JPH0655449B2 - Glass-based epoxy resin laminate processing method - Google Patents
Glass-based epoxy resin laminate processing methodInfo
- Publication number
- JPH0655449B2 JPH0655449B2 JP61298228A JP29822886A JPH0655449B2 JP H0655449 B2 JPH0655449 B2 JP H0655449B2 JP 61298228 A JP61298228 A JP 61298228A JP 29822886 A JP29822886 A JP 29822886A JP H0655449 B2 JPH0655449 B2 JP H0655449B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- glass
- based epoxy
- resin laminate
- processing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Moulding By Coating Moulds (AREA)
- Laminated Bodies (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】 ［技術分野］ 本発明は、プリント配線板として用いられるガラス基材
エポキシ樹脂積層板の処理法に関するものである。Description: TECHNICAL FIELD The present invention relates to a method for treating a glass-based epoxy resin laminate used as a printed wiring board.
［背景技術］ ガラス基材エポキシ樹脂積層板は片面乃至両面に銅箔を
積層した銅張り積層板として作成することによって、プ
リント配線板の加工に用いられる。すなわち、表面の銅
箔をエッチング処理することによって回路パターンを作
成し、さらに電気部品を半田付けして実装してプリント
配線板として仕上げられるのである。しかしこのガラス
基材エポキシ樹脂積層板は寸法安定性が十分でなく、半
田レベラーやリフローソルダリングなどの工程で高温が
作用すると反りやねじれが発生し易く、部品の自動実装
が困難になるなどの問題が生じるものであった。BACKGROUND ART A glass-based epoxy resin laminate is used as a printed wiring board by making it as a copper-clad laminate in which copper foil is laminated on one side or both sides. That is, a circuit pattern is created by etching the copper foil on the surface, and then electrical components are soldered and mounted to complete a printed wiring board. However, this glass-based epoxy resin laminate does not have sufficient dimensional stability, and when high temperatures act in processes such as solder leveler and reflow soldering, warping and twisting easily occur, making it difficult to automatically mount components. There was a problem.
［発明の目的］ 本発明は、上記の点に鑑みて為されたものであり、ガラ
ス基材エポキシ樹脂積層板の寸法安定性を向上させるこ
とを目的とするものである。[Object of the Invention] The present invention has been made in view of the above points, and an object thereof is to improve the dimensional stability of a glass-based epoxy resin laminate.
［発明の開示］ しかして本発明に係るガラス基材エポキシ樹脂積層板の
処理法は、ガラス基材エポキシ樹脂積層板をエポキシ樹
脂のガラス転位点以上の温度に加熱するエージングをお
こなったのちに、このガラス転位点以上の温度のガラス
基材エポキシ樹脂積層板をイオン交換水中に入れて急冷
することを特徴とするものであり、以下本発明を詳細に
説明する。DISCLOSURE OF THE INVENTION However, the method for treating a glass-based epoxy resin laminate according to the present invention, after performing aging for heating the glass-based epoxy resin laminate to a temperature equal to or higher than the glass transition point of the epoxy resin, The present invention is characterized in that a glass-based epoxy resin laminated plate having a temperature equal to or higher than the glass transition point is put into ion-exchanged water and rapidly cooled. The present invention will be described in detail below.
