CN109234597A - A kind of tungsten-copper alloy and preparation method thereof - Google Patents
A kind of tungsten-copper alloy and preparation method thereof Download PDFInfo
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- CN109234597A CN109234597A CN201811400891.4A CN201811400891A CN109234597A CN 109234597 A CN109234597 A CN 109234597A CN 201811400891 A CN201811400891 A CN 201811400891A CN 109234597 A CN109234597 A CN 109234597A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/04—Alloys based on tungsten or molybdenum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/065—Spherical particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/14—Treatment of metallic powder
- B22F1/142—Thermal or thermo-mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/045—Alloys based on refractory metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Abstract
The invention discloses a kind of preparation methods of tungsten-copper alloy, raw material is handled by plasma spheroidization, raw material is set to become spherical from polygon, dispersibility substantially improves, reduce tungsten powder agglomeration, it ensure that being uniformly distributed for tungsten copper during copper facing, make the abundant copper facing of tungsten powder surface, it is sent out and is prepared using solid phase hot pressed sintering, in solid phase hot pressing sintering process, powder can be reset in 1100~1200 DEG C of short time heat preservations, copper particle is precipitated to tungsten particle surface, improve the wetability of tungsten copper with the copper facing collective effect of tungsten powder surface, densify tungsten-copper alloy in a short time, 1000~1050 DEG C are cooled to later with the rate of temperature fall of 2~5 DEG C/min, copper mobility weakens, applying pressure at this time ooze out copper will not, facilitate tungsten-copper alloy further to densify, and due to lower sintering temperature and compared with Short sintering time, gained tungsten-copper alloy crystal grain is tiny, even tissue, and the preparation method simple process used, and equipment is art technology commonly used equipment, is conducive to industrial production.
Description
Technical field
The present invention relates to technical field of alloy material, more particularly to a kind of tungsten-copper alloy and preparation method thereof.
Background technique
Tungsten-copper alloy is a kind of two phase structure pseudo-alloy formed based on tungsten, copper, is metal-base composites, by
It is larger in metallic copper and tungsten physical difference, therefore cannot be produced using fusion casting, generally carried out using powder metallurgy technology
Production.Tungsten-copper alloy has wide purposes, wherein most be applied to space flight, aviation, electronics, electric power, metallurgy, machinery,
The industries such as sports equipment, secondly also will be used to manufacture arc resistant ablation high-voltage appliance switch contact and rocket nozzle larynx lining,
The high-temperature components such as tail vane, also serve as the electrode of electric machining, die material and other require electrical and thermal conductivity performance and applied at elevated temperature
Occasion.
Since tungsten and copper are all immiscible under solid-state and liquid, powder metallurgy prepares tungsten-copper alloy material and product
Main technique approach.The preparation process of tradition tungsten-copper alloy has infiltration method, liquid-phase sintering and vacuum heating-press sintering etc. at present.
Infiltration method is that tungsten powder is first cold-pressed into base, and W skeleton is made in preliminary sintering, then the copper powder or copper billet of compacting are placed on skeleton, is risen
To high temperature, penetrate into copper fusing in tungsten base gap, so that Tungsten-copper Composites be made.Due to easy to form in W skeleton sintering process
Closed pore (1% ~ 3%), therefore high-densit tungsten-copper alloy cannot be obtained, while when W content is lower, it is difficult to form stable bone
Frame limits the application range of this method.Tungsten powder and copper powder are mainly uniformly mixed by liquid-phase sintering, and adhesive cold pressing is added
Tungsten-copper composite material is directly obtained by liquid-phase sintering at base, then at a high temperature of 1200 DEG C or more.Due to the wetting of tungsten and copper
Property is poor, and a small amount of Ni is often added in liquid sintering process in order to densify, and the elements such as Co improve its wetability, however this
A little elements can be such that the thermal conductivity of tungsten-copper alloy and conductivity reduces.Solid phase hot pressed sintering, which refers to, is placed in inertia for W-Cu composite powder
In graphite jig, pressurization while make powder lower than Cu fusing point at a temperature of be sintered, can be sintered within a short period of time
It is a kind of reinforced sintering method to uniform product.The great advantage of hot pressing can exactly substantially reduce forming pressure and shortening
Sintering time, while the crystal grain for the tungsten-copper alloy prepared is thinner, however the Cu of solid phase is almost without mobility, the tungsten copper of preparation
The consistency of alloy is generally below 98%, and the uneven easily segregation of ingredient.
Molten cementation process would generally be pre-sintered in skeleton blank preparation process in tungsten and a small amount of copper powder is added as inducer
The structural heterogenity that tungsten seeps process for copper preparation Tungsten-copper Composites is eliminated, the enlightenment is based on, how to combine the improvement of molten cementation process special
Point using solid phase hot pressing sintering method provide a kind of uniform segregation-free of ingredient, even tissue tungsten-copper alloy preparation method, be this
Field technical staff's urgent problem to be solved.
Summary of the invention
In view of this, closing tungsten copper the present invention provides tungsten-copper alloy of a kind of excellent combination property and preparation method thereof
Gold consistency with higher and the uniform segregation-free of ingredient.
In order to achieve the above object, the present invention adopts the following technical scheme:
A kind of preparation method of tungsten-copper alloy, which comprises the following steps:
(1) induction plasma powder spheroidization device is used, plasma spheroidization processing is carried out to pure tungsten powder and pure copper powder respectively, is obtained
To nodularization tungsten powder and nodularization copper powder；
(2) the nodularization tungsten powder obtained in step (1) is dispersed in copper electrolyte, adjusts pH=11~14, is heated to 50~85
DEG C, it is filtered after persistently stirring 3~5h, dry copper facing nodularization tungsten powder；
(3) the nodularization copper powder obtained in step (1) is uniformly mixed with the copper facing nodularization tungsten powder obtained in step (2)
It is placed in graphite jig and is placed in vacuum hotpressing machine, be warming up to 1100~1200 with the heating rate of 10~20 DEG C/min
DEG C, 15~30min is kept the temperature, is cooled to 1000~1050 DEG C later with the rate of temperature fall of 2~5 DEG C/min, 1~2h is kept the temperature, with furnace
It is cooled to room temperature to get tungsten-copper alloy.
Preferably, the induction plasma powder spheroidization device parameter in the step (1) are as follows: plasma generates gas stream
Measure 30~60L/min, protective layer gas be hydrogen, 80~400 L/min of flow, synthesize 50~150kPa of cavity pressure, wait from
Sub- 30~150kW of power, powder 2~15kg/h of delivery rate, powder in-position are powder feeding gas flow in the middle part of high-temperature region
8~20 L/min.
Preferably, pure tungsten powder purity > 99.5%, fine copper powder purity > 99.7% in the step (1).
Preferably, step (1) pure tungsten powder, pure copper powder partial size be 2~15 μm.
Preferably, every liter of copper electrolyte in the step (2) include 10~30g copper sulphate, 20~40mL formaldehyde, 8~
30mg sodium potassium tartrate tetrahydrate, 10~50g, 2,2 '-bipyridyl, 60~150mL methanol, surplus is water.
Preferably, form by mass percentage in the step (3): nodularization copper powder is 10~50%, and nodularization copper facing tungsten powder is
50~90%.
Preferably, the graphite jig inner surface is coated with boron nitride release agent.
Preferably, vacuum degree is 0.01~0.1Pa in vacuum hotpressing machine in the step (3).
Preferably, rate of temperature fall is cooled to after 1000~1050 DEG C the application pressure in vacuum hotpressing machine in the step (3)
Power is to 40~50MPa.
It can be seen via above technical scheme that compared with prior art, the present disclosure provides a kind of tungsten-copper alloys
Preparation method has reached effect below:
Raw material is handled by plasma spheroidization, so that raw material becomes spherical from polygon, dispersibility is substantially improved, and reduces tungsten powder group
Poly- phenomenon ensure that being uniformly distributed for tungsten copper during copper facing, make the abundant copper facing of tungsten powder surface；
In solid phase hot pressing sintering process, powder can be reset in the heat preservation of 1100~1200 DEG C of short time, copper particle be precipitated to
Tungsten particle surface improves the wetability of tungsten copper with the copper facing collective effect of tungsten powder surface, keeps tungsten-copper alloy fine and close in a short time
Change, be cooled to 1000~1050 DEG C later with the rate of temperature fall of 2~5 DEG C/min, copper mobility weakens, and applying pressure at this time makes copper
It will not ooze out, facilitate tungsten-copper alloy and further densify, and due to lower sintering temperature and shorter sintering time, institute
It is tiny to obtain tungsten-copper alloy crystal grain, even tissue；
The preparation method simple process that the present invention uses, equipment are art technology commonly used equipment, are conducive to industrial production.
Specific embodiment
It is clearly and completely retouched below in conjunction with technical solution of the present invention technical solution in the embodiment of the present invention
It states, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the present invention
In embodiment, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
The present invention provides a kind of preparation methods of tungsten-copper alloy, comprising the following steps:
(1) induction plasma powder spheroidization device is used, plasma spheroidization processing is carried out to pure tungsten powder and pure copper powder respectively, is obtained
To nodularization tungsten powder and nodularization copper powder；
(2) nodularization tungsten powder obtained in step (1) is dispersed in copper electrolyte, adjusts pH=11~14, is heated to 50~85 DEG C,
It is filtered after persistently stirring 3~5h, dry copper facing nodularization tungsten powder；
(3) nodularization copper powder obtained in step (1) is uniformly mixed with copper facing nodularization tungsten powder obtained in step (2) and is placed on stone
It is placed in vacuum hotpressing machine in black mold, is warming up to 1100~1200 DEG C with the heating rate of 10~20 DEG C/min, heat preservation 15
~30min is cooled to 1000~1050 DEG C later with the rate of temperature fall of 2~5 DEG C/min, keeps the temperature 1~2h, cools to room with the furnace
Temperature is to get tungsten-copper alloy.
Induction plasma powder spheroidization device parameter in order to advanced optimize above scheme, in step (1) are as follows: wait from
Son generates 30~60L/min of gas flow, and protective layer gas is hydrogen, and 80~400 L/min of flow synthesizes cavity pressure 50
~150kPa, 30~150kW of plasma power, powder 2~15kg/h of delivery rate, powder in-position are in high-temperature region
Portion, 8~20 L/min of powder feeding gas flow.
In order to advanced optimize above scheme, pure tungsten powder purity > 99.5%, fine copper powder purity > 99.7% in step (1).
In order to advanced optimize above scheme, step (1) pure tungsten powder, pure copper powder partial size be 2~15 μm.
In order to advanced optimize above scheme, every liter of copper electrolyte in step (2) include 10~30g copper sulphate, 20~
40mL formaldehyde, 8~30mg sodium potassium tartrate tetrahydrate, 10~50g, 2,2 '-bipyridyl, 60~150mL methanol, surplus is water.
In order to advanced optimize above scheme, form by mass percentage in step (3): nodularization copper powder is 10~50%, ball
Changing copper facing tungsten powder is 50~90%.
In order to advanced optimize above scheme, graphite jig inner surface is coated with boron nitride release agent.
In order to advanced optimize above scheme, vacuum degree is 0.01~0.1Pa in vacuum hotpressing machine in step (3).
In order to advanced optimize above scheme, rate of temperature fall is cooled to after 1000~1050 DEG C in Vacuum Heat in step (3)
40~50MPa is applied pressure in press.
Embodiment 1
Induction plasma powder spheroidization device parameter is set are as follows: plasma generates gas flow 30L/min, protective layer gas
For hydrogen, 80 L/min of flow synthesizes cavity pressure 50kPa, plasma power 30kW, powder delivery rate 2kg/h, powder
In-position is 8 L/min of powder feeding gas flow in the middle part of high-temperature region.
Configure copper electrolyte: every liter of copper plating bath includes 10g copper sulphate, 20mL formaldehyde, 8mg sodium potassium tartrate tetrahydrate, 10g 2,2 '-connection
Pyridine, 60mL methanol, surplus are water.
Tungsten-copper alloy is prepared using following steps:
(1) use induction plasma powder spheroidization device, to pure tungsten powder and purity be 99.8% pure copper powder carry out respectively etc. from
Sub- spheroidising obtains nodularization tungsten powder and nodularization copper powder；
(2) nodularization tungsten powder obtained in step (1) is dispersed in copper electrolyte, adjusts pH=11~14, is heated to 50~85 DEG C,
It is filtered after persistently stirring 3~5h, dry copper facing nodularization tungsten powder；
(3) by mass percentage, by nodularization copper powder 10% obtained in step (1) and copper facing nodularization tungsten powder obtained in step (2)
90% is uniformly mixed the vacuum for being placed on and being placed on that vacuum degree is 0.01~0.1Pa in the graphite jig for being coated with boron nitride release agent
In hot press, 1100~1200 DEG C are warming up to the heating rate of 10~20 DEG C/min, 15~30min is kept the temperature, later with 2~5
DEG C/rate of temperature fall of min is cooled to 1000~1050 DEG C, 40~50Mpa is applied pressure to, 1~2h is kept the temperature, cools to room with the furnace
Temperature is to get tungsten-copper alloy.
To obtaining to tungsten-copper alloy detecting, tungsten is mutually evenly distributed segregation-free, and average crystal grain partial size is 0.45 μm, is caused
Density is 99.2%.
Embodiment 2
Induction plasma powder spheroidization device parameter is set are as follows: plasma generates gas flow 60L/min, protective layer gas
For hydrogen, 400 L/min of flow synthesizes cavity pressure 150kPa, plasma power 150kW, powder delivery rate 15kg/h, powder
Last in-position is 20 L/min of powder feeding gas flow in the middle part of high-temperature region.
Configure copper electrolyte: every liter of copper plating bath includes 10g copper sulphate, 20mL formaldehyde, 8mg sodium potassium tartrate tetrahydrate, 10g 2,2 '-connection
Pyridine, 60mL methanol, surplus are water.
Tungsten-copper alloy is prepared using following steps:
(1) use induction plasma powder spheroidization device, to pure tungsten powder and purity be 99.8% pure copper powder carry out respectively etc. from
Sub- spheroidising obtains nodularization tungsten powder and nodularization copper powder；
(2) nodularization tungsten powder obtained in step (1) is dispersed in copper electrolyte, adjusts pH=11~14, is heated to 50~85 DEG C,
It is filtered after persistently stirring 3~5h, dry copper facing nodularization tungsten powder；
(3) by mass percentage, by nodularization copper powder 20% obtained in step (1) and copper facing nodularization tungsten powder obtained in step (2)
80% is uniformly mixed the vacuum for being placed on and being placed on that vacuum degree is 0.01~0.1Pa in the graphite jig for being coated with boron nitride release agent
In hot press, 1100~1200 DEG C are warming up to the heating rate of 10~20 DEG C/min, 15~30min is kept the temperature, later with 2~5
DEG C/rate of temperature fall of min is cooled to 1000~1050 DEG C, 40~50Mpa is applied pressure to, 1~2h is kept the temperature, cools to room with the furnace
Temperature is to get tungsten-copper alloy.
To obtaining to tungsten-copper alloy detecting, tungsten is mutually evenly distributed segregation-free, and average crystal grain partial size is 0.35 μm, is caused
Density is 99.5%.
Embodiment 3
Induction plasma powder spheroidization device parameter is set are as follows: plasma generates gas flow 30L/min, protective layer gas
For hydrogen, 80 L/min of flow synthesizes cavity pressure 50kPa, plasma power 30kW, powder delivery rate 2kg/h, powder
In-position is 8 L/min of powder feeding gas flow in the middle part of high-temperature region.
Configure copper electrolyte: every liter of copper electrolyte includes 30g copper sulphate, 40mL formaldehyde, 30mg sodium potassium tartrate tetrahydrate, 50g 2,2 '-
Bipyridyl, 150mL methanol, surplus are water.
Tungsten-copper alloy is prepared using following steps:
(1) use induction plasma powder spheroidization device, to pure tungsten powder and purity be 99.8% pure copper powder carry out respectively etc. from
Sub- spheroidising obtains nodularization tungsten powder and nodularization copper powder；
(2) nodularization tungsten powder obtained in step (1) is dispersed in copper electrolyte, adjusts pH=11~14, is heated to 50~85 DEG C,
It is filtered after persistently stirring 3~5h, dry copper facing nodularization tungsten powder；
(3) by mass percentage, by nodularization copper powder 30% obtained in step (1) and copper facing nodularization tungsten powder obtained in step (2)
70% is uniformly mixed the vacuum for being placed on and being placed on that vacuum degree is 0.01~0.1Pa in the graphite jig for being coated with boron nitride release agent
In hot press, 1100~1200 DEG C are warming up to the heating rate of 10~20 DEG C/min, 15~30min is kept the temperature, later with 2~5
DEG C/rate of temperature fall of min is cooled to 1000~1050 DEG C, 40~50Mpa is applied pressure to, 1~2h is kept the temperature, cools to room with the furnace
Temperature is to get tungsten-copper alloy.
To obtaining to tungsten-copper alloy detecting, tungsten is mutually evenly distributed segregation-free, and average crystal grain partial size is 0.39 μm, is caused
Density is 99.4%.
Embodiment 4
Induction plasma powder spheroidization device parameter is set are as follows: plasma generates gas flow 30L/min, protective layer gas
For hydrogen, 80 L/min of flow synthesizes cavity pressure 50kPa, plasma power 30kW, powder delivery rate 2kg/h, powder
In-position is 8 L/min of powder feeding gas flow in the middle part of high-temperature region.
Configure copper electrolyte: every liter of copper electrolyte includes 30g copper sulphate, 40mL formaldehyde, 30mg sodium potassium tartrate tetrahydrate, 50g 2,2 '-
Bipyridyl, 150mL methanol, surplus are water.
Tungsten-copper alloy is prepared using following steps:
(1) use induction plasma powder spheroidization device, to pure tungsten powder and purity be 99.8% pure copper powder carry out respectively etc. from
Sub- spheroidising obtains nodularization tungsten powder and nodularization copper powder；
(2) nodularization tungsten powder obtained in step (1) is dispersed in copper electrolyte, adjusts pH=11~14, is heated to 50~85 DEG C,
It is filtered after persistently stirring 3~5h, dry copper facing nodularization tungsten powder；
(3) by mass percentage, by nodularization copper powder 50% obtained in step (1) and copper facing nodularization tungsten powder obtained in step (2)
50% is uniformly mixed the vacuum for being placed on and being placed on that vacuum degree is 0.01~0.1Pa in the graphite jig for being coated with boron nitride release agent
In hot press, 1100~1200 DEG C are warming up to the heating rate of 10~20 DEG C/min, 15~30min is kept the temperature, later with 2~5
DEG C/rate of temperature fall of min is cooled to 1000~1050 DEG C, 40~50Mpa is applied pressure to, 1~2h is kept the temperature, cools to room with the furnace
Temperature is to get tungsten-copper alloy.
To obtaining to tungsten-copper alloy detecting, tungsten is mutually evenly distributed segregation-free, and average crystal grain partial size is 0.42 μm, is caused
Density is 99.3%.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.For device disclosed in embodiment
For, since it is corresponded to the methods disclosed in the examples, so being described relatively simple, related place is said referring to method part
It is bright.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (9)
1. a kind of preparation method of tungsten-copper alloy, which comprises the following steps:
(1) induction plasma powder spheroidization device is used, plasma spheroidization processing is carried out to pure tungsten powder and pure copper powder respectively, is obtained
To nodularization tungsten powder and nodularization copper powder；
(2) the nodularization tungsten powder obtained in step (1) is dispersed in copper electrolyte, adjusts pH=11~14, is heated to 50~85
DEG C, it is filtered after persistently stirring 3~5h, dry copper facing nodularization tungsten powder；
(3) the nodularization copper powder obtained in step (1) is uniformly mixed with the copper facing nodularization tungsten powder obtained in step (2)
It is placed in graphite jig and is placed in vacuum hotpressing machine, be warming up to 1100~1200 with the heating rate of 10~20 DEG C/min
DEG C, 15~30min is kept the temperature, is cooled to 1000~1050 DEG C later with the rate of temperature fall of 2~5 DEG C/min, 1~2h is kept the temperature, with furnace
It is cooled to room temperature to get tungsten-copper alloy.
2. a kind of preparation method of tungsten-copper alloy according to claim 1, which is characterized in that the sense in the step (1)
Answer plasma powder spheroidization device parameter are as follows: plasma generates 30~60L/min of gas flow, and protective layer gas is hydrogen,
80~400 L/min of flow synthesizes 50~150kPa of cavity pressure, 30~150kW of plasma power, powder delivery rate 2
~15kg/h, powder in-position are 8~20 L/min of powder feeding gas flow in the middle part of high-temperature region.
3. a kind of preparation method of tungsten-copper alloy according to claim 1, which is characterized in that pure tungsten in the step (1)
Powder purity > 99.5%, fine copper powder purity > 99.7%.
4. a kind of preparation method of tungsten-copper alloy according to claim 1, which is characterized in that step (1) pure tungsten powder,
The partial size of pure copper powder is 2~15 μm.
5. a kind of preparation method of tungsten-copper alloy according to claim 1, which is characterized in that every in the step (2)
Rise copper electrolyte include 10~30g copper sulphate, 20~40mL formaldehyde, 8~30mg sodium potassium tartrate tetrahydrate, 10~50g 2,2 '-bipyridyl,
60~150mL methanol, surplus are water.
6. a kind of preparation method of tungsten-copper alloy according to claim 1, which is characterized in that press matter in the step (3)
Measure percentage composition: nodularization copper powder is 10~50%, and nodularization copper facing tungsten powder is 50~90%.
7. a kind of preparation method of tungsten-copper alloy according to claim 1, which is characterized in that the graphite jig inner surface
It is coated with boron nitride release agent.
8. a kind of preparation method of tungsten-copper alloy according to claim 1, which is characterized in that vacuum in the step (3)
Vacuum degree is 0.01~0.1Pa in hot press.
9. a kind of preparation method of tungsten-copper alloy according to claim 1, which is characterized in that cooling in the step (3)
Rate applies pressure to 40~50MPa after being cooled to 1000~1050 DEG C in vacuum hotpressing machine.
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| CN111394715A (en) * | 2020-04-03 | 2020-07-10 | 湖南工程学院 | Silicon carbide particle and whisker mixture processing apparatus for aluminium base composite |
| CN111411254A (en) * | 2020-04-09 | 2020-07-14 | 西安理工大学 | Tungsten-reinforced copper composite material and preparation method thereof |
| CN113637865A (en) * | 2021-08-12 | 2021-11-12 | 福建工程学院 | GO/TiCN-doped wear-resistant tungsten-copper composite material and preparation method thereof |
| CN113649566A (en) * | 2021-07-28 | 2021-11-16 | 武汉理工大学 | W-Ni-Sn-P-Cu-based composite powder and preparation method and application thereof |
| CN116550975A (en) * | 2023-07-04 | 2023-08-08 | 赣州金顺科技有限公司 | Preparation method of diamond/copper composite material |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62127449A (en) * | 1985-11-26 | 1987-06-09 | Toshiba Corp | Electrode material for electric discharge machining and its production |
| JPS63195242A (en) * | 1987-02-06 | 1988-08-12 | Nippon Tungsten Co Ltd | Electrode material for electric discharge machining |
| CN103045885A (en) * | 2012-12-27 | 2013-04-17 | 中南大学 | Preparation method for high-density fine grain tungsten copper alloy |
| CN104152734A (en) * | 2014-06-12 | 2014-11-19 | 陕西斯瑞工业有限责任公司 | Method for preparing tungsten-copper alloy from spherical tungsten powder |
| CN104404282A (en) * | 2014-12-02 | 2015-03-11 | 天龙钨钼（天津）有限公司 | Tungsten copper alloy with low tungsten content and preparation method of tungsten copper alloy |
| CN104550943A (en) * | 2015-01-28 | 2015-04-29 | 中国科学院过程工程研究所 | Spherical copper coating tungsten composite powder, preparation method and application thereof |
| CN106180653A (en) * | 2016-08-05 | 2016-12-07 | 陕西斯瑞新材料股份有限公司 | Discharge plasma sintering prepares the method for copper tungsten contact material |
| CN106435319A (en) * | 2016-12-15 | 2017-02-22 | 四川恒珲新材料科技有限公司 | Tungsten-copper alloy and production method thereof |
-
2018
- 2018-11-22 CN CN201811400891.4A patent/CN109234597A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62127449A (en) * | 1985-11-26 | 1987-06-09 | Toshiba Corp | Electrode material for electric discharge machining and its production |
| JPS63195242A (en) * | 1987-02-06 | 1988-08-12 | Nippon Tungsten Co Ltd | Electrode material for electric discharge machining |
| CN103045885A (en) * | 2012-12-27 | 2013-04-17 | 中南大学 | Preparation method for high-density fine grain tungsten copper alloy |
| CN104152734A (en) * | 2014-06-12 | 2014-11-19 | 陕西斯瑞工业有限责任公司 | Method for preparing tungsten-copper alloy from spherical tungsten powder |
| CN104404282A (en) * | 2014-12-02 | 2015-03-11 | 天龙钨钼（天津）有限公司 | Tungsten copper alloy with low tungsten content and preparation method of tungsten copper alloy |
| CN104550943A (en) * | 2015-01-28 | 2015-04-29 | 中国科学院过程工程研究所 | Spherical copper coating tungsten composite powder, preparation method and application thereof |
| CN106180653A (en) * | 2016-08-05 | 2016-12-07 | 陕西斯瑞新材料股份有限公司 | Discharge plasma sintering prepares the method for copper tungsten contact material |
| CN106435319A (en) * | 2016-12-15 | 2017-02-22 | 四川恒珲新材料科技有限公司 | Tungsten-copper alloy and production method thereof |
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| CN111394715A (en) * | 2020-04-03 | 2020-07-10 | 湖南工程学院 | Silicon carbide particle and whisker mixture processing apparatus for aluminium base composite |
| CN111411254A (en) * | 2020-04-09 | 2020-07-14 | 西安理工大学 | Tungsten-reinforced copper composite material and preparation method thereof |
| CN111411254B (en) * | 2020-04-09 | 2021-07-20 | 西安理工大学 | Tungsten-reinforced copper composite material and preparation method thereof |
| CN113649566A (en) * | 2021-07-28 | 2021-11-16 | 武汉理工大学 | W-Ni-Sn-P-Cu-based composite powder and preparation method and application thereof |
| CN113637865A (en) * | 2021-08-12 | 2021-11-12 | 福建工程学院 | GO/TiCN-doped wear-resistant tungsten-copper composite material and preparation method thereof |
| CN116550975A (en) * | 2023-07-04 | 2023-08-08 | 赣州金顺科技有限公司 | Preparation method of diamond/copper composite material |
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