジット積層板という）が使用され
るようになった。コンポジット積層板は、中間層にガラ
ス不織布が基材として用いられており、ガラス織布基材
積層板に比較して、経済的に安価で、かつ打抜き加工が
可能で、Ｖカット性が優れており、加工性の良いガラス
基材積層板として使用されているが、スルーホールメッ
キの信頼性が低く、また加熱加圧成形時の歪みを生じ易
いため、寸法安定性、反りが劣るという問題がある。2. Description of the Related Art Consumer electronic devices have become smaller and more sophisticated, and as a laminate for printed circuits used therein, glass nonwoven fabric is used as an intermediate layer base material and glass woven fabric is used as a surface layer base material. A laminated plate (hereinafter referred to as a composite laminated plate) in which a material is impregnated with an epoxy resin and heated and pressed has come to be used. The non-woven glass substrate is used as the intermediate layer in the composite laminate, which is economically cheaper than the glass woven substrate laminate, can be punched, and has excellent V-cutting properties. However, it is used as a glass substrate laminate with good workability, but the reliability of through-hole plating is low, and distortion during heat and pressure molding is likely to occur, resulting in poor dimensional stability and warpage. is there.

【０００３】ところで、テレビ、エアコンのように高電
圧が印加されるもの、また、産業用電子機器においても
安全性を確保する立場から耐トラッキング性が要求され
るようになってきた。従来、民生機器に用いられるフェ
ノール樹脂積層板においては、この耐トラッキング性の
ため、金属箔を積層板に接着するのに用いる接着剤に、
炭化しにくいメラミン樹脂や脂環族エポキシやポリエス
テル樹脂系が用いられてきた。しかし、コンポジット積
層板などのエポキシ積層板は小型化、高密度化に伴い、
金属箔が薄くなる傾向がある。このため、接着剤が金属
箔に塗工できない。また、塗工後カールしてしまうなど
という点から接着剤付金属箔が使用できない状況であ
る。By the way, tracking resistance has come to be required from the standpoint of ensuring safety in applications such as televisions and air conditioners to which a high voltage is applied, and also in industrial electronic equipment. Conventionally, in a phenolic resin laminated board used for consumer equipment, due to this tracking resistance, an adhesive used to adhere the metal foil to the laminated board,
Melamine resins, alicyclic epoxies, and polyester resin systems that are difficult to carbonize have been used. However, as epoxy laminates such as composite laminates become smaller and higher in density,
The metal foil tends to be thin. Therefore, the adhesive cannot be applied to the metal foil. In addition, it is a situation in which the metal foil with adhesive cannot be used because it curls after coating.

【０００４】更に、産業用機器においては、耐トラッキ
ング性向上のため、脂環式エポキシや不飽和ポリエステ
ル樹脂系が用いられてきたが、コストが高い、耐熱性、
金属箔との引剥がし強さが弱い等の問題がある。Further, in industrial equipment, an alicyclic epoxy or unsaturated polyester resin system has been used to improve tracking resistance, but the cost is high, heat resistance,
There are problems such as weak peeling strength from the metal foil.

【０００５】[0005]

【発明が解決しようとする課題】本発明は、前記のよう
な従来の問題点を解決するため種々の検討の結果なされ
たもので、その目的とするところは、従来のコンポジッ
ト積層板の優れた打抜き加工性、Ｖカット加工性、及び
他の諸特性を劣化させることなく、良好な耐トラッキン
グ性を有し、積層板加工時の寸法安定性、反りの優れた
積層板を提供するにある。The present invention has been made as a result of various studies in order to solve the above-mentioned conventional problems, and an object of the present invention is to provide an excellent composite laminated plate of the related art. It is an object of the present invention to provide a laminated plate which has good tracking resistance without deteriorating punching workability, V-cut workability, and other characteristics, and has excellent dimensional stability and warpage during processing of the laminated plate.

【０００６】[0006]

【課題を解決するための手段】本発明は、表面層は熱硬
化性樹脂を含浸したガラス織布からなり、中間層は熱硬
化性樹脂に対して無機充填剤が１０〜２００重量％含有
されている樹脂を含浸したガラス不織布からなる積層板
において、各表面層の熱硬化性樹脂を含浸したガラス織
布を、それぞれ２枚以上使用し、少なくともその１枚は
無機充填剤が表面層の樹脂に対して、１０〜２００重量
％含有されていることを特徴とする印刷回路用積層板で
ある。従来のコンポジット積層板は、図１に示すように
中間層の基材にガラス不織布が用いられ、表面層には、
各面に１枚のガラス織布が用いられているため、ガラス
織布基材の積層板に比較して、積層板加工工程での寸法
安定性、反りが劣る問題点があった。According to the present invention, the surface layer comprises a woven glass cloth impregnated with a thermosetting resin, and the intermediate layer contains 10 to 200% by weight of an inorganic filler with respect to the thermosetting resin. 2 or more glass woven cloths impregnated with the thermosetting resin of each surface layer are used in a laminated plate made of a glass nonwoven fabric impregnated with a resin, at least one of which is a resin having an inorganic filler as a surface layer. On the other hand, the laminated board for a printed circuit is characterized by containing 10 to 200% by weight. As shown in FIG. 1, a conventional composite laminated plate uses a glass nonwoven fabric as a base material of an intermediate layer and a surface layer of
Since one glass woven fabric is used for each surface, there is a problem that the dimensional stability and warpage in the laminated plate processing step are inferior to the laminated plate of the glass woven fabric substrate.

