CN108381058A - One kind high-performance solder of low-silver copper-base containing Ga and preparation method thereof - Google Patents
One kind high-performance solder of low-silver copper-base containing Ga and preparation method thereof Download PDFInfo
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- CN108381058A CN108381058A CN201810161764.7A CN201810161764A CN108381058A CN 108381058 A CN108381058 A CN 108381058A CN 201810161764 A CN201810161764 A CN 201810161764A CN 108381058 A CN108381058 A CN 108381058A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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Abstract
The invention discloses a kind of high-performance solders of low-silver copper-base containing Ga, are made by mass percentage of following raw material：Ag 1.5~2.5%, P 4.5~5.5%, Sn 5~7%, Ni 0.01~2%, Ga 0.001~0.05%, Si 0.001~0.1%, Ce 0.01~0.05%, remaining is copper and inevitable impurity, and the purity of each raw material is 99.9% or more.Preparation method is that intermediate alloy is made according to specific ratio respectively in Ni and Cu, P and Cu, Si and Cu, Ga and Cu and Ce and Cu, then Ni metal, Cu P, Cu Ni, Cu Si, Cu Ga and Cu Ce are sequentially added and carries out melting, Sn and Ag is added until completely melted, borax is added immediately after the completion of charging, post-processes to obtain the final product.Greatly reduce production cost, and improve after solder high mechanical strength, compactness it is good, connector corrosion resistance and tensile strength are outstanding, soldering processes performance is excellent, soldered fitting stable quality, with good fatigue behaviour, the service life of soldered fitting can be effectively promoted, BCu88PAg solderings can be substituted.
Description
Technical field
The present invention relates to solder manufacturing technology field, especially a kind of high-performance solder of low-silver copper-base containing Ga and its preparation side
Method.
Background technology
Solder can be divided into soft solder and hard solder with fusion temperature classification, and hard solder can be divided into copper according to substrate types
A variety of solders such as base solder, silver-base solder, nickel-based solder, auri solder, palladium base solder, manganese based solder.Copper base solder is as hard
One kind in solder has following advantage when welding copper alloy and stainless steel：Copper base solder it is cheap；Copper base solder is led
It is electrically stronger；α-Cu tissues in seam organization have very strong moulding and intensity；Cu atoms in the welding process can be with mother
Material occurs, beneficial to diffusion, to enhance weld strength；Cu-P systems copper base solder due to can occur from wetting effect with copper alloy base material,
The expense using brazing flux can be saved.
But traditional copper base solder also has its shortcoming：Cu-Zn systems are higher without cadmium copper base solder temperature, right after welding
Base material is affected；Cu-P phases have very strong brittleness, have fatal Effect on Mechanical Properties to base material α-Cu tissues；Cu is former
Although son individually can be also not enough to reach pre- beneficial to diffusion, since the holding time is short by the atomic migration of Cu atoms
Phase effect.
Response ratio preferably has BCu88PAg solders currently on the market, but due to there is the addition of 5% silver element so that its
Price is relatively high, and use cost greatly increases.
It is on December 29th, 2016, Publication No. there are also the relatively good solder of some performances, such as publication date
In the Chinese patent of CN106624448A, a kind of novel low silver-bearing copper phosphorus brazing alloy is disclosed, although mechanical strength is in the solder
Improve, but protective treatment is not carried out to lead impurity element, bismuth in its brazing process, influences the wetability of solder.
Invention content
Present invention aims at a kind of high-performance solder of low-silver copper-base containing Ga and its preparation process newly is provided, ensureing original
While some Cu-P brazing filler metals performances, wetability, mechanical strength are significantly improved, solid-liquid phase line is reduced, finally obtains and be similar to
The welding using effect of BCu88PAg.
To achieve the goals above, the present invention provides the following technical solutions：
A kind of high-performance solder of low-silver copper-base containing Ga, which is characterized in that be made by mass percentage of following raw material：Ag
1.5~2.5%, P 4.5~5.5%, Sn 5~7%, Ni 0.01~2%, Ga 0.001~0.05%, Si 0.001~
0.1%, 0.01~0.05% Ce, remaining be copper and inevitable impurity, and the purity of each raw material 99.9% with
On.
