CN103624418B - A kind of low silver copper-base filler metals and preparation method thereof - Google Patents
A kind of low silver copper-base filler metals and preparation method thereof Download PDFInfo
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- CN103624418B CN103624418B CN201310673027.2A CN201310673027A CN103624418B CN 103624418 B CN103624418 B CN 103624418B CN 201310673027 A CN201310673027 A CN 201310673027A CN 103624418 B CN103624418 B CN 103624418B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
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Abstract
The present invention relates to a kind of low silver copper-base filler metals and preparation method thereof, low silver copper-base filler metals contains Ag, Cu and P, also added Sn, Ni and rare earth, each weight percentages of components is: the Ni of the Sn of P, 5-7% of Ag, 5.5-6.6% of 1.5-2.5%, 1.0-2.5%, rare earth≤0.05%, surplus are Cu; Sn is first prepared into filament Sn melting again by the preparation method of low silver copper-base filler metals, obtains brazing material by continuous casting, even crowded, shaping, cleaning.The formula Design of solder of the present invention is reasonable, and brazing filler metal melts temperature is lower, wetability, good fluidity, soldered fitting steady quality, long service life; BCu80AgP copper-phosphorus brazing alloy can be replaced, greatly reduce the production cost of motor soldering.The preparation method of solder of the present invention effectively can solve the segregation problems of Sn, and preparation technology is optimized, and the solder quality prepared significantly improves.
Description
Technical field
The present invention relates to a kind of low silver copper-base filler metals and preparation method thereof, be applicable to the soldering of the industry such as motor, machinery, belong to brazing material field.
Background technology
In recent years, due to continuous fierceness and the limited Precious Metals Resources of market competition, the brazing material being usually used in the industry such as machinery, motor is proposed to the requirement of " reduce costs, reduce noble metal silver consumption ", for replacing the BCu80AgP at the common argentiferous 15% of electromechanics trade, the brazing material that the silver content requiring solder manufacturer to develop to make new advances is lower.
The copper-phosphorus brazing alloy that silver content common is in the market less, as the BCu89PAg copper-phosphorus brazing alloy of argentiferous 5%, the BCu91PAg copper-phosphorus brazing alloy etc. of argentiferous 2%, although these copper-phosphorus brazing alloy prices are lower, but the decay resistance of soldered fitting, anti-fatigue performance etc. all do not reach instructions for use, motor does not reach during soldering the result of use of BCu80AgP, therefore cannot meet the requirement of client.
Also there is now some performances solder relatively preferably, if publication date is on 07 28th, 2010, publication number is in the Chinese patent of CN101786208A, disclose a kind of novel active copper-phosphorus brazing alloy, although the content of Ag is lower in this solder, but creep strength relative deficiency after its soldering motor, is difficult to substitute BCu80AgP copper-phosphorus brazing alloy completely.
In sum, also do not have a kind of formula Design reasonable at present, be suitable for the low silver-bearing copper phosphorus brazing alloy of motor soldering.The solidus of existing low silver-bearing copper phosphorus brazing alloy and liquidus temperature interval are too large, and high silver-bearing copper phosphorus brazing alloy silver content is higher, produce and use cost high, will can not meet user demand in soldering on motor gradually, thus hinder the development of solder in electromechanics trade.
On the other hand, in industry, the melting containing Sn copper base solder easily being there is to the segregation of Sn, cause the copper base solder Composition Control containing Sn not good, causing solder performance not enough, in the urgent need to developing a kind of smelting preparation process can avoiding Sn segregation.
China Patent No. 200510023129.5 discloses the patent that name is called " a kind of copper-base brazing alloy ", it is selective in the copper-base brazing alloy (i.e. copper base solder) of routine adds manganese, zinc, silver, nickel, silicon, tin, aluminium, lithium, rare earth, welding technological properties is close with silver solder, and cost is lower than general silver solder more than 1 times; But this brazing alloy can not replace the BCu80AgP at the common argentiferous 15% of electromechanics trade, in patent and the scheme of not mentioned solution Sn segregation problems, do not overcome above-mentioned defect of the prior art yet.
China Patent No. 200710102635.2 discloses the patent that name is called the copper-phosphorus brazing alloy of nickel " stanniferous and ", it is except traditional copper-phosphorus brazing alloy constitution element, also comprise tin (Sn) and nickel (Ni), tensile strength is better, and not containing silver element, operating temperature reduces, soldering can operate at low temperatures, and reduce oxidation and the deformation of base material, cost reduces; But this brazing alloy can not replace the BCu80AgP at the common argentiferous 15% of electromechanics trade, in patent and the scheme of not mentioned solution Sn segregation problems, do not overcome above-mentioned defect of the prior art yet.
China Patent No. 200910097437.0 discloses the patent that name is called " a kind of low silver copper base medium temperature brazing filler ", it with the addition of P, In, Ni, Ga in copper base solder, and Ag content is only 1.8%-5%, can replace completely BAg25CuZnSn silver solder for freezing, the soldering of the industry such as machinery, electromechanics, electrical equipment, instrument and meter, valve pipe fitting; But this solder can not replace the BCu80AgP at the common argentiferous 15% of electromechanics trade, not containing Sn in formula, do not overcome above-mentioned defect of the prior art yet.
Summary of the invention
The object of the invention is to overcome above shortcomings in prior art, and provide that a kind of formula Design is reasonable, price is low, cost performance is high, the low silver copper-base filler metals of fusion temperature narrow range, joint performance excellence.
The present invention's adopted technical scheme that solves the problem is: this low silver copper-base filler metals contains Ag, Cu and P, it is characterized in that: also added Sn, Ni and rare earth; The each weight percentages of components of described low silver copper-base filler metals is: the Sn of the P of the Ag of 1.5-2.5%, 5.5-6.6%, 5-7 %, the Ni of 1.0-2.5%, rare earth≤0.05%, and surplus is Cu.
The each weight percentages of components of low silver copper-base filler metals described in the present invention is preferably: the Sn of the P of the Ag of 1.8-2.2%, 5.8-6.4%, 5.5-6.5 %, the Ni of 1.5-2.0%, rare earth≤0.03%, surplus is Cu.
The each weight percentages of components of low silver copper-base filler metals described in the present invention is more preferably: the Ag of 2.0%, the P of 6.1%, the Sn of 6.0 %, the Ni of 1.7%, the rare earth of 0.02%, surplus is Cu.
Solder of the present invention take Ag-Cu-P as matrix, and Cu is surplus, and other each compositions and content are determined in the following manner:
Ag: by considering performance and cost requirement, selects Ag content range to be 1.5 ~ 2.5%;
P: known with reference to Cu-P binary phase diagraml, is eutectic composition when P content is 8.4%, has minimum fusion temperature, but the Cu under this kind of composition in solder
3p brittlement phase is more, is unfavorable for the production and processing of solder, and can cause the decline of soldering joint strength; In hypoeutectic composition range, the rising of P content effectively can reduce the fusion temperature of solder, but when P content is greater than 6.6%, the Cu in solder
3p brittlement phase is more, is difficult to be processed into thread or strip, and declining also appears because of the existence of brittlement phase in weld strength, easily occurs fracture; For P content higher than 8.4% hypereutectic composition solder also there is a large amount of brittlement phase, and fusion temperature is higher, does not also have actual serviceability; For obtaining excellent serviceability, by lot of experiment validation, the P content of solder is decided to be 5.5%-6.6%;
Sn: for optimizing the brazing property of solder further, obtains the solder with good comprehensive brazing property, selects in solder, add chemical element Sn, mainly play the fusion temperature reducing solder, and improve wetability and the mobility of brazing filler metal alloy; But the content of Sn can not be too high, the content once Sn just easily forms Ag more than 7%
3sn and Cu
41sn
11frangible compounds, causes solder poor processability, cannot make solder finished product;
Ni: because Ni element can be solidly soluted into the effect playing solution strengthening in Cu matrix, can improve the intensity of solder, so select to add chemical element Ni, increases intensity, the toughness of solder; Ni element can also play the effect of the resistance to corrosion improving soldered fitting simultaneously, thus improves the comprehensive brazing property of solder; But the content of Ni can not be too high, by experiment, once the content of Ni is more than 2.5%, the fusion temperature of brazing filler metal alloy can be made to raise, and Ni can form Ni with P
3p brittlement phase, makes solder hardness increase, and is unfavorable for the further machine-shaping of solder;
Rare earth: adding trace rare-earth has regulating action to solder tissue, can the tissue of refinement brazing filler metal alloy, promotes the processing characteristics of solder, reduces the oxide content in ingot casting simultaneously, improve the wettability of solder.
The present invention also provides a kind of its preparation method of described low silver copper-base filler metals, and the technical scheme adopted is: the preparation method of this low silver copper-base filler metals, is characterized in that: to described Sn process before melting, the Sn of bulk is prepared into filamentous Sn; In fusion process, described Sn adds with the form of filament Sn; In fusion process, the described rare earth adding trace regulates solder tissue; After melting, then obtain brazing material by continuous casting, even crowded, shaping, cleaning.Because high Sn copper-phosphorus brazing alloy easily component segregation occurs when melting, cause during actual use and infusibility or cross flow occur, there is no the generation that perfect method can avoid segregation at present; Pretreatment is carried out to Sn, adds with the form of filament Sn in fusion process, increase the contact area of Sn and melt, be conducive to Sn and be uniformly distributed in liquation, the segregation problems of Sn can be solved.
The present invention is preferably in described step (2) i.e. fusion process, and the described rare earth adding trace regulates solder tissue.Add trace rare-earth and have regulating action to solder tissue, can the tissue of refinement brazing filler metal alloy, promote the processing characteristics of solder, reduce the oxide content in ingot casting simultaneously, improve the wettability of solder.
Described Ni and rare earth, before melting, are first carried out melting in advance with Cu, make intermediate alloy Cu-Ni and Cu-RE respectively, then carry out follow-up melting by the present invention.By Cu-Ni reasonable offer, reduce smelting temperature, avoid the too high transition loss causing other raw materials of smelting temperature; Meanwhile, by the preparation of Cu-RE, prevent a large amount of oxidations of oxidizable elements RE, reduce loss; According to the actual needs produced, adopt the mode of intermediate alloy Cu-Ni and Cu-RE prepared, and in molding procedure strict controlled working amount, in multi-step process, adopt intermediate annealing process simultaneously, effectively reduced the work hardening of material by above method; In addition, if do not adopt this technique, the product composition made has larger deviation.
The present invention, in fusion process, uses dry plant ash as coverture.Be coverture with charcoal in traditional smelting copper alloy process, and the present invention uses dry plant ash as coverture, plant ash has the advantages such as area coverage is large, covering is fine and close, effectively ensure that the oxidization burning loss of Sn and rare earth element in fusion process, decrease liquation suction hydrogen during refining and oxygen content.
The present invention compared with prior art, has the following advantages and effect:
1, the content of noble metal silver is few, reduces silver content about 13%, greatly reduce production cost, saved the consumption of noble metal silver, make the limited resources of silver can obtain more reasonably utilizing than BCu80AgP;
2, the mechanical strength of soldered fitting is high, compactness good, resistivity is low, joint corrosion resistance and creep strength outstanding, after client uses, to feed back soldering processes performance excellent, soldered fitting steady quality, there is good fatigue behaviour, effectively can promote the service life of soldered fitting; Process performance index requires with BCu80AgP copper-phosphorus brazing alloy suitable, and part index number, also higher than BCu80AgP copper-phosphorus brazing alloy, can substitute the soldering of BCu80AgP for electromechanics trade;
3, fusion temperature of the present invention is 570 DEG C ~ 690 DEG C, is starkly lower than conventional copper-phosphorus brazing alloy, can reduce brazing temperature during soldering, prevents mother metal overheated causing from rupturing;
4, adopt low silver copper-base filler metals of the present invention to carry out brazed copper joint, its tensile strength can reach more than 300MPa;
5, the connection in large and medium-sized alternating current generator between stator line and lead-out wire is applicable to.
The formula Design of low silver copper-base filler metals of the present invention is reasonable, and noble silver content is low, and cost performance is high; When for motor soldering, brazing filler metal melts temperature is lower, wetability, good fluidity, and soldered fitting steady quality has good fatigue behaviour, the long service life of soldered fitting; High comprehensive performance, can replace the BCu80AgP copper-phosphorus brazing alloy that the scope of application is wide, consumption is large, thus greatly can reduce the production cost of motor soldering.
The preparation method of low silver copper-base filler metals of the present invention effectively can solve the segregation problems of Sn, and preparation technology is optimized, and the solder quality prepared significantly improves.
Detailed description of the invention
Below by specific embodiment, the present invention is described in further detail, and following examples are explanation of the invention and the present invention is not limited to following examples.
See table 1-table 5, in each embodiment, each composition by weight percent and parameter are write exactly in table, table 1 is embodiment of the present invention 1-embodiment 6 data table related, table 2 is embodiment of the present invention 7-embodiment 12 data table related, table 3 is embodiment of the present invention 13-embodiment 18 data table related, table 4 is embodiment of the present invention 19-embodiment 24 data table related, and table 5 is embodiment of the present invention 25-embodiment 30 data table related.
Table 1 embodiment 1-embodiment 6 data table related.
| Component and parameter name | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 |
| Ag (% by weight) | 1.5 | 1.7 | 1.7 | 1.7 | 1.7 | 2.0 |
| P (% by weight) | 5.5 | 5.5 | 5.8 | 5.8 | 5.8 | 5.8 |
| Ni (% by weight) | 1.0 | 1.5 | 1.5 | 1.7 | 1.1 | 1.7 |
| Sn (% by weight) | 5.0 | 5.0 | 5.0 | 5.0 | 5.3 | 5.3 |
| Cu (% by weight) | Surplus | Surplus | Surplus | Surplus | Surplus | Surplus |
| RE (% by weight) | Nothing | Nothing | Nothing | Nothing | Nothing | Nothing |
| Brazing filler metal melts temperature (DEG C) | 610~670 | 613~674 | 613~667 | 615~671 | 605~653 | 602~659 |
| Solder tensile strength (MPa) | 350 | 354 | 348 | 356 | 351 | 348 |
Table 2 embodiment 7-embodiment 12 data table related.
| Component and parameter name | Embodiment 7 | Embodiment 8 | Embodiment 9 | Embodiment 10 | Embodiment 11 | Embodiment 12 |
| Ag (% by weight) | 2.0 | 2.0 | 2.0 | 2.2 | 2.2 | 2.2 |
| P (% by weight) | 6.1 | 6.1 | 6.1 | 6.1 | 6.3 | 6.3 |
| Ni (% by weight) | 1.7 | 2.0 | 2.0 | 2.0 | 2.0 | 2.2 |
| Sn (% by weight) | 5.3 | 5.3 | 5.6 | 5.6 | 5.6 | 5.6 |
| Cu (% by weight) | Surplus | Surplus | Surplus | Surplus | Surplus | Surplus |
| RE (% by weight) | Nothing | Nothing | Nothing | Nothing | Nothing | Nothing |
| Brazing filler metal melts temperature (DEG C) | 601~652 | 601~661 | 597~654 | 597~651 | 597~649 | 600~655 |
| Solder tensile strength (MPa) | 346 | 357 | 352 | 352 | 349 | 361 |
Table 3 embodiment 13-embodiment 18 data table related.
| Component and parameter name | Embodiment 13 | Embodiment 14 | Embodiment 15 | Embodiment 16 | Embodiment 17 | Embodiment 18 |
| Ag (% by weight) | 2.2 | 2.3 | 2.3 | 2.3 | 2.3 | 2.5 |
| P (% by weight) | 6.3 | 6.3 | 6.4 | 6.4 | 6.4 | 6.4 |
| Ni (% by weight) | 2.2 | 2.2 | 2.2 | 2.4 | 2.4 | 2.4 |
| Sn (% by weight) | 6.0 | 6.0 | 6.0 | 6.0 | 6.3 | 6.3 |
| Cu (% by weight) | Surplus | Surplus | Surplus | Surplus | Surplus | Surplus |
| RE (% by weight) | Nothing | Nothing | Nothing | Nothing | Nothing | Nothing |
| Brazing filler metal melts temperature (DEG C) | 595~647 | 592~645 | 592~642 | 597~652 | 587~645 | 583~641 |
| Solder tensile strength (MPa) | 358 | 355 | 353 | 352 | 363 | 361 |
Table 4 embodiment 19-embodiment 24 data table related.
| Component and parameter name | Embodiment 19 | Embodiment 20 | Embodiment 21 | Embodiment 22 | Embodiment 23 | Embodiment 24 |
| Ag (% by weight) | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 |
| P (% by weight) | 6.6 | 6.6 | 6.6 | 6.6 | 6.6 | 6.1 |
| Ni (% by weight) | 2.4 | 2.5 | 2.5 | 2.5 | 1.7 | 1.0 |
| Sn (% by weight) | 6.3 | 6.3 | 6.7 | 7.0 | 7.0 | 6.0 |
| Cu (% by weight) | Surplus | Surplus | Surplus | Surplus | Surplus | Surplus |
| RE (% by weight) | Nothing | Nothing | Nothing | Nothing | Nothing | 0.02 |
| Brazing filler metal melts temperature (DEG C) | 581~639 | 584~643 | 577~636 | 572~634 | 570~631 | 590~653 |
| Solder tensile strength (MPa) | 356 | 354 | 371 | 377 | 354 | 352 |
Table 5 embodiment 25-embodiment 30 data table related.
| Component and parameter name | Embodiment 25 | Embodiment 26 | Embodiment 27 | Embodiment 28 | Embodiment 29 | Embodiment 30 |
| Ag (% by weight) | 2.5 | 2.2 | 2.0 | 2.0 | 2.0 | 2.2 |
| P (% by weight) | 6.1 | 6.1 | 6.1 | 6.1 | 6.1 | 6.1 |
| Ni (% by weight) | 1.7 | 1.2 | 1.3 | 1.7 | 1.7 | 1.4 |
| Sn (% by weight) | 6.0 | 6.0 | 6.0 | 6.0 | 6.0 | 6.0 |
| Cu (% by weight) | Surplus | Surplus | Surplus | Surplus | Surplus | Surplus |
| RE (% by weight) | 0.03 | 0.02 | 0.02 | 0.03 | 0.05 | 0.05 |
| Brazing filler metal melts temperature (DEG C) | 595~663 | 593~662 | 595~665 | 603~670 | 602~670 | 592~658 |
| Solder tensile strength (MPa) | 356 | 349 | 351 | 361 | 361 | 351 |
The process performance index of low silver copper-base filler metals of the present invention requires suitable with BCu80AgP silver solder, part index number is also better than BCu80AgP copper-phosphorus brazing alloy, make low silver copper-base filler metals of the present invention can replace the soldering of BCu80AgP copper-phosphorus brazing alloy for the industry such as motor, machinery completely, and greatly reduce the content of noble metal silver, reduce production cost, there is good economic and social benefit.
The preparation method of embodiment 1-6 comprises the following steps:
(1) pretreatment before melting: before melting, to Sn process, is prepared into filamentous Sn by the Sn of bulk;
(2) melting: in fusion process, Sn adds with the form of filament Sn, increases the contact area of Sn and melt, is conducive to Sn and is uniformly distributed in liquation, solves the segregation problems of Sn; Use dry plant ash as coverture, plant ash have area coverage large, cover the advantages such as fine and close, effectively reduce the oxidization burning loss of Sn in fusion process, decrease liquation suction hydrogen during refining and oxygen content;
(3) melting subsequent treatment: after melting, then obtain brazing material by continuous casting, even crowded, shaping, cleaning.
The preparation method of embodiment 7-12 comprises the following steps:
(1) pretreatment before melting: before melting, to Sn process, is prepared into filamentous Sn by the Sn of bulk;
(2) melting: in fusion process, first adds Cu, P, Ni, Ag element time reinforced, adds Sn until completely melted, adds the effect that coverture plays insulation, prevents the scaling loss of oxidizable element after having fed in raw material immediately; Sn adds with the form of filament Sn, increases the contact area of Sn and melt, is conducive to Sn and is uniformly distributed in liquation, solves the segregation problems of Sn; Use dry plant ash as coverture, plant ash have area coverage large, cover the advantages such as fine and close, effectively reduce the oxidization burning loss of Sn in fusion process, decrease liquation suction hydrogen during refining and oxygen content;
(3) melting subsequent treatment: after melting, then obtain brazing material by continuous casting, even crowded, shaping, cleaning.
The preparation method of embodiment 13-23 comprises the following steps:
(1) pretreatment before melting: before melting, to Sn process, is prepared into filamentous Sn by the Sn of bulk; According to the actual needs produced, Ni is first carried out melting in advance with Cu, makes intermediate alloy Cu-Ni, then carry out follow-up melting;
(2) melting: in fusion process, first adds Cu-P, Cu, Cu-Ni, Ag element time reinforced, adds Sn until completely melted, adds the effect that coverture plays insulation, prevents the scaling loss of oxidizable element after having fed in raw material immediately; Sn adds with the form of filament Sn, increases the contact area of Sn and melt, is conducive to Sn and is uniformly distributed in liquation, solves the segregation problems of Sn; Use dry plant ash as coverture, plant ash have area coverage large, cover the advantages such as fine and close, effectively reduce the oxidization burning loss of Sn in fusion process, decrease liquation suction hydrogen during refining and oxygen content;
(3) melting subsequent treatment: after melting, then obtain brazing material by continuous casting, even crowded, shaping, cleaning.
The preparation method of embodiment 24-28 comprises the following steps:
(1) pretreatment before melting: before melting, to Sn process, is prepared into filamentous Sn by the Sn of bulk; According to the actual needs produced, Ni and rare earth are first carried out melting in advance with Cu respectively, makes intermediate alloy Cu-Ni and Cu-RE, then carry out follow-up melting;
(2) melting: in fusion process, first adds Cu-P, Cu, Cu-Ni, Ag element time reinforced, adds Cu-RE until completely melted, finally add Sn, adds the effect that coverture plays insulation, prevents the scaling loss of oxidizable element after having fed in raw material immediately; Sn adds with the form of filament Sn, increases the contact area of Sn and melt, is conducive to Sn and is uniformly distributed in liquation, solves the segregation problems of Sn; Use dry plant ash as coverture, plant ash have area coverage large, cover the advantages such as fine and close, effectively reduce the oxidization burning loss of Sn and rare earth element in fusion process, decrease liquation suction hydrogen during refining and oxygen content; The described rare earth adding trace regulates solder tissue.
(3) melting subsequent treatment: after melting, then obtain brazing material by continuous casting, even crowded, shaping, cleaning.
The preparation method of embodiment 29-30 comprises the following steps:
(1) pretreatment before melting: before melting, to Sn process, is prepared into filamentous Sn by the Sn of bulk;
(2) melting: in fusion process, Sn adds with the form of filament Sn, increases the contact area of Sn and melt, is conducive to Sn and is uniformly distributed in liquation, solves the segregation problems of Sn; Use dry plant ash as coverture, plant ash have area coverage large, cover the advantages such as fine and close, effectively reduce the oxidization burning loss of Sn and rare earth element in fusion process, decrease liquation suction hydrogen during refining and oxygen content; The described rare earth adding trace regulates solder tissue.
(3) melting subsequent treatment: after melting, then obtain brazing material by continuous casting, even crowded, shaping, cleaning.
All the other steps prepared by solder of the present invention are identical with conventional method or close, do not repeat them here.
It should be noted that, percentage composition used in the present invention is all weight percentage, and Ag represents silver, P represents phosphorus, Ni represents nickel, Sn represents tin, Cu represents copper, RE represents rare earth, and this is common practise to one skilled in the art.
By foregoing description, those skilled in the art can implement.
Although the present invention with embodiment openly as above; but it is also not used to limit protection scope of the present invention; any technical staff being familiar with this technology, not departing from the change and retouching done in the spirit and scope of the present invention, all should belong to protection scope of the present invention.
Claims (7)
1. a low silver copper-base filler metals, containing Ag, Cu, P, Sn, Ni and rare earth; It is characterized in that: each weight percentages of components of described low silver copper-base filler metals is: the Sn of the P of the Ag of 1.8-2.2%, 5.8-6.4%, 5.5-6.5 %, the Ni of 1.5-2.0%, rare earth≤0.03%, surplus is Cu.
2. low silver copper-base filler metals according to claim 1, is characterized in that: each weight percentages of components of described low silver copper-base filler metals is: the Ag of 2.0%, the P of 6.1%, the Sn of 6.0 %, the Ni of 1.7%, the rare earth of 0.02%, and surplus is Cu.
3. a preparation method for low silver copper-base filler metals as claimed in claim 1 or 2, is characterized in that: comprise the following steps:
(1) pretreatment before melting: to described Sn process, the Sn of bulk is prepared into filamentous Sn;
(2) melting: described Sn adds with the form of filament Sn;
(3) melting subsequent treatment: obtain brazing material by continuous casting, even crowded, shaping, cleaning again.
4. the preparation method of low silver copper-base filler metals according to claim 3, is characterized in that: in described step (2), and the described rare earth adding trace regulates solder tissue.
5. the preparation method of low silver copper-base filler metals according to claim 3, is characterized in that: in described step (1), described Ni is first carried out melting in advance with Cu, makes intermediate alloy Cu-Ni, then carry out follow-up melting.
6. the preparation method of low silver copper-base filler metals according to claim 4, is characterized in that: in described step (1), described Ni and rare earth is first carried out melting in advance with Cu, makes intermediate alloy Cu-Ni and Cu-RE respectively, then carry out follow-up melting.
7. the preparation method of the low silver copper-base filler metals according to the arbitrary claim of claim 3-6, is characterized in that: in described step (2), uses dry plant ash as coverture.
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| CN104028915B (en) * | 2014-06-09 | 2016-09-07 | 乐清市博特焊接材料有限公司 | A kind of phosphor-copper welding rod and preparation method thereof |
| CN104785951A (en) * | 2015-03-16 | 2015-07-22 | 杭州华光焊接新材料股份有限公司 | Low-silver brazing material for dissimilar metal connecting |
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