【０００７】本発明はこの欠点を解決するものであり、
表面層のガラス織布を図２に一例を示すように各面に対
して各２枚以上使用することにより、加工時の寸法安定
性、反りをガラス織布基材の積層板と同等レベルまで向
上させることができる。また、本発明に用いられる無機
充填剤は表面層の樹脂に対して、１０〜２００％（重量
％、以下同じ）、好ましくは２０〜２００％含まれる。
２０％以下では耐トラッキング性の効果が小さく、２０
０％以上では無機充填剤混合時の樹脂粘度が高くなりす
ぎて、ガラス不織布への含浸が困難となる。また、中間
層においては、無機充填剤が中間層樹脂に対して１０〜
２００％、好ましくは６０〜２００％含まれる。６０％
以下では寸法安定性やスルホールメッキ信頼性が低下し
て好ましくはない。２００％以上では無機充填剤を樹脂
に混合した時に粘度が高くなりすぎて、ガラス不織布へ
の含浸が困難となる。The present invention solves this drawback.
By using two or more glass woven fabrics for each surface on each side, as shown in Fig. 2, the dimensional stability and warpage during processing are at the same level as those of glass woven fabric laminates. Can be improved. The inorganic filler used in the present invention is contained in the surface layer resin in an amount of 10 to 200% (% by weight, hereinafter the same), preferably 20 to 200%.
If it is 20% or less, the effect of tracking resistance is small,
If it is 0% or more, the resin viscosity becomes too high when the inorganic filler is mixed, and it becomes difficult to impregnate the glass nonwoven fabric. In addition, in the intermediate layer, the inorganic filler is 10 to the intermediate layer resin.
200%, preferably 60-200%. 60%
The following is not preferable because the dimensional stability and the reliability of through-hole plating are reduced. If it is 200% or more, the viscosity becomes too high when the inorganic filler is mixed with the resin, and it becomes difficult to impregnate the glass nonwoven fabric.

【０００８】本発明において使用するガラス織布は、５
０g／m² 〜２６０g／m² のものが望ましい。また使用す
るガラス織布は２１０g／m² 程度のもので各面に対して
それぞれ２〜３枚が望ましく、それ以上では、コンポジ
ット積層板の打抜き加工、Ｖカット性が失なわれる恐れ
がある。また、無機充填剤としては、水酸化アルミニウ
ム、シリカ、タルク、ウォラストナイト、水酸化マグネ
シウム、クレー等があるが、難燃性、加工性、耐熱性よ
り、好ましくは水酸化アルミニウムである。本発明に用
いられる樹脂は、エポキシ樹脂以外に、ポリイミド樹
脂、ポリエステル樹脂、フェノール樹脂でもよい。The glass woven fabric used in the present invention is 5
Those 0g / m ^² ~260g / m ² is desirable. Further, the glass woven fabric used is about 210 g / m ² , and it is desirable that two to three sheets are used for each side. If the number of glass woven fabrics is more than that, there is a possibility that the punching process and V-cutting property of the composite laminate may be lost. As the inorganic filler, there are aluminum hydroxide, silica, talc, wollastonite, magnesium hydroxide, clay and the like, but aluminum hydroxide is preferable in view of flame retardancy, processability and heat resistance. The resin used in the present invention may be a polyimide resin, a polyester resin, or a phenol resin in addition to the epoxy resin.

【０００９】[0009]

【実施例】以下に、本発明の実施例、及び比較例（従来
例）を示す。「部」は「重量部」を示す。《実施例》エポキシ樹脂配合ワニスの組成は次の通りで
ある。（１）臭素化エポキシ樹脂（油化シェル製ＥＰ−１０４６）１００部（２）ジシアンジアミド４部（３）２−エチル−４−メチルイミダゾール０.１５部（４）メチルセロソルブ３６部（５）アセトン６０部上記材料を混合して均一なワニスを作製した。EXAMPLES Examples of the present invention and comparative examples (conventional examples) are shown below. "Part" means "part by weight". <Example> The composition of the varnish containing an epoxy resin is as follows. (1) Brominated epoxy resin (EP-1046 manufactured by Yuka Shell Co., Ltd.) 100 parts (2) Dicyandiamide 4 parts (3) 2-Ethyl-4-methylimidazole 0.15 part (4) Methylcellosolve 36 parts (5) Acetone 60 parts The above materials were mixed to prepare a uniform varnish.