Preferably, a kind of high-performance solder of low-silver copper-base containing Ga is made of following raw material by mass percentage：Ag
1.9~2.1%, P 4.9~5.1%, Sn 1%, Ni 1%, Ga 0.01%, Si 0.05%, 0.03% surpluses of Ce be copper and
Inevitable impurity, and the purity of each raw material is 99.9% or more.
The preparation method of the above-mentioned high-performance of low-silver copper-base containing Ga solder, includes the following steps：
(1), Ni and Cu is subjected to advance melting according to the ratio of 12~18wt% containing Ni, intermediate alloy Cu-Ni is made；
(2), P and Cu is subjected to advance melting according to the ratio of 12~18wt% containing P, intermediate alloy Cu-P is made；
(3), Si and Cu is subjected to advance melting according to the ratio of 12~18wt% containing Si, intermediate alloy Cu-Si is made；
(4), Ga and Cu is subjected to advance melting according to the ratio containing Ga 8~12%, intermediate alloy Cu-Ga is made；
(5), Ce and Cu is subjected to advance melting according to the ratio containing Ce 8~12%, intermediate alloy Cu-Ce is made；
(6), micronization processes are carried out to Sn；
(7), Ni metal, the progress melting of Cu-P, Cu-Ni, Cu-Si, Cu-Ga and Cu-Ce intermediate alloy are sequentially added, has been waited for
Sn and Ag is added after running down, borax is added immediately after the completion of charging, plays heat preservation, remove slag and antioxidation；
(8) after melting, then by stripping off the skin, squeezing, wire drawing, alignment and surface treatment obtain solder.
Preferably, Ni and Cu is subjected to advance melting according to the ratio of the 15wt% containing Ni, P and Cu is according to 15wt% containing P
Ratio carry out advance melting, Si and Cu carries out advance melting according to the ratio of the 15wt% containing Si, and Ga and Cu are according to containing Ga
Choosing is molten in advance for the ratio progress of 10wt%, and Ce and Cu carry out pre-selection according to the ratio of the 10wt% containing ce and melt, and intermediate alloy is made.
Ag elements can significantly reduce the solid-liquid phase line of solder, and can so that weld seam is bright and clean, have metallic luster.In solder
Matrix in, Ag can form Ag-Cu alloy phases with Cu, the intensity higher of the tissue ratio α-Cu tissue of this Ag-Cu alloys phase, and
And degree of grain refinement is also very high, this makes the comprehensive mechanical property of solder increase.But Ag belongs to precious metal, largely
Addition can cause use cost to greatly increase, and can limit it and use and promote.
The content of P element can be obtained according to Cu-P binary phase diagramls, and Cu and P is reaching when P content reaches 8.14wt%
Eutectic point, fusing point is 714 DEG C at this time, and liquidus curve is overlapped with solidus, and co-crystal structures at this time are loose, Cu3P is wherein with thin
Laminated structure exists, and moulding α-Cu tissues has been isolated, easily in Cu3Stress concentration is formed at P concentrations, is shown greatly crisp
Property and it is not easy to be processed.When P content is more than 8.14wt%, due to Cu3P phase fusing points are up to 1022 DEG C, the Cu largely increased3P can make
The rising of solder liquidus curve and less easy processing.When P content is less than 8.14wt%, matrix can form α-Cu and Cu3The machinery of P is mixed
It closes object and liquidus curve is increased with the reduction of P content.And if P element content is too low, can lose self-fluxing effect.Therefore P
Content is very crucial.
The addition of Sn elements can significantly reduce the liquidus curve of solder, this is because there are a large amount of high temperature remnants in collective
Phase δ phases, this remnants δ phases release a large amount of heat, significantly reduce the liquidus curve of solder after melting again.But as Sn contains
The increase of amount, the brittleness such as β, ε, δ being typically found in Cu-Sn systems high-temperature-phase can dramatically increase so that solder processing is impatient
Play declines.Therefore the content of Sn is very crucial.
