CN103589883A - Preparation method of tungsten copper alloy - Google Patents
Preparation method of tungsten copper alloy Download PDFInfo
- Publication number
- CN103589883A CN103589883A CN201310555517.2A CN201310555517A CN103589883A CN 103589883 A CN103589883 A CN 103589883A CN 201310555517 A CN201310555517 A CN 201310555517A CN 103589883 A CN103589883 A CN 103589883A
- Authority
- CN
- China
- Prior art keywords
- tungsten
- copper
- powder
- copper alloy
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention relates to a preparation method of a tungsten copper alloy, which is characterized by comprising the following steps: using tungsten powder with a diameter of 0.8 to 1.5 mu(m) and copper powder with a diameter of 50 mu(m) according to a mass ratio of the tungsten powder to the copper powder of (70 to 30):(30 to 70); carrying out ball milling on the mixed powder for 2.5 hours at a rotating speed of 150 rpm; under a pressure of 150 to 600 MPa, carrying out cold pressing on the mixed powder to form a blank, sealing in a steel sleeve and welding the blank and the steel sleeve, wherein the coating and sleeving thickness is 5 to 10 mm; and at a temperature rising speed of 30 DEG C per minute and at a temperature of 1,100 to 1,150 DEG C, carrying out heat preservation for 30 min and rolling the obtained product into the tungsten copper alloy. The method disclosed by the invention is a preparation method of the tungsten copper alloy, which can improve density, electrical conductivity and hardness of the tungsten copper alloy.
Description
Technical field
The present invention relates to the do not dissolve each other preparation method of alloy of two-phase, be specifically related to W, Cu mixed powder adopts liquid phase copper hot rolling process to prepare the method for tungsten-copper alloy.
Background technology
Tungsten-copper alloy, due to the many good characteristics of self, has been widely used in large-capacity vacuum circuit breaker and microelectronic at present.Tungsten copper is applied and is mainly comprised electrical contact material and electrode materials aspect electrical material.High intensity tungsten copper electrode material, as the new function material with good electroconductibility, intensity and high-temperature behavior, has obtained application widely in fields such as resistance welding and electrospark machining.Tungsten-copper alloy sheet material, due to advantages such as its coefficient of expansion are little, electrical and thermal conductivity is good, is applied to power electronic device as a kind of novel electronic package material.
Tungsten and copper do not dissolve each other, and therefore only have the method by powder metallurgy could obtain the compound of these two kinds of metals, but having produced fully dense powdered material has great difficulty.Tradition adopts infiltration method to prepare, it is that tungsten powder or the powder mix that mixes part copper powder are pressed into briquet, be prepared into the POROUS TUNGSTEN skeleton matrix with certain density and intensity, then on briquet, place needed copper, after being heated to copper fusing, copper liquid phase filling pore, thus obtain the comparatively good Tungsten-copper Composites of over-all properties, but it is slow that the shortcoming of infiltration method is densification rate, and densification degree is low.Conventional melting infiltration sintering and simple liquid phase sintering cannot meet the requirement of 98% relative density, by increasing compacting pressure, improve green density, can reach the object that improves final densities.But its only within the scope of certain pressure effectively and act on limited.Another kind method increases sintering temperature exactly until 1400 ~ 1500 ℃, and density can obviously improve, but now sintering condition is required harshly, and under high temperature, size distortion is serious, and liquid phase copper too overflows and makes composition generation segregation.In addition, during melting infiltration sintering, liquid phase copper only depends on the capillary action in W skeleton space to infiltrate, and copper coagulation phase distributes thick and inhomogeneous, and high temperature sintering can make tungsten particle agglomeration, forms thick heterogeneous structure.
