JPH0752788B2 - Method of forming printed wiring board - Google Patents
Method of forming printed wiring boardInfo
- Publication number
- JPH0752788B2 JPH0752788B2 JP33452188A JP33452188A JPH0752788B2 JP H0752788 B2 JPH0752788 B2 JP H0752788B2 JP 33452188 A JP33452188 A JP 33452188A JP 33452188 A JP33452188 A JP 33452188A JP H0752788 B2 JPH0752788 B2 JP H0752788B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- copper foil
- forming
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、各種のエレクトロニクス機器に使用されるプ
リント配線板の形成方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a printed wiring board used in various electronic devices.
従来の技術 従来のプリント配線板の形成方法は、セルローズペーパ
ーまたはガラス布等のライニング材にフェノールエポキ
シ、ポリイミドのいずれか一方、または双方を配合した
樹脂を含浸させた基材の１枚または複数枚を、銅箔とと
もに160〜230℃の加熱状況下でプレスし、樹脂板成型と
銅箔の被着とを同時に行う方法であった。この方法で使
用されるライニング材、樹脂ならびに銅箔は、そのいず
れもがプラスの温度係数を持つため、常温に冷却したの
ちに大きな応力の残留がなく、反りやねじれ等の少ない
平坦なプリント配線板を形成することが可能であった。2. Description of the Related Art A conventional method for forming a printed wiring board is as follows. One or a plurality of base materials obtained by impregnating a lining material such as cellulose paper or glass cloth with a resin containing one or both of phenol epoxy and polyimide. Was pressed together with a copper foil under a heating condition of 160 to 230 ° C., and the resin plate molding and the copper foil deposition were simultaneously performed. The lining materials, resins, and copper foils used in this method all have a positive temperature coefficient, so there is no large residual stress after cooling to room temperature, and flat printed wiring with little warpage or twisting. It was possible to form a plate.
発明が解決しようとする課題 このような方法で形成された従来のプリント配線板は、
これに取り付けられる電子部品が樹脂外装を有するであ
るときには電子部品との間で均一な接合状態を保持す
る。しかしながら、電子部品がセラミックス外装を有す
るものであると、電子部品との熱膨張係数が異なるため
に均一な接合状態を保持することができなくなる。Problems to be Solved by the Invention A conventional printed wiring board formed by such a method is
When the electronic component attached to this has a resin exterior, it maintains a uniform bonded state with the electronic component. However, if the electronic component has a ceramic exterior, it is not possible to maintain a uniform bonded state because the thermal expansion coefficient of the electronic component is different from that of the electronic component.
この問題を解決できるプリント配線板として、アーラミ
ドファイバーからなる布または紙のラインフォースメン
トにエポキシ樹脂を芳香族アミンアミダクト硬化剤とと
もに含浸させて形成した基材の両面に銅箔を被着させた
構造のプリント配線板が出現している。この構造のプリ
ント配線板では、ラインフォースメントがマイナスの熱
膨張係数を有し、エポキシ樹脂を約60vol.％含浸させた
とき、アルミナ磁器の熱膨張係数と同じ6.5ppmとなり、
セラミック外装を有する電子部品との温度膨張の差を−
55〜＋125℃の範囲で解消することができる。As a printed wiring board that can solve this problem, copper foil is attached to both sides of the base material formed by impregnating the line force of cloth or paper made of aramide fiber with epoxy resin together with the aromatic amine amidact curing agent. Printed wiring boards with different structures are emerging. In the printed wiring board with this structure, the line force has a negative coefficient of thermal expansion, and when impregnated with an epoxy resin of about 60 vol.%, It becomes 6.5 ppm, which is the same as the coefficient of thermal expansion of alumina porcelain.
Difference in temperature expansion from electronic parts with ceramic exterior
It can be resolved within the range of 55 to + 125 ° C.
しかしながら、このプリント配線板の形成過程、すなわ
ち、基材に銅箔を被着するための加熱処理が終了し、被
着された銅箔が冷却収縮する際にプラスの熱膨張係数を
もつ含浸樹脂の収縮とマイナスの膨張係数をもつライン
フォースメントの膨張によって、残留応力の発生した状
態となることがある。ところで、基材に被着された銅箔
をパターエッチングした場合、上記のように残留応力の
発生した状態が成立していると、パターエッチングされ
た部分が応力から開放されるため、銅箔パターンには0.
2〜0.3％程度の伸びが生じ、このことによりプリント配
線板に反り、ねじれ、波打ち現象などが発生する。However, the process of forming this printed wiring board, that is, the heat treatment for depositing the copper foil on the substrate is completed, and the impregnated resin having a positive coefficient of thermal expansion when the deposited copper foil cools and shrinks. Residual stress may be generated due to the contraction of and the expansion of the line force with a negative expansion coefficient. By the way, when the copper foil deposited on the base material is putter-etched, if the state in which the residual stress is generated as described above is satisfied, the part that is putter-etched is released from the stress, and thus the copper foil pattern Is 0.
Elongation of about 2 to 0.3% occurs, which causes the printed wiring board to warp, twist, or wavy.
課題を解決するための手段 本発明は、アーラミドファイバーからなる布または紙の
ラインフォースメントにエポキシ樹脂を芳香族アミンア
ダクト硬化剤とともに含浸させて形成した基材の両面に
銅箔を被着させた構造のプリント配線板における問題点
の排除を意図してなれたもので、伸縮の温度係数がマイ
ナスであるアーラミドファイバーからなる布または紙
に、伸縮の温度係数がプラスである樹脂を含浸させて形
成した基材を、銅箔とともに圧熱成型して銅張基材を形
成したのち、前記銅箔にパターエッチングを施し、次い
で、前記樹脂のガラス転移温度以上、はんだ付け温度以
下の温度範囲に設定された熱エージングを施す方法であ
る。Means for Solving the Problems The present invention is to apply a copper foil to both sides of a base material formed by impregnating an epoxy resin with an aromatic amine adduct curing agent into a line force of cloth or paper made of aramide fiber. With the intention of eliminating problems in printed wiring boards with a different structure, a cloth or paper made of aramide fiber with a negative expansion / contraction temperature coefficient is impregnated with a resin with a positive expansion / contraction temperature coefficient. After forming the base material formed by pressing with copper foil to form a copper-clad base material, putter etching is performed on the copper foil, and then set to a temperature range of the glass transition temperature of the resin or higher and the soldering temperature or lower. This is a method of applying heat aging.
作用 本発明のプリント配線板の形成方法によれば、アーラミ
ドファイバーからなる布または紙と含浸樹脂との接着力
が一時的に弱まって応力緩和が起こり、パターンエッチ
ング後の銅箔パターン部分の応力解放が回避される。Effect According to the method for forming a printed wiring board of the present invention, stress relaxation occurs due to the temporary weakening of the adhesive force between the cloth or paper made of aramide fiber and the impregnated resin, and the stress of the copper foil pattern portion after pattern etching. Release is avoided.
実施例 以下に、図面を参照して本発明を詳細に説明する。Examples Hereinafter, the present invention will be described in detail with reference to the drawings.
第１図は、本発明にかかるプリント配線板の形成方法の
一実施例を説明するための工程順断面図であり、まず、
アーラミドファイバーからなり、寸法が330×330mmの布
または紙１を準備する［第１図（ａ）］。次いで、エポ
キシ樹脂を含浸させて基材２を形成する［第１図
（ｂ）］。さらに、２枚の基材２を積層配置するととも
に、その両面に厚さが35μｍの銅箔３を配置し、これら
を170℃の加熱状況下で85分間にわたりプレスして第１
図（ｃ）で示す両面銅張積層体４を形成する。なお、基
材２がアーラミドファイバーからなる布を用いたもので
あるときの両面銅張積層体４の厚さは1.6mm、また、基
材２がアーラミドファイバーからなる紙を用いたもので
あるときの両面銅張積層体４の厚さは0.4mmとした。FIG. 1 is a process sequence cross-sectional view for explaining an embodiment of the method for forming a printed wiring board according to the present invention.
Prepare a cloth or paper 1 made of aramide fiber and having dimensions of 330 × 330 mm [FIG. 1 (a)]. Then, an epoxy resin is impregnated to form the base material 2 [FIG. 1 (b)]. Further, two base materials 2 are laminated and arranged, and a copper foil 3 having a thickness of 35 μm is arranged on both surfaces thereof, and these are pressed under a heating condition of 170 ° C. for 85 minutes to make a first
The double-sided copper clad laminate 4 shown in FIG. The thickness of the double-sided copper-clad laminate 4 is 1.6 mm when the base material 2 is a cloth made of aramide fiber, and the base material 2 is a paper made of aramide fiber. The thickness of the double-sided copper-clad laminate 4 at one time was 0.4 mm.
以上の処理工程を経て形成されたれた両面銅張積層体４
に対して、銅箔３を所定の配線層とするためのパターエ
ッチングを施すことによって、第２図で示すように、銅
箔パターン５を形成する。次いで、エージング処理を施
すわけであるが、本発明の方法では、両面銅張積層体４
の構成主体である含浸樹脂のガラス転移温度が160℃、
はんだ付け温度が215℃であることを考慮して、エージ
ング条件を215℃、３分間とした。Double-sided copper clad laminate 4 formed through the above processing steps
On the other hand, the copper foil pattern 5 is formed as shown in FIG. 2 by performing the pattern etching for making the copper foil 3 into a predetermined wiring layer. Next, an aging treatment is performed. In the method of the present invention, the double-sided copper clad laminate 4 is used.
The glass transition temperature of the impregnated resin, which is the main constituent of
Considering that the soldering temperature was 215 ° C, the aging condition was 215 ° C for 3 minutes.
第３図は、以上説明してきた本発明の形成方法と従来の
形成方法の違いをより一層明確にするために示した形成
工程フローチャートであり、本発明の形成方法（ａ）で
は、エッチング後に215℃のエージングが実施される点
で従来の形成方法（ｂ）と著しく相違している。FIG. 3 is a flow chart of the forming process shown in order to further clarify the difference between the forming method of the present invention described above and the conventional forming method. In the forming method (a) of the present invention, 215 is shown after etching. This is significantly different from the conventional forming method (b) in that the aging at ℃ is performed.
第３図のフローチャートで示した工程を経た後の銅箔パ
ターンの伸びを比較確認した実験の結果は下表の通りで
あり、はんだ付け（リフロー）後の伸びに関して、著し
い改善効果のあったことが確認された。The results of the experiment comparing and confirming the elongation of the copper foil pattern after going through the process shown in the flowchart of Fig. 3 are as shown in the table below, and there was a significant improvement effect on the elongation after soldering (reflow). Was confirmed.
発明の効果 以上説明したように、本発明のプリント配線板の形成方
法によれば、著しいエージング効果が奏され、プリント
配線板に反り、ねじれ、波打ち現象などが発生する不都
合を確実に排除することができ、寸法精度を±0.01％以
内に保つことができた。したがって、ソルダーレジスト
の印刷とはんだクリームの印刷に用いるマスクはエッチ
ングのマスクと同じ寸法でよく、修正や伸びしろ、縮み
しろの設定を不要とする効果が奏される。さらに、−55
〜＋150℃の範囲にわたってアルミナ磁器と同じ6.5ppm
の熱膨張係数が得られるため、セラミック外装を有する
電子部品との温度膨張の差を広い温度範囲で解消するこ
とが可能となり、各種電子部品の搭載精度およびはんだ
付け精度の向上、はんだ付け後の差動応力の低減をはか
ることのできる信頼性の高いプリント配線板が実現され
る。 EFFECTS OF THE INVENTION As described above, according to the method for forming a printed wiring board of the present invention, a remarkable aging effect is exhibited, and it is possible to surely eliminate the inconvenience that the printed wiring board is warped, twisted, or wavy. The dimensional accuracy could be kept within ± 0.01%. Therefore, the mask used for printing the solder resist and the solder cream may have the same size as the etching mask, and the effect of eliminating the need for setting correction, expansion, and contraction is obtained. Furthermore, −55
6.5ppm same as alumina porcelain over the range of + 150 ℃
Since the coefficient of thermal expansion can be obtained, it is possible to eliminate the difference in temperature expansion with an electronic component having a ceramic exterior over a wide temperature range, improve the mounting accuracy and soldering accuracy of various electronic components, and A highly reliable printed wiring board capable of reducing differential stress is realized.
第１図は、本発明にかかるプリント配線板の形成方法の
一実施例を説明するための工程順断面図、第２図は、銅
箔パターンの形成された状態を示す断面図、第３図は、
本発明の形成方法と従来の形成方法の違いをより一層明
確にするために示した形成工程フローチャートである。 １……アーラミドファイバーからなる布または紙、２…
…エポキシ樹脂含浸の基材、３……銅箔、４……両面銅
張積層体、５……銅箔パターンFIG. 1 is a sectional view in order of steps for explaining an embodiment of a method for forming a printed wiring board according to the present invention, FIG. 2 is a sectional view showing a state in which a copper foil pattern is formed, and FIG. Is
7 is a flowchart of forming steps shown to further clarify the difference between the forming method of the present invention and the conventional forming method. 1 ... Cloth or paper made of aramide fiber, 2 ...
… Epoxy resin-impregnated substrate, 3 …… Copper foil, 4 …… Double-sided copper clad laminate, 5 …… Copper foil pattern
Claims (1)
ドファイバーからなる布または紙に、伸縮の温度係数が
プラスである樹脂を含浸させて形成した基材を、銅箔と
ともに圧熱成型して銅張基材を形成したのち、前記銅箔
にパターンエッチングを施し、次いで、前記樹脂のガラ
ス転移温度以上、はんだ付け温度以下の温度範囲に設定
した熱エージングを施すことを特徴とするプリント配線
板の形成方法。1. A base material formed by impregnating a cloth or paper made of aramide fiber having a negative temperature coefficient of expansion and contraction with a resin having a positive temperature coefficient of expansion and pressure molding together with a copper foil. After forming a copper-clad base material, pattern etching is performed on the copper foil, and then thermal aging is performed in a temperature range of the glass transition temperature of the resin or more and the soldering temperature or less, thereby forming a printed wiring board. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33452188A JPH0752788B2 (en) | 1988-12-28 | 1988-12-28 | Method of forming printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33452188A JPH0752788B2 (en) | 1988-12-28 | 1988-12-28 | Method of forming printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH031590A JPH031590A (en) | 1991-01-08 |
| JPH0752788B2 true JPH0752788B2 (en) | 1995-06-05 |
Family
ID=18278332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33452188A Expired - Fee Related JPH0752788B2 (en) | 1988-12-28 | 1988-12-28 | Method of forming printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0752788B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2601128B2 (en) * | 1992-05-06 | 1997-04-16 | 松下電器産業株式会社 | Method of manufacturing circuit forming substrate and circuit forming substrate |
| JP6226232B2 (en) * | 2012-11-12 | 2017-11-08 | パナソニックＩｐマネジメント株式会社 | Metal-clad laminate, metal-clad laminate production method, printed wiring board, multilayer printed wiring board |
-
1988
- 1988-12-28 JP JP33452188A patent/JPH0752788B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH031590A (en) | 1991-01-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
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|
| R250 | Receipt of annual fees |
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| LAPS | Cancellation because of no payment of annual fees |