Ni elements can be infinitely dissolved in α-Cu matrixes, this just plays the role of reinforcing, and the intensity of solder can be improved,
So selection addition chemical element Ni, increases the intensity, toughness of solder；Ni elements, which can also play, simultaneously improves the anti-of soldered fitting
The effect of corrosive power, to improve the synthesis brazing property of solder；But the content of Ni cannot be excessively high, by experiment, once
The content of Ni is more than 3.0%, and the fusion temperature of brazing filler metal alloy can be made to increase, and Ni can be with p-shaped at Ni3P brittlement phases, are unfavorable for pricker
The processing performance of material.Therefore the concrete content of Ni elements is also very crucial.
The features such as addition meeting thinning microstructure of Ga elements, promotion ingredient is uniform.And when Ga contents increase, in solder tissue
Acicular structure can be changed into bulk tissue, effectively enhance the comprehensive performance of solder matrix.Ga also has reduction solder solid-liquid
The effect of phase line, and significant effect.Ga can hinder frangible compounds Cu in solder in solder matrix5.6The formation of Sn.But
The extruding cost that can increase in solder production is added in a large amount of of Ga, and the stronger α-Cu of plasticity in solder matrix can be made to scatter,
Influence the processing performance of solder.
There is prodigious effect on surface after solder is welded in the addition of Si elements, it can so that face of weld is very smooth.
But excessive addition Si elements can make solder surface dulling itself black.
Ce elements have prodigious effect as one kind in rare earth element, a small amount of be added to copper base solder：Ce can be with Sn
Form CeSn3, hinder Sn to be combined with non-Ce elements, reduce large-sized β-Sn, Cu6Sn5And Ag3The quantity of Sn keeps tissue thin
Change；The addition of Ce can form related compound with inevitable impurity element Pb, Bi in preceding material, it is suppressed that simple substance phase impurity
Formation, the adverse effect of impurity element Pb, Bi to solder wetting can be slowed down.
Therefore each element in formula plan as a whole with regard to very important, the content difference of an element can cause other yuan
The great variety of plain optimum content, the not adjustment of limited number of time can obtain.
It must contain Ga low-silver copper-base high-performance solders obtained by the present invention and be mainly used for Refrigerating Machinery, air-conditioning, musical instrument, glasses etc.
The soldering of product.The content of noble metal silver is few, greatly reduces production cost, has saved the dosage of noble metal silver so that
The limited resources of silver can be more reasonably utilized.
Low silver copper-base filler metals high mechanical strength, compactness are good in invention, and connector corrosion resistance and tensile strength are outstanding, through visitor
It is excellent that soldering processes performance is fed back after the use of family, soldered fitting stable quality has good fatigue behaviour, can effectively promote pricker
The service life of plumb joint；Process performance index requirement is suitable with BCu88PAg copper-phosphorus brazing alloys, and part index number is also higher than
BCu88PAg copper-phosphorus brazing alloys can substitute BCu88PAg solderings.
Description of the drawings
Attached drawing is used to provide further understanding of the present invention, and a part for constitution instruction, the reality with the present invention
It applies example to be used to explain the present invention together, not be construed as limiting the invention.In the accompanying drawings：
Fig. 1 is the tissue metallograph of the high-performance solder of low-silver copper-base containing Ga of the present invention；
The tissue metallograph for the BCu88PAg solder structural schematic diagrams that Fig. 2 is.
Specific implementation mode
Hereinafter, preferred embodiments of the present invention will be described, it should be understood that preferred embodiment described herein is only used
In the description and interpretation present invention, it is not intended to limit the present invention.
Embodiment 1
A kind of high-performance solder of low-silver copper-base containing Ga, is made of following raw material by mass percentage：Ag 1.5%, P
5%, Sn5%, Ni1%, Ga 0.001, Si 0.01%, 0.01% surpluses of Ce be copper and inevitable impurity, and each
The purity of raw material is 99.9% or more.
The preparation method of the present embodiment high-performance solder of low-silver copper-base containing Ga, includes the following steps：
(1) Ni and Cu is subjected to advance melting according to the ratio containing Ni12%, intermediate alloy Cu-Ni is made；
(2) P and Cu is subjected to advance melting according to the ratio containing P12%, intermediate alloy Cu-P is made；
(3) Si and Cu is subjected to advance melting according to the ratio containing Si12%, intermediate alloy Cu-Si is made；
(4) Ga and Cu is subjected to advance melting according to the ratio containing Ga 8%, intermediate alloy Cu-Ga is made；
(5) Ce and Cu is subjected to advance melting according to the ratio containing Ce 8%, intermediate alloy Cu-Ce is made；
(6) micronization processes are carried out to Sn；The Sn of bulk is prepared into tiny block-like Sn；
(7) Ni metal, the progress melting of Cu-P, Cu-Ni, Cu-Si, Cu-Ga and Cu-Ce intermediate alloy are sequentially added, has been waited for
Sn and Ag is added after running down, borax is added immediately after the completion of charging, plays heat preservation, remove slag and antioxidation；
(8) after melting, then by stripping off the skin, squeezing, wire drawing, alignment and surface treatment obtain solder.
The high-performance solder liquidus curve of low-silver copper-base containing Ga made from the present embodiment is 769.97 DEG C, solidus 627.26
DEG C, shear strength 167.4MPa, the 0.2g solder with red copper welding is that wetting areas is 120.35mm in red copper2, solder electricity
Resistance rate 3.279 × 10–7Ω·m。
Embodiment 2
The present embodiment provides a kind of high-performance solders of low-silver copper-base containing Ga, are made by mass percentage of following raw material：
Ag 2.5%, P4.5%, Sn7%, Ni 0.01%, Ga 0.05%, Si 0.05%, Ce0.03% surpluses are copper and can not keep away
The impurity exempted from, and the purity of each raw material is 99.9% or more.
The preparation method of the present embodiment high-performance solder of low-silver copper-base containing Ga, includes the following steps：
(1) Ni and Cu is subjected to advance melting according to the ratio containing Ni12%, intermediate alloy Cu-Ni is made；
(2) P and Cu is subjected to advance melting according to the ratio containing P18%, intermediate alloy Cu-P is made；
(3) Si and Cu is subjected to advance melting according to the ratio containing Si18%, intermediate alloy Cu-Si is made；
(4) Ga and Cu is subjected to advance melting according to the ratio containing Ga12%, intermediate alloy Cu-Ga is made；
(5) Ce and Cu is subjected to advance melting according to the ratio containing Ce 12%, intermediate alloy Cu-Ce is made；
(6) micronization processes are carried out to Sn；The Sn of bulk is prepared into tiny block-like Sn；
(7) Ni metal, the progress melting of Cu-P, Cu-Ni, Cu-Si, Cu-Ga and Cu-Ce intermediate alloy are sequentially added, has been waited for
Sn and Ag is added after running down, borax is added immediately after the completion of charging, plays heat preservation, remove slag and antioxidation；
(8) after melting, then by stripping off the skin, squeezing, wire drawing, alignment and surface treatment obtain solder.
The high-performance solder liquidus curve of low-silver copper-base containing Ga made from the present embodiment is 770.82 DEG C, solidus 623.15
DEG C, wetting areas of shear strength 169.5MPa, the 0.2g solder welded with red copper in red copper is 123.34mm2, solder electricity
Resistance rate 3.284 × 10–7Ω·m。
Embodiment 3
The present embodiment provides a kind of high-performance solders of low-silver copper-base containing Ga, are made by mass percentage of following raw material：
Ag 2.1%, P 5.1%, Sn6.5%, Ni 1%, Ga 0.01%, Si 0.05%, 0.03% surpluses of Ce are copper and can not keep away
The impurity exempted from, and the purity of each raw material is 99.9% or more.
(1) Ni and Cu is subjected to advance melting according to the ratio containing Ni 15%, intermediate alloy Cu-Ni is made；
(2) P and Cu is subjected to advance melting according to the ratio containing P 15%, intermediate alloy Cu-P is made；
(3) Si and Cu is subjected to advance melting according to the ratio containing Si 15%, intermediate alloy Cu-Si is made；
(4) Ga and Cu is subjected to advance melting according to the ratio containing Ga 10%, intermediate alloy Cu-Ga is made；
(5) Ce and Cu is subjected to advance melting according to the ratio containing Ce 10%, intermediate alloy Cu-Ce is made；
(6) micronization processes are carried out to Sn；The Sn of bulk is prepared into tiny block-like Sn；
(7) Ni metal, the progress melting of Cu-P, Cu-Ni, Cu-Si, Cu-Ga and Cu-Ce intermediate alloy are sequentially added, has been waited for
Sn and Ag is added after running down, borax is added immediately after the completion of charging, plays heat preservation, remove slag and antioxidation；
(8) after melting, then by stripping off the skin, squeezing, wire drawing, alignment and surface treatment obtain solder.
The high-performance solder liquidus curve of low-silver copper-base containing Ga made from the present embodiment is 769.97 DEG C, solidus 627.26
DEG C, wetting areas of shear strength 162.3MPa, the 0.2g solder welded with red copper in red copper is 119.98mm2, solder electricity
Resistance rate 3.199 × 10–7Ω·m。
Embodiment 4
The present embodiment provides a kind of high-performance solders of low-silver copper-base containing Ga, are made by mass percentage of following raw material：
Ag 1.9%, P4.5%, Sn 5.5%, Ni 2%, Ga 0.03%, Si 0.1%, Ce0.03% surpluses are for copper and unavoidably
Impurity, and the purity of each raw material is 99.9% or more.
(1) Ni and Cu is subjected to advance melting according to the ratio containing Ni12%, intermediate alloy Cu-Ni is made；
(2) P and Cu is subjected to advance melting according to the ratio containing P12%, intermediate alloy Cu-P is made；
(3) Si and Cu is subjected to advance melting according to the ratio containing Si12%, intermediate alloy Cu-Si is made；
(4) Ga and Cu is subjected to advance melting according to the ratio containing Ga 10%, intermediate alloy Cu-Ga is made；
(5) Ce and Cu is subjected to advance melting according to the ratio containing Ce 10%, intermediate alloy Cu-Ce is made；
(6) micronization processes are carried out to Sn；The Sn of bulk is prepared into tiny block-like Sn；
(7) Ni metal, the progress melting of Cu-P, Cu-Ni, Cu-Si, Cu-Ga and Cu-Ce intermediate alloy are sequentially added, has been waited for
Sn and Ag is added after running down, borax is added immediately after the completion of charging, plays heat preservation, remove slag and antioxidation；
(8) after melting, then by stripping off the skin, squeezing, wire drawing, alignment and surface treatment obtain solder.
The high-performance solder liquidus curve of low-silver copper-base containing Ga made from the present embodiment is 774.12 DEG C, solidus 631.22
DEG C, wetting areas of shear strength 169.1MPa, the 0.2g solder welded with red copper in red copper is 124.56mm2, solder electricity
Resistance rate 3.230 × 10–7Ω·m。
Embodiment 5
The present embodiment provides a kind of high-performance solders of low-silver copper-base containing Ga, are made by mass percentage of following raw material：
Ag 1.5%, P 5.5%, Sn 7%, Ni 2%, Ga 0.03%, Si 0.1%, 0.05% surpluses of Ce are for copper and unavoidably
Impurity, and the purity of each raw material is 99.9% or more.
(1) Ni and Cu is subjected to advance melting according to the ratio containing Ni15%, intermediate alloy Cu-Ni is made；
(2) P and Cu is subjected to advance melting according to the ratio containing P15%, intermediate alloy Cu-P is made；
(3) Si and Cu is subjected to advance melting according to the ratio containing Si15%, intermediate alloy Cu-Si is made；
(4) Ga and Cu is subjected to advance melting according to the ratio containing Ga 10%, intermediate alloy Cu-Ga is made；
(5) Ce and Cu is subjected to advance melting according to the ratio containing Ce 10%, intermediate alloy Cu-Ce is made；
(6) micronization processes are carried out to Sn；The Sn of bulk is prepared into tiny block-like Sn；
(7) Ni metal, the progress melting of Cu-P, Cu-Ni, Cu-Si, Cu-Ga and Cu-Ce intermediate alloy are sequentially added, has been waited for
Sn and Ag is added after running down, borax is added immediately after the completion of charging, plays heat preservation, remove slag and antioxidation；
(8) after melting, then by stripping off the skin, squeezing, wire drawing, alignment and surface treatment obtain solder.