Powder jacket thermal distortion (extruding, rolling) method can significantly improve the relative density (> 98%) of tungsten-copper alloy, and have tiny grain structure, high rigidity and good conductivity.CN200710144332.7 adopts powder jacket, 800 ~ 1000 ℃ of hot extrusions, has obtained the tungsten-copper alloy bar with superperformance.CN 200810209542.4 adopts Powder Sintered Blanks, and after 850 ~ 950 ℃ of hot extrusions, then annealing has obtained deformation tungsten-copper alloy bar.But hot extrusion has some limitations: first, the restriction of the technique that is squeezed, this method is difficult to obtain large-sized tungsten copper wide plate and thin plate; Secondly, at 800 ~ 1000 ℃, tungsten-copper alloy is carried out to thermal distortion, because Heating temperature is now positioned at below copper fusing point (1083 ℃), copper is mutually still in solid-state,, easily there is segregation and macropore in mobility and filling pore poor-performing, affects electrical and thermal conductivity performance, simultaneously, the low resistance to deformation that causes of temperature increases, more serious to mould infringement, and adopts the tungsten-copper alloy of sintering extrusion process, in sintering process, tungsten is grown up mutually also can reduce the hardness value of material greatly.
Summary of the invention
The present invention proposes a kind of density that improves tungsten-copper alloy, the preparation method of the tungsten-copper alloy of specific conductivity and hardness.
It is as follows that the present invention prepares tungsten-copper alloy preparation of plates method steps: by tungsten powder: copper powder mass ratio is 70 ~ 30: 30 ~ 70, and cut-off footpath is the tungsten powder of 0.8 ~ 1.5 μ m and the copper powder of diameter 50 μ m; Under rotating speed 150rpm, ball milling mixed powder is 2.5 hours; At pressure, be under 150 ~ 600MPa, enclose steel bushing seam after mixed powder is cold-pressed into base, jacket thickness is 5 ~ 10mm; With the heat-up rate of 30 ℃/min, at 1100 ~ 1150 ℃, insulation 30min, is rolled into tungsten-copper alloy.
The present invention colds pressing after base jacket tungsten copper powder without sintering, near temperature direct heat distortion copper fusing point, utilize copper phase temperature in high temperature deformation process to approach or surpass the Transient liquid phase effect that self fusing point produces, significantly improving mobility and the filling properties to hole of copper phase.The present invention provides the production technique that a kind of low cost can mass-producing for the preparation of plates of high performance and big size tungsten copper; surpassing rolling at the temperature of copper fusing point; by the rapid flow of liquid phase copper under rolling pressure; abundant filling pore; and form complete conductive copper network, can obtain the tungsten-copper alloy sheet material that approaches full densification and there is high rigidity and good conductive heat conductivility.
The invention has the advantages that:
1. adopt liquid phase copper hot rolling process to solve tungsten-copper alloy two-phase interface wettability poor, the problem of densified sintering product difficulty, replace traditional melting infiltration sintering and solid phase extrusion process, force under pressure liquid phase copper to flow and fill the hole between tungsten phase, and form the conductive and heat-conductive copper networks of complete connection, material density can reach 99.3%, and specific conductivity surpasses 47%IACS.
2. due to without sintering process, only by the heating of short period of time, effectively suppressed growing up of tungsten phase, the hardness of material is improved, hardness can reach 215HV.
3. this invention provides possibility for the suitability for industrialized production of High Performance W copper alloy.
Embodiment
Following examples that the present invention provides, only, for goal of the invention is described, do not form any limitation of the invention.
Embodiment mono-
By tungsten powder: copper powder mass ratio is 30: 70, and tungsten powder diameter is 1.2 μ m, copper powder diameter 50 μ m, rotational speed of ball-mill 150rpm, Ball-milling Time 2.5h; The tungsten copper that mixed powder is molded into 400mm * 200mm * 10mm under the 600MPa slab of colding pressing; With the jacket thickness 5mm low-carbon (LC) steel bushing bag tungsten copper base of colding pressing, with temperature rise rate, 30 ℃/min is heated to 1100 ℃, and is incubated 30min, and multi-pass hot rolling on the milling train of Φ 400 * 400mm, obtains tungsten copper sheet material.This tungsten copper sheet material density reaches 99.3%, specific conductivity 82%IACS, hardness value 95HV.
Embodiment bis-
By tungsten powder: copper powder mass ratio is 40: 60, and tungsten powder diameter is 1.2 μ m, copper powder diameter 50 μ m, rotational speed of ball-mill 150rpm, Ball-milling Time 2.5h; The tungsten copper that mixed powder is molded into 400mm * 200mm * 10mm under the 600MPa slab of colding pressing; With the jacket thickness 5mm low-carbon (LC) steel bushing bag tungsten copper base of colding pressing, with temperature rise rate, 30 ℃/min is heated to 1100 ℃, and is incubated 30min, and multi-pass hot rolling on the milling train of Φ 400 * 400mm, obtains tungsten copper sheet material.This tungsten copper sheet material density reaches 98.7%, specific conductivity 75%IACS, hardness value 123HV.
Embodiment tri-
By tungsten powder: copper powder mass ratio is 50: 50, and tungsten powder diameter is 0.8 μ m, copper powder diameter 50 μ m, rotational speed of ball-mill 150rpm, Ball-milling Time 2.5h; The tungsten copper that mixed powder is molded into 400mm * 200mm * 10mm under the 200MPa isostatic cool pressing slab of colding pressing; With the jacket thickness 7mm low-carbon (LC) steel bushing bag tungsten copper base of colding pressing, with temperature rise rate, 30 ℃/min is heated to 1130 ℃, and is incubated 30min, and multi-pass hot rolling on the milling train of Φ 400 * 400mm, obtains tungsten copper sheet material.This tungsten copper sheet material density reaches 98.5%, specific conductivity 62%IACS, hardness value 160HV.
Embodiment tetra-
By tungsten powder: copper powder mass ratio is 60: 40, and tungsten powder diameter is 0.8 μ m, copper powder diameter 50 μ m, rotational speed of ball-mill 150rpm, Ball-milling Time 2.5h; The tungsten copper that mixed powder is molded into 400mm * 200mm * 10mm under the 200MPa isostatic cool pressing slab of colding pressing; With the jacket thickness 10mm low-carbon (LC) steel bushing bag tungsten copper base of colding pressing, with temperature rise rate, 30 ℃/min is heated to 1130 ℃, and is incubated 30min, and multi-pass hot rolling on the milling train of Φ 400 * 400mm, obtains tungsten copper sheet material.This tungsten copper sheet material density reaches 98.2%, specific conductivity 52%IACS, hardness value 195HV.
Embodiment five
By tungsten powder: copper powder mass ratio is 70: 30, and tungsten powder diameter is 0.8 μ m, copper powder diameter 50 μ m, rotational speed of ball-mill 150rpm, Ball-milling Time 2.5h; The tungsten copper that mixed powder is molded into 400mm * 200mm * 10mm under the 200MPa isostatic cool pressing slab of colding pressing; With the jacket thickness 10mm low-carbon (LC) steel bushing bag tungsten copper base of colding pressing, with temperature rise rate, 30 ℃/min is heated to 1150 ℃, and is incubated 30min, and multi-pass hot rolling on the milling train of Φ 400 * 400mm, obtains tungsten copper sheet material.This tungsten copper sheet material density reaches 99.0%, specific conductivity 47%IACS, hardness value 215HV.
Claims (1)
1. a tungsten-copper alloy preparation method, is characterized in that step is as follows: by tungsten powder: copper powder mass ratio is 70 ~ 30: 30 ~ 70, and cut-off footpath is the tungsten powder of 0.8 ~ 1.5 μ m and the copper powder of diameter 50 μ m; Under rotating speed 150rpm, ball milling mixed powder is 2.5 hours; At pressure, be under 150 ~ 600MPa, enclose steel bushing seam after mixed powder is cold-pressed into base, jacket thickness is 5 ~ 10mm; With the heat-up rate of 30 ℃/min, at 1100 ~ 1150 ℃, insulation 30min, is rolled into tungsten-copper alloy.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310555517.2A CN103589883A (en) | 2013-11-11 | 2013-11-11 | Preparation method of tungsten copper alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310555517.2A CN103589883A (en) | 2013-11-11 | 2013-11-11 | Preparation method of tungsten copper alloy |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103589883A true CN103589883A (en) | 2014-02-19 |
Family
ID=50080193
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310555517.2A Pending CN103589883A (en) | 2013-11-11 | 2013-11-11 | Preparation method of tungsten copper alloy |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103589883A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104209532A (en) * | 2014-03-19 | 2014-12-17 | 天龙钨钼(天津)有限公司 | Thin tungsten copper sheet and preparing method of thin tungsten copper sheet |
CN112080665A (en) * | 2020-09-13 | 2020-12-15 | 江西同欣机械制造股份有限公司 | Supporting block material capable of not damaging excircle of camshaft |
CN112975307A (en) * | 2021-05-11 | 2021-06-18 | 陕西斯瑞新材料股份有限公司 | Method for improving brazing strength of tungsten-copper part |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03120324A (en) * | 1989-10-02 | 1991-05-22 | Sumitomo Metal Ind Ltd | Manufacture of alloy for compacted bullet |
EP0806489A2 (en) * | 1996-05-07 | 1997-11-12 | BRUSH WELLMAN Inc. | Process for making improved copper/tungsten composites |
CN1261264C (en) * | 2001-12-27 | 2006-06-28 | 韩国机械研究院 | Method for preparing tungsten-copper base composite powder and sintered alloy made up by using said composite powder for making radiator |
CN101117672A (en) * | 2007-09-18 | 2008-02-06 | 武汉理工大学 | Activated sintering preparation method of fine crystalline non-magnetic wolfram-copper alloy |
CN101121201A (en) * | 2007-09-19 | 2008-02-13 | 哈尔滨工业大学 | Tungsten copper powder high compactedness material and method for preparing the material using heat extrusion |
CN103045885A (en) * | 2012-12-27 | 2013-04-17 | 中南大学 | Preparation method for high-density fine grain tungsten copper alloy |
-
2013
- 2013-11-11 CN CN201310555517.2A patent/CN103589883A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03120324A (en) * | 1989-10-02 | 1991-05-22 | Sumitomo Metal Ind Ltd | Manufacture of alloy for compacted bullet |
EP0806489A2 (en) * | 1996-05-07 | 1997-11-12 | BRUSH WELLMAN Inc. | Process for making improved copper/tungsten composites |
CN1261264C (en) * | 2001-12-27 | 2006-06-28 | 韩国机械研究院 | Method for preparing tungsten-copper base composite powder and sintered alloy made up by using said composite powder for making radiator |
CN101117672A (en) * | 2007-09-18 | 2008-02-06 | 武汉理工大学 | Activated sintering preparation method of fine crystalline non-magnetic wolfram-copper alloy |
CN101121201A (en) * | 2007-09-19 | 2008-02-13 | 哈尔滨工业大学 | Tungsten copper powder high compactedness material and method for preparing the material using heat extrusion |
CN103045885A (en) * | 2012-12-27 | 2013-04-17 | 中南大学 | Preparation method for high-density fine grain tungsten copper alloy |
Non-Patent Citations (8)
Title |
---|
于洋等: "轧制塑性变形对W-Cu复合材料组织性能影响", 《粉末冶金技术》 * |
李达人: "W-Cu粉末热挤压致密工艺及塑性变形研究", 《哈尔滨工业大学2009年度博士学位论文》 * |
李达人: "W-Cu粉末热挤压致密工艺及塑性变形研究", 《哈尔滨工业大学博士学位论文》 * |
李达人等: "W-40Cu粉末包套热挤压过程数值模拟", 《粉末冶金技术》 * |
李达人等: "挤压比对粉末包套热挤压致密W-40%Cu合金的影响", 《中国钨业》 * |
李达人等: "机械球磨对热挤压W-40Cu材料组织和性能的影响", 《稀有金属材料与工程》 * |
李达人等: "粉末包套挤压致密化过程的理论分析", 《2010中国材料研讨会论文集》 * |
王欣等: "机械球磨热压烧结Mo-50%Cu合金的组织性能", 《稀有金属材料与工程》 * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104209532A (en) * | 2014-03-19 | 2014-12-17 | 天龙钨钼(天津)有限公司 | Thin tungsten copper sheet and preparing method of thin tungsten copper sheet |
CN104209532B (en) * | 2014-03-19 | 2017-01-11 | 安泰天龙(天津)钨钼科技有限公司 | Thin tungsten copper sheet and preparing method of thin tungsten copper sheet |
CN112080665A (en) * | 2020-09-13 | 2020-12-15 | 江西同欣机械制造股份有限公司 | Supporting block material capable of not damaging excircle of camshaft |
CN112080665B (en) * | 2020-09-13 | 2021-09-21 | 江西同欣机械制造股份有限公司 | Supporting block material capable of not damaging excircle of camshaft |
CN112975307A (en) * | 2021-05-11 | 2021-06-18 | 陕西斯瑞新材料股份有限公司 | Method for improving brazing strength of tungsten-copper part |
CN112975307B (en) * | 2021-05-11 | 2021-07-30 | 陕西斯瑞新材料股份有限公司 | Method for improving brazing strength of tungsten-copper part |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103045885B (en) | Preparation method for high-density fine grain tungsten copper alloy | |
CN105132726B (en) | A kind of copper-chromium contact material suitable for contactor and preparation method thereof | |
CN100436616C (en) | Preparation method of near fully densificated high W or Mo content W-Cu or Mo-Cu composite material | |
CN102041421B (en) | High-tungsten content high-compactness fine-grain tungsten-copper material and preparation method thereof | |
CN104630527B (en) | A kind of method preparing copper base diamond composite | |
CN104988438A (en) | High-strength and high-conductivity carbon nano tube strengthening copper-based composite material and preparing method thereof | |
CN103343266B (en) | High-thermal-conductivity graphite-high silicon aluminium-based composite material and preparation process for same | |
CN104213009A (en) | Method for cladding copper on surface of infiltration sintered tungsten-copper composite material | |
CN103352136A (en) | Copper-based contact material and manufacturing process thereof | |
CN109234597A (en) | A kind of tungsten-copper alloy and preparation method thereof | |
US8048366B2 (en) | Process for making copper tungsten and copper molybdenum composite electronic packaging materials | |
CN103589883A (en) | Preparation method of tungsten copper alloy | |
CN101121201A (en) | Tungsten copper powder high compactedness material and method for preparing the material using heat extrusion | |
CN100523236C (en) | Special copper alloy and manufacturing method thereof | |
CN1233492C (en) | Method for preparing copper base electrode powder deformation compound material | |
CN101624662B (en) | Method for preparing W-Cu alloy in microwave infiltration way | |
CN105177346A (en) | Tungsten-copper electric contact material and preparation method thereof | |
CN103045895A (en) | Electric contact material and preparation method thereof | |
CN105945293A (en) | High-hardness high-conductivity CuCr25 contact material and preparation method and application thereof | |
CN102031411B (en) | Method for preparing compact W-Cu composite material at low temperature | |
CN107841669B (en) | High-thermal-conductivity active composite packaging material and preparation method thereof | |
CN114160787A (en) | Manufacturing method of non-shrinkage tungsten framework | |
CN113976885A (en) | Preparation method of tungsten-copper functionally graded material | |
CN111230103A (en) | Preparation method of tungsten-copper alloy wear-resistant electrode | |
CN103710555B (en) | A kind of method utilizing casting method to prepare tungsten copper sheet or plate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140219 |