【００１０】次いで、前記エポキシ樹脂配合ワニスに樹
脂分１００部に対して、次の配合の無機充填剤を添加
し、撹拌混合し、無機充填剤含有ワニス［１］を作製し
た。（１）ギブサイト型水酸化アルミニウム５０部（昭和電工ハイジライトＨ−４２）（２）超微粉末シリカ（シオノギ製薬製カープレックス）２部この無機充填剤含有ワニス［１］をガラス織布（日東紡
績製 WE-18K-RB84）に樹脂含有量が３３〜３７％になる
ように含浸乾燥し、表面層用ガラス織布プリプレグを得
た。また、前記エポキシ樹脂配合ワニスに樹脂分１００
部に対して、次の配合の無機充填剤を添加し、撹拌混合
し無機充填剤含有ワニス［２］を作製した。（１）シリカ（龍森製クリスタライトＶＸ−３）２５部（２）ギブサイト型水酸化アルミニウム７０部（昭和電工ハイジライトＨ−４２）（３）超微粉末シリカ（シオノギ製薬製カープレックス）５部この無機充填剤含有ワニス［２］をガラス不織布（日本
バイリーン製EP-4075）に樹脂及び無機充填剤の含有量
が９０％になるように含浸乾燥して、ガラス不織布プリ
プレグを得た。次に、前記ガラス不織布プリプレグを中
間層とし、上下表面層に前記ガラス織布プリプレグを各
２枚配置し、更にその両面に１８μｍ厚の銅箔を重ね、
成形温度１６５℃、圧力６０kg／cm² で９０分間積層成
形して、厚さ１.６mmの銅張り積層板を得た。Next, an inorganic filler having the following composition was added to 100 parts of the resin content of the varnish containing the epoxy resin, and the mixture was stirred and mixed to prepare an inorganic filler-containing varnish [1]. (1) Gibbsite type aluminum hydroxide 50 parts (Showa Denko Heidilite H-42) (2) Ultrafine powder silica (Shionogi Pharmaceutical Carplex) 2 parts This inorganic filler-containing varnish [1] is woven into glass cloth (Nitto). WE-18K-RB84) made by spinning was impregnated and dried so that the resin content was 33 to 37% to obtain a glass woven fabric prepreg for a surface layer. In addition, 100 parts of resin is added to the varnish containing the epoxy resin.
An inorganic filler having the following formulation was added to each part and mixed with stirring to prepare an inorganic filler-containing varnish [2]. (1) Silica (Tatsumori Crystallite VX-3) 25 parts (2) Gibbsite type aluminum hydroxide 70 parts (Showa Denko Heidilite H-42) (3) Superfine powder silica (Shionogi Pharmaceutical Carplex) 5 Part This inorganic filler-containing varnish [2] was impregnated into a glass nonwoven fabric (EP-4075 manufactured by Nippon Vilene) so that the content of the resin and the inorganic filler was 90%, and dried to obtain a glass nonwoven fabric prepreg. Next, the glass non-woven fabric prepreg was used as an intermediate layer, and two glass woven fabric prepregs were arranged on each of the upper and lower surface layers, and a copper foil having a thickness of 18 μm was laminated on both surfaces thereof.
Laminating was performed at a molding temperature of 165 ° C. and a pressure of 60 kg / cm ² for 90 minutes to obtain a copper-clad laminate having a thickness of 1.6 mm.

【００１１】《比較例》実施例において、上下表面層の
ガラス織布プリプレグにおいて、無機充填剤を添加せ
ず、エポキシ樹脂のみをガラス織布に樹脂含有量が３５
〜４５％になるように含浸乾燥したガラス織布プリプレ
グを作製し、これを各１枚配置して実施例と同様にして
厚さ１.６mmの銅張積層板を得た。以上の実施例及び比
較例により得られた銅張積層板について、回路板の加工
工程における寸法変化率（収縮率）、反り、Ｖカット性
ならびに、耐トラッキング性、はんだ耐熱性、銅箔引剥
がし強さを測定した。その結果を表１に示す。Comparative Example In the examples, in the glass woven cloth prepreg for the upper and lower surface layers, the epoxy resin alone was added to the glass woven cloth without adding the inorganic filler, and the resin content was 35.
A glass woven fabric prepreg impregnated and dried to a content of ˜45% was prepared, and one prepreg was arranged for each to obtain a copper clad laminate having a thickness of 1.6 mm in the same manner as in the example. Regarding the copper-clad laminates obtained in the above Examples and Comparative Examples, the dimensional change rate (shrinkage rate), warpage, V-cutting property, and tracking resistance, solder heat resistance, and copper foil peeling in the circuit board processing process were performed. The strength was measured. The results are shown in Table 1.

【００１２】[0012]

【表１】 [Table 1]

【００１３】（測定方法）寸法変化率：JIS C 6481に準じて測定反り：同上Ｖカット性：２５mm幅のテストピースを作成し、両表面
ガラス織布の層をＶカットして中間層の部分を０．５mm
残した。スパン５０mmとして曲げ強度を測定し、折れ強
度とした。半田耐熱性：JIS C 6481に準じて測定銅箔引剥が強さ：同上表１からも明らかなように、表面層として無機充填剤を
含有したガラス織布プリプレグを２枚以上使用した実施
例の銅張積層板は、寸法安定性、反りおいて優れてお
り、Ｖカット加工性は従来のコンポジット銅張板と同様
である。なお、打抜き性、スルーホールメッキ信頼性、
電気絶縁性等も測定したが、実施例と比較例との間に差
は認められなかった。(Measurement method) Dimensional change rate: Measured according to JIS C 6481 Warp: Same as above V-cutting property: A 25 mm wide test piece was prepared, and both surfaces of the glass woven fabric were V-cut to form an intermediate layer. 0.5mm part
left. Bending strength was measured with a span of 50 mm and defined as bending strength. Solder heat resistance: Measured according to JIS C 6481 Copper foil peeling strength: Same as above As is clear from Table 1, an example using two or more glass woven prepregs containing an inorganic filler as a surface layer The copper-clad laminate is excellent in dimensional stability and warpage, and has V-cut workability similar to that of the conventional composite copper-clad board. In addition, punchability, through-hole plating reliability,
The electrical insulating property was also measured, but no difference was observed between the example and the comparative example.

【００１４】[0014]

【発明の効果】本発明による積層板は、表面層のガラス
織布を２枚以上使用し、無機充填剤を含有したプリプレ
グを使用することにより、従来のコンポジット積層板に
比較して、寸法収縮率、反りが大幅に低減し、ガラス織
布基材積層板と同等レベルとなり、しかも耐トラッキン
グ性、耐熱性、銅箔引剥がし強さに優れており、工業的
な印刷回路用積層板として極めて好適である。INDUSTRIAL APPLICABILITY The laminated sheet according to the present invention uses two or more glass woven fabrics for the surface layer and uses the prepreg containing the inorganic filler, so that the dimensional shrinkage is reduced as compared with the conventional composite laminated sheet. The rate and warpage are greatly reduced, and the level is the same as that of the glass woven fabric substrate laminate. Moreover, it has excellent tracking resistance, heat resistance, and copper foil peeling strength, making it extremely useful as an industrial printed circuit laminate. It is suitable.

【図面の簡単な説明】[Brief description of drawings]

【図１】従来のコンポジット積層板の概略断面図FIG. 1 is a schematic sectional view of a conventional composite laminated plate.

【図２】本発明のコンポジット積層板の概略断面図FIG. 2 is a schematic sectional view of a composite laminate of the present invention.

【符号の説明】[Explanation of symbols]

１銅箔２熱硬化性樹脂含浸ガラス織布２' 無機充填剤含有熱硬化性樹脂含浸ガラス織布３無機充填剤含有熱硬化性樹脂含浸ガラス不織布 1 Copper Foil 2 Thermosetting Resin Impregnated Glass Woven Fabric 2'Inorganic Filler-Containing Thermosetting Resin Impregnated Glass Woven Fabric 3 Inorganic Filler-Containing Thermosetting Resin Impregnated Glass Nonwoven Fabric

Claims

【特許請求の範囲】[Claims]

【請求項１】表面層は熱硬化性樹脂を含浸したガラス
織布からなり、中間層は熱硬化性樹脂に対して無機充填
剤が１０〜２００重量％含有されている樹脂を含浸した
ガラス不織布からなる積層板において、各表面層の熱硬
化性樹脂を含浸したガラス織布をそれぞれ２枚以上使用
し、少なくともその１枚は無機充填剤が表面層の樹脂に
対して、１０〜２００重量％含有されていることを特徴
とする印刷回路用積層板。1. The surface layer is made of a glass woven fabric impregnated with a thermosetting resin, and the intermediate layer is a glass nonwoven fabric impregnated with a resin containing 10 to 200% by weight of an inorganic filler with respect to the thermosetting resin. In the laminated plate consisting of, two or more glass woven fabrics impregnated with the thermosetting resin of each surface layer are used, and at least one of them has an inorganic filler in an amount of 10 to 200% by weight based on the resin of the surface layer. A laminated board for a printed circuit, characterized in that it is contained.