The high-performance solder liquidus curve of low-silver copper-base containing Ga made from the present embodiment is 766.56 DEG C, solidus 627.26
DEG C, wetting areas of shear strength 165.6MPa, the 0.2g solder welded with red copper in red copper is 128.18mm2, solder electricity
Resistance rate 3.232 × 10–7Ω·m。
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
With within principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention god.
Finally it should be noted that：The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention,
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used
With technical scheme described in the above embodiments is modified or equivalent replacement of some of the technical features.
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in the present invention's
Within protection domain.
Claims (4)
1. a kind of high-performance solder of low-silver copper-base containing Ga, which is characterized in that be made by mass percentage of following raw material：Ag
1.5~2.5%, P 4.5~5.5%, Sn 5~7%, Ni 0.01~2%, Ga 0.001~0.05%, Si 0.001~
0.1%, 0.01~0.05% Ce, remaining be copper and inevitable impurity, and the purity of each raw material 99.9% with
On.
2. the high-performance solder of low-silver copper-base containing Ga as described in right will go 1, which is characterized in that by mass percentage by following
Raw material is made：Ag 1.9~2.1%, P 4.9~5.1%, Sn 5.5~6.5%, Ni 1%, Ga 0.01%, Si 0.05%,
0.03% surpluses of Ce are copper and inevitable impurity, and the purity of each raw material is 99.9% or more.
3. the preparation method of the high-performance of low-silver copper-base containing Ga solder as claimed in claim 1 or 2, which is characterized in that including such as
Lower step：
(1), Ni and Cu is subjected to advance melting according to the ratio of 12~18wt% containing Ni, intermediate alloy Cu-Ni is made；
(2), P and Cu is subjected to advance melting according to the ratio of 12~18wt% containing P, intermediate alloy Cu-P is made；
(3), Si and Cu is subjected to advance melting according to the ratio of 12~18wt% containing Si, intermediate alloy Cu-Si is made；
(4), Ga and Cu is subjected to advance melting according to the ratio containing Ga 8~12%, intermediate alloy Cu-Ga is made；
(5), Ce and Cu is subjected to advance melting according to the ratio containing Ce 8~12%, intermediate alloy Cu-Ce is made；
(6), micronization processes are carried out to Sn；
(7), Ni metal, the progress melting of Cu-P, Cu-Ni, Cu-Si, Cu-Ga and Cu-Ce intermediate alloy are sequentially added, waits for melting completely
Sn and Ag is added after change, borax is added immediately after the completion of charging；
(8) after melting, then by stripping off the skin, squeezing, wire drawing, alignment and surface treatment obtain solder.
4. the preparation method of the high-performance of low-silver copper-base containing Ga solder as claimed in claim 3, which is characterized in that press Ni and Cu
The advance melting of ratio progress of advance melting, P and Cu according to the 15wt% containing P, Si and Cu are carried out according to the ratio of the 15wt% containing Ni
Advance melting, Ga and Cu, which are carried out, according to the ratio of the 15wt% containing Si selects molten, Ce in advance according to the ratio progress of the 10wt% containing Ga
Choosing in advance is carried out according to the ratio of the 10wt% containing Ce to melt, intermediate alloy is made with Cu.
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| CN201810161764.7A CN108381058A (en) | 2018-02-27 | 2018-02-27 | One kind high-performance solder of low-silver copper-base containing Ga and preparation method thereof |
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| CN201810161764.7A CN108381058A (en) | 2018-02-27 | 2018-02-27 | One kind high-performance solder of low-silver copper-base containing Ga and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109865961A (en) * | 2019-03-05 | 2019-06-11 | 苏州昆腾威新材料科技有限公司 | A kind of copper-based spherical powder material and the preparation method and application thereof |
| CN114055012A (en) * | 2021-11-05 | 2022-02-18 | 安徽工业大学 | Multi-element copper-based alloy brazing filler metal containing rare earth elements, preparation method and brazing method thereof |
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