ガラス基材エポキシ樹脂積層板は、ガラス布を基材とし
これにエポキシ樹脂のワニスを含浸して乾燥することで
作成したプリプレグを複数枚重ね、これを加熱加圧成形
することによって製造される。このときプリプレグの最
外面に銅箔を重ねて加熱加圧成形をおこなうことによっ
て片面銅張り乃至両面銅張りのガラス基材エポキシ樹脂
積層板を得ることができる。そしてこのように製造され
たガラス基材エポキシ樹脂積層板をまず加熱してエージ
ングする。このエージングの際の加熱温度はエポキシ樹
脂のガラス転位点以上に設定されるものである。上限は
特に限定されないが、エポキシ樹脂を変質劣化させない
温度にする必要があり、また銅箔に接着剤などの処理が
してある場合にはこの処理剤を変質させない温度にする
必要がある。具体的には１３０〜１８０℃が一般に好ま
しい。このようにエージング加熱したのちに、ガラス基
材エポキシ樹脂積層板を水に浸漬してガラス転位点以下
の温度に急冷する。ここで、エージング加熱したのちに
室内に放置して徐冷すると、ガラス基材エポキシ樹脂積
層板はかえって寸法変化率が大きくなったり反りやねじ
れが発生し易くなったり、さらにその縦と横の寸法変化
のばらつきが大きくなる傾向がある。このために本発明
ではエージングののちに水によって急冷するものであ
る。また急冷はガラス基材エポキシ樹脂積層板の温度が
エポキシ樹脂のガラス転位点よりも高い状態でおこなわ
れるものであり、ガラス基材エポキシ樹脂積層板の温度
がエポキシ樹脂のガラス転位点よりも低くなった状態で
急冷したのでは効果が得られない。急冷のために用いる
水としては、ガラス基材エポキシ樹脂積層板の外観を損
ねたりすることを防止するために、イオン交換して不純
物イオンが存在しないイオン交換水を用いることが好ま
しく、水温は２０℃程度の室温の温度でよい。The glass-based epoxy resin laminate is manufactured by stacking a plurality of prepregs prepared by impregnating a glass cloth with a varnish of epoxy resin and drying the glass cloth as a base material, and heat-pressing the prepregs. At this time, a copper foil is laminated on the outermost surface of the prepreg and subjected to heat and pressure molding to obtain a glass base epoxy resin laminated plate having one side copper-clad or both sides copper-clad. Then, the glass-based epoxy resin laminated plate thus manufactured is first heated and aged. The heating temperature during this aging is set to be equal to or higher than the glass transition point of the epoxy resin. The upper limit is not particularly limited, but it is necessary to set the temperature at which the epoxy resin is not deteriorated and deteriorated, and when the copper foil is treated with an adhesive or the like, it is necessary to keep the temperature at which the treating agent is not deteriorated. Specifically, 130 to 180 ° C. is generally preferable. After aging and heating in this way, the glass-based epoxy resin laminate is immersed in water and rapidly cooled to a temperature below the glass transition point. Here, if the glass-based epoxy resin laminated plate has a large dimensional change rate or is susceptible to warpage or twisting, if it is left to stand in a room and then gradually cooled after being subjected to aging heating. The variation tends to be large. Therefore, in the present invention, the material is rapidly cooled with water after aging. Further, the quenching is performed in a state where the temperature of the glass-based epoxy resin laminate is higher than the glass transition point of the epoxy resin, and the temperature of the glass-based epoxy resin laminate is lower than the glass transition point of the epoxy resin. The effect cannot be obtained if it is rapidly cooled in the open state. As the water used for the rapid cooling, it is preferable to use ion-exchanged water which is ion-exchanged and has no impurity ions in order to prevent the appearance of the glass-based epoxy resin laminate from being impaired, and the water temperature is 20. A room temperature of about ℃ may be used.
次ぎに本発明を実施例によって例証する。The invention will now be illustrated by the examples.
実施例 厚み１８μの銅箔を両面に張った厚み１．６mmのガラス
布基材エポキシ樹脂積層板を１７５℃で３０分間エージ
ング処理し、次いで１分経過する以内にこのガラス布基
材エポキシ樹脂積層板を２０℃のイオン交換水中に入
れ、急冷した。こののちに水切りをおこない、８０℃で
３０分間乾燥した。EXAMPLE A glass cloth base material epoxy resin laminate having a thickness of 1.6 mm in which a copper foil having a thickness of 18 μ is stretched on both sides is aged at 175 ° C. for 30 minutes, and then within 1 minute, the glass cloth base material epoxy resin laminate is laminated. The plate was placed in ion exchange water at 20 ° C. and quenched. After that, water was drained and dried at 80 ° C. for 30 minutes.
比較例１ 実施例で用いたのと同じガラス布基材エポキシ樹脂積層
板について、実施例と同じ条件でエージング処理したの
ち、室内にそのまま放置して自然放冷させ、徐冷した。Comparative Example 1 The same glass cloth substrate epoxy resin laminate as that used in the example was subjected to an aging treatment under the same conditions as in the example, and then allowed to stand in a room as it is to be naturally cooled and then gradually cooled.
上記実施例及び比較例１で処理したガラス布基材エポキ
シ樹脂積層板と、エージング処理していない実施例１で
用いたのと同じガラス布基材エポキシ樹脂積層板（比較
例２）について、その表面粗度、寸法変化率、反りねじ
れについて測定した。ここで「表面粗度」は、積層板の
表面を東京精密株式会社製の表面粗度測定器によって測
定をおこなった。また「寸法変化率」は、積層板の銅箔
を全面エッチング除去して１７０℃で１時間乾燥する処
理の前後の寸法の変化率を測定スパン２００mmで三次元
座標測定機にて測定をおこなった。さらに「反りねじ
れ」は、積層板の銅箔を全面エッチング除去して１７０
℃で１時間乾燥する処理の前後の反りやねじれの最大値
を２５０×２５０mmの寸法の試験片について鋼尺で測定
した。結果を次表に示す。次表において「縦」はガラス
布基材エポキシ樹脂積層板におけるガラス布の長手方向
と平行な向きを、「横」はこれと直角な向きをそれぞれ
示し、また「寸法変化率」において△印は収縮率をその
他は膨張率を示す。Regarding the glass cloth base epoxy resin laminated plate treated in the above Examples and Comparative Example 1 and the same glass cloth base epoxy resin laminated plate (Comparative Example 2) used in Example 1 not subjected to aging treatment, The surface roughness, the dimensional change rate, and the warp twist were measured. Here, the "surface roughness" was obtained by measuring the surface of the laminated plate with a surface roughness measuring instrument manufactured by Tokyo Seimitsu Co., Ltd. The "dimensional change rate" was measured by a three-dimensional coordinate measuring machine with a measuring span of 200 mm before and after the copper foil of the laminated plate was entirely etched and dried at 170 ° C for 1 hour. . Furthermore, "warp twist" is 170% by etching and removing the copper foil of the laminated board.
The maximum values of warpage and twist before and after the treatment of drying at 1 ° C. for 1 hour were measured with a steel scale on a test piece having a size of 250 × 250 mm. The results are shown in the table below. In the following table, "longitudinal" indicates the direction parallel to the longitudinal direction of the glass cloth in the glass cloth base epoxy resin laminated plate, "horizontal" indicates the direction perpendicular to this, and in the "dimensional change rate", a triangle indicates The contraction rate and others indicate the expansion rate.
表の結果、エージング処理したあとに急冷するようにし
た実施例のものでは、処理をおこなわない比較例２のも
のよりも寸法変化率と反りねじれのいずれも小さくする
ことができ、寸法安定性を高める効果があることが確認
され、さらに表面粗度も大きく低下することがないこと
が確認される。またエージング処理したあと徐冷するよ
うにした比較例１のものでは処理をおこなわない比較例
２のものよりもむしろ寸法変化率と反りねじれのいずれ
もが大きくなる傾向が見られ、さらに表面粗度も悪化す
る傾向が見られる。 As a result of the table, in the example of which the cooling is performed after the aging treatment, both the dimensional change rate and the warp twist can be made smaller than those of the comparative example 2 in which the treatment is not performed, and the dimensional stability is improved. It is confirmed that the effect of increasing the surface roughness is obtained, and that the surface roughness is not significantly reduced. Further, in the case of Comparative Example 1 in which aging treatment is followed by slow cooling, both the dimensional change rate and the warp twist tend to be larger than those in Comparative Example 2 in which no treatment is performed, and the surface roughness is further increased. Also tends to get worse.
［発明の効果］ 上述のように本発明にあっては、ガラス基材エポキシ樹
脂積層板をエポキシ樹脂のガラス転位点以上の温度に加
熱するエージングをおこなったのちに、このガラス転位
点以上の温度のガラス基材エポキシ樹脂積層板をイオン
交換水中に入れて急冷するようにしたものであるから、
ガラス基材エポキシ樹脂積層板の寸法安定性を高めるこ
とができ、寸法変化や反りねじれを小さくすることがで
きるものである。またガラス転位点以上の温度のガラス
基材エポキシ樹脂積層板をイオン交換水中に入れて急冷
することによって、イオン交換水によって急冷されるガ
ラス基材エポキシ樹脂積層板はイオン交換水から何の影
響も受けることなく急冷されることになり、ガラス基材
エポキシ樹脂積層板の外観を損ねたりすることがないよ
うにすることができ、さらにガラス基材エポキシ樹脂積
層板を急冷するのに大掛かりな設備を必要とせず、簡単
な装置と工程で急冷することができるものである。[Effects of the Invention] As described above, in the present invention, after aging by heating the glass-based epoxy resin laminate to a temperature not lower than the glass transition point of the epoxy resin, the temperature not lower than this glass transition point. Since the glass-based epoxy resin laminated plate of is put into ion-exchanged water to be rapidly cooled,
The dimensional stability of the glass-based epoxy resin laminate can be enhanced, and dimensional change and warp twist can be reduced. Also, by putting a glass-based epoxy resin laminate at a temperature above the glass transition point in ion-exchanged water and quenching it, the glass-based epoxy resin laminate is rapidly cooled by ion-exchanged water. It will be cooled rapidly without receiving it, it will be possible to prevent the appearance of the glass-based epoxy resin laminated plate from being damaged, and moreover, large-scale equipment will be needed to rapidly cool the glass-based epoxy resin laminated plate. It is not necessary and can be rapidly cooled with a simple device and process.
Claims (1)
樹脂のガラス転位点以上の温度に加熱するエージングを
おこなったのちに、このガラス転位点以上の温度のガラ
ス基材エポキシ樹脂積層板をイオン交換水中に入れて急
冷することを特徴とするガラス基材エポキシ樹脂積層板
の処理法。1. A glass-based epoxy resin laminate is subjected to aging by heating the glass-based epoxy resin laminate to a temperature above the glass transition point of the epoxy resin, and then the glass-based epoxy resin laminate at a temperature above this glass transition point is subjected to ion exchange. A method for treating a glass-based epoxy resin laminate, which is characterized by placing in water and quenching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61298228A JPH0655449B2 (en) | 1986-12-15 | 1986-12-15 | Glass-based epoxy resin laminate processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61298228A JPH0655449B2 (en) | 1986-12-15 | 1986-12-15 | Glass-based epoxy resin laminate processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63151436A JPS63151436A (en) | 1988-06-24 |
| JPH0655449B2 true JPH0655449B2 (en) | 1994-07-27 |
Family
ID=17856888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61298228A Expired - Fee Related JPH0655449B2 (en) | 1986-12-15 | 1986-12-15 | Glass-based epoxy resin laminate processing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0655449B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6226232B2 (en) * | 2012-11-12 | 2017-11-08 | パナソニックＩｐマネジメント株式会社 | Metal-clad laminate, metal-clad laminate production method, printed wiring board, multilayer printed wiring board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5941262A (en) * | 1982-08-31 | 1984-03-07 | 松下電工株式会社 | Manufacture of laminated board |
| JPS59129490A (en) * | 1983-01-14 | 1984-07-25 | 松下電工株式会社 | Method of producing laminated board |
| JPS6189694A (en) * | 1984-10-09 | 1986-05-07 | ソニー株式会社 | Method and apparatus for correcting shape of printed circuitboard |
-
1986
- 1986-12-15 JP JP61298228A patent/JPH0655449B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63151436A (en) | 1988